CN104065248A - Power supply conversion device, photovoltaic apparatus comprising the power supply conversion device, and manufacture method of power supply device - Google Patents
Power supply conversion device, photovoltaic apparatus comprising the power supply conversion device, and manufacture method of power supply device Download PDFInfo
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- CN104065248A CN104065248A CN201310092846.8A CN201310092846A CN104065248A CN 104065248 A CN104065248 A CN 104065248A CN 201310092846 A CN201310092846 A CN 201310092846A CN 104065248 A CN104065248 A CN 104065248A
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Abstract
The invention discloses a power supply conversion device, a photovoltaic apparatus comprising the power supply conversion device, and a manufacture method of a power supply device. The power supply conversion device comprises a printed circuit board (PCB), electronic and electrical elements on the PCB, partition objects, and a pouring sealant. The edge of each partition object is contacted with the PCB to enable at least one zone of the PCB to be surrounded by one partition object or more partition objects so as to form one or multiple partition zones. Each partition zone defines a partition space in different areas of the PCB, and only one side, opposite to the PCB, of each partition space is opened. One or more electronic or electrical elements are supported at each partition space of the PCB. At least a part of each partition space of the PCB is filled up with the pouring sealant which is enabled to cover all the electronic or electrical elements in each partition space. The other part, which is not surrounded by the partition objects, of the PCB is completely covered by the pouring sealant.
Description
Technical field
The present invention relates to a kind of power supply change-over device and the photovoltaic apparatus that comprises this power supply change-over device.
Background technology
Power supply changeover device and inverter are applicable to multiple power sources management application.Specifically, Miniature inverter and power supply optimizer are the key elements for photovoltaic system.
Power supply optimizer is the DC-to-DC converter technology of the exploitation for energy production capacity is maximized, for obtaining best power from photovoltaic or wind generator system.Power supply optimizer is simple in structure, only comprises capacitor and conversion module, does not have inverter module.Power supply optimizer can be very little, it is wide that its size is less than 300(conventionally) * 200(is high) * 100(is dark) mm, and preferably its width is less than 250,200,150 or 100mm even, it is highly less than 150,100,70 or 50mm even, and its degree of depth is less than 70,50,30 or 15mm even.In these Miniature Power Unit optimizers, the volume that holds the housing of power supply optimizer element is less than 3 liters conventionally, is less than 2,1,0.75,0.5 liters, or is even less than 0.25 liter.
Miniature inverter is the class in power supply changeover device, and it the most often uses together with photovoltaic panel, but also can have other application.Miniature inverter is combined in power supply optimizer and small-sized inverter in single housing substantially, and for each plate of photovoltaic system, power supply optimizer is stayed inverter in independent box, and only an inverter is applicable to whole photovoltaic panel array.When Miniature inverter is used together with photovoltaic panel, it is located immediately near photovoltaic panel and is set to and photovoltaic panel electrical connection, and is often integrated into the structure of photovoltaic panel.Each Miniature inverter carries out MPPT maximum power point tracking to obtain the best power of photovoltaic panel by the photovoltaic panel to its electrical connection.Compare with the size of conventional inverter, the size of Miniature inverter is less, it is wide that the size of Miniature inverter is less than 500(conventionally) * 300(is high) * 100(is dark) millimeter (mm), and preferably its width is less than 250,200,150 or 100mm even, it is highly less than 150,100,70 or 50mm even, and its degree of depth is less than 80,70,50,30 or 15mm even.The volume that holds the housing of Miniature inverter element is less than 3 liters conventionally, is less than 2,1,0.75,0.5 liters, or is even less than 0.25 liter.Miniature inverter is different from conventional inverter, because they are suitable for using low-voltage current in a small amount, the heat being produced by Miniature inverter is less than the heat being produced by conventional inverter.
Due to Miniature inverter conventionally with photovoltaic panel in same position, so their need more firm protection, be subject to the impact of environmental key-element (for example temperature of water, moisture, variation and ultraviolet and other radiation).Miniature inverter has (being included in heat management and environmental protection aspect) high reliability request, thereby withstands the test that is exposed to each environmental key-element while using out of doors.Current leading Miniature inverter and power supply optimizer company provide the guarantee period of 25 years for its product, and the thermal conductivity casting glue of filling these devices is critical materials of realizing this protection.Miniature inverter is for example being described in United States Patent (USP) 7796412 to some extent, and this full patent texts is incorporated herein by reference.
The corresponding corresponding parts of numeral in accompanying drawing.Fig. 1 is the schematic diagram of the power supply changeover device of general prior art.In brief, power supply changeover device 100 comprises and conventionally contains housing 101 and the capping 102 of being made by metal and other durable materials, and the electronic printing circuit board (PCB) 104 of holding electrical element 103 is operationally being set in power supply changeover device inside.Object for present patent application, electric component 103 is one or more for stablizing the set of capacitor and one or more conversion modules of input current, described conversion module comprises for improving the transformer of input voltage, and by thyristor, be operably connected to inverter module, described inverter module comprises that one or more inductors and miscellaneous part are so that can firm power conversion and anti-phase.The sign of each parts of electric component 103 is not shown in figures.
Except said elements, power supply changeover device also comprises the heat that one or more radiators produce for management.In the power supply changeover device of prior art, the whole PCB with electronics and electric component is coated in casting glue 105, and described casting glue is assigned in housing 101 by hole 106 conventionally, to protect electronic component to avoid the impact of environmental key-element.In typical power supply changeover device, be relatively positioned with thereon the PCB of Electrical and Electronic element, the height of element is differentiated.Pointed in Fig. 1, the power supply changeover device of prior art is filled with casting glue material completely.
In the power supply changeover device of prior art, heat radiation casting glue, for filling the whole void space in power supply changeover device, is avoided the impact of environment with protection component, and the useful life of extension fixture.Yet we recognize that casting glue is applied with thermal stress to the element of power supply changeover device.Reduce this stress and will further extend the life-span of transducer.
Summary of the invention
The present invention relates to use the casting glue of reduction to protect the method for element in electronic installation, and relate to the electronic installation of manufacturing by these class methods.The embodiment of these class methods is particularly useful for Miniature Power Unit inverter or transducer.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the power supply changeover device of general prior art.
Fig. 2 a-2b is the schematic diagram with the power supply changeover device of subregion embedding layout, and it carrys out grappling separator with contact adhesive.
Fig. 3 a-3b is the schematic diagram with the power supply changeover device of subregion embedding, and it carrys out grappling separator with link.
Embodiment
In present patent application, use term " power supply changeover device " to mean to comprise the electronic installation of one or more semiconductor modules and electric component, it is converted to stronger DC for (1) by direct current (DC), it is power supply optimizer, (2) DC is converted to alternating current (AC), it is inverter, or (3) be converted to DC by AC, as light-emitting diode (LED) module.
