TW201505329A - Sectioned potting in power converters - Google Patents

Abstract

Power devices comprising partitions are provided wherein the partitions create enclosed spaces to allow sectioned potting of the components of such devices.

Description

Partition potting of power converter

Power converters and inverters are available for a variety of power management applications. In particular, micro-inverters and power optimizers are key components for photovoltaic systems.

BACKGROUND OF THE INVENTION

The power optimizer is a DC-DC converter technology developed to maximize energy production for optimal power from photovoltaic or wind power systems. The power optimizer has a simple structure, including only capacitors and converter modules, and no inverter modules. The power optimizer can be small, typically having a size less than 300 (width) x 200 (height) x 100 (deep) mm, and preferably having a width less than 250, 200, 150 or even 100 mm, and a height less than 150, 100, 70 Or even 50mm, the depth is less than 70, 50, 30 or even 15mm. In these small power optimizers, the housing housing the power optimizer element typically has a volume of less than 3 liters, less than 2, 1, 0.75, 0.5 liters, or even less than 0.25 liters.

Micro-inverters are a type of power converter that is most commonly used with photovoltaic panels, but can have other applications as well. The micro-inverter basically combines the power optimizer and the small inverter in a single housing and is used for Each board in the photovoltaic system, while the power optimizer leaves the inverter in a separate box, and only one inverter is suitable for the entire array of photovoltaic panels. When a micro-inverter is used with a photovoltaic panel, it is located directly adjacent to the photovoltaic panel and is placed in electrical connection with the photovoltaic panel and is often integrated into the structure of the photovoltaic panel. Each micro-inverter obtains the optimum power of the photovoltaic panel by performing maximum power point tracking on the photovoltaic panels electrically connected thereto. The size of the micro-inverter is smaller than that of a conventional inverter, and the size of the micro-inverter is usually less than 500 (width) × 300 (height) × 100 (deep) millimeter (mm), and preferably The width is less than 250, 200, 150 or even 100 mm, and its height is less than 150, 100, 70 or even 50 mm, and its depth is less than 80, 70, 50, 30 or even 15 mm. The housing housing the microinverter component typically has a volume of less than 3 liters, less than 2, 1, 0.75, 0.5 liters, or even less than 0.25 liters. Micro-inverters differ from conventional inverters in that they are suitable for using a small amount of low-voltage current, and the heat generated by the micro-inverter is less than the heat generated by a conventional inverter.

Since micro-inverters are usually co-located with photovoltaic panels, they require more robust protection from environmental factors such as water, moisture, changing temperatures, and ultraviolet and other radiation. Micro-inverters have high reliability requirements (including in thermal management and environmental protection) to withstand the exposure to environmental elements when used outdoors. The current leading micro-inverter and power optimizer companies offer a 25-year warranty on their products, and thermal potting compounds that fill these devices are key to achieving this protection. A micro-inverter is described, for example, in U.S. Patent No. 7,796,412, the disclosure of which is incorporated herein in its entirety by reference.

Corresponding numerals in the figures indicate corresponding parts. Figure 1 is general A schematic diagram of a prior art power converter. In short, the power converter 100 includes a housing 101 and a cover 102 that are typically made of metal and other durable materials, and an electronic printed circuit board (PCB) that supports the electrical components 103 is operatively disposed within the power converter. ) 104. For the purposes of this patent application, electrical component 103 is one or more sets of capacitors and one or more converter modules for stabilizing the input current, the converter module including a transformer for increasing the input voltage, And operatively connected to the inverter module by a controlled rectifier, the inverter module including one or more inductors and other components to enable stable power conversion and reverse phase. The identification of each component of electrical component 103 is not shown in the figures.

In addition to the above components, the power converter also includes one or more heat sinks for managing the heat generated. In prior art power converters, the entire PCB with electronic and electrical components is encapsulated in a potting compound 105, which is typically dispensed into the housing 101 through holes 106 to protect the electronic components from environmental elements. Impact. In a typical power converter, the height of the components is different relative to the PCB on which the electrical and electronic components are located. As indicated in Figure 1, the prior art power converter is completely filled with potting material.

In prior art power converters, a heat-dissipating potting compound is used to fill the entire void space within the power converter to protect the components from the environment and extend the life of the device. However, we recognize that the potting compound exerts thermal stress on the components of the power converter. Reducing this stress will further extend the life of the converter.

Summary of invention

The present invention relates to a method of protecting components within an electronic device using a reduced amount of potting compound, and to an electronic device fabricated by such methods. Embodiments of such methods are particularly applicable to small power inverters or converters.

21, 23 ‧ ‧ separation space

100‧‧‧Power Converter

101‧‧‧shell

102‧‧‧ Cover

103‧‧‧Electrical components

104‧‧‧Board (PCB)

105‧‧‧Encapsulation

106‧‧‧ holes

201‧‧‧ housing

202‧‧‧ Cover

204‧‧‧PCB

205‧‧‧Encapsulation

206‧‧‧ hole

208‧‧‧PSA

309‧‧‧Support parts

2031, 2032, 2033‧‧‧ components

2031h, 2071h‧‧‧ height

2071, 2073, 3071‧‧‧ partitions

1 is a schematic diagram of a conventional prior art power converter.

2 is a schematic illustration of a power converter with a partition potting arrangement that uses a pressure sensitive adhesive to anchor the separator.

3 is a schematic illustration of a power converter with partition potting that uses a connecting component to anchor the divider.

detailed description

The term "power converter" is used in this patent application to mean an electronic device comprising one or more semiconductor modules and electrical components for (1) converting direct current (DC) to a stronger DC, ie a power optimizer (2) converting DC to alternating current (AC), ie, inverter, or (3) converting AC to DC, such as a light emitting diode (LED) module.

The present invention relates to power converters of any type or size, but in particular embodiments, the present invention relates to small power optimizers or micro-inverters that are not limited to, but typically used with, photovoltaic panels, typically mounted directly to photovoltaic panels. Later, each board is directly serviced by its own power converter, thereby improving conversion efficiency. The invention also relates to an LED module or photovoltaic panel comprising a small power optimizer or a microinverter.

