CN104022045A - Device for flattening index hole in lead frame - Google Patents
Device for flattening index hole in lead frame Download PDFInfo
- Publication number
- CN104022045A CN104022045A CN201410278045.5A CN201410278045A CN104022045A CN 104022045 A CN104022045 A CN 104022045A CN 201410278045 A CN201410278045 A CN 201410278045A CN 104022045 A CN104022045 A CN 104022045A
- Authority
- CN
- China
- Prior art keywords
- groove
- plate
- lead frame
- plummer
- index hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Abstract
The invention discloses a device for flattening an index hole in a lead frame. The device comprises a bearing device and a pressing head. A groove I (3) is formed in a bearing table (1) in the length direction. Grooves II (4) are formed in the top of the bearing table (1) and located in the two sides of the groove I (3). Each L plate (2) is arranged on the top of the bearing table (1), and the vertical plate of each L plate (2) is parallel to the inner wall of the corresponding groove II (4). A flange (6) is arranged on the top of a rectangular block (5) and is parallel to the long edge of the rectangular block (5). The flange (6) is arranged upwards. The two ends of a pressing plate (7) are provided with pressing blocks (8) respectively. The two pressing blocks (8) are arranged between the vertical plates of the two adjacent L plates (2), and the pressing plate (7) abuts against the flange (6). The device for flattening the index hole in the lead frame has the advantages of being compact in structure, reducing labor intensity of a worker, facilitating operation of the worker, and improving production efficiency.
Description
Technical field
The present invention relates to the technical field of the pressing of the index hole on reinforcement on lead frame, particularly a kind of device that flattens index hole on lead frame.
Background technology
Lead frame of triode is the basic element of character of semiconductor element.Lead frame of triode is as T0-92(industry universal model), lead frame generally comprises Ji Dao, left little solder joint, right little solder joint, internal pin, pin and connects the parts compositions such as muscle.On market, generally contain the lead frame sheet of multiple lead frames for the lead frame of triode using or sell, between lead frame sheet, be provided with the reinforcement that is concave shape, on each reinforcement and along being provided with multiple index holes on the length direction of reinforcement, but, the surrounding of the index hole of the part lead frame processing through leading portion is jagged, therefore, this lead frame cannot pass through Trim Molding machine, thereby there is the phenomenon getting stuck, workman have to take out this lead frame, with a less column, index hole burr is around flattened again, but index hole is compared with little and quantity is many, this has increased workman's labour intensity beyond doubt, and reduce the production efficiency of lead frame sheet, be difficult to meet the demand in market, have a strong impact on the economic benefit of enterprise, therefore, do not promote the use of.
Summary of the invention
The object of the invention is to overcome the shortcoming of prior art, a kind of compact conformation is provided, alleviate workman labour intensity, facilitate the device of index hole on the pressing lead frame that workman operates, enhances productivity.
Object of the present invention is achieved through the following technical solutions: a kind of device that flattens index hole on lead frame, it comprises bogey and pressure head, described bogey is by plummer, spacing head and L plate composition, the rectangular shape of plummer, on plummer and along being provided with groove I on the length direction of plummer, the top of plummer and the both sides that are positioned at groove I are provided with groove II, two groove II are symmetrical arranged and the both sides of two groove II are provided with L plate, each L plate is all arranged on the inwall setting that the top of plummer and the vertical plate of each L plate are all parallel to groove II, described spacing head is made up of rectangular block and fin, fin is arranged on the top of rectangular block and is parallel to the long limit setting of rectangular block, the two ends of rectangular block are placed on respectively in two groove II, fin arranges upward, described pressure head is made up of pressing plate and briquetting, the two ends of pressing plate are respectively arranged with briquetting, two briquettings are separately positioned between the vertical plate of two adjacent L plates and pressing plate is pressed on fin.
The top of described plummer and the both sides that are positioned at two groove II are provided with multiple screwed holes, on the level board of described L plate, are provided with multiple through holes, and L plate is fixedly mounted on plummer through through hole and screwed hole successively by screw.