The present invention relates to the power supply changeover device of any type or size, but in specific embodiments, the present invention relates to Miniature Power Unit optimizer or Miniature inverter, its be not limited to but conventionally use together with photovoltaic panel, be conventionally directly installed to photovoltaic panel after, make each plate directly provide service by the power supply changeover device of himself, thereby improve conversion efficiency.The invention still further relates to the LED module or the photovoltaic panel that comprise Miniature Power Unit optimizer or Miniature inverter.
Power supply changeover device of the present invention.Present patent application relates to the invention about power supply change-over device, and described power supply change-over device comprises: the printed circuit board (PCB) (PCB) with at least one region, electronics on PCB and electric component, this class component is operably connected to each other for power conversion, one or more separators, each separator has edge, and casting glue, wherein each separator Qi edge contacts with PCB, at least one region that makes PCB by one or more separators around, thereby form one or more separated regions, each separated region limits the compartment and only in the relative side with PCB, opens wide on the zones of different of PCB, the one or more electronics of this type of area supporting of each of PCB or electric component, each this type of compartment is filled with casting glue at least in part, make completely coated all electronics or the electric component that is arranged in this region of casting glue, and be not separated thing around PCB region in PCB by casting glue, covered completely, wherein at least one region of PCB, exist and be positioned at the space on casting glue, electronics or electric component at least one region of described casting glue covering PCB.
Power supply changeover device of the present invention has structure, therefore can make casting glue cover each electronics or electric component completely according to the height of this class component, but not need to fill completely the void space between electronics or electric component top and power supply changeover device capping.In typical power supply changeover device, be positioned at Electrical and Electronic element on PCB difference to some extent on the height measured perpendicular to PCB direction.Yet, on PCB, there is the more than one element with mutually the same or similar height, and some in the element of this type of similar height are adjacent one another are.In one embodiment of the invention, the element set of this type of similar height together, and by highly over described element heights and the impermeable separator of casting glue around.Then, casting glue is assigned to by the formed compartment of separator around, to cover element wherein completely.In the power supply changeover device of prior art, casting glue is filled equably housing and is arrived capping, by comparison, and in embodiment of the present invention, the height of the compartment institute receiving element of filling casting glue is less, and now casting glue is understood cladding element and on casting glue, left void space.In other words, the amount that covers the required casting glue of element in a space is not only according to the area of PCB in the compartment, also change according to the height of element in this compartment.
For purposes of illustration, element can be classified as to the cluster of differing heights: A group, B group and C group.A group is the highest element, and comprises transformer and capacitor.B group is medium altitude element, and comprises inductor, resistor and other Electrical and Electronic elements.C group is minimum element, for example surface mount device (SMD) and integrated circuit (IC) chip.The grouping of height and the quantity of element cluster can where necessary and can be selected by layout and the design of power supply changeover device, but conventionally have two, three or four highly groupings, and one, two, three, four or five clusters.Separator can be by any configuration setting, as long as separator forms the compartment, wherein casting glue measure retain and can not move to the outside of enclosed region before casting glue solidify.
It is poor not exist the certain height that limits " similarly " height, can for convenience any element be assigned to suitable group.Yet as limiting examples, in the situation that the elongate elements of first group is shorter than the short element of second group, the difference between the elongate elements of first group and the short element of second group can be 3 to 5mm.The exemplary height of Miniature inverter and Miniature Power Unit converters and exemplary be grouped into as follows:
Embodiment of the present invention are shown in Fig. 2 a and 2b.In Fig. 2 a and 2b, Fig. 2 a observes the schematic side elevation of power supply changeover device from being parallel to the direction at PCB204 edge.Power supply changeover device comprises housing 201 and capping 202, and PCB204 is positioned at this housing, and electric or electronic component is operably connected on PCB204.Separator 2071 is around the cluster of element 2031, and its height 2071h is greater than in the compartment the height 2031h of high element.Casting glue 205 is incorporated into the compartment 21 by the hole 206 in capping 202, and element 2031 is covered completely by casting glue, and space (not shown) is retained on the casting glue 205 in the compartment 21.In other words, in the compartment 21, the degree of depth of casting glue 205 is greater than height 2031h, and is less than the height 2071h of separator 2071.Separator 2073 forms second compartment 23, and wherein element 2033 is arranged in this space.The casting glue of second batch quantity 205 is assigned in the compartment 23, makes element 2033 completely be covered and be up to capping 202 by casting glue 205.The 3rd cluster components (not shown), if any, can by the 3rd separator (not shown) around, and be coated on similarly in casting glue 205.When the cluster of sufficient amount identified, and while being covered by casting glue 205 in a similar fashion, PCB204 and lowest component 2032(be SMD and IC chip for example) by introducing enough casting glues 205 to fill any space below PCB204 and around and to cover minimum element, and space (not shown) is retained on the casting glue 205 of cladding element 2032.
Fig. 2 b is the schematic diagram of power supply changeover device of observing the surperficial (not shown) of PCB204 from top downwards.Each rectangle or square 2031,2032 or 2033 representation elements.Element 2031 has similar height each other.Element 2032 has similar height each other.Element 2033 has similar height each other.Separator 2071 and 2073 is connected to PCB204, Existential Space not between separator 2071 and 2073 edge (not shown) and PCB204 preferably, but can comprise some spaces, as long as uncured casting glue 205 in position solidifies before from this spatial migration not out.Each in separator 2071 and 2073 is around the different elements cluster of similar height, and this type of cluster is element 2031 or 2033.Separator 2071 forms the compartment 21, and demarcate by PCB204 in the bottom in this space, and element 2031 is positioned at wherein.Similarly, separator 2073 forms the compartment 23 of PCB204, and wherein element 2033 is arranged in the compartment.
Separator can be constructed by a supporting material, to form cylindrical without any turning, maybe can have turning so that there is three, four, five, six, seven, eight or more surface.The surface of separator can be smooth or crooked.Alternatively, separator can be by two block of material or more than the material structure of two, and when it, to be placed in PCB upper during for object of the present invention, can be connected to each other by any connected mode.Separator is basically perpendicular to PCB location conventionally, but can become other angles with respect to PCB.Separator also can have enough height, and the height that makes to have around the shortest parts of the separator of a set of pieces surpasses in this region 1,2,3,4,5 or more millimeters of the height of the highest element.Thereby separator can reach the top contact capping of housing, but can not surpass the height of housing vertical plane.
Parts around the separator of the compartment can form around the parts of another separator of another compartment.In this case, this base part of separator is between two compartments.
