CN104051387B - Metal Post Bonding Using Pre-Fabricated Metal Posts - Google Patents
Metal Post Bonding Using Pre-Fabricated Metal Posts Download PDFInfo
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- CN104051387B CN104051387B CN201310479255.6A CN201310479255A CN104051387B CN 104051387 B CN104051387 B CN 104051387B CN 201310479255 A CN201310479255 A CN 201310479255A CN 104051387 B CN104051387 B CN 104051387B
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Abstract
A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
Description
This application claims entitled " the metal post bonding using pre- submitting on March 15th, 2013
The priority of the 61/798th, No. 553 U.S. Provisional Application of fabricated metal posts ", entire contents are incorporated into
This is as reference.
Technical field
This patent disclosure relates generally to quasiconductor, more particularly, to the side of the device of inclusion metal colonnade, formation metal colonnade
Method and the device for jointing metal post.
Background technology
In the joint of integrated circuit, solder areas, copper pillar etc. are used for for component pipe core being bonded to package substrate.However,
Tube core and package substrate can occur warpage.In addition, packaging technology frequently involves the thermal process that packaging part is heated.Due to envelope
Piece installing includes the different materials with different heat expansion coefficient (cte), so stress is applied on packaging part upon engagement.Example
As package substrate generally has bigger cte than component pipe core.This leads to stress to be applied to solder areas.Because stress is also logical
Cross solder areas and be transferred to component pipe core, therefore lead to the dielectric medium in component pipe core to be layered.
A kind of method solving this problem is that metal column is used as the cross tie part of component pipe core and package substrate.Metal column
Longer than common solder areas and metal mainstay (metal pillar), therefore can absorb stress.By metal lead wire is engaged
On one of component pipe core and package substrate, and cut metal lead wire afterwards to form metal column.Therefore, metal lead wire
In remaining and connect to engage ball part be metal column.However, this technique has low-down volume of production.In addition, very
The difficult concordance controlling metal lead wire length.
Content of the invention
According to an aspect of the invention, it is provided a kind of device, it includes metal colonnade.Wherein, metal colonnade includes:
Multiple metal columns, multiple metal columns have through the size configuring to be bonded to IC-components；And interconnecting parts, will be many
Individual metal column is connected as metal colonnade.
Preferably, interconnecting parts include and multiple metal column identical metals, and each of multiple metal column is big
Part all with the metal post separation that is adjacent in multiple metal columns.
Preferably, interconnecting parts are continuously connected to multiple metal columns, do not have between interconnecting parts and multiple metal column
Form interface.
Preferably, each of multiple metal columns includes: internal；And metal material, gold different from internal material
Belong to and at the first end of each metal column in multiple metal columns for the material, cover inside.
Preferably, each of multiple metal columns also includes: second end relative with first end, and inside is at the second end
Place is not covered by the metallic material.
Preferably, multiple metal columns include straight metal column.
Preferably, multiple metal columns include bending metals post.
According to a further aspect in the invention, there is provided a kind of method, comprising: form multiple metal columns, by positioned at multiple
Vulnerable area between the adjacent metal post of metal column interconnects multiple metal columns to form metal colonnade, and vulnerable area includes and many
The gold being adjacent in individual metal column identical metal, and the major part of each of multiple metal column and multiple metal columns
Belong to post separation；And the end of each with the multiple metal column of metal-plated.
Preferably, the step forming multiple metal columns includes: forms the photoetching of patterning on the opposite side of metallic film
Glue；And etching metallic film, to form multiple metal columns.
Preferably, the step forming multiple metal columns includes: supply metal film passes through two roller bearings including teeth portion
Between, metallic film is molded by roller bearing, to form multiple metal columns.
Preferably, after through two roller bearings, multiple row metal column is formed by metal film simultaneously.
Preferably, the method also includes: the layer gold with nickel dam and above nickel dam plates each of multiple metal columns
Individual end.
Preferably, the method also includes: multiple metal columns are arranged in metal column conservator；From metal column conservator
Take out one of multiple metal columns metal column；One of multiple metal columns metal column is bonded to metal pad；And it is right
In multiple metal columns, remaining metal column repeats the step taken out and engage.
Preferably, the step taking out one of multiple metal columns metal column includes: using chopper cutting edge from gold
Belong to a metal column cutting out multiple metal columns in colonnade；One metal column of multiple metal columns is pushed to the groove in chopper
End；And make a metal column of multiple metal columns be clamped in the end of groove.