The power converter of the present invention. The present patent application relates to an invention relating to a power conversion device comprising: a printed circuit board (PCB) having at least one area; electronic and electrical components on the PCB, such elements being operatively coupled to each other for use For converting power; one or more separators, each separator having an edge; and potting compound, wherein each separator is in contact with the PCB at its edge such that at least one region of the PCB is surrounded by one or more separators Forming one or more separation regions, each of which defines a separation space over a different region of the PCB and is only open on the opposite side of the PCB, each such region of the PCB supporting one or more electrons or Electrical components, each such compartment being at least partially filled with potting glue such that the potting compound completely covers all of the electronic or electrical components located in the area, and the PCB is filled in a PCB area that is not surrounded by the separator The encapsulant is completely covered, wherein there is a void above the potting compound in at least one region of the PCB, the potting compound covering the electronic or electrical in at least one region of the PCB Pieces.

The power converter of the present invention is structured so that the potting glue can completely cover each electronic or electrical component according to the height of such components, but does not need to be completely filled with the top of the electronic or electrical component and the power converter cover The space between the gaps. In a typical power converter, the electrical and electronic components positioned on the PCB differ in the height measured perpendicular to the PCB direction. However, there are more than one elements having the same or similar heights on the PCB, and some of such height-like elements are adjacent to each other. In one embodiment of the invention, such height-like elements are brought together and are heighted beyond the height of the elements and potting An impermeable partition surrounds. The potting compound is then dispensed into the compartment formed by the surrounding dividers to completely cover the components therein. In prior art power converters, the potting compound uniformly fills the casing and reaches the closure, in contrast to the embodiment of the present invention, the height of the components contained in the partitioning space filled with the potting compound is small, The potting compound covers the component and leaves a void space above the potting compound. In other words, the amount of potting glue required to cover an element within a space varies not only by the area of the PCB within the space but also by the height of the elements within the space.

For illustrative purposes, components can be classified into clusters of different heights: Group A, Group B, and Group C. Group A is the highest component and includes transformers and capacitors. Group B is a medium height component and includes inductors, resistors, and other electrical and electronic components. Group C is the lowest component, such as surface mount devices (SMD) and integrated circuit (IC) chips. The height of the grouping and the number of component clusters can be selected when necessary and can be selected by the layout and design of the power converter, but usually there are two, three or four height groups, and one, two, three, four Or five clusters. The separator may be disposed in any configuration as long as the separator forms a separation space in which the amount of potting compound is retained and does not migrate to the outside of the closed region until the potting compound cures.

There are no specific height differences that will define a "similar" height, and any component can be assigned to the appropriate group for convenience. However, as a non-limiting example, where the longest component of the first set is shorter than the shortest component of the second set, the difference between the longest component of the first set and the shortest component of the second set may be 3 to 5 mm . Typical heights and exemplary groupings of microinverters and small power converter components are as follows:

Embodiments of the invention are illustrated in Figures 2a and 2b. In Figures 2a and 2b, Figure 2a is a schematic side view of the power converter as viewed from a direction parallel to the edge of the PCB 204. The power converter includes a housing 201 and a cover 202 within which the PCB 204 is located, with electrical or electronic components operatively coupled to the PCB 204. The divider 2071 surrounds the cluster of elements 2031 and its height 2071h is greater than the height 2031h of the highest component within the separation space. The potting compound 205 is introduced into the partition space 21 through the holes 206 in the cover 202 such that the element 2031 is completely covered by the potting glue, and a void (not shown) remains above the potting compound 205 in the partition space 21. In other words, the depth of the potting compound 205 in the partition space 21 is greater than the height 2031h and smaller than the height 2071h of the partition 2071. The partition 2073 forms a second separation space 23 in which the element 2033 is located. A second batch of potting compound 205 is dispensed into the compartment 23 such that the component 2033 is completely covered by the potting compound 205 up to the closure 202. A third cluster element (not shown), if any, may be surrounded by a third separator (not shown) and similarly wrapped in potting compound 205. When a sufficient number of clusters are identified, and When covered by the potting compound 205 in a similar manner, the PCB 204 and the lowest component 2032 (eg, SMD and IC wafers) fill a minimum amount of encapsulant 205 to fill any space under and around the PCB 204 and cover the lowest components. And a void (not shown) remains over the potting compound 205 of the cover element 2032.

Figure 2b is a schematic illustration of a power converter looking down the top surface of the PCB 204 (not shown). Each rectangle or square 2031, 2032, or 2033 represents an element. The elements 2031 have similar heights to each other. Elements 2032 have similar heights to one another. Elements 2033 have similar heights to each other. The separators 2071 and 2073 are connected to the PCB 204, preferably there is no space between the edges (not shown) of the separators 2071 and 2073 and the PCB 204, but may include some space as long as the uncured potting compound 205 is in place It does not migrate out of this space before curing. Each of the dividers 2071 and 2073 is clustered around different elements of similar height, such clusters being elements 2031 or 2033. The partition 2071 forms a partition space 21, the bottom of which is delimited by a PCB 204, and the element 2031 is located therein. Similarly, the separator 2073 forms a separation space 23 of the PCB 204 in which the element 2033 is located in the separation space.

The divider may be constructed from a piece of support material to form a cylindrical shape without any corners, or may have corners such that there are three, four, five, six, seven, eight or more surfaces. The surface of the divider can be flat or curved. Alternatively, the separator may be constructed from two pieces of material or more than two pieces of material, and when placed on a PCB for the purposes of the present invention, may be joined to each other by any means of attachment. The spacers are typically positioned substantially perpendicular to the PCB, but may be at other angles relative to the PCB. The separator may also have a height sufficient to allow the shortest portion of the divider around a group of elements The piece has a height that exceeds the height of the highest component in the area by 1, 2, 3, 4, 5 or more millimeters. The divider may reach the top edge of the housing to contact the closure, but may not exceed the height of the vertical plane of the housing.

The component surrounding the partition of the separation space may form a component that surrounds another partition of the other separation space. In this case, such components of the divider are between the two compartments.