Separator can be made by the material of any enough rigidity, so that it keeps basic vertical position with respect to PCB when being fixed to PCB.Alternatively, spacer material cannot be from supporting but can for example, supporting by support unit (framework, support, pillar or bar).For example, separator can comprise or be connected to net sheet, sheet metal or the film of being made by metal or plastics, and these materials can provide enough supporting forces.This type of support unit can be permanent, or can when casting glue is uncured, temporarily place, and is removed when casting glue solidifies.Every separator can be flexible or inflexibility.Separator can be solid, maybe can have loose structure.When separator has loose structure, described hole can be sealing, and do not allow casting glue infiltration through separator, or described hole can be opening or part opening, as long as the infiltration of uncured casting glue is enough slow, so that casting glue can not pass separator before solidifying, not release.If aperture is very little and/or the required travel distance long enough of casting glue infiltration separator, and required amount curing time casting glue has enough viscosity and makes the opposite side of uncured casting glue from a side shifting of separator to separator that the time quantum of cost is greater than to casting glue and is assigned among the power supply change-over device that is provided with separator, can realize this slow infiltration.Any polymer solids or porous material all can be used for preparing separator, comprise polyurethane, organopolysiloxane, polyisobutene, polybutadiene or be used to form the repetitive of any aforementioned substances monomer (as, PIC/polyalcohol, PDMS D5, isobutene, 1,3-butadiene) or oligomer in any both or more persons' copolymer.Separator also can for example, by the material based on cellulose or lignin (paper wood) preparation, and this type of material usable surface coating material is processed.The material preparation in the life-span (25 years or longer) of power supply change-over device is preferably longer than or is equaled to separator by the life-span having.Separator is preferably electric insulation (nonconducting), to can not hinder the normal running of the power supply change-over device that separator is wherein set.Separator can not comprise can suppress the curing component of casting glue.For example, separator can not comprise phosphoric acid and its derivant material.
Separator can have any thickness, as long as meet the characteristic described in the paragraph before this section of next-door neighbour.On the other hand, separator is may not can so thick so that hinder the layout of element or unnecessarily increase the size of device.In typical embodiment, for Miniature inverter and other small device sizes, the thickness of separator is 0.1,0.5,1,2 or 3mm.In another embodiment, for larger power supply changeover device, separator thickness can be at most 10mm.
Separator can be constructed by being applicable to manufacture any usual manner of the material of partage.Polymeric material can be poured into a mould by any mode, molding, spray or be shaped to the separator of final form, and wherein the initial monomers of polymeric material or uncured material are processed to polymer.Separator can be from larger solid or plate cutting or moulding.
Separator can be fixed to pcb board by any mode.Contact adhesive (PSA) can be applied to the separator edge of contiguous pcb board, and separator can be pressed onto and adhere on PCB.The illustration of this type of method of attachment is shown in the schematic diagram of Fig. 2 a and 2b, wherein shows PSA208.Separator 2071 can adhere to by the adhesive of PSA, two-sided band or any type between itself and PCB.Fig. 3 a has for supporting the end view of embodiment of the present invention of the support unit of separator, and Fig. 3 b is the plan view of this embodiment.As shown in Figure 3 a and 3b shown, as separator is directly adhered to separately to the alternative form of PCB, for example, the appendicular support unit 309 of the connection endways with contiguous PCB304 can be adhered to separator 3071.As shown in Figure 3 a and 3b shown, support unit 309 can embed in separator 3071.Alternatively, support unit can be connected to by adhesive the outside of separator.Separator 3071 is disconnected separator 3071 itself or be also connected to PCB304 by connecting support unit 309 except connecting separator 3071 itself by connecting support unit 309.Support unit 309 can be connected to PCB with adhesive or by being embedded friction fit in separator, thus supporting separator.Support unit 309 also can be welded to PCB304.Support unit can be club or narrow boards, and can be by making with the identical or different material of separator.Support unit 309 can have outside screw-screw-thread type fastening piece for example at the screw of the end of contiguous PCB304 and be connected to PCB304 by this screw.
PCB can be designed for using together with separator of the present invention particularly, makes it can have groove and/or receiving opening for setting and the connection of separator.The structure installation of PCB has the receiving structure for support unit, for example, with the cross sectional dimensions of support unit and shape and the indented region or the hole that match for the receiving screw thread of the screw-screwed part of support unit.The layout of PCB can be taken the position of separator into account, and can be by the elements combination of similar height together.
Like this, expect that the amount of the casting glue that the element of effective protection power source transducer is required is than the power supply changeover device few 10,20,30,40 or even 50% that lacks the prior art of one or more separators.Thereby this is favourable for the cost that reduces amount of casting glue and reduce the necessary casting glue of protection power source transducer, and because the space on short element allows casting glue generation thermal expansion, thereby alleviated compared with the thermal stress of short element.The minimizing of casting glue amount has also alleviated the weight of transducer, has so just alleviated and has supported the required mechanical support of transducer, thereby reduced more cost, and reduced the mechanical stress of any structure of supporting hot transducer.
Can be identical for the casting glue of each compartment or different.Maybe advantageously the electric or electronic component in the thermal capacity that makes casting glue and the concrete compartment matches.
Potting adhesive composition.Polymer composition as casting glue of the present invention can be any casting glue using together with transducer at present.It is preferably heat conduction, and the electric and/or electronic component that is applicable to protection power source transducer is avoided the impact of environmental key-element.If use curable materials, curing composition is nonflammable.So-called " nonflammable " refers to that it has surpassed flammable UL94 grade V-1 or better.Curing composition is preferably equal to or less than 4mm at thickness, surpasses UL94V-1 when preferably thickness is equal to or less than 2mm.
The polymer that comprises polymer composition can be the copolymer of polyurethane, organopolysiloxane, polyisobutene, polybutadiene or the monomer that comprises any aforementioned substances or oligomer.Preferred polymer is organopolysiloxane.The example of casting glue comprises the composition of commercially available acquisition, for example, for the Dow Corning Sylgard of the composition based on organopolysiloxane
160, Sylgard
170, CN-8760, Shin Etsu KET132, Beginor Besil340, and for EFI polymer 30222/40020, the Epic resin S7202-04 of the composition based on polyurethane.
For implementing the curing materials that exemplary organopolysiloxane composition of the present invention is the curable compositions that comprises organopolysiloxane, curing agent and catalyst.The example of this type of organopolysiloxane can be present in PCT patent application PCT/CN12/076460.
Component (A) is that each independent polymer molecule on average has at least 0.5, the organopolysiloxane of the thiazolinyl of two or more silicon bondings more typically, and can be single mixture of planting polymer or two or more polymer.Component (A) can be (the comprising circulus) of straight chain or branching.
