CN104044320A - Organic transparent substrate and manufacturing method thereof - Google Patents
Organic transparent substrate and manufacturing method thereof Download PDFInfo
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- CN104044320A CN104044320A CN201410293707.6A CN201410293707A CN104044320A CN 104044320 A CN104044320 A CN 104044320A CN 201410293707 A CN201410293707 A CN 201410293707A CN 104044320 A CN104044320 A CN 104044320A
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- inorganic oxide
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Abstract
The invention relates to an organic transparent substrate and a manufacturing method thereof, belonging to the technical field of the transparent optical substrate. By adoption of the invention, the problems that the existing organic resin substrate is poor in blocking performance to oxygen and water vapor, can deform easily in the high-temperature and high-humidity environment, the electrostatic quantity is high, and the adhesive force of the surface film layer is poor, and the problem of difficult bonding between inorganic oxide and the organic resin substrate are solved. The organic transparent substrate comprises an organic resin layer, wherein the two surfaces of the organic resin layer are adhered with inorganic oxide film layers. The manufacturing method of the organic transparent substrate comprises the steps of (1) dip-coating; and (2) curing. According to the organic transparent substrate and the manufacturing method, the operation is simple, the bonding effect is good, the obtained organic transparent substrate is excellent in shape stability, surface hardness, optical performance, weather resistance, impact resistance, heat resistance and energy conservation in the high-temperature and high-humidity environment, low in water absorption rate and easy in secondary surface treatment and can be widely used.
Description
Technical field
The present invention relates to the technical field of transparent substrate, be specifically related to a kind of organic transparency carrier and manufacture method thereof.
Background technology
Organic resin laminated plate is excellence aspect the transparency, lightweight, processability and mechanical strength, be widely used in electronic unit, building materials parts, automobile component etc., easily scratch but its case hardness is not enough, and the anti-ultraviolet weatherability of polycarbonate resin (PC) is poor, while use out of doors, easily occur that xanthochromia etc. is deteriorated.So need to do on the surface of organic resin laminated plate relevant coating processing, but the heat resistance difference of the water absorption character of each layer of resin and glass transition temperature representative in organic resin laminated plate, can produce very large warpage, and can with the splitting of the face coat of cure process, antireflection processing, antifouling processing, non-glare treated or conductive processing etc., according to using method and formation problem.
Organic resin substrate has three shortcomings: the one, and poor to the barrier property of oxygen, steam; The 2nd, non-refractory; The 3rd, static content is too strong.So the adhesion of organic resin substrate surface and types of functionality rete is poor, in order to address this problem, need to process organic resin substrate surface.At present best surface treatment method is on organic resin substrate, to adhere to inorganic oxide, the adhesion of case hardness, light transmission rate, weatherability and other functional film layer that can disposable raising organic resin substrate.
On the other hand, if can be by inorganic oxide (especially silica, titanium dioxide, the inorganic oxide such as zirconium dioxide and aluminium oxide) for organic resin laminated plate surface, can improve its intensity, impact flexibility, wearability, light transmission, uvioresistant, anti-aging, heat resistance and the performance such as energy-conservation, and the oozing property of resistance of inorganic oxide is very excellent, coating is very thin, so surface band has the lower secondary surface treatment of more easily doing of the organic resin laminated plate water absorption rate of inorganic oxide film layer, for example antifouling processing, conductive processing etc., but it is very large that the fusing point of inorganic oxide and resin plate differs, very large in conjunction with difficulty, although can the glass substrate with inorganic oxide protective film and resin plate be bonded together with bonding agent, but thickness and weight can further increase, cannot be widely used.
Summary of the invention
In order to overcome the deficiencies in the prior art, one object of the present invention is to provide a kind of organic transparency carrier, and it has solved, and the barrier property to oxygen and steam of prior art existence is poor, easy in hot and humid environment deformation, static content occurs by force and the problem of superficial film poor adhesive force.
Another object of the present invention is to provide a kind of manufacture method of organic transparency carrier, and it has solved the inorganic oxide of prior art existence and the problem of the difficult combination of organic resin substrate.
