CN104013522A - Intelligent voice vibrator system - Google Patents

Intelligent voice vibrator system Download PDF

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Publication number
CN104013522A
CN104013522A CN201410089000.3A CN201410089000A CN104013522A CN 104013522 A CN104013522 A CN 104013522A CN 201410089000 A CN201410089000 A CN 201410089000A CN 104013522 A CN104013522 A CN 104013522A
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China
Prior art keywords
electric capacity
pin
chip
unit
resistance
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CN201410089000.3A
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Chinese (zh)
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CN104013522B (en
Inventor
吕学刚
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Shenzhen Does Not Hinder Interactive Science And Technology Development Co Ltd
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Shenzhen Does Not Hinder Interactive Science And Technology Development Co Ltd
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Priority to CN201410089000.3A priority Critical patent/CN104013522B/en
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Publication of CN104013522B publication Critical patent/CN104013522B/en
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Abstract

The invention discloses an intelligent voice vibrator system which comprises a vibrator, wherein the vibrator comprises a bar body, a power supply unit and a motor unit, wherein a wireless receiving unit and a main control unit are further arranged in the bar body, the wireless receiving unit receives an external control signal obtained through voice message conversion and transmits the signal to the main control unit, the main control unit controls the motor unit according to the external control signal, and then the motor unit drives the bar body to work in a corresponding vibration mode. According to the intelligent voice vibrator system, the vibration intensity of the vibrator can be controlled by means of voice messages by receiving the external control signal, user experience and participation are better achieved, and a user can achieve sexual pleasure.