Component (A) also can be defined as Organoalkyl polysiloxanes.(A) thiazolinyl of the silicon bonding of organopolysiloxane is not particularly limited, and the example of suitable thiazolinyl is vinyl, pi-allyl, cyclobutenyl, pentenyl and hexenyl.Each thiazolinyl can be identical or different, and each can be independently selected from other all thiazolinyls.Each thiazolinyl can be end group or side group, and the two all can be present in the Organoalkyl polysiloxanes of (A).Vinyl is preferred.
In various embodiments, component (A) can have following formula:
Formula (I): R
1 2r
2siO (R
1 2siO)
d(R
1r
2siO)
esiR
1 2r
2,
Formula (II): R
1 3siO (R
1 2siO)
f(R
1r
2siO)
gsiR
1 3, or their combination.
In formula (I) with (II), each R
1be not contain any monovalent organic radical group of aliphatic unsaturated group and each R independently
2be aliphatic unsaturated organic group independently.R
1include but not limited to have any the alkyl in 1 to 10 carbon atom, as methyl; Ethyl; The isomer of following group: propyl group, butyl, amyl group, hexyl, heptyl, octyl group, nonyl, decyl; Cycloalkyl is cyclopenta and cyclohexyl for example; And aryl for example phenyl, tolyl, xylyl, benzyl and 2-phenethyl.Each R
2be aliphatic unsaturated any monovalent organic radical group independently, it is exemplified as thiazolinyl for example vinyl, pi-allyl, cyclobutenyl, pentenyl, hexenyl or heptenyl.R
2can comprise halogen atom or halogen group.
Subscript " d " has the mean value that is at least 1 conventionally, but can have scope, is 0.1 to 2000 value.Subscript " e " and " f " can be 0 or positive number separately.Alternatively, can to have scope be 0 to 2000 mean value to subscript " e ".Subscript " g " has and is at least 1 and more typically have the mean value that is at least 2.Alternatively, can to have scope be 1 to 2000 mean value to subscript " g ".
In various embodiments, component (A) is also defined as the polydialkysiloxane of thiazolinyl dialkyl group silicyl end-blocking.Specifically, polydialkysiloxane also can be defined as: dimethyl silicone polymer (PDMS), methyl (3,3,3-trifluoro propyl) copolymer of polysiloxanes, ethylene methacrylic radical siloxane and dimethyl siloxane, methyl (3,3,3-trifluoro propyl) copolymer of the copolymer of siloxanes and dimethyl siloxane, methyl phenyl vinyl siloxanes and dimethyl siloxane or the organosiloxane copolymer that formed by the siloxane unit representing by following formula: (CH
3)
3siO
1/2, (CH
3)
2(CH
2=CH) SiO
1/2, CH
3siO
3/2, (CH
3)
2siO
2/2.Each in these polymer is end-blocking, in one or two molecular end, passes through dimethyl vinyl siloxy or methyl phenyl vinyl siloxy or silanol group end-blocking.Aforementioned siloxanes can comprise the phenyl of the replacement methyl of a tittle.
Component (B) is that each molecule on average has at least 2,3 or more than the crosslinking agent of the hydrogen atom of 3 silicon bondings, and can comprise silane or siloxanes, for example polysiloxane.The hydrogen atom of silicon bonding can be end group or side group.Component (B) also can comprise monovalence alkyl replacement or non-substituted.The example of suitable non-substituted monovalence alkyl comprises any one the alkyl having between 1 and 10 carbon atom, as methyl; Ethyl; The isomer of following group: propyl group, butyl, amyl group, hexyl, heptyl, octyl group; Cyclopenta, cyclohexyl or similar cycloalkyl; Phenyl, tolyl, xylyl or similar aryl; Benzyl, phenethyl or similar aralkyl; Or 3,3,3-trifluoro propyl, 3-chloropropyl or similar haloalkyl.Alkyl preferably, in particular to methyl.
Component (B) also can comprise siloxane unit, and described siloxane unit includes but not limited to HR
3 2siO
1/2, R
3 3siO
1/2, HR
3siO
2/2, R
3 2siO
2/2, R
3siO
3/2and SiO
4/2unit, wherein each R
3independently selected from any monovalent organic radical group of not fatty family degree of unsaturation, as in the previous paragraph.In various embodiments, (B) crosslinking agent comprises or is the compound of following formula:
Formula (III) R
3 3siO (R
3 2siO) h (R
3hSiO) iSiR
3 3,
Formula (IV) R
3 2hSiO (R
3 2siO) j (R
3hSiO) kSiR
3 2h,
Or their combination.
In above-mentioned formula (III) with (IV), it is 0 to 2000 mean value that subscript " h ", " j " and " k " have scope separately, and subscript " i " to have scope be 2 to 2000 mean value.Each R
3be any monovalent organic radical group independently.Suitable any monovalent organic radical group comprises the alkyl with 1 to 20,1 to 15,1 to 10,5 to 20,5 to 15 or 5 to 10 carbon atoms, for example methyl; Ethyl; The isomer of following group: propyl group, butyl, amyl group, octyl group, decyl, undecyl, dodecyl and octadecyl; Cycloalkyl is cyclopenta and cyclohexyl for example; Thiazolinyl is vinyl, pi-allyl, cyclobutenyl and hexenyl for example; Alkynyl is acetenyl, propinyl and butynyl for example; And aryl for example phenyl, tolyl, xylyl, benzyl and 2-phenethyl.
Or component (B) also can be defined as: the copolymer of methylhydrogenpolysi,oxane or methyl hydrogen siloxane and dimethyl siloxane, the two one of in one or two molecular end by trimethylsiloxy group, dimethyl hydrogen siloxy or their combination end-blocking; Ring-type methylhydrogenpolysi,oxane; And/or the organosiloxane being formed by the siloxane unit representing by following formula: (CH
3)
3siO
1/2, (CH
3)
2hSiO
1/2and SiO
4/2; Four (dimethyl hydrogen siloxy) silane or methyl-tri-(dimethyl hydrogen siloxy) silane or dimethyl polysiloxane, they by any combination end-blocking of above-mentioned group, need only at least one hydrogen atom that comprises silicon bonding in these groups in one or two molecular end.
Also expect the combination that component (B) can be or comprises at least one two or more the different organic hydrogen polysiloxanes in following characteristic: structure, mean molecule quantity, viscosity, siloxane unit and sequence.Component (B) also can comprise silane.Have the relatively low degree of polymerization (DP) (as, DP scope is 3 to 100) the dimethyl silicone polymer of dimethyl hydrogen siloxy end-blocking be commonly called cahin extension agent, and a part for component (B) can be or comprise cahin extension agent.In one embodiment, component (B) halogen atom-containing not.In another embodiment, each molecule of component (B) comprises one or more halogen atoms.Be contemplated that generally speaking not halogen atom-containing of gel.