According to another aspect of the invention, there is provided a kind of device, comprising: metal column conservator, it is configured to storage mutually
Even to form multiple metal columns of row；And chopper.Wherein, chopper is configured to: the foremost in the multiple metal columns of taking-up
One metal column；And a metal column of the foremost in multiple metal columns is bonded on metal pad.
Preferably, metal column conservator also includes feed mechanism, and it is configured to promote forward metal colonnade.
Preferably, chopper includes being configured to a gold cutting out the foremost in multiple metal columns from metal colonnade
Belong to the cutting edge of post, and this device also includes fixture, this fixture is configured to: one of multiple metal columns metal column is pushed away
End to the groove in chopper；And make a metal column of multiple metal columns be clamped in the end of groove.
Preferably, each of multiple metal columns are all straight metal columns, and metal column conservator and groove have by
It is configured to be suitable for the inner space of the straight of multiple metal columns.
Preferably, each of multiple metal columns is bending metals post, and metal column conservator and groove have and joined
It is set to the inner space of the bending of suitable multiple metal column.
Preferably, chopper be configured to ultrasonic bonding engaging a metal of the foremost in multiple metal columns
Post.
Brief description
In order to be more fully understood from embodiment and its advantage, come with reference to following description presently in connection with accompanying drawing, wherein:
Fig. 1 and Fig. 2 is the perspective view of the metal column according to some exemplary embodiments；
Fig. 3 a to Fig. 4 c shows according to some exemplary embodiments for forming the exemplary formation process of metal column；
Fig. 5 and Fig. 6 shows and takes out straight metal column from metal column conservator according to some exemplary embodiments；
Fig. 7 shows and takes out bending metals post from metal column conservator according to some exemplary embodiments；
Fig. 8 shows and according to some exemplary embodiments, metal column is bonded on metal pad；And
Fig. 9 shows that the many choppers (multi-capillary) according to some exemplary embodiments engage.
Specific embodiment
The discussed in detail below manufacture of embodiments of the invention and use.It will be appreciated, however, that the invention provides being permitted
The applicable inventive concept how can realize in various specific environments.The specific embodiment discussed is only schematic
, and do not limit the scope of the invention.
Metal column manufacturing process is provided according to each exemplary embodiment and prefabricated metal column is bonded on encapsulation
Method on part.Show the interstage forming metal column and jointing metal post.Discuss the deformation of embodiment.In the whole text
Each view and illustrative embodiment in, similar reference number is used for representing similar element.
Fig. 1 illustrates the perspective view of multiple metal columns 20.According to some embodiments, metal column 20 includes copper.In optional enforcement
In example, metal column 20 includes aluminum, tungsten, stannum etc..Metal column 20 can be used for forming the bonding wire in the packaging part of integrated circuit,
And can be used for engaging two package parts of such as component pipe core, intermediary layer, package substrate, printed circuit board (PCB) (pcb)
Together.Alternatively, metal column 20 is used as to detect the probe of integrated circuit.Therefore, they are determined according to the purposes of metal column 20
Length and width.In certain embodiments, length l of metal column 20 is in the range of about 60 μm to about 500 μm, and metal column
20 width w is in the range of about 15 μm to 100 μm.In the exemplary embodiment shown, metal column 20 forms row 120.
The major part of each metal column 20 is separated with adjacent metal column 20, and can be with its physical separation.?
In some embodiments, little vulnerable area 22 is retained between adjacent metal column 20, and metal column 20 is mutually linked as arrange
120.Thus, part 22 is used as the interconnecting parts of metal column 20.In certain embodiments, as shown in figure 1, two adjacent metal posts
20 are interconnected by a vulnerable area 22.In an alternative embodiment, two adjacent metal columns 20 are by two or more thin
Weak part 22 interconnects.Vulnerable area 22 can will be thinner than the major part of each metal column 20, thus weaker, therefore may be used
To be destroyed like that as desired without destroying metal column 20.