The separator can be made of any sufficiently rigid material so that it remains in a substantially vertical position relative to the PCB when secured to the PCB. Alternatively, the separator material may not be self-supporting but may be supported by a support member such as a frame, bracket, strut or rod. For example, the separator may comprise or be attached to a mesh, foil or film made of metal or plastic that provides sufficient support. Such support members may be permanent or may be temporarily placed when the potting compound is uncured and removed when the potting compound is cured. Each divider can be flexible or non-flexible. The separator may be solid or may have a porous structure. When the separator has a porous structure, the pores may be closed and the potting compound is not allowed to permeate through the separator, or the pores may be open or partially open as long as the penetration of the uncured potting compound is sufficient Slow so that the potting compound does not vent through the separator before curing. If the aperture is small and/or the potting penetration distance required for the potting compound is sufficiently long, and the potting compound has sufficient viscosity to move the uncured potting glue from one side of the partition to the other side of the partition This slow penetration can be achieved by the amount of time that will be spent after the potting agent is dispensed into the power conversion device provided with the separator. Any polymer solid or porous material can be used to prepare the separator, including polyurethane, organopolyoxane, poly Isobutylene, polybutadiene, or any of the monomers used to form repeating units of any of the foregoing (eg, polyisocyanate/polyol, PDMS D5, isobutylene, 1,3-butadiene) or oligomer Copolymer of one or more. The separator may also be prepared from a cellulose or lignin-based material, such as paper, which may be treated with a surface coating material. The separator is preferably prepared from a material having a lifetime longer than or equal to the life of the power conversion device (i.e., 25 years or longer). The separator is preferably electrically insulating (i.e., non-conductive) so as not to interfere with the normal operation of the power conversion device in which the separator is disposed. The separator may not contain components that would inhibit potting of the potting compound. For example, the separator may not contain phosphoric acid and its derivative materials.

The separator may have any thickness as long as it satisfies the characteristics described in the paragraph immediately before this paragraph. On the other hand, the separator may not be so thick as to hinder the layout of the components or unnecessarily increase the size of the device. In a typical embodiment, for microinverters and other small size devices, the separator has a thickness of 0.1, 0.5, 1, 2, or 3 mm. In another embodiment, the separator thickness can be up to 10 mm for larger power converters.

The separator can be constructed by any conventional means suitable for the material from which the segment is made. The polymeric material can be cast, molded, sprayed or formed into a final form of the separator by any means, wherein the starting monomer or uncured material of the polymeric material is processed into a polymer. The separator can be cut or formed from a larger solid or plate.

The separator can be fixed to the PCB in any way. A pressure sensitive adhesive (PSA) can be applied to the edge of the separator adjacent to the PCB board such that the separator Can be pressed and adhered to the PCB. An illustration of such a connection method is shown in the schematic of Figures 2a and 2b, in which PSA 208 is shown. The separator 2071 can be adhered by a PSA, a double-sided tape, or any type of adhesive between itself and the PCB. Fig. 3a is a side view of an embodiment of the invention having a support member for supporting a partition, and Fig. 3b is a top view of the embodiment. As shown in Figures 3a and 3b, as an alternative to attaching the separator directly to the PCB, for example, a support member 309 having a connecting appendage adjacent the PCB 304 at the end may be adhered to the separator 3071. As shown in Figures 3a and 3b, the support member 309 can be embedded in the divider 3071. Alternatively, the support member can be attached to the exterior of the separator by an adhesive. The partition 3071 is connected to the PCB 304 by the connection support member 309 instead of the connection spacer 3071 itself or by the connection support member 309 in addition to the connection spacer 3071 itself. The support member 309 can be attached to the PCB using an adhesive or by friction fitting it into the separator to support the separator. Support member 309 can also be soldered to PCB 304. The support member can be a rod or a narrow plate and can be made of the same or a different material than the partition. The support member 309 can have an external screw-threaded fastener such as a screw adjacent the end of the PCB 304 and connected to the PCB 304 by the screw.

The PCB may be specifically designed for use with the separator of the present invention such that it may have grooves and/or receiving holes for the placement and attachment of the divider. The configuration of the PCB has a receiving structure for the support member, such as a serrated region or hole that matches the cross-sectional size and shape of the support member and the receiving threads of the screw-threaded member for the support member. The layout of the PCB takes into account the location of the divider and can be classed The height-like components are combined.

Thus, it is expected that the amount of potting glue required to effectively protect the components of the power converter is 10, 20, 30, 40 or even 50% less than prior art power converters lacking one or more dividers. This is advantageous for reducing the amount of potting and thereby reducing the cost of the potting glue necessary to protect the power converter, and also because the space above the shortest component allows the potting compound to thermally expand, thereby reducing the need for shorter components. Thermal stress. The reduction in potting amount also reduces the weight of the converter, which reduces the mechanical support required to support the converter, thereby reducing the cost and reducing the mechanical stress on any structure that supports the heat exchanger.

The potting glue used for each compartment may be the same or different. It may be advantageous to match the heat capacity of the potting compound to electrical or electronic components in a particular compartment.

Potting compound composition. The potting composition used as the potting compound of the present invention can be any potting compound currently used with the converter. It is preferably thermally conductive and is suitable for protecting electrical and/or electronic components of the power converter from environmental factors. If a curable material is used, the cured composition is non-flammable. By "non-flammable" is meant that it exceeds the flammability UL 94 rating of V-1 or better. The cured composition preferably exceeds UL 94 V-1 at a thickness equal to or less than 4 mm, preferably at a thickness equal to or less than 2 mm.

The polymer comprising the polymer composition can be a polyurethane, an organopolyoxane, a polyisobutylene, a polybutadiene, or a copolymer comprising monomers or oligomers of any of the foregoing. A preferred polymer is an organopolyoxane. Examples of potting gels include commercially available compositions, for example for organic based Polysiloxane composition of Dow Corning Sylgard® 160, Sylgard® 170, CN-8760, Shin Etsu KET 132, Beginor Besil 340, and EFI polymer 30222/40020, Epic resin S7202 for polyurethane based compositions -04.

An exemplary organopolyoxane composition for use in the practice of the invention is a cured material of a curable composition comprising an organopolysiloxane, a curing agent, and a catalyst. Examples of such organopolyoxanes can be found in PCT patent application PCT/CN12/076460.

Component (A) is an organopolyoxane having an average of at least 0.5, more typically two or more fluorene-bonded alkenyl groups per individual polymer molecule, and may be a single polymer, or A mixture of two or more polymers. Component (A) may be linear (including cyclic structures) or branched.