Crosslinking agent (B) can have straight chain, branching or part branching molecular structure linearity, ring-type, dendritic or resin.
In component (A), in the thiazolinyl of silicon bonding and component (B), the mol ratio of the hydrogen of silicon bonding represents with SiH:Vi ratio in this article, and it affects the physical characteristic of the curing materials of component (A) and component (B).In the present invention, SiH:Vi ratio is 0.1 to being less than 1.5.When SiH:Vi ratio is less than 0.1, composition is difficult to solidify completely.On the other hand, when SiH:Vi ratio is 1.5 or when larger, cure polymer is applied to that pressure on the element of power supply change-over device increases and its flexibility reduces and can not expect.Preferably, SiH:Vi ratio is 0.1 to 1.2, is more particularly 0.1 to 1.0, and is more particularly 0.3 to 0.7.
Component (C) is catalyst, and is not subject to concrete restriction, and it can be any catalyst known in the art.In one embodiment, component (C) comprises and is selected from the platinum group metal of platinum, rhodium, ruthenium, palladium, osmium or iridium, their organo-metallic compound or their combination.In another embodiment, component (C) is also defined as fine powder, platinum black, platinous chloride, the platinum tetrachloride of platinum; The chloroplatinic acid of chloroplatinic acid, alcohol modification, chloroplatinic acid hexahydrate; And the complex compound of this compounds, for example the platinum complex of alkene, the platinum complex of phosphinylidyne, alkenyl siloxane as 1, the platinum complex of 3-divinyl tetramethyl disiloxane, low-molecular-weight organopolysiloxane for example 1,3-divinyl-1,1, the complex compound of the complex compound of the complex compound of the platinum complex of 3,3-tetramethyl disiloxane, chloroplatinic acid and beta-diketon, chloroplatinic acid and alkene and chloroplatinic acid and 1,3-divinyl tetramethyl disiloxane.
Conventionally, based on (A) and total weight meter (B), component (C) is with 0.01 to 1,000ppm, or 0.1 to 500ppm, or 1 to 500ppm, or 2 to 200ppm, or 5 to 150ppm amount exists/uses.
In embodiments of the invention, can use any in above-mentioned polymer, and it can be mixed with (D) one or more fillers.
Component (D) is the combination of filler or filler.That these fillers can be is heat conduction and/or athermanous, strengthen and/or unstiffened fire retardant and/or non-fire retardant.It is dry and/or through Chemical Pretreatment that filler can be, or undried and/or without Chemical Pretreatment.The example of typical filler includes but not limited to lower any one or any combination: grind quartzy (SiO 2 powder), precipitated silica, pyrogenic silica, (grind or precipitation) aluminum trihydrate, (grind or precipitation) two hydrous magnesiums or aluminium oxide.
Heat filling is known in the art, referring to for example United States Patent (USP) 6,169, and 142(the 4th hurdle the 7th to 33 row).Component (D) can comprise inorganic filler, fusible filler or their combination.Inorganic filler be exemplified as onyx; Aluminum trihydrate, metal oxide be aluminium oxide, beryllium oxide, magnesium oxide and zinc oxide for example; Nitride is aluminium nitride and boron nitride for example; Carbide is carborundum and tungsten carbide for example; Barium titanate, carbon fibre, diamond, graphite, magnesium hydroxide and their combination.
Component (D) can be single plants heat filling or the combination of two or more not identical heat fillings at least one following characteristic, and described characteristic is for example grain shape, particle mean size, particle size distribution and filler type.In certain embodiments, what may expect is that first heat filling with larger particle mean size is combined to meet the ratio of closest packing theoretical distribution curve with second heat filling with less particle mean size, and described the second heat filling can have the material identical or different with the first filler.The first filler that use has larger particle mean size can improve charging efficiency, can reduce viscosity with second filler with the little particle mean size of comparing with the first filler, and can improve heat transmission.
The shape of heat filling particle is not subject to concrete restriction; Yet when in composition, the loading density of heat filling is very high, circle or spheric granules can stop viscosity to be increased to less desirable level.The particle mean size of heat filling will depend on various factors, comprise for the selected heat filling type of component (D) and the accurate amount of adding curable compositions to, and will use therein the bondline thickness of device of the cured product of composition.In some instantiations, heat filling can have the particle mean size that scope is 0.1 micron to 80 microns or 0.1 micron to 50 microns or 0.1 micron to 10 microns.
Heat filling is commercially available acquisition.For example, fusible filler can derive from Indium Corp. America (Indium Corporation, America, the Utica of New York, United States Utica, N.Y., U.S.A.), Arconium company (Arconium, Providence, the R.I. of Rhode Island,USA Pu Weidunsi, U.S.A.) and (the AIM Solder of AIM scolder company of Rhode Island,USA Cranston, Cranston, R.I., U.S.A.).Al filler is commercially available acquisition, for example derive from (the Toyal America of U.S. Toyal Co., Ltd of Illinois, America Naperville, Inc., Naperville, Illinois, U.S.A.) and Valimet Co., Ltd (Valimet Inc., the Stockton of California, USA Stockton, California, U.S.A.).Silver fillers can be commercially available from the Mei Taile science and technology u s company (Metalor Technologies U.S.A.Corp., Attleboro, Massachusetts, U.S.A.) of Massachusetts, United States Aunar Er Baile.Zinc oxide for example trade mark is KADOX
and XX
zinc oxide can be commercially available from the U.S. zinc company (Zinc Corporation of America, Monaca, Pennsylvania, U.S.A.) of Pennsylvania, America Mo Naka.In addition, CB-A20S and Al-43-Me have varigrained alumina packing, (Showa-Denko) is commercially available in Qi Kecong Showa Denko K. K, and the commercially available alumina packing of AA-04, AA-2 and AA18 Shi Kecong Sumitomo Chemical Co (Sumitomo Chemical Company).Boron nitride filler can be commercially available from the Mai Tu company (Momentive Corporation, Cleveland, Ohio, U.S.A.) of Ohio, USA Cleveland.
Filler can be fire retardant, maybe can play fire retardant.Fire retardant is known in the art.The example of known flame retardant is carbon black, melting or pyrogenic silica, silica gel, phosphate, phosphinate, polyphosphonates or copolymerization phosphonate ester, melamine, slaine, hydroxide and oxide, hydrated alumina, metal borate etc. and their combination.Some organosilicon, silane and silsesquioxane also can be used as fire retardant.The polysiloxane of hydrosilylation cure as softness of the present invention while being clamminess gel, is conventionally avoided using the fire retardant of phosphorous, sulphur or nitrogen-atoms, thereby will be hindered curing possibility to be down to minimum.Referring to, " anti-flammability of the Fire Retardancy of Polymeric Materials(polymeric material) " of Kashiwagi and Gilman for example, 353-389 page (2000), the document is incorporated to way of reference accordingly.