The degree of depth of described groove I is greater than the thickness of lead frame.
The width of described groove I is greater than groove II.
The rectangular shape of described briquetting.
Described rectangular block and the width of briquetting all equate with groove II.
The present invention has the following advantages: on (1) plummer of the present invention and along being provided with groove I on the length direction of plummer, groove I has played the effect of guiding, thereby rectangular frame is slided in groove I, facilitated workman by the bottom cunning of the reinforcement with jagged index hole on fin, facilitated workman's operation.(2) two ends of pressing plate of the present invention are respectively arranged with briquetting, the two ends of rectangular block are placed on respectively in two groove II, fin arranges upward, when this device uses, only need first pressure head to be taken out from bogey, again by the bottom cunning of the reinforcement with jagged index hole on fin, then two briquettings are separately positioned between the vertical plate of two adjacent L plates, and pressing plate is pressed in to the top of this reinforcement, finally beat the top of pressing plate with hammer, thereby disposable by all with jagged index hole pressing on this reinforcement, so not only greatly save workman's labour intensity, and improve greatly the production efficiency of lead frame.
Brief description of the drawings
Fig. 1 is the assembly structure schematic diagram of bogey of the present invention and pressure head;
Fig. 2 is the A-A cutaway view of Fig. 1;
Fig. 3 is the vertical view of plummer of the present invention;
Fig. 4 is the B-B cutaway view of Fig. 3;
Fig. 5 is the structural representation of the spacing head of the present invention;
Fig. 6 is the sectional view of Fig. 5;
Fig. 7 is the structural representation of pressure head of the present invention;
Fig. 8 is the C-C cutaway view of Fig. 7;
Fig. 9 is the I portion zoomed-in view of Fig. 2;
In figure, 1-plummer, 2-L plate, 3-groove I, 4-groove II, 5-rectangular block, 6-fin, 7-pressing plate, 8-briquetting, 9-screwed hole, 10-through hole.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, and protection scope of the present invention is not limited to the following stated:
As Figure 1-4, a kind of device that flattens index hole on lead frame, it comprises bogey and pressure head, described bogey is by plummer 1, spacing head and L plate 2 form, the rectangular shape of plummer 1, on plummer 1 and along being provided with groove I3 on the length direction of plummer 1, the degree of depth of groove I3 is greater than the thickness of lead frame, the top of plummer 1 and the both sides that are positioned at groove I3 are provided with groove II4, the width of groove I3 is greater than groove II4, two groove II4 are symmetrical arranged and the both sides of two groove II4 are provided with L plate 2, each L plate 2 is all arranged on the inwall setting that the top of plummer 1 and the vertical plate of each L plate 2 are all parallel to groove II4.As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, spacing head is made up of rectangular block 5 and fin 6, fin 6 is arranged on the top of rectangular block 5 and is parallel to the long limit setting of rectangular block 5, the two ends of rectangular block 5 are placed on respectively in two groove II4, fin 6 arranges upward.As shown in Figure 1, Figure 2, Figure 7 and Figure 8, pressure head is made up of pressing plate 7 and briquetting 8, the two ends of pressing plate 7 are respectively arranged with briquetting 8, the rectangular shape of briquetting 8, the width of rectangular block 5 and briquetting 8 all equates with groove II4, and two briquettings 8 are separately positioned between the vertical plate of two adjacent L plates 2 and pressing plate 7 is pressed on fin 6.
As depicted in figs. 1 and 2, the top of plummer 1 and the both sides that are positioned at two groove II4 are provided with multiple screwed holes 9, on the level board of described L plate 2, be provided with multiple through holes 10, L plate 2 is fixedly mounted on plummer 1 through through hole 10 and screwed hole 9 successively by screw.