For solving above-mentioned first problem, the technical solution adopted in the present invention is as follows:
A kind of organic transparency carrier, comprises organic resin layer, and the positive and negative of described organic resin layer is all attached with inorganic oxide rete.
Preferably, described inorganic oxide rete mainly comprise inorganic oxide, described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide.The Main Function of inorganic oxide is on organic resin substrate, to form to intercept rete, promotes the case hardness, optical property, weatherability, heat resistance, reduction water absorption rate, energy-conservation and be easy to the performances such as secondary surface treatment of organic resin substrate.
Preferably, described organic resin layer is the laminated body of PMMA layer, PC layer, PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC.Wherein, PMMA is acrylic compounds resin, and PC is polycarbonate resin.
Preferably, in the time that organic resin layer is the laminated body of PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC, the thickness of described PC layer is 0.1mm-2.5mm; The thickness of described PMMA layer is 0.1mm-1.0mm; The thickness of described inorganic oxide protective film is 10nm-1000nm.If lower than 0.1mm, can there is the situation of partially soft rigidity deficiency in the thickness of PC layer; If exceed 2.5mm, the situation that exists the difficult control of aetiolation and hardness to decline.If lower than 0.1mm, there is the situation of case hardness, marresistance and weatherability deficiency in the thickness of PMMA layer; If exceed 1.0mm, there is the situation of resistance to impact deficiency.If lower than 10nm, can there is the situation of barrier, case hardness, marresistance and weatherability deficiency in the thickness of inorganic oxide protective film; Its thickness is below 1000nm, and after moulding, optical effect situation not good or that outward appearance is not good occurs lessly.
Preferably, the thickness of described organic transparency carrier is 0.3-3.0mm.The thickness of organic transparency carrier, more than 0.3mm, can reduce the generation of the not good or situation that thickness and precision is not good of transfer printing, and in addition, its thickness, below 3.0mm, has reduced the generation of the not good or situation that thickness and precision is not good of lightweight.
For solving above-mentioned Second Problem, the technical solution adopted in the present invention is as follows:
A method of manufacturing organic transparency carrier as claimed in claim 1, it comprises the following steps:
(1) dip-coating (dip-coating); (2) solidify.
Described step (1) is that organic resin layer is all put in inorganic oxide solution and is soaked, and described inorganic oxide solution comprises the composition of following mass percentage content:
Inorganic oxide: 0.1%-15%;
Adjusting agent: surplus;
Described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide or aluminium oxide.Described adjusting agent is alcohols, ketone and lipoid substance, and the Main Function of adjusting agent is to improve surface uniformity and the workability of raising inorganic oxide protective film etc. of inorganic oxide on organic resin plate.The Main Function of this step is for form inorganic matter rete on organic resin substrate, promotes the case hardness, optical property, weatherability, heat resistance, reduction water absorption rate, energy-conservation and be easy to the performances such as secondary surface treatment of organic resin substrate.
Described step (2) is that organic resin substrate is taken out from inorganic oxide solution, and its surperficial inorganic oxide protective film is cured.
Preferably, the content of described inorganic oxide is 0.5%-10%; The soaking temperature of described step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min; The solidification temperature of described step (2) is 60 DEG C-100 DEG C, and be 15min-120min hardening time.
Preferably, described inorganic oxide solution also comprises interfacial agent, and its main component is organic compound, especially has hydrophilic and organic amphiprotic molecule hydrophobic grouping, and the content of described interfacial agent is 1%-10%.The Main Function of interfacial agent is the surface tension reducing between liquid and solid, makes inorganic oxide composition be attached to well organic resin plate first-class.
Preferably, the content of described interfacial agent is 1%-5%.
Preferably, the soaking temperature of described step (1) is 15 DEG C-35 DEG C, and soak time is 1min-10min; The solidification temperature of described step (2) is 70 DEG C-90 DEG C, and be 30min-100min hardening time.