One or more (D) fillers dispersed, in component (A), and dispersible in (B) in (F).That dispersion can be is heat treated, dry or chemically treated.Optional components as described below (E) and (F) can with or can be interact or react with filler.The total content of (D) filler based on (A) and total weight meter (B) will be wished the minimum that official can need for realizing, and can be greater than 5,10,20,30,40 or 50 % by weight.
By curable prepolymer be monomer or oligomer the silicon composition in the situation that with component (A), (B) and (C) and component (D) mix.The thermal conductivity cured silicone product that the softness that is cured as composition is clamminess, this product can be water white or colourless translucent, or has color.
Composition also can comprise optional components.
Can add component (E) is organosilicon liquid.In other words, component (E) can be described to only one in the organosilicon liquid of sense and/or the organosilicon liquid of non-sense or their mixture.In one embodiment, (E) be also defined as the dimethyl silicone polymer of non-sense.In another embodiment, (E) be also defined as the dimethyl silicone polymer of vinyl functional.What term " the organosilicon liquid of sense " was described conventionally is that fluid functionalised and hydrosilylation reactions occurs, and comprises unsaturated group and/or Si-H group.Yet, be contemplated that except one or more unsaturated groups and/or Si-H group or while there is not one or more unsaturated groups and/or Si-H group, fluid can comprise one or more additional functionality.In various non-limiting embodiments, (E) as United States Patent (USP) 6,020, one or more in 409,4,374,967 and/or 6,001,918 described, and each in these patents is all incorporated herein by reference clearly.(E) be not subject to the concrete restriction of any structure or viscosity.
In one embodiment, (E) be the organosilicon liquid of sense, and react with (A) and/or (B) at (C) and existing in situation (D).In other words, hydrosilylation reactions product also can be defined as (A), (B) and (E) the hydrosilylation reactions product of the organosilicon liquid of sense, wherein (A), (B) and (E) under (C) and existence (D), by hydrosilylation, react.In another embodiment, (A) and (B) at (C), (D) with (E), under the existence of the organosilicon liquid of non-sense, via hydrosilylation, react.
(A) to one or more the mixed formation mixture in (E), and this mixture can further react to form gel with the remaining ingredient in (A) to (E), and wherein (E) is optional components in mixture or as remaining component.In other words, (A) in (E) one or more any combination can with (A) to (E) in one or more any other composite reaction, as long as form gel.
Potting adhesive composition can comprise other optional components.(A) to the mixture of (E) or in them any one or many persons can mix with one or more additives independently, by it, processed or reacted with it.Annexing ingredient can be selected from (F) filler treatment agent, (G) adhesion promoter, (H) solvent or diluent, (I) surfactant, (J) acid acceptor, (K) hydrosilylation stabilizer and their combination.
Component (F) is filler treatment agent.Filler for component (D) is optionally used component (F) inorganic agent to carry out surface treatment.Inorganic agent and processing method are known in the art, and referring to for example United States Patent (USP) 6,169,142(walks on the 4th hurdle the 42nd the 5th hurdle the 2nd row).
The amount of component (F) can root Ju various factors and change, and comprise for the selected filler type of component (D) and amount, and filler is to use component (F) to process on the spot or processing before mixing with other components of composition.Yet the scope that composition can comprise its amount is 0.1% to 2% component (F).
Component (F) can comprise with any ratio and be present in the formula R in specific components (F)
6 msi (OR
7)
(4-m)alkoxy silane, wherein subscript m is 1,2 or 3.Alternatively, subscript m can be 1 for all molecules in specific components (F), for all molecules, can be 2, or can be 3 for all molecules.Each R
6be any monovalent organic radical group independently, for example, there is the alkyl of 1 to 50 carbon atom or 6 to 18 carbon atoms.R
6be exemplified as alkyl, for example hexyl, octyl group, dodecyl, myristyl, cetyl and octadecyl; And aryl, for example benzyl, phenyl and phenethyl.R
6can be saturated or undersaturated, branching or non-branching and unsubstituted.R
6can be saturated, without branching with unsubstituted.
Each R
7can be the unsubstituted saturated hydrocarbyl with 1 to 4 carbon atom or 1 to 2 carbon atom.The alkoxy silane of component (H) be exemplified as hexyl trimethoxy silane, octyltri-ethoxysilane, decyl trimethoxy silane, dodecyltrimethoxysilane, myristyl trimethoxy silane, phenyltrimethoxysila,e, phenethyl trimethoxy silane, octadecyl trimethoxy silane, octadecyltriethoxy silane and their combination.
The oligosiloxane of alkoxy-functional also can be used as inorganic agent.Oligosiloxane of alkoxy-functional and preparation method thereof is known in the art, referring to for example EP 1101167 A2.For example, the oligosiloxane of suitable alkoxy-functional comprises formula (R
8o)
nsi (OSiR
9 2r
10)
(4-n)those.In the formula, subscript n is 1,2 or 3, or n is 3.Each R
8can be alkyl.Each R
9can be independently selected from the saturated and undersaturated monovalence alkyl with 1 to 10 carbon atom.Each R
10can be the saturated or unsaturated monovalence alkyl with at least 11 carbon atoms.
Metallic stuffing can be used alkyl hydrosulfide such as Stearyl mercaptan etc.; And aliphatic acid for example oleic acid, stearic acid; Titanate; Titanate coupling agent; Zirconates coupling agent; And their combined treatment.
The alkyl methyl polysiloxanes that can comprise alkoxysilyl functional for the inorganic agent of aluminium oxide or passivation aluminium nitride is (as, R
11 or
1d psi (OR
13)
(4-o-p)partial hydrolysis condensation product or cohydrolysis condensation product or mixture) or similar material, wherein hydrolyzable groups can comprise silazane, acyloxy or oxime.In all these groups, be connected to the group (R in above formula for example of Si
11) be the hydrocarbon of the unsaturated monovalence hydrocarbon of long-chain or monovalence aromatics official energy.Each R
12be monovalence alkyl independently, and each R
13independently for thering is the monovalence alkyl of 1 to 4 carbon atom.In above formula, subscript o is 1,2 or 3, and subscript p is 0,1 or 2, precondition be " o+p " the summation of " o " and " p " be 1,2 or 3.Inorganic agent also can be polysiloxane, and can draw together and have formula R
16 3si (OSiR
17)
roSi (OR
18)
3those, R wherein
16, R
17and R
18be univalent alkyl independently of one another, as methyl, and subscript " r " is 1 to 200.Those skilled in the art can optimize concrete processing to help fillers dispersed without undo experimentation.