Description

Intelligent sound vibrating head system
Technical field
The present invention relates to sex aids, relate in particular to a kind of intelligent sound vibrating head system.
Background technology
Along with the raising of people's living standard, people liberate gradually to the idea of property, also more and more higher to the enjoyment level of sexual experience.In prior art, realize the control of pattern and the intensity of motor by the simple several buttons on vibrating head, control model immobile phase is to single, and packing is simple.Vibrating head only possesses vibration, stirs function, and the stimulation degree that women in use felt is general, on its physiology, can not reach in the short period of time pleasant sensation, and result of use is not very desirable, making property requires to be met, and for above-mentioned shortcoming, is necessary to make improvement.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of improved intelligent sound vibrating head system is provided.
The technical solution adopted for the present invention to solve the technical problems is: a kind of intelligent sound vibrating head system is provided, and involving vibrations rod, vibrating head comprises barred body, power supply unit and electric motor units; In barred body, be also provided with radio receiving unit and main control unit, radio receiving unit receives by the external control signal of voice messaging conversion gained and is sent to main control unit, main control unit is controlled electric motor units according to external control signal, so by electric motor units driving rod body running in corresponding vibration mode.
Intelligent sound vibrating head system of the present invention, also comprises mobile device, and mobile device comprises voice collector unit, the Audio Processing Unit being connected successively and the wireless transmitting unit communicating to connect with radio receiving unit.
Intelligent sound vibrating head system of the present invention, vibrating head also comprises for the pushbutton unit of manual adjustment barred body mode of vibration, for storing memory element, LED unit, electrification reset unit and the clock unit of vibration signal, pushbutton unit, memory element, LED unit, electrification reset unit and clock unit are connected with main control unit respectively, and electrification reset unit is connected with power supply unit respectively with electric motor units.
Intelligent sound vibrating head system of the present invention, main control unit comprises the 6th resistance, the 11 resistance and has the first chip of the first pin to the 49 pins, the first chip comprises the high level pin for being connected with high level, the 6th resistance is connected between high level pin and the 23 pin of the first chip, and the 11 resistance is connected between the 24 pin and ground of the first chip.
Intelligent sound vibrating head system of the present invention, radio receiving unit comprises at least one in bluetooth receiving circuit, WIFI receiving circuit, infrared receiving circuit, Zigbee receiving circuit, G/G receiving circuit, UWB receiving circuit and infrared receiving circuit.
Intelligent sound vibrating head system of the present invention, radio receiving unit is bluetooth receiving circuit, bluetooth receiving circuit comprises the first inductance, the second inductance, the 3rd inductance, the tenth electric capacity, the 11 electric capacity, the 12 electric capacity and the 14 electric capacity, wherein, the second end of the first inductance is connected with the first end of the second inductance, the second end of the second inductance is connected with the first end of the tenth electric capacity, the first end of the 11 electric capacity connects the first end of the first inductance, the second end of the 11 electric capacity connects the first end of the 3rd inductance, the first end of the 3rd inductance connects the first end of the 12 electric capacity, the second end of the 3rd inductance connects the first end of the 14 electric capacity, the tenth electric capacity, the 12 electric capacity and the 14 electric capacity three's the equal ground connection of the second end, the first end of the first inductance connects the 32 pin of the first chip, the second end of the first inductance connects the 31 pin of the first chip, the second end of the second inductance connects the 30 pin of the first chip, the second end of the 3rd inductance is the Bluetooth signal receiving terminal of bluetooth receiving circuit.
Intelligent sound vibrating head system of the present invention, radio receiving unit is WIFI receiving circuit, WIFI receiving circuit comprises the 4th inductance, the 13 electric capacity and the 15 electric capacity, wherein, the two ends of the 4th inductance connect respectively the 13 first end of electric capacity and the first end of the 15 electric capacity, the equal ground connection of the second end of the second end of the 13 electric capacity and the 15 electric capacity, the first end of the 13 electric capacity connects the 48 pin of the first chip, and the first end of the 15 electric capacity is the WIFI signal receiving end of WIFI receiving circuit.
Intelligent sound vibrating head system of the present invention, power supply unit comprises charging circuit, testing circuit and power circuit, charging circuit is connected with testing circuit, power circuit and electric motor units respectively, testing circuit is connected with main control unit respectively with power circuit, and power circuit is connected with electrification reset unit.
Intelligent sound vibrating head system of the present invention, charging circuit comprises the 8th resistance, the 4th electric capacity, the 5th electric capacity, the 6th electric capacity, the 7th electric capacity, the 8th electric capacity, the 28 electric capacity, the 4th interface, the 5th interface and the 7th chip, the 7th chip comprises the first pin to the five pins, the first end of the 4th interface connects the 4th pin of the 7th chip, the second end ground connection of the 4th interface, the 5th electric capacity is connected between the first end and the second end of the 4th interface, the first pin of the 7th chip connects the tenth pin of the first chip, the second pin ground connection of the 7th chip, the 3rd pin of the 7th chip connects the first end of the 5th interface, the 5th pin of the 7th chip passes through the 8th resistance eutral grounding, the second end ground connection of the 5th interface, and the first end of the 4th interface is the first potential end, the first end of the 5th interface is the second potential end, the 4th electric capacity, the 6th electric capacity, the 7th electric capacity, the first end of the 8th electric capacity and the 28 electric capacity is in parallel to be respectively connected with the high level pin of the first chip, the 4th electric capacity, the 6th electric capacity, the 7th electric capacity, the second end ground connection of the 8th electric capacity and the 28 electric capacity, the 4th electric capacity, the 6th electric capacity, the 7th electric capacity, the first end of the 8th electric capacity and the 28 electric capacity is connected the 7th test point.