In certain embodiments, the end 20 ' of metal column 20 can be coated with the non-oxidizability improving metal column 20 and bonding
The metal material of property.According to some embodiments, for example, plate nickel dam 24 in the end of each metal column 20.Furthermore, it is possible to
Layer gold 26 is plated on nickel dam 24.In certain embodiments, layer gold 26 covers a part for the nickel dam 24 in same metal column 20
Rather than all.Nickel coating 24 and layer gold 26 can be come using chemical plating.It is alternatively possible to implementing chemical nickel and gold (enig), changing
Learn nickel plating chemical palladium-plating (enep), chemical nickel plating palladium soaks golden (enepig), wicking (imsn), leaching silver (imag), leaching gold (imau)
Etc. plating the end 20 ' of metal column 20.In certain embodiments, plate one end of each metal column 20, and do not plate the other end.But
It is that in an alternative embodiment, two ends all can be plated.In other embodiments, two ends are not all plated.In an alternative embodiment,
Metal column 20 is coated with blanket sealer, and blanket sealer can have and the material discussed and structure identical material
Material and structure.Although not being shown specifically, the nickel dam 24 being on adjacent metal post 20 and layer gold 26 can be separated from each other.
Fig. 2 shows metal column 20 according to alternative embodiment.In addition to so that metal column 20 is bent to form Microspring, this
A little embodiments are similar to the embodiment in Fig. 1.For example, metal column 20 can have n shape as shown in Figure 2 and (have in a zigzag
Pattern).Because when bending metals post is under stress, its shape can easily change, so bending metals post 20
It is suitable to absorb stress.
Fig. 3 a to Fig. 4 c illustrates the illustrative processes for forming metal column 20.Fig. 3 a and Fig. 3 b respectively illustrates according to one
The top view and the sectional view that are formed during metal column 20 of a little embodiments.With reference to Fig. 3 a, provide metal film 30.Metal film 30 include with
The base material identical material of metal column 20, and copper, aluminum, tungsten, stannum or their alloy can be included.Photoresist 32 is formed at gold
Belong to the opposite sides of film 30 and be patterned.As shown in Figure 3 b, positioned at the pattern of the photoresist 32 of metal film 30 opposite sides
Can overlap each other, Fig. 3 b is the sectional view being obtained by the section curve 3b-3b in Fig. 3 a.In certain embodiments, as Fig. 3 a
Shown, photoresist 32 includes multiple band portion 32a, multiple band portion 32a of (the y direction in Fig. 3 a) in a first direction upper longitudinal extension
Between be separated from each other by interval.Additionally, photoresist 32 is additionally included in the band portion 32b of x direction extension, wherein, photoresist part
32b interconnects photoresist part 32a.It is used for making the major part of metal column 20 separated from one another with portion 32a.In subsequent technique,
Band portion 32b is used for forming vulnerable area 22(Fig. 1).
Then, by metal film 30 with the photoresist 32 that is located on metal film immerses in etching solution (not shown) with etch gold
Belong to film 30.Therefore, form metal column 20 as shown in Figure 1.During etching metal film 30, because etching is isotropism
, so the shape of the sectional view of metal column 20 can have rounded chamfer.Guarantor due to photoresist part 32b in such as Fig. 3 a
Shield, forms vulnerable area 22(Fig. 2).By suitably adjusting band portion 32b(Fig. 3 a) size, due to isotropic etching, gold
Belong in film 30 and being partially etched by the part covering with portion 32b, but be not removed completely.Taking out from etching solution
After metal film 30 and photoresist 32, remove photoresist 32.In a subsequent step, cambium layer 24 and layer 26 on metal column 20
(Fig. 1).Bending metals post 20(Fig. 2 will formed) embodiment in, implement mechanical bend technique so that metal column 20 bends
For desired shape.
Fig. 4 a, Fig. 4 b and Fig. 4 c show metal column 20 according to the alternative embodiment sectional view in forming process and bow
View.As shown in sectional view 4a, first, metal film 30 scrolling on bobbin 34.Although not shown in Fig. 4 a, metal film 30
It can be elongated metal band.Two roller bearings 36 are disposed opposite to each other, and metallic film 30 is through them.Roller bearing 36 is as shown
Direction 39 rotates, thus molding metal 30.Metal film 30 after molding is pulled to bobbin 40, and rolls up on bobbin 40
Dynamic.Arrow 38 represents and applies a force upon on roller bearing 36 with molding metal 30.After with roller bearing 36 molding, metal film 30 is formed
Metal column 20, and metal column 20 also schematically shows in FIG.Also as shown in fig. 1 although the major part of metal column 20 that
This separates, but metal column 20 connects still through vulnerable area 22, to form long metal colonnade 120(Fig. 4 c).By interconnection gold
The row 120 that genus post 20 is formed scrolling on spool 40.