Component (G) is adhesion promoter.Suitable adhesion promoter can comprise formula R
14 qsi (OR
15)
(4-q)alkoxy silane, wherein subscript q is 1,2 or 3, or q is 3.Each R
14be monovalence organo-functional group independently.R
14can be for example for example aminoethyl aminopropyl or aminopropyl, methacryloxypropyl or unsaturated organic group of glycidoxypropyl or (epoxycyclohexyl) ethyl, amido functional group of epoxy-functional.Each R
15independently for thering is the unsubstituted saturated hydrocarbyl of at least 1 carbon atom.R
15can there is 1 to 4 carbon atom, or 1 to 2 carbon atom.R
15be exemplified as methyl, ethyl, n-pro-pyl and isopropyl.
The example of suitable adhesion promoter comprises the combination of glycidoxypropyltrimewasxysilane and glycidoxypropyltrimewasxysilane and aluminium chelate compound or zirconium chelate.Example for the adhesion promoter of hydrosilylation curable compositions can be present in United States Patent (USP) 4,087,585 and United States Patent (USP) 5,194,649 in.Curable compositions can comprise the adhesion promoter of the weighing scale 0.5% to 5% based on described composition.
Component (H) solvent or diluent can add during preparing composition, for example, for helping, mix and send.All or part of of component (H) optionally removed after preparing composition.
Component (I) is surfactant.Suitable surfactant comprises copolymer, other non-ionic surface active agents and their combination of organic silicon polyether, ethylene oxide polymer, epoxypropane polymer, oxirane and expoxy propane.Composition can comprise weighing scale based on described composition 0.05% surfactant at the most.
Component (J) is acid acceptor.Suitable acid acceptor comprises magnesium oxide, calcium oxide and their combination.Composition can comprise weighing scale based on described composition 2% component (J) at the most.
Component (K) is hydrosilylation stabilizer, for preventing curable compositions premature setting.In order to regulate curing rate, and improve the processing of composition under industrial condition, can by composition and alkynes alcohol, eneyne compound, BTA, amine for example tetramethylethylenediamine, dialkyl group fumarate, dialkylene fumarate, dialkoxy alkyl fumarate, maleate for example diallyl maleate and their combination further mix.Alternatively, stabilizer can comprise alkynol.Below the instantiation of compounds for this reason: for example 2-methyl-3-butyne-2-alcohol, 3-methyl isophthalic acid-butine-3-alcohol, 3,5-dimethyl-1-hexin-3-alcohol, 2-phenyl-3-butyne-2-alcohol, 3-Phenyl-1-butyn-3-ol, 1-acetenyl-1-cyclohexanol, [(1,1-dimethyl-2-propynyl) oxygen base] trimethyl silane, methyl (three (1,1-dimethyl-2-propynyl oxygen base)) silane or similar acetylene compound; 3-methyl-pirylene, 3,5-dimethyl-3-hexene-1-alkynes or similarly eneyne compound; Other additives can comprise compound based on hydrazine, the compound based on phosphine, the compound based on mercaptan, cycloalkenyl group siloxanes for example methyl ethylene cyclosiloxane as 1,3,5,7-tetramethyl-1,3,5,7-tetrem thiazolinyl cyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-, tetra-hexenyl cyclotetrasiloxanes, BTA or similar triazole.The content of this type of inhibitor in the curable thermally-conductive silicone elastic composition of hydrosilylation can be in the scope of 0.0001 to 5 weight portion/100 parts by weight of component (A).Suitable hydrogenation methyl-monosilane curing inhibitors has disclosed in United States Patent (USP) 3,445,420,3,989,667,4,584,361 and 5,036,117 for example.
Person of skill in the art will appreciate that, when selecting the component of above-mentioned composition, between the type of component, may exist overlapping because some component as herein described can have more than a kind of function.For example, some alkoxy silane can be used as filler treatment agent and adhesion promoter, and some plasticizer for example fatty acid ester also can be used as filler treatment agent.Those skilled in the art can distinguish and select suitable component and amount thereof according to various factors, and described factor comprises that the desired use of composition and composition are to be prepared as single part or many parts composition.
Composition can be prepared by the following method, and the method comprises by any easy mode and for example under ambient temperature or high temperature, stirs and mix all components.When composition is at high temperature prepared, the temperature of preparation process is lower than the curing temperature of composition.
The method can comprise the step that component (A) to (D) (and optional (E)) is provided, and by one or more step mixing in (A) to (E).Component (A) to (D) and optional (E) can mix, and with an instant part (single part) or be divided into two parts (two parts) of before using, needs being mixed and provide.With regard to two parts system, to not restriction of blending ratio, and blending ratio can be one to one or unequal.The method also can be included in (C) and (D) and under the existence of optional (E), via hydrosilylation reactions, solidify or partly solidified (A) and step (B).This solidifies and can occur not using hot in the situation that, or via heating, occurs alternatively.Also under the existence of expection (A) and one or more or aforementioned other monomers or polymer that (B) can be in aforementioned additive, react or curing.
When there is component (F), composition optionally, by using component (G) to carry out surface treatment to component (D) (and component (F), if existed), then mixes its product to prepare with other components of composition.Alternatively, composition can be prepared as many parts composition, for example, when component (K) does not exist, or when composition will store a very long time before use.In many parts composition, crosslinking agent is with catalyst stores in separated part, and described part is mixed before composition be about to be used.For example, two parts curable organosilicon composition can be by for example, mixing and comprise prepared by the component of matrix polymer, catalyst, heat filling and plasticizer and one or more annexing ingredients via any easy mode (stir) in body portion.Curing agent part can comprise prepared by the component of crosslinking agent, matrix polymer, heat filling and plasticizer and one or more annexing ingredients by for example, mixing via any easy mode (stir).Can be under ambient temperature or high temperature blending ingredients, this depends on selected curing mechanism.When using two-part curable organosilicon composition, the scope of the weight ratio of the amount of matrix and curing agent can be 1:1 to 50:1; Can select any ratio within the scope of this as suitable ratio according to convenience.Those skilled in the art can prepare curable compositions and without undo experimentation.
Method.The disclosure also provides the method that forms electronic products.The method comprises provides printed circuit board (PCB) (PCB), the electronics on PCB and electric component (this class component is operably connected for power conversion), one or more separators and casting glue; Electrical and Electronic element and PCB are operationally fitted together for power conversion, thereby obtain the converters of assembling; The converters of assembling is placed in to housing; One or more separators are operably connected to PCB by adhesive or link, to form only in the unlimited compartment of PCB opposite side; Casting glue is assigned in the compartment, all Electrical and Electronic elements are coated in the compartment completely; And curing casting glue.