Component (A) can also be defined as an organoalkyl polyoxane. (A) The fluorene-bonded alkenyl group of the organopolyoxyalkylene is not particularly limited, and examples of suitable alkenyl groups are a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexenyl group. Each alkenyl group can be the same or different and each can be independently selected from all other alkenyl groups. Each alkenyl group can be a terminal group or a pendant group, and both can be present in the organoalkyl polyoxane of (A). Vinyl is preferred.

In various embodiments, component (A) can have the formula: Formula (I): R ¹ ₂ R ² SiO(R ¹ ₂ SiO) _d (R ¹ R ² SiO) _e SiR ¹ ₂ R ² , II): R ¹ ₃ SiO(R ¹ ₂ SiO) _f (R ¹ R ² SiO) _g SiR ¹ ₃ , or a combination thereof.

In the formulae (I) and (II), each R ^{1 is} independently a monovalent organic group free of an aliphatic unsaturated group, and each R ^{2 is} independently an aliphatic unsaturated organic group. R ¹ includes, but is not limited to, an alkyl group having any one of 1 to 10 carbon atoms, such as a methyl group; an ethyl group; isomers of the following groups: propyl, butyl, pentyl, hexyl, g. And octyl groups such as phenyl, tolyl, xylyl, benzyl and 2-phenylethyl. Each R ^{2 is} independently an aliphatically unsaturated monovalent organic group exemplified by an alkenyl group such as a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group or a heptenyl group. R ² may include a halogen atom or a halogen group.

The subscript "d" typically has an average of at least 1, but may have a value ranging from 0.1 to 2000. The subscripts "e" and "f" can each be 0 or a positive number. Alternatively, the subscript "e" may have an average value ranging from 0 to 2000. The subscript "g," has an average value of at least 1, and more typically has a minimum of 2. Alternatively, the subscript "g," may have an average value ranging from 1 to 2000.

In various embodiments, component (A) is also defined as an alkenyl dialkyl formamidine-terminated polydialkyl decane. In particular, polydialkyloxane can also be defined as: polydimethyl methoxy oxane (PDMS), methyl (3,3,3-trifluoropropyl) polyoxy siloxane, methyl ethylene a copolymer of a base oxane and dimethyl methoxy alkane, a copolymer of methyl (3,3,3-trifluoropropyl) decane and dimethyl methoxy olefin, methyl phenyl vinyl fluorene a copolymer of oxyalkane and dimethyloxane, or an organosiloxane copolymer composed of a siloxane unit represented by the formula: (CH ₃ ) ₃ SiO _1⁄2 , (CH ₃ ) ₂ (CH ₂ = CH) SiO _1⁄2 , CH ₃ SiO _3/2 , (CH ₃ ) ₂ SiO _2/2 . Each of these polymers is capped, i.e., terminated at the end of one or two molecules by a dimethylvinyl methoxy or methyl phenyl vinyl methoxy or stanol group. The aforementioned oxane may contain some amount of a phenyl group in place of a methyl group.

Component (B) is a crosslinking agent having an average of at least 2, 3 or more than 3 fluorene-bonded hydrogen atoms per molecule, and may include decane or a decane, such as a polyorganosiloxane. The hydrazine-bonded hydrogen atom may be a terminal group or a pendant group. Component (B) may further comprise a substituted or unsubstituted monovalent hydrocarbon group. Examples of suitable unsubstituted monovalent hydrocarbon groups include alkyl groups having any of between 1 and 10 carbon atoms, such as methyl; ethyl; isomers of the following groups: propyl, Butyl, pentyl, hexyl, heptyl, octyl; cyclopentyl, cyclohexyl or similar cycloalkyl; phenyl, tolyl, xylyl or similar aryl; benzyl, phenethyl or the like Aralkyl; or 3,3,3-trifluoropropyl, 3-chloropropyl or similar haloalkyl. Preferred is an alkyl group, specifically a methyl group.

Component (B) may further comprise a oxoxane unit including, but not limited to, HR ³ ₂ SiO _1/2 , R ³ ₃ SiO _1/2 , HR ³ SiO _2/2 , R ³ ₂ SiO _2/2 , R ³ SiO _3/2 and SiO _4/2 units, wherein each R ^{3 is} independently selected from monovalent organic groups free of aliphatic unsaturation, as described in the preceding paragraph. In various embodiments, the (B) crosslinking agent comprises or is a compound of the formula: Formula (III) R ³ ₃ SiO(R ³ ₂ SiO)h(R ³ HSiO)iSiR ³ ₃ , Formula (IV) R ³ ₂ HSiO(R ³ ₂ SiO)j(R ³ HSiO)kSiR ³ ₂ H, or a combination thereof.

In the above formulae (III) and (IV), the subscripts "h", "j" and "k" each have an average value ranging from 0 to 2000, and the subscript "i" has an average ranging from 2 to 2000. value. Each R ^{3 is} independently a monovalent organic group. Suitable monovalent organic groups include alkyl groups having 1 to 20, 1 to 15, 1 to 10, 5 to 20, 5 to 15, or 5 to 10 carbon atoms, such as methyl; ethyl; the following groups Isomers: propyl, butyl, pentyl, octyl, decyl, undecyl, dodecyl and octadecyl; cycloalkyl such as cyclopentyl and cyclohexyl; alkenyl For example, vinyl, allyl, butenyl and hexenyl; alkynyl such as ethynyl, propynyl and butynyl; and aryl such as phenyl, tolyl, xylyl, benzyl and 2-phenyl base.

Or component (B) may also be defined as: a copolymer of methylhydrogenpolysiloxane or methylhydroquinone and dimethyloxane, either of which passes at one or two molecular ends a trimethylmethoxy group, a dimethylhydroperoxy group, or a combination thereof, or the like; a cyclic methyl hydrogen polyoxyalkylene; and/or an organic oxime composed of a siloxane unit represented by the following formula Alkane: (CH ₃ ) ₃ SiO _1⁄2 , (CH ₃ ) ₂ HSiO _1⁄2 and SiO _4/2 ; tetrakis(dimethylhydroquinooxy)decane, or methyl-tris(dimethylhydroquinoneoxy)decane Or dimethylpolyoxane, which is terminated at one or two molecular ends by any combination of the above groups, as long as at least one of these groups contains a hydrazine-bonded hydrogen atom.