Fig. 4 b illustrates the enlarged drawing of a part for the system shown in Fig. 4 a.According to some embodiments, roller bearing 36 has tooth
Portion 42, designs the shape of teeth portion 42 according to the intended shape of the metal column 20 obtaining.The teeth portion 42 of two relative roller bearings 36
Some positions between can have a small-gap suture (not shown), form vulnerable area 22(Fig. 1).The tooth of two relative roller bearings 36
Some other position in portion 42 contacts with each other, and therefore the major part in adjacent metal post 20 is separated from each other.
Fig. 4 c illustrates the top view of system shown in Fig. 4 a.As shown in fig. 4 a, in metal film 30 after roller bearing 36, with
When formed metal column 20 multiple row 120, wherein, the sum of the row 120 simultaneously being formed can be in tens of to thousands of scopes.
Thus, it is efficiently formed metal column 20.
In other embodiment, it is possible to use the additive method of such as galvanoplastics is forming metal column 20.
As shown in Fig. 1 and Fig. 4 c, metal colonnade 120 can be arranged in metal column conservator to facilitate taking-up.As long as
Multiple metal columns 20 can be preserved, and can easily it effectively be taken out, then metal column conservator can have different
Design.In some exemplary embodiments, metal column 20 is saved in metal column box.For example, Fig. 5 and Fig. 6 shows gold
Belong to post 20 and be stored in the exemplary embodiment taking out metal column 20 in metal column box 44 and one by one.With reference to Fig. 5, by metal colonnade
120 are placed in metal column box 44, and metal column box 44 be sized and shaped to be suitable for metal colonnade 120 and metal
The size and dimension of post 20.Metal column box 44 can include feed mechanism 45, when taking out the metal column 20 of foremost, supplies machine
Structure 45 is used for promoting metal colonnade 120 forward.For example, feed mechanism 45 can include spring.The front end 44 ' of metal column box 44 is
Opening, thus take out metal column 20 from front end 44 '.
In an alternative embodiment, for example, metal column 20 is not to be placed in straight metal column box, but rollable,
For example, the metal column 20 of the scrolling on bobbin 40 similar to Fig. 4 a, and rolling can be placed on the shape being suitable to respective roll
In the box of shape.And, corresponding box has opening, thus can be taken off metal column 20.
As shown in Figure 5, in exemplary taking-up technique, chopper 46 is used for taking out metal column 20.Chopper 46 includes cutting
Sword 48, when chopper 46 moves against in metal colonnade 120, cutting edge 48 sharp enough to cut through vulnerable area 22(Fig. 1).Cause
This, in metal colonnade 120, the metal column 20 of foremost is separated with metal colonnade 120.Chopper 46 includes groove 50, the width of groove 50
It is substantially equal to, and the width less times greater than metal column 20.According to some embodiments, when taking out the metal column 20 of foremost,
Chopper 46 can be to metal column 20 applying power of foremost, to be pulled along metal row 120(direction to the right towards in Fig. 5).
Additionally, feed mechanism 45 also provides thrust.Therefore, the mobile metal column 20 to foremost of the second metal column 20 in row 120 it
The position at front place, and after taking out preceding metal column 20, it is changed into the metal column of foremost.As shown in Figure 5 and Figure 6,
After being cut open, metal column 20 is pushed in groove 50 by fixture 52.Next, as shown in Figure 6, fixture 52 is by metal column 20
Push the end of groove 50 to, and so that metal column 20 is clamped in chopper 46.It is then possible to chopper 46 is removed from box 44.
As shown in figure 8, after by fixation, the end 20 ' of metal column 20 is exposed to the bottom of chopper (capillary) 46
Outside.Then, metal column 20 can be bonded to metal pad 54 by chopper 46, wherein, during joint technology, using ultrasound wave
Vibrate and to help engage.Metal pad 54 can be the part of the package parts 56 and 58 shown in Fig. 9.In some embodiments
In, may be easy to form, with metal pad 54, the metal engaging because the end 20 ' of metal column 20 is coated with, therefore, obtained
Joint has good quality.Additionally, because the conventional wire end of the lead cutting down from metal lead wire is not over plating
Layer improves, so the quality engaging can be engaged and shape better than by the directly tradition using the metal lead wire from bobbin
The joint becoming.After metal column 20 in making chopper 46 engages, chopper 46 moves back to box 44(Fig. 5), to take out next metal
Post 20, and additional joint can be executed.