More particularly, for casting glue of the present invention, can prepare by any suitable mode (comprising the usual manner of preparing this type of curable polymer), but the curable gel that specifically, softness as herein described is clamminess can form by the step of aforementioned formation gel.Before in uncured potting adhesive composition is assigned to housing, it is fully degassed so that air is removed from uncured fluid, and mix all components.Degassed and mixing can complete by the blender-distributor of commercially available acquisition.
Casting glue can be assigned in the compartment before or after placing housing capping.If casting glue distributed before placing capping, it distributes from compartment top, to cover all elements in institute surrounding area, and be never separated thing around PCB region on distribute, make casting glue fill below PCB and any space around cover minimum element, then place capping with closure shell.For casting glue, after placing capping, distribute, capping has one or more dispensing orifices, these holes corresponding to separator around each position of the compartment, and from dispensing orifice, casting glue is assigned to the compartment.
What it will be understood by those of skill in the art that technology disclosed herein represents that inventor finds can put into practice technology of the present invention well, so it can be regarded as forming the optimal way of its practice.Yet, according to the disclosure, it will be understood by those of skill in the art that without departing from the spirit and scope of the present invention, can carry out various modifications and still can obtain similar or similar result disclosed specific embodiments.All percentage is all in % by weight.
Claims (11)
1. a power supply change-over device, comprising:
The printed circuit board (PCB) (PCB) with at least one region;
Electronics on described PCB and electric component, this class component can operatively be connected to each other for power conversion;
One or more separators, each separator has edge; With
Casting glue,
It is characterized in that each separator Qi edge contacts with described PCB, described at least one region that makes described PCB by one or more separators around to form one or more area of isolation, each area of isolation limits the compartment and only described, opens wide with a relative side of PCB on the zones of different of described PCB, the one or more electronics of this type of area supporting of each of described PCB or electric component
Each this type of compartment is filled with described casting glue at least in part, makes completely coated all electronics or the electric component that is arranged in described region of described casting glue,
And not by described separator around the part of described PCB in, described PCB is covered completely by described casting glue, wherein at least one region of described PCB, exist and be positioned at the space on described casting glue, described casting glue covers electronics or the electric component at least one region of described PCB.
2. power supply change-over device according to claim 1, wherein said separator is connected to described PCB by connected mode.
3. power supply change-over device according to claim 2, is characterized in that described connected mode is adhesive.
4. power supply change-over device according to claim 3, is characterized in that described adhesive is contact adhesive.
5. power supply change-over device according to claim 1, is characterized in that described separator also comprises support unit.
6. power supply change-over device according to claim 5, is characterized in that described separator is connected to described PCB through described support unit.
7. power supply change-over device according to claim 5, is characterized in that described separator is connected to described PCB by connected mode and by described support unit.
8. according to power supply change-over device in any one of the preceding claims wherein, it is characterized in that described separator comprises polyurethane, organopolysiloxane, polyisobutene or their copolymer.
9. power supply change-over device according to claim 1, described power supply change-over device is terminal box, Miniature inverter, power supply optimizer or light-emitting diode transducer.
10. a photovoltaic apparatus, comprises power supply change-over device according to claim 1.
11. 1 kinds of methods of manufacturing supply unit, said method comprising the steps of:
A) Electrical and Electronic element and printed circuit board (PCB) (PCB) are operationally fitted together for power conversion, thereby obtain the converters of elementary assembling, described PCB has at least one region;
B) by each edge of separator being connected to the connected mode of described PCB, the marginate separator of one or more each tools is operably connected to the PCB of the converters of described assembling, thereby form the one or more separated regions that limit one or more compartments, each separated region only opens wide with a relative side of PCB described, thereby obtains the transducer portion element of secondary assembling;
C) converters of described secondary assembling is placed in housing;
D) casting glue is assigned in each compartment of converters of described secondary assembling, to be coated on all Electrical and Electronic elements in the described compartment completely;
E) distribute described casting glue with the remainder of the PCB of the converters of completely coated described secondary assembling; And
F) solidify described casting glue to obtain described supply unit, wherein at least one region of described PCB, exist and be positioned at the space on described casting glue, described casting glue covers electronics or the electric component at least one region of described PCB.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310092846.8A CN104065248A (en) | 2013-03-22 | 2013-03-22 | Power supply conversion device, photovoltaic apparatus comprising the power supply conversion device, and manufacture method of power supply device |
| PCT/CN2014/073952 WO2014146614A1 (en) | 2013-03-22 | 2014-03-24 | Sectioned potting in power converters |
| TW103110979A TW201505329A (en) | 2013-03-22 | 2014-03-24 | Sectioned potting in power converters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310092846.8A CN104065248A (en) | 2013-03-22 | 2013-03-22 | Power supply conversion device, photovoltaic apparatus comprising the power supply conversion device, and manufacture method of power supply device |
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|---|---|
| CN104065248A true CN104065248A (en) | 2014-09-24 |
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| CN201310092846.8A Pending CN104065248A (en) | 2013-03-22 | 2013-03-22 | Power supply conversion device, photovoltaic apparatus comprising the power supply conversion device, and manufacture method of power supply device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602865A (en) * | 2019-06-17 | 2019-12-20 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
| CN111107723A (en) * | 2019-12-11 | 2020-05-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | Electrical device, method for manufacturing an electrical device and motor vehicle |
-
2013
- 2013-03-22 CN CN201310092846.8A patent/CN104065248A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602865A (en) * | 2019-06-17 | 2019-12-20 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
| CN110602865B (en) * | 2019-06-17 | 2020-12-22 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
| CN111107723A (en) * | 2019-12-11 | 2020-05-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | Electrical device, method for manufacturing an electrical device and motor vehicle |
| EP3836768A1 (en) * | 2019-12-11 | 2021-06-16 | Valeo Siemens Eautomotive Shenzhen Co., Ltd | Electrical apparatus, method for manufacturing electrical apparatus, and motor vehicle |
| CN113194651A (en) * | 2019-12-11 | 2021-07-30 | 法雷奥西门子新能源汽车(深圳)有限公司 | Electrical device, method for manufacturing an electrical device and motor vehicle |
| CN113194651B (en) * | 2019-12-11 | 2023-07-07 | 法雷奥新能源汽车(深圳)有限公司 | Electrical device, method for producing an electrical device, and motor vehicle |
| US11744049B2 (en) | 2019-12-11 | 2023-08-29 | Valeo Siemens Eautomotive (Shenzhen) Co., Ltd. | Heat dissipation device for electronic component |
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