Component (B) is also contemplated to be or comprise a combination of two or more organohydrogenpolyoxanes differing in at least one of the following characteristics: structure, average molecular weight, viscosity, oxane unit and sequence. Component (B) may also comprise decane. A dimethylhydroquinone-terminated polydimethyloxane having a relatively low degree of polymerization (DP) (eg, a DP range of 3 to 100) is generally referred to as a chain extender, and component (B) A portion of it can be or contain a chain extender. In one embodiment, component (B) is free of halogen atoms. In another embodiment, each molecule of component (B) comprises one or more halogen atoms. It is expected that in general the gel may be free of halogen atoms.

The crosslinking agent (B) may have a linear, branched, or partially branched Linear, cyclic, dendritic or resin molecular structure.

The molar ratio of the fluorene-bonded alkenyl group in component (A) to the hydrazine-bonded hydrogen in component (B) is represented herein by the SiH:Vi ratio, which affects component (A) and component (B). The physical properties of the cured material. In the present invention, the SiH:Vi ratio is from 0.1 to less than 1.5. When the SiH:Vi ratio is less than 0.1, the composition is difficult to fully cure. On the other hand, when the SiH:Vi ratio is 1.5 or more, the pressure exerted by the cured polymer on the elements of the power conversion device is increased and the softness reduction is undesirable. Preferably, the SiH:Vi ratio is from 0.1 to 1.2, more specifically from 0.1 to 1.0, and more specifically from 0.3 to 0.7.

Component (C) is a catalyst and is not particularly limited and may be any catalyst known in the art. In one embodiment, component (C) comprises a platinum group metal selected from the group consisting of platinum, rhodium, ruthenium, palladium, iridium or osmium, organometallic compounds thereof, or the like, or combinations thereof. In another embodiment, component (C) is further defined as a fine powder of platinum metal, platinum black, platinum dichloride, platinum tetrachloride; chloroplatinic acid, alcohol modified chloroplatinic acid, chloroplatinic acid Hexahydrate; and complexes of such compounds, such as platinum complexes of olefins, platinum complexes of carbonium, alkenyloxyalkanes such as 1,3-divinyltetramethyldioxane Platinum complex, low molecular weight organopolyoxyalkylene such as platinum complex of 1,3-divinyl-1,1,3,3-tetramethyldioxane, chloroplatinic acid and β-diketone a complex, a complex of chloroplatinic acid with an olefin, and a complex of chloroplatinic acid with 1,3-divinyltetramethyldioxane.

In general, component (C) is present/used in an amount of 0.01 to 1,000 ppm, or 0.1 to 500 ppm, or 1 to 500 ppm, or 2 to 200 ppm, or 5 to 150 ppm, based on the total weight of (A) and (B). .

In an embodiment of the invention, any of the above polymers may be used and may be combined with (D) one or more fillers.

Component (D) is a filler or a combination of fillers. These fillers may be thermally and/or thermally non-conductive, reinforced and/or non-reinforced flame retardants and/or non-flame retardants. The filler can be dry and/or chemically pretreated, or undried and/or not chemically pretreated. Examples of typical fillers include, but are not limited to, any one or any combination of the following: ground quartz (cerium oxide powder), precipitated cerium oxide, pyrogenic cerium oxide, (milled or precipitated) aluminum trihydrate, (grinding) Or precipitated magnesium dihydrate, or alumina.

Thermally conductive fillers are known in the art, see, for example, U.S. Patent 6,169,142 (col. 4, lines 7 to 33). Component (D) may include an inorganic filler, a fusible filler, or a combination thereof. Examples of inorganic fillers are onyx; aluminum trihydrate, metal oxides such as alumina, cerium oxide, magnesium oxide and zinc oxide; nitrides such as aluminum nitride and boron nitride; carbides such as tantalum carbide and tungsten carbide; A combination of bismuth, carbon fiber, diamond, graphite, magnesium hydroxide, and the like.

Component (D) may be a single thermally conductive filler or a combination of two or more thermally conductive fillers that differ in at least one of the following characteristics, such as particle shape, average fineness, fineness distribution, and Type of packing. In certain embodiments, it may be desirable to combine a first thermally conductive filler having a greater average fineness with a second thermally conductive filler having a smaller average fineness to meet a ratio of a closest packed theoretical distribution curve, said The two thermally conductive fillers may have the same or different materials as the first filler. Using a first filler having a large average fineness and having a smaller average finer than the first filler The slightly second filler improves the filling efficiency, reduces the viscosity, and improves heat transfer.

The shape of the thermally conductive filler particles is not particularly limited; however, when the packing density of the thermally conductive filler in the composition is high, the round or spherical particles can prevent the viscosity from increasing to an undesired level. The average fineness of the thermally conductive filler will depend on various factors, including the type of thermally conductive filler selected for component (D) and the exact amount added to the curable composition, as well as the gum of the device in which the cured product of the composition will be used. Layer thickness. In some embodiments, the thermally conductive filler can have an average fineness ranging from 0.1 micrometers to 80 micrometers, or from 0.1 micrometers to 50 micrometers, or from 0.1 micrometers to 10 micrometers.

Thermally conductive fillers are commercially available. For example, fusible fillers are available from Indium Corporation (America, Utica, NY, USA) in U.S.A., Arconium, Inc., of Providence, Rhode Island, USA. RI, USA) and AIM Solder, Cranston, RI, USA, Cranston, Rhode Island. Aluminum fillers are commercially available, for example, from United States Toyal Co., Ltd. (Toyal America, Inc., Naperville, Illinois, USA), Naperville, Ill., and Valimet Co., Ltd., Stockton, California, USA ( Valimet Inc., Stockton, California, USA). Silver fillers are commercially available from Metalor Technologies U.S.A. Corp., Attleboro, Massachusetts, U.S.A., Attleboro, MA. Zinc oxide such as zinc oxide under the trademarks KADOX® and XX® is available from Zinc Corporation of America, Monaco, PA, USA. Monaca, Pennsylvania, U.S.A.) is commercially available. In addition, CB-A20S and Al-43-Me are alumina fillers having different fineness, which are commercially available from Showa-Denko, and AA-04, AA-2 and AA18 are available. Alumina filler commercially available from Sumitomo Chemical Company. Boron nitride fillers are commercially available from Momentive Corporation, Cleveland, Ohio, U.S.A.