Fig. 7 shows bending metals post 20(according to some embodiments referring also to Fig. 2) storage and taking-up.Except box 44
With the shape and size of the inner space of the groove 50 in chopper 46 be designed to be suitable for bending metals post 20 shape and size it
Outward, these embodiments are essentially identical with the embodiment in Fig. 5 and Fig. 6.For example, in the embodiment of Fig. 7, box 44 and groove 50 interior
Portion space is designed to n shape (with reference to Fig. 2).The joint of bending metals post 20 is essentially identical with the joint shown in Fig. 8.
With reference to Fig. 8, show example package assembly 58, and metal column 20 is bonded on package parts 58.Encapsulation part
Part 58 can be a part for the package parts 56 schematically showing in Fig. 9.In certain embodiments, package parts 56(Fig. 9)
It is the wafer including multiple chips 58, chip 58 can include the active circuit comprising transistor.In an alternative embodiment,
Package parts 56 are the intermediary layer wafers including multiple intermediary layer chips 58, and intermediary layer chip 58 can not include active electrical
Road.In another alternative embodiment, package parts 56 are the package substrate bands including multiple package substrate 58, encapsulation lining
Bottom 58 can be laminated substrates or lamination substrate.In another alternative embodiment, package parts 56 are probe card, connect thereon
Close metal column 20, for use as probe.
Fig. 8 shows the sectional view according to some embodiments as the example package part 58 of chip.Package parts
58 include Semiconductor substrate 202, and Semiconductor substrate 202 can be bulk silicon substrate or silicon-on-insulator substrate.Alternatively, partly lead
Body substrate 202 can include comprising other semi-conducting materials of iii race, iv race and/or v race element.Integrated circuit 204 is formed at
At the surface 202a of Semiconductor substrate 202.Complementary metal oxide semiconductors (CMOS) (cmos) device can be included in integrated circuit 204
Part.In an alternative embodiment, substrate 202 is intermediary layer tube core, package substrate etc..It is the reality of intermediary layer tube core in package parts 58
Apply in example, package parts 58 do not include the active device of such as transistor.In certain embodiments, package parts 58 can include
The passive device of such as resistor and capacitor or do not include passive device.
Package parts 58 be component pipe core embodiment in, package parts 58 can also be included positioned at Semiconductor substrate
The interlayer dielectric layer (ild) 205 of 202 tops, and it is located at the interconnection structure 210 above ild205.Contact plunger 203 is formed at
In ild205, and it is electrically connected to integrated circuit 204.Interconnection structure 210 include dielectric layer 230 and in dielectric layer 230 shape
The metal wire 206 becoming and through hole 208.In certain embodiments, dielectric layer 230 is formed by low k dielectric.For example, low k dielectric
The dielectric constant (k value) of material can be less than about 2.8 or less than about 2.5.Metal wire 206 and through hole 208 can be by copper, copper alloys
Or other conductive materials containing metal are formed.Can use and singly inlay and/or dual-damascene technics formation metal wire 206 and through hole
208.
Metal pad 54 is formed above interconnection structure 210, and can be electrically connected by metal wire 206 and through hole 208
To circuit 204.The dotted line 212 illustrating represents the electrical connection including metal wire and through hole.Metal pad 54 can be aluminum pad or
Aluminum bronze pad.For example, metal pad 54 can include aluminum (in this case, the metal pad between about 1% and about 100%
54 is aluminum pad), and less than about 1% copper.In certain embodiments, metal pad 54 includes copper, aluminum, nickel, palladium, gold, silver
Deng.Metal pad 54 can also have chemical nickel and gold (enig), chemical nickel plating chemical palladium-plating (enep), chemical nickel plating palladium leaching gold
(enepig), the structure of wicking (imsn), leaching silver-colored (imag), leaching golden (imau) etc..By such structure, metal pad 54 is very
Good is bonded to metal column 20.