Compared to existing technology, beneficial effect of the present invention is:
The present invention adheres to inorganic oxide by the two sides at organic resin layer; this organic transparency carrier has interlaminar adhesion; can be provided in shape stability in hot and humid environment, case hardness, optical property, weather resistance, resistance to impact, heat resistance and energy saving excellence, water absorption rate low and easily make the transparent substrate of secondary surface treatment, this substrate can be used as transparent baseplate material, transparent protective material uses.Particularly, be applicable at the portable display of portable telephone terminal, OA machine, Portable electronic game machine, portable data assistance, mobile PC etc., notebook type PC, Desktop PC LCD monitor, liquid crystal display etc. escope etc. is set.
In organic transparency carrier of the present invention, can on one face or two faces, implement any in antireflection processing, antifouling processing, antistatic treatment, weatherability treatment and non-glare treated.The method of antireflection processing, antifouling processing, antistatic treatment, weatherability treatment and non-glare treated is not particularly limited, and can use known method.For example, apply the method for reflection reduction coating, method, the method for coating antistatic coating etc. of evaporation dielectric substance film.Can be applicable to the method for most secondary surface treatment.
Obtain organic transparency carrier by method of the present invention; without with adhesive, inorganic oxide protective film and organic resin layer being carried out bonding; only organic resin layer need be placed on and in inorganic oxide solution, carry out dip-coating (dip-coating) and solidify again; simple to operate; the combination of the organic transparency carrier obtaining by the method is effective; the increase of its thickness and weight is less, meets widely used requirement.
The partial test of the organic transparency carrier obtaining by method of the present invention carries out as follows:
One, pencil scratch hardness test
Taking JIS K5600-5-4 as benchmark, taking the angle with respect to surperficial as 45 degree, load 750g increases gradually hardness to the surface of plexiglass layer and press pencil, the hardest pencil hardness that does not produce scar is evaluated as pencil hardness.For the test film that has carried out hard painting processing, pencil hardness 3H is qualified above.
Two, total light transmittance is measured
Use color, the turbidity total light transmittance of analyzer COH400 (Japanese electricity Se industrial group manufacture) determination test sheet simultaneously.It is qualified that test film by total light transmittance more than 90% is designated as.
Detailed description of the invention
A kind of organic transparency carrier, comprises organic resin layer, is all attached with inorganic oxide rete at the positive and negative of organic resin layer.Inorganic oxide rete mainly comprise inorganic oxide, inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide.And organic resin layer is the laminated body of PMMA layer, PC layer, PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC.In the time that organic resin layer is the laminated body of PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC, the thickness of PC layer is 0.1mm-2.5mm, and the thickness of PMMA layer is 0.1mm-1.0mm, and the thickness of inorganic oxide protective film is 10nm-1000nm.The thickness of organic transparency carrier is 0.3-3.0mm.
A method of manufacturing organic transparency carrier, it comprises the following steps: (1) dip-coating; (2) solidify.Step (1) is that organic resin layer is put in inorganic oxide solution and is soaked, and inorganic oxide solution comprises the inorganic oxide of the composition of following mass percentage content: 0.1%-15%; Surplus is adjusting agent.Inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide or aluminium oxide.Adjusting agent is alcohols, ketone and lipoid substance.In this step, the content of inorganic oxide is preferably 0.5%-10%.The soaking temperature of step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min.The soaking temperature of step (1) is preferably 15 DEG C-35 DEG C, and soak time is preferably 1min-10min.Step (2) is that organic resin substrate is taken out from inorganic oxide solution, and its surperficial inorganic oxide protective film is cured.The solidification temperature of this step is 60 DEG C-100 DEG C, and be 15min-120min hardening time.Solidification temperature is preferably 70 DEG C-90 DEG C, is preferably 30min-100min hardening time.In addition,, as preferred embodiment, inorganic oxide solution also comprises interfacial agent, its main component is organic compound, especially has hydrophilic and organic amphiprotic molecule hydrophobic grouping, and the content of interfacial agent is 1%-10%, preferably, the content of this interfacial agent is 1%-5%.
Below in conjunction with detailed description of the invention, the present invention is described in further detail.