The filler may be a flame retardant or may function as a flame retardant. Flame retardants are known in the art. Examples of known flame retardants are carbon black, molten or pyrogenic cerium oxide, cerium, phosphate, phosphinate, polyphosphonate or copolyphosphonate, melamine, metal salts, hydroxides and oxides. , hydrated alumina, metal borate, etc., and combinations thereof. Certain organic hydrazines, decanes and sesquioxanes can also be used as flame retardants. When a hydroquinone-cured polyorganosiloxane is used as the soft tacky gel of the present invention, the use of a flame retardant containing phosphorus, sulfur or nitrogen atoms is generally avoided, thereby minimizing the possibility of hindering curing. See, for example, "The Fire Retardancy of Polymeric Materials" by Kashiwagi and Gilman, pp. 353-389 (2000), which is hereby incorporated by reference.

One or more (D) fillers are dispersed in the component (A) and may be dispersed in (B) to (F). The dispersion can be heat treated, dried, or chemically treated. Optional components (E) and (F) as described below may or may not interact or react with the filler. The total amount of (D) filler based on the total weight of (A) and (B) will be the minimum amount required to achieve the desired functionality, and may be greater than 5, 10, 20, 30, 40 or 50% by weight.

The curable prepolymer, i.e., the monomer or oligomer, is mixed with components (A), (B) and (C) and component (D) in the case of an organic hydrazine composition. The composition cures to a soft, tacky thermally conductive, cured organic oxime product which may be colorless, transparent or colorless translucent, or have a color.

The composition may also comprise optional components.

Component (E), an organic mash, may be added. In other words, component (E) can be described as only one of a functional organic mash and/or a non-functional organic mash or a mixture thereof. In one embodiment, (E) is also defined as a non-functional polydimethyloxane. In another embodiment, (E) is also defined as a vinyl functional polydimethyl siloxane. The term "functional organic mash" generally describes a fluid that is functionalized to undergo a hydrogenation sulfonation reaction, ie, contains an unsaturated group and/or a Si-H group. However, it is contemplated that in addition to one or more unsaturated groups and/or Si-H groups, or in the absence of one or more unsaturated groups and/or Si-H groups, the fluid may comprise one Or a plurality of additional functional groups. In various non-limiting embodiments, (E) is described in one or more of U.S. Patent Nos. 6,020,409, 4,374,967, and/or 6, 001, 918, each of each of each of (E) is not subject to any specific restrictions on structure or viscosity.

In one embodiment, (E) is a functional organic mash and reacts with (A) and/or (B) in the presence of (C) and (D). In other words, the hydrogenated sulfonation reaction product can also be defined as the hydrogenated decylation reaction product of (A), (B) and (E) functional organoxides, wherein (A), (B) and (E) The reaction is carried out by hydrogenation of hydrazine in the presence of (C) and (D). In another embodiment, (A) and (B) are in the presence of (C), (D), and (E) non-functional organic mash The reaction is carried out via hydrazine hydride.

One or more of (A) to (E) may be mixed together to form a mixture, and the mixture may be further reacted with the remaining components in (A) to (E) to form a gel, wherein (E) is An optional component in the mixture or as a remaining component. In other words, any combination of one or more of (A) to (E) can be reacted with any other combination of one or more of (A) to (E) as long as a gel is formed. .

The potting composition can comprise other optional components. The mixture of (A) to (E) or any one or more of them may be independently mixed with, treated by, or reacted with one or more additives. The additional component may be selected from (F) a filler treatment agent, (G) an adhesion promoter, (H) a solvent or a diluent, (I) a surfactant, (J) an acid acceptor, (K) a hydrogenated decylation stabilizer. And combinations of them.

Component (F) is a filler treating agent. The filler for component (D) may optionally be surface treated with a component (F) treating agent. Treatment agents and treatment methods are known in the art, see, for example, U.S. Patent 6,169,142 (col. 4, line 42 to column 5, line 2).

The amount of component (F) may vary depending on various factors, including the type and amount of filler selected for component (D), and whether the filler is treated in situ using component (F) or in other groups with the composition. Dispose of before mixing. However, the composition may comprise component (F) in an amount ranging from 0.1% to 2%.

Component (F) may comprise an alkoxy decane of the formula R ⁶ _m Si(OR ⁷ ) _(4-m) present in the specific component (F) in any proportion, wherein the subscript m is 1, 2 or 3 . Alternatively, the subscript m can be 1 for all molecules in a particular component (F), 2 for all molecules, or 3. for all molecules. Each R ^{6 is} independently a monovalent organic group such as a hydrocarbon group having 1 to 50 carbon atoms or 6 to 18 carbon atoms. Examples of R ⁶ are alkyl groups such as hexyl, octyl, dodecyl, tetradecyl, hexadecyl and octadecyl; and aryl groups such as benzyl, phenyl and phenethyl. R ⁶ may be saturated or unsaturated, branched or unbranched, and unsubstituted. R ⁶ can be saturated, unbranched and unsubstituted.

Each R ⁷ may be an unsubstituted saturated hydrocarbon group having 1 to 4 carbon atoms or 1 to 2 carbon atoms. Examples of the alkoxydecane of the component (H) are hexyltrimethoxydecane, octyltriethoxydecane, decyltrimethoxydecane, dodecyltrimethoxydecane, tetradecyltrimethoxy. Decane, phenyltrimethoxydecane, phenethyltrimethoxydecane, octadecyltrimethoxydecane, octadecyltriethoxydecane, and combinations thereof.

Alkoxy-functional oligomethoxyoxanes can also be used as treating agents. Alkoxy-functional oligoaluminoxanes and processes for their preparation are known in the art, see for example EP 1101167 A2. For example, suitable alkoxy-functional oligoamoxines include those of the formula (R ⁸ O) _n Si (OSiR ⁹ ₂ R ¹⁰ ) _(4-n) . In the formula, the subscript n is 1, 2, or 3, or n is 3. Each R ⁸ can be an alkyl group. Each R ⁹ may be independently selected from saturated and unsaturated monovalent hydrocarbon groups having from 1 to 10 carbon atoms. Each R ¹⁰ may be a saturated or unsaturated monovalent hydrocarbon group having at least 11 carbon atoms.