The course of work of the present invention is as follows: first pressure head is taken out from bogey, subsequently lead frame is lain in groove I3, slowly promoting lead frame moves on on fin 6 bottom of the reinforcement with jagged index hole again, then two briquettings are separately positioned between the vertical plate of two adjacent L plates 2, and pressing plate 7 is pressed in to the top of this reinforcement, finally beat the top of pressing plate 7 with hammer, active force is delivered on this reinforcement by pressing plate 7, thereby the disposable pressing plate 7 that beats just can flatten with jagged index hole all on this reinforcement, saved workman's labour intensity, improve again the production efficiency of lead frame.
Claims (6)
1. one kind flattens the device of index hole on lead frame, it is characterized in that: it comprises bogey and pressure head, described bogey is by plummer (1), spacing head and L plate (2) composition, the rectangular shape of plummer (1), on plummer (1) and along being provided with groove I(3 on the length direction of plummer (1)), the top of plummer (1) and be positioned at groove I(3) both sides be provided with groove II(4), two groove II(4) be symmetrical arranged and two groove II(4) both sides be provided with L plate (2), each L plate (2) is all arranged on the top of plummer (1) and the vertical plate of each L plate (2) is all parallel to groove II(4) inwall setting, described spacing head is made up of rectangular block (5) and fin (6), fin (6) is arranged on the top of rectangular block (5) and is parallel to the long limit setting of rectangular block (5), the two ends of rectangular block (5) are placed on respectively two groove II(4) in, fin (6) arranges upward, described pressure head is made up of pressing plate (7) and briquetting (8), the two ends of pressing plate (7) are respectively arranged with briquetting (8), two briquettings (8) are separately positioned between the vertical plate of two adjacent L plates (2) and pressing plate (7) is pressed on fin (6).
2. a kind of device that flattens index hole on lead frame according to claim 1, it is characterized in that: the top of described plummer (1) and be positioned at two groove II(4) both sides be provided with multiple screwed holes (9), on the level board of described L plate (2), be provided with multiple through holes (10), L plate (2) is fixedly mounted on plummer (1) through through hole (10) and screwed hole (9) successively by screw.
3. a kind of device that flattens index hole on lead frame according to claim 1, is characterized in that: described groove I(3) the degree of depth be greater than the thickness of lead frame.
4. according to a kind of device that flattens index hole on lead frame described in claim 1 or 3, it is characterized in that: described groove I(3) width be greater than groove II(4).
5. a kind of device that flattens index hole on lead frame according to claim 1, is characterized in that: the described rectangular shape of briquetting (8).
6. a kind of device that flattens index hole on lead frame according to claim 1, is characterized in that: described rectangular block (5) and the width of briquetting (8) all with groove II(4) equate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278045.5A CN104022045B (en) | 2014-06-20 | 2014-06-20 | A kind of flatten the device of index hole on lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278045.5A CN104022045B (en) | 2014-06-20 | 2014-06-20 | A kind of flatten the device of index hole on lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104022045A true CN104022045A (en) | 2014-09-03 |
| CN104022045B CN104022045B (en) | 2016-08-17 |
Family
ID=51438740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410278045.5A Expired - Fee Related CN104022045B (en) | 2014-06-20 | 2014-06-20 | A kind of flatten the device of index hole on lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104022045B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940002771Y1 (en) * | 1991-05-14 | 1994-04-23 | 금성일렉트론 주식회사 | Clamping apparatus of inner lead of lead-frame |
| US5155901A (en) * | 1991-12-30 | 1992-10-20 | Fierkens Richard H J | Integrated circuit lead frame positioner apparatus and method |
| CN202816883U (en) * | 2012-08-31 | 2013-03-20 | 杰群电子科技（东莞）有限公司 | Pressure plate for packaging semiconductor chips |
| CN203910764U (en) * | 2014-06-20 | 2014-10-29 | 成都先进功率半导体股份有限公司 | Device for pressing index holes on lead wire frame |
-
2014
- 2014-06-20 CN CN201410278045.5A patent/CN104022045B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN104022045B (en) | 2016-08-17 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20170620 |