Embodiment mono-
Step (1), PC organic resin layer is put in inorganic oxide solution and is soaked, wherein, inorganic oxide solution comprises the silica of 0.1% mass percent, interfacial agent and the 98.9% mass percent adjusting agent of 1% mass percent, soaking temperature is 10 DEG C, and soak time is 15 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 15 minutes under the environment of 100 DEG C, thereby obtains being attached with on the two sides of PC organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment bis-
Step (1), PMMA organic resin layer is put in inorganic oxide solution and is soaked, wherein, inorganic oxide solution comprises interfacial agent and the 97.5% mass percent adjusting agent of the silica of 0.5% mass percent and titanium dioxide, 2% mass percent, soaking temperature is 15 DEG C, and soak time is 13 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 20 minutes under the environment of 95 DEG C, thereby obtains being attached with on the two sides of PMMA organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment tri-
Step (1), to be put in inorganic oxide solution and soak in the organic resin laminated body of the equal composite joint PMMA of PC positive and negative, wherein, inorganic oxide solution comprises silica, titanium dioxide and the zirconium dioxide of 1% mass percent, interfacial agent and the 96% mass percent adjusting agent of 3% mass percent, soaking temperature is 20 DEG C, and soak time is 11 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 40 minutes under the environment of 90 DEG C, thereby obtains being attached with on the two sides of organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment tetra-
Step (1), to be put in inorganic oxide solution and soak in the organic resin laminated body of PMMA and PC lamination, wherein, inorganic oxide solution comprises silica, titanium dioxide, zirconium dioxide and the aluminium oxide of 5% mass percent, interfacial agent and the 91% mass percent adjusting agent of 4% mass percent, soaking temperature is 25 DEG C, and soak time is 9 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 50 minutes under the environment of 85 DEG C, thereby obtains being attached with on the two sides of the organic resin layer of PMMA and PC lamination organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment five
Step (1), to be put in inorganic oxide solution and soak in the organic resin laminated body of the equal composite joint PMMA of PC positive and negative, wherein, inorganic oxide solution comprises interfacial agent and the 87% mass percent adjusting agent of the titanium dioxide of 8% mass percent and zirconium dioxide, 5% mass percent, soaking temperature is 27 DEG C, and soak time is 7 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 60 minutes under the environment of 80 DEG C, thereby obtains being attached with on the two sides of organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment six
Step (1), PMMA organic resin layer is put in inorganic oxide solution and is soaked, wherein, inorganic oxide solution comprises interfacial agent and the 83% mass percent adjusting agent of the zirconium dioxide of 10% mass percent and aluminium oxide, 7% mass percent, soaking temperature is 30 DEG C, and soak time is 5 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 80 minutes under the environment of 75 DEG C, thereby obtains being attached with on the two sides of PMMA organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment seven
Step (1), PC organic resin layer is put in inorganic oxide solution and is soaked, wherein, inorganic oxide solution comprises titanium dioxide, zirconium dioxide and the aluminium oxide of 12% mass percent, interfacial agent and the 79% mass percent adjusting agent of 9% mass percent, soaking temperature is 35 DEG C, and soak time is 3 minutes.
Step (2) by the organic resin layer taking-up of soaking, is solidified 100 minutes under the environment of 70 DEG C, thereby obtains being attached with on the two sides of PC organic resin layer organic transparency carrier of the inorganic oxide rete of sclerosis.
Embodiment eight
Step (1), the organic resin layer of PMMA and PC lamination is put in inorganic oxide solution and is soaked, wherein, inorganic oxide solution comprises silica, zirconium dioxide and the aluminium oxide of 15% mass percent, interfacial agent and the 75% mass percent adjusting agent of 10% mass percent, soaking temperature is 40 DEG C, and soak time is 1 minute.
Step (2) by the organic resin layer taking-up of soaking, is solidified 120 minutes under the environment of 60 DEG C, thereby obtains being attached with on the two sides of the organic resin layer of PMMA and PC lamination organic transparency carrier of the inorganic oxide rete of sclerosis.
Above-mentioned embodiment is only the preferred embodiment of the present invention; can not limit the scope of protection of the invention with this, the variation of any unsubstantiality that those skilled in the art does on basis of the present invention and replacement all belong to the present invention's scope required for protection.
Claims (10)
1. an organic transparency carrier, comprises organic resin layer, it is characterized in that: the positive and negative of described organic resin layer is all attached with inorganic oxide rete.