The metal filler may be an alkyl mercaptan such as octadecyl mercaptan or the like; and a fatty acid such as oleic acid, stearic acid; titanate; a titanate coupling agent; a zirconate coupling agent; .

The treating agent for alumina or passivated aluminum nitride may include an alkoxycarbendanyl-functional alkylmethyl polyoxyalkylene (eg, R ¹¹ _O R ¹² _p Si(OR ¹³ ) _(4-op) A partially hydrolyzed condensate or cohydrolyzed condensate or mixture) or a similar material, wherein the hydrolyzable group may include a decazane, a decyloxy group or a hydrazine. Among all of these groups, a group attached to Si (for example, R ¹¹ in the above formula) is a long-chain unsaturated monovalent hydrocarbon or a monovalent aromatic functional hydrocarbon. Each R ^{12 is} independently a monovalent hydrocarbon group, and each R ^{13 is} independently a monovalent hydrocarbon group having 1 to 4 carbon atoms. In the above formula, the subscript o is 1, 2 or 3, and the subscript p is 0, 1 or 2, provided that "o+p" is the sum of "o" and "p" is 1, 2 or 3. . The treating agent may also be a polyorganosiloxane, and may include those having the formula R ¹⁶ ₃ Si(OSiR ¹⁷ ) _r OSi(OR ¹⁸ ) ₃ , wherein each of R ¹⁶ , R ¹⁷ and R ^{18 is} independently a monovalent alkane A base such as a methyl group, and the subscript "r" is from 1 to 200. One skilled in the art can optimize the specific treatment to aid in the dispersion of the filler without undue experimentation.

Component (G) is an adhesion promoter. Suitable adhesion promoters may include alkoxy decanes of the formula R ¹⁴ _q Si(OR ¹⁵ ) _(4-q) wherein the subscript q is 1, 2 or 3, or q is 3. Each R ^{14 is} independently a monovalent organic functional group. R ¹⁴ may be an epoxy functional group such as glycidoxypropyl or (epoxycyclohexyl)ethyl, an amino functional group such as aminoethylaminopropyl or aminopropyl, methacryloxypropyl, or unsaturated. Organic group. Each R ^{15 is} independently an unsubstituted saturated hydrocarbon group having at least 1 carbon atom. R ¹⁵ may have 1 to 4 carbon atoms, or 1 to 2 carbon atoms. R ^{15 is} exemplified by methyl, ethyl, n-propyl and isopropyl.

Examples of suitable adhesion promoters include glycidoxypropyl trimethoxy decane and glycidoxypropyl trimethoxy decane with aluminum A combination of a chelate or a zirconium chelate. An example of an adhesion promoter for a hydrogenated decylated curable composition can be found in U.S. Patent 4,087,585 and U.S. Patent 5,194,649. The curable composition may comprise from 0.5% to 5% by weight of the composition of an adhesion promoter.

The component (H) solvent or diluent can be added during the preparation of the composition, for example to aid in mixing and delivery. All or a portion of component (H) may optionally be removed after preparation of the composition.

Component (I) is a surfactant. Suitable surfactants include organoindole polyethers, ethylene oxide polymers, propylene oxide polymers, copolymers of ethylene oxide and propylene oxide, other nonionic surfactants, and combinations thereof. The composition may comprise up to 0.05% by weight of surfactant based on the weight of the composition.

Component (J) is an acid acceptor. Suitable acid acceptors include magnesium oxide, calcium oxide, and combinations thereof. The composition may comprise up to 2% of component (J) based on the weight of the composition.

Component (K) is a hydrogenated decylation stabilizer for preventing premature curing of the curable composition. In order to adjust the curing speed and improve the treatment of the composition under industrial conditions, the composition may be combined with an alkyne alcohol, an enyne compound, a benzotriazole, an amine such as tetramethylethylenediamine, a dialkyl fumarate, two Alkenyl fumarate, dialkoxyalkyl fumarate, maleate such as diallyl maleate, and combinations thereof are further mixed. Alternatively, the stabilizer can include an alkynol. Specific examples of such compounds are as follows: 2-methyl-3-butyn-2-ol, 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyne 3-ol, 2-phenyl-3-butyn-2-ol, 3-phenyl-1-butyne-3- Alcohol, 1-ethynyl-1-cyclohexanol, [(1,1-dimethyl-2-propynyl)oxy]trimethylnonane, methyl (tris(1,1-dimethyl)- 2-propynyloxy)) decane or a similar acetylene compound; 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexene-1-yne or the like Enyne compounds; other additives may include ruthenium-based compounds, phosphine-based compounds, thiol-based compounds, cycloalkenyl siloxanes such as methylvinylcyclodecane such as 1,3,5,7-tetramethyl 1,-3,5,7-tetravinylcyclotetraoxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetraoxane, benzene And triazole, or a similar triazole. The content of such an inhibitor in the hydrogenated decylated curable thermally conductive silicone elastomer composition may range from 0.0001 to 5 parts by weight per 100 parts by weight of component (A). Suitable hydrogenated methyl sulfonylation cure inhibitors are disclosed, for example, in U.S. Patent Nos. 3,445,420, 3,989,667, 4,584,361, and 5,036,117.

Those skilled in the art will recognize that when selecting components of the above compositions, there may be overlap between the types of components, as some of the components described herein may have more than one function. For example, certain alkoxydecanes can be used as filler treating agents and adhesion promoters, and certain plasticizers such as fatty acid esters can also be used as filler treating agents. Those skilled in the art will be able to distinguish and select the appropriate components and amounts thereof depending on various factors, including the intended use of the composition, and whether the composition will be prepared as a one-part or multi-part composition.

The composition can be prepared by a method comprising mixing all of the components by any convenient means such as stirring at ambient temperature or elevated temperature. When the composition is prepared at elevated temperatures, the temperature of the preparation process is lower than the curing temperature of the composition.