Fig. 9 is shown with many choppers and metal column is bonded on package parts 56.As shown in Figure 9, it is possible to use multiple split
Knife 46, metal column 20 is simultaneously bonded on package parts 56.Each chopper 46 can carry metal column conservator 44, with
Supplying metal post 20, although multiple chopper 46 can share a metal column conservator 44.Therefore, it can enforcement to simultaneously engage with,
Thus improving the volume of production of joint technology.
In an embodiment of the present invention, using high-throughput technique prefabricated metal post.Due to the formation of coating, improve gold
Belong to the engageable property of post.In addition, in jointing metal post, joint side does not need to be implemented in any used in traditional handicraft taking
Cutting action (such as, using electric spark).As a comparison, in traditional metal formation process, by metal lead wire is connect
It is bonded on metal pad, then, cut metal lead wire (for example, using electric spark) and form metal column.Therefore, the present invention's
It is not necessary to be used for forming the device of electric spark in embodiment, and engagement device is much smaller than traditional chopper.This makes multiple choppers
Can be simultaneously to same package parts action.This improves the volume of production of joint technology.Further, since metal column is prefabricated
, so the length of metal column and shape are unified.
According to some embodiments, a kind of method includes: take out one of metal column from metal column conservator, and will
This metal column is bonded on metal pad, and wherein, metal column is prefabricated.
According to other embodiment, a kind of method includes forming multiple metal columns.Multiple metal columns pass through in multiple metal columns
Adjacent metal post between vulnerable area and interconnect to form metal colonnade.Vulnerable area includes and multiple metal column identicals
Metal.The metal post separation being adjacent in the major part of each in multiple metal columns and multiple metal columns.Multiple metals
The end of each of post is plated with metal.
According to other other embodiment, a kind of device includes: metal column conservator, is configured to preserve interconnection to be formed
Multiple metal columns of row；And chopper.Chopper is configured to take out the metal column of the foremost in multiple metal columns, and will be many
In individual metal column, the metal column of foremost is bonded on metal pad.
Although describe embodiment and its advantage in detail it should be appreciated that, without departing from being defined by the following claims
The spirit and scope of embodiment in the case of, the present invention can be made with multiple changes, substitutions and modifications.Additionally, the application
Scope be not limited to technique described in description, installations, manufacture and material composition, instrument, method and steps
Concrete embodiment again.Those of ordinary skill in the art are from the present invention it can be readily appreciated that can be utilized existing according to the present invention
Or from now on will the function essentially identical to the corresponding embodiment execution of present invention description of exploitation or realize essentially identical
The technique of result, installations, manufacture, material composition, instrument, method or step.Therefore, claims are intended to so
Technique, installations, material composition, instrument, means, method or step include in the range of them.In addition, each power
Profit requires all to constitute independent embodiment, and the combination of multiple claim and embodiment is included within the scope of the invention.
Claims (18)
1. a kind of device including metal colonnade, comprising:
Metal colonnade, comprising:
Multiple metal columns, the plurality of metal column has through the size configuring to be bonded to IC-components；And
Interconnecting parts, the plurality of metal column are connected as described metal colonnade, described interconnecting parts are than the plurality of metal column
Each of major part will be thinner.
2. the device including metal colonnade according to claim 1, wherein, described interconnecting parts include and the plurality of gold
Belong to post identical metal, and be adjacent in the major part of each of the plurality of metal column and the plurality of metal column
Metal post separation.
3. the device including metal colonnade according to claim 2, wherein, described interconnecting parts are continuously connected to described
Multiple metal columns, do not form interface between described interconnecting parts and the plurality of metal column.
4. the device including metal colonnade according to claim 1, wherein, each of the plurality of metal column is wrapped
Include:
Internal；And
Metal material, different from the material of described inside, described metal material is in each metal column of the plurality of metal column
First end at cover described inside.
5. the device including metal colonnade according to claim 4, wherein, each of the plurality of metal column is also wrapped
Include: second end relative with described first end, and described inside do not cover by described metal material at described second end.
6. the device including metal colonnade according to claim 1, wherein, the plurality of metal column includes straight metal
Post.
7. the device including metal colonnade according to claim 1, wherein, the plurality of metal column includes bending metals
Post.