2. the organic transparency carrier of one as claimed in claim 1, is characterized in that: described inorganic oxide rete mainly comprise inorganic oxide, described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide.
3. the organic transparency carrier of one as claimed in claim 2, is characterized in that: described organic resin layer is the laminated body of PMMA layer, PC layer, PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC.
4. the organic transparency carrier of one as claimed in claim 3, is characterized in that: in the time that organic resin layer is the laminated body of PMMA and PC or the laminated body at the equal composite joint PMMA of positive and negative of PC, the thickness of described PC layer is 0.1mm-2.5mm; The thickness of described PMMA layer is 0.1mm-1.0mm; The thickness of described inorganic oxide rete is 10nm-1000nm.
5. the organic transparency carrier of one as claimed in claim 1, is characterized in that: the thickness of described organic transparency carrier is 0.3-3.0mm.
6. a method of manufacturing organic transparency carrier as claimed in claim 1, is characterized in that comprising the following steps:
(1) dip-coating; (2) solidify;
Described step (1) is that organic resin layer is all put in inorganic oxide solution and is soaked; Described inorganic oxide solution comprises the composition of following mass percentage content:
Inorganic oxide: 0.1%-15%;
Adjusting agent: surplus;
Described inorganic oxide is preferably one or more in silica, titanium dioxide, zirconium dioxide or aluminium oxide; Described adjusting agent is alcohols, ketone and lipoid substance;
Described step (2) is that organic resin substrate is taken out from inorganic oxide solution, and its surperficial inorganic oxide rete is cured.
7. the manufacture method of a kind of organic transparency carrier as claimed in claim 6, is characterized in that: the content of described inorganic oxide is 0.5%-10%; The soaking temperature of described step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min; The solidification temperature of described step (2) is 60 DEG C-100 DEG C, and be 15min-120min hardening time.
8. the manufacture method of a kind of organic transparency carrier as claimed in claim 6, is characterized in that: described inorganic oxide solution also comprises interfacial agent, and the content of described interfacial agent is 1%-10%, and its main component is organic compound.
9. the manufacture method of a kind of organic transparency carrier as claimed in claim 8, is characterized in that: the content of described interfacial agent is 1%-5%.
10. the manufacture method of a kind of organic transparency carrier as claimed in claim 6, is characterized in that: the soaking temperature of described step (1) is 15 DEG C-35 DEG C, and soak time is 1min-10min; The solidification temperature of described step (2) is 70 DEG C-90 DEG C, and be 30min-100min hardening time.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405902A (en) * | 2015-12-15 | 2016-03-16 | 常熟市万隆电源技术研发有限公司 | Polycrystalline silicon solar cell panel grid with high conversion efficiency |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6420032B1 (en) * | 1999-03-17 | 2002-07-16 | General Electric Company | Adhesion layer for metal oxide UV filters |
| CN102825873A (en) * | 2012-08-23 | 2012-12-19 | 赵金生 | Anti-UV colorized organic sheet and manufacturing method thereof |
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2014
- 2014-06-25 CN CN201410293707.6A patent/CN104044320B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6420032B1 (en) * | 1999-03-17 | 2002-07-16 | General Electric Company | Adhesion layer for metal oxide UV filters |
| CN102825873A (en) * | 2012-08-23 | 2012-12-19 | 赵金生 | Anti-UV colorized organic sheet and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405902A (en) * | 2015-12-15 | 2016-03-16 | 常熟市万隆电源技术研发有限公司 | Polycrystalline silicon solar cell panel grid with high conversion efficiency |
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Effective date of registration: 20210413 Address after: 204e, area B, second floor, building 1, building 2, building 4, building 5, Yuehua Industrial Zone, No.2 Yuehua Road, Meiting community, Meilin street, Futian District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Haoyi quantum R & D Co.,Ltd. Address before: 515200 104, 143 dungaonanmen street, Huicheng Town, Huilai County, Huizhou City, Guangdong Province Patentee before: Huang Jianquan Patentee before: Zhang Yanwei Patentee before: Qiu Dengjia |
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