The method can include the steps of providing components (A) through (D) (and optionally (E)), and mixing one or more of (A) through (E) together. The components (A) to (D) and optionally (E) may be mixed and provided in one ready-to-use portion (single portion) or into two portions (two portions) which will need to be mixed before application. In the case of a two-part system, there is no limitation on the mixing ratio, and the mixing ratio may be one to one or unequal. The process may also include the step of curing or partially curing (A) and (B) via a hydrogenation alkylation reaction in the presence of (C) and (D) and optionally (E). This curing can occur without the use of heat or alternatively via heating. It is also contemplated that (A) and (B) may be reacted or cured in the presence of one or more of the foregoing additives or the other monomers or polymers described above.

When component (F) is present, the composition may optionally be surface treated by using component (G) to component (D) (and component (F), if present), and then the product and composition thereof The other components are mixed to prepare. Alternatively, the composition can be prepared as a multi-part composition, such as when component (K) is not present, or when the composition will be stored for a prolonged period of time prior to use. In a multi-part composition, the cross-linking agent and catalyst are stored in separate parts and the parts are mixed just prior to use of the composition. For example, a two-part curable organic bismuth composition can be mixed by a matrix polymer, a catalyst, a component of a thermally conductive filler and a plasticizer, and one or more additional components by any convenient means (eg, agitation) in the matrix portion. preparation. The curing agent portion can be prepared by mixing a component including a crosslinking agent, a matrix polymer, a thermally conductive filler, and a plasticizer, and one or more additional components via any convenient means such as stirring. Mixing components at ambient or elevated temperatures, depending on The curing mechanism chosen. When a two-part curable organic bismuth composition is used, the weight ratio of the amount of the matrix to the curing agent may range from 1:1 to 50:1; any ratio within the range may be selected as a suitable ratio according to convenience. Those skilled in the art will be able to prepare curable compositions without undue experimentation.

method. The present disclosure also provides methods of forming electronic articles. The method includes providing a printed circuit board (PCB), electronic and electrical components on the PCB (such components are operatively coupled for converting power), one or more dividers and potting glue; electrical and electronic components Operatively assembled with the PCB for converting electrical power to obtain an assembled converter component; placing the assembled transducer component in a housing; operatively passing one or more dividers through the adhesive or connecting component Connected to the PCB to form a separation space that is only open on the opposite side of the PCB; the potting compound is dispensed into the separation space such that all electrical and electronic components are completely encapsulated in the separation space; and the potting compound is cured.

More particularly, the potting compounds useful in the present invention can be prepared by any suitable means, including conventional means of preparing such curable polymers, but in particular, the soft tacky curables described herein. The gel can be formed by the aforementioned step of forming a gel. Prior to dispensing the uncured potting composition into the housing, it is thoroughly degassed to remove air from the uncured fluid and mix all components. Degassing and mixing can be accomplished by a commercially available mixer-distributor.

The potting compound can be dispensed into the separation space before or after the housing cover is placed. If the potting compound is dispensed before placing the cover, it is separated from it The top of the space is dispensed to cover all of the components in the surrounding area and to be dispensed from the area of the PCB that is not surrounded by the spacers, so that the potting fills any space under and around the PCB and covers the lowest components, then places Cover to close the housing. For the potting compound to be dispensed after the cover is placed, the cover has one or more dispensing holes corresponding to each position of the partition space surrounded by the partition, and the potting glue is dispensed from the dispensing hole into the partition space .

Those skilled in the art will appreciate that the techniques disclosed herein are representative of the techniques discovered by the inventors to practice the invention. However, it will be apparent to those skilled in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; All percentages are in % by weight.

21, 23 ‧ ‧ separation space

201‧‧‧ housing

202‧‧‧ Cover

204‧‧‧PCB

205‧‧‧Encapsulation

206‧‧‧ hole

208‧‧‧PSA

2031, 2032, 2033‧‧‧ components

2031h, 2071h‧‧‧ height

2071, 2073‧‧‧ partitions

Claims (11)

A power conversion device comprising: a printed circuit board (PCB) having at least one region; electronic and electrical components on the PCB, the components being operatively coupled to each other for converting power; one or more dividers Each separator has an edge; and a potting compound, characterized in that each separator is in contact with the PCB at its edge such that the at least one region of the PCB is surrounded by one or more separators to form One or more isolation regions, each isolation region defining a separation space over a different region of the PCB and being open only on the opposite side of the PCB, each such region of the PCB supporting one or more Electrical or electrical components, each such compartment being at least partially filled with the potting compound such that the potting compound completely encloses all of the electronic or electrical components located in the area and is not In a portion of the PCB surrounded by a separator, the PCB is completely covered by the potting compound, wherein a void above the potting compound is present over at least one region of the PCB, the potting Covering at least one area of the PCB in an electronic or electrical component. The power conversion device of claim 1, wherein the separator is connected to the PCB by a connection. The power conversion device of claim 2, wherein the connection means is a binder. The power conversion device of claim 3, wherein the binder is a pressure sensitive adhesive. The power conversion device of claim 1, wherein the partition further comprises a support member. The power conversion device of claim 5, wherein the separator is connected to the PCB through the support member. The power conversion device of claim 5, wherein the separator is connected to the PCB by a connection and through the support member. The power conversion device according to any one of claims 1 to 7, wherein the separator comprises a copolymer of polyurethane, organopolyoxane, polyisobutylene or the like. The power conversion device of claim 1, wherein the power conversion device is a junction box, a micro inverter, a power optimizer, or a light emitting diode converter. A photovoltaic device comprising the power conversion device of claim 6. A method of manufacturing a power supply device, the method comprising the steps of: a) operatively assembling electrical and electronic components with a printed circuit board (PCB) for converting electrical power to obtain a primary assembled converter component, The PCB has at least one (two?) regions; b) one or more spaced apart dividers are operatively coupled to the assembled transition by connecting each edge of the divider to the PCB The PCB of the component, thereby forming one or more separation regions defining one or more separation spaces, each separation region only The opposite side of the PCB is open to obtain a secondary assembled converter section element; c) placing the secondary assembled converter component into the housing; d) dispensing the potting compound to the Each of the compartments of the secondary assembled converter element to completely enclose all of the electrical and electronic components in the separation space; e) dispensing the potting compound to completely encapsulate the conversion of the secondary assembly a remaining portion of the PCB of the device element; and f) curing the potting compound to obtain the power supply device, wherein a void above the potting compound is present over at least one region of the PCB, the irrigation The sealant covers the electronic or electrical components in at least one region of the PCB.