8. a kind of method of formation metal colonnade and jointing metal post, comprising:
Form multiple metal columns, described many by the vulnerable area interconnection between the adjacent metal post of the plurality of metal column
To form metal colonnade, described vulnerable area includes and the plurality of metal column identical metal, the plurality of gold individual metal column
Belong to the metal post separation being adjacent in the major part of each and the plurality of metal column of post；And
The end of each with the plurality of metal column of metal-plated；
The plurality of metal column is arranged in metal column conservator；
Take out one of the plurality of metal column metal column from described metal column conservator,
Wherein, the step taking out the one metal column in the plurality of metal column includes:
Cutting edge using chopper cuts out one metal column of the plurality of metal column from described metal colonnade；
One metal column of the plurality of metal column is pushed to the end of the groove in described chopper；And
One metal column of the plurality of metal column is made to be clamped in the described end of described groove.
9. the method for formation metal colonnade according to claim 8 and jointing metal post, wherein, forms the plurality of metal
The step of post includes:
The photoresist of patterning is formed on the opposite side of metallic film；And
Etch described metallic film, to form the plurality of metal column.
10. the method for formation metal colonnade according to claim 8 and jointing metal post, wherein, forms the plurality of gold
The step belonging to post includes: between supply metallic film passes through including two roller bearings of teeth portion, described metallic film passes through institute
State roller bearing molding, to form the plurality of metal column.
11. methods forming metal colonnade and jointing metal post according to claim 10, wherein, through described two
After between roller bearing, multiple row metal column is formed by described metallic film simultaneously.
12. formation metal colonnade according to claim 8 and the method for jointing metal post, are also included: with nickel dam and position
Layer gold above described nickel dam to plate the described end of each of the plurality of metal column.
13. formation metal colonnade according to claim 8 and the method for jointing metal post, also include:
One metal column in the plurality of metal column is bonded to metal pad；And
Remaining metal column in the plurality of metal column is repeated with the described step taken out with described joint.
A kind of 14. devices for jointing metal post, comprising:
Metal column conservator, is configured to storage interconnection to form multiple metal columns of row；And
Chopper, is configured to:
Take out a metal column of the foremost in the plurality of metal column；And
One metal column of the described foremost in the plurality of metal column is bonded on metal pad；
Wherein, described chopper includes: cutting edge, is configured to cut out described in the plurality of metal column from metal colonnade
One metal column of foremost, and described device also includes fixture, and described fixture is configured to:
One of the plurality of metal column metal column is pushed to the end of the groove in described chopper；And
One metal column of the plurality of metal column is made to be clamped in the described end of described groove.
15. devices for jointing metal post according to claim 14, wherein, described metal column conservator also includes:
Feed mechanism, is configured to promote forward metal colonnade.
16. devices for jointing metal post according to claim 14, wherein, each of the plurality of metal column
All straight metal column, and described metal column conservator and described groove have be configured to be suitable for the plurality of metal column straight
The inner space of shape.
17. devices for jointing metal post according to claim 14, wherein, the plurality of metal column each
It is bending metals post, and described metal column conservator and described groove have the bending being configured to be suitable for the plurality of metal column
Inner space.
18. devices for jointing metal post according to claim 14, wherein, described chopper is configured to ultrasonic
Ripple engages and to engage a metal column of the described foremost in the plurality of metal column.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361798553P | 2013-03-15 | 2013-03-15 | |
| US61/798,553 | 2013-03-15 | ||
| US13/926,905 | 2013-06-25 | ||
| US13/926,905 US9263407B2 (en) | 2013-03-15 | 2013-06-25 | Method for manufacturing a plurality of metal posts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104051387A CN104051387A (en) | 2014-09-17 |
| CN104051387B true CN104051387B (en) | 2017-01-18 |
Family
ID=51504046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310479255.6A Active CN104051387B (en) | 2013-03-15 | 2013-10-14 | Metal Post Bonding Using Pre-Fabricated Metal Posts |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7010846B2 (en) * | 2000-04-14 | 2006-03-14 | Denso Corporation | Method of manufacturing stator core of vehicle rotary electric machine |
| CN102185188A (en) * | 2009-12-21 | 2011-09-14 | 日立汽车系统株式会社 | Connector and method for producing the connector |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7010846B2 (en) * | 2000-04-14 | 2006-03-14 | Denso Corporation | Method of manufacturing stator core of vehicle rotary electric machine |
| CN102185188A (en) * | 2009-12-21 | 2011-09-14 | 日立汽车系统株式会社 | Connector and method for producing the connector |
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| CN104051387A (en) | 2014-09-17 |
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