Intelligent sound vibrating head system of the present invention, barred body comprises clavate main body and the lateral body stretching out laterally from clavate main body tail end, electric motor units comprises the first motor circuit and the second motor circuit, the first motor circuit is positioned at clavate body head, the second motor circuit is positioned on the end of lateral body, wherein, the first motor circuit comprises the first resistance, the 4th resistance, the first diode, the second electric capacity, the 16 electric capacity, the first motor and the first audion, the negative pole of the first diode, the first end of the first end of the second electric capacity and the first motor is connected respectively the second end of the first resistance, the positive pole of the first diode, the second end of the second electric capacity and the second end of the first motor are connected respectively the colelctor electrode of the first audion, the second end of the 4th resistance connects the base stage of the first audion, the 16 electric capacity is connected between the base stage and emitter stage of the first audion, the grounded emitter of the first audion, the first end of the 4th resistance connects the 45 pin of the first chip, the first end of the first resistance connects the second potential end.
Enforcement the invention has the beneficial effects as follows: the intelligent sound vibrating head system in the present invention is by receiving external control signal, can utilize voice messaging to remove to control the vibration strong or weak of vibrating head, realize better user's experience and participation, make user reach the effect of sexual joyful.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of vibrating head in one embodiment of the invention;
Fig. 2 is the module diagram of mobile device in one embodiment of the invention;
Fig. 3 is the module diagram of vibrating head in Fig. 1;
Fig. 4 is the circuit diagram of radio receiving unit in Fig. 3;
Fig. 5 is the circuit diagram of main control unit in Fig. 3;
Fig. 6 is the circuit diagram of electric motor units in Fig. 3;
Fig. 7 is the circuit diagram of charging circuit in Fig. 3;
Fig. 8 is the circuit diagram of testing circuit in Fig. 3;
Fig. 9 is the circuit diagram of power circuit in Fig. 3;
Figure 10 is the circuit diagram of pushbutton unit in Fig. 3;
Figure 11 is the circuit diagram of memory element in Fig. 3;
Figure 12 is the circuit diagram of LED unit in Fig. 3;
Figure 13 is the circuit diagram of electrification reset unit in Fig. 3;
Figure 14 is the circuit diagram of clock unit in Fig. 3.
The specific embodiment
For technical characterictic of the present invention, object and effect being had more clearly, understand, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
As shown in Figures 1 to 3, the present invention constructs a kind of intelligent sound vibrating head system, involving vibrations rod 10 and mobile device 20, vibrating head 10 works in corresponding vibration mode by receiving external control signal, and mobile device 20 sends the external control signal by voice messaging conversion gained to vibrating head 10.Vibrating head 10 and mobile device 20 carry out communication by wireless connections.Understandably, mobile device 20 can arrange also and can not arrange.
Wherein, as shown in Figure 2, mobile device 20 comprises voice collector unit 21, Audio Processing Unit 22 and transmitter unit 23, and three is connected successively.Voice collector unit 21, for collecting voice messaging, is preferably mike.Audio Processing Unit 22 is converted to external control signal for the voice messaging that voice collector unit 21 is collected.Transmitter unit 23 is for external control signal being emitted to vibrating head 10, thus the mode of vibration of control vibrating head 10.Understandably, mobile device 20 can be the common intelligent mobile communication apparatus such as notebook computer, panel computer, mobile phone, ipod.
As shown in Figure 1, vibrating head 10 comprises a barred body 100, and barred body 100 comprises clavate main body 101 and the lateral body 102 stretching out laterally from described clavate main body 101 tail ends.Shown in Fig. 3, on barred body 100, be provided with radio receiving unit 11, main control unit 12, electric motor units 13, power supply unit 14, pushbutton unit 15, memory element 16, LED unit 17, electrification reset unit 18 and clock unit 19.
Wherein, radio receiving unit 11 is connected with main control unit 12, and radio receiving unit 11 receives by the external control signal of voice messaging conversion gained and is sent to main control unit 12.In technical scheme of the present invention, radio receiving unit 11 can comprise at least one in bluetooth receiving circuit 111, WIFI receiving circuit 112, infrared receiving circuit, Zigbee receiving circuit, 3G/4G receiving circuit, UWB receiving circuit and infrared receiving circuit.Understandably, in certain embodiments, radio receiving unit 11 is only bluetooth receiving circuit 111.Shown in Fig. 4, bluetooth receiving circuit 111 can comprise the first inductance L 1, the second inductance L 2, the 3rd inductance L 3, the tenth capacitor C the 10, the 11 capacitor C the 11, the 12 capacitor C 12 and the 14 capacitor C 14.The second end of the first inductance L 1 is connected with the first end of the second inductance L 2, the second end of the second inductance L 2 is connected with the first end of the tenth capacitor C 10, the first end of the 11 capacitor C 11 connects the first end of the first inductance L 1, the second end of the 11 capacitor C 11 connects the first end of the 3rd inductance L 3, the first end of the 3rd inductance L 3 connects the first end of the 12 capacitor C 12, the second end of the 3rd inductance L 3 connects the first end of the 14 capacitor C 14, the tenth capacitor C 10, the second end of the 12 capacitor C 12 and the 14 capacitor C 14 threes is ground connection respectively, the first end of the first inductance L 1 connects the 32 pin ANT2 of the first chip U1, the second end of the first inductance L 1 connects the 31 pin ANTl of the first chip U1, the second end of the second inductance L 2 connects the 30 pin VDD_PA of the first chip U1, the second end of the 3rd inductance L 3 connects Bluetooth antenna, Bluetooth signal receiving terminal for bluetooth receiving circuit 111.As selection, in certain embodiments, radio receiving unit 11 can be also only WIFI receiving circuit 112.Again in conjunction with shown in Fig. 4, WIFI receiving circuit 112 can comprise the 4th inductance L the 4, the 13 capacitor C 13 and the 15 capacitor C 15, wherein, the two ends of the 4th inductance L 4 connect respectively the 13 first end of capacitor C 13 and the first end of the 15 capacitor C 15, the second end of the second end of the 13 capacitor C 13 and the 15 capacitor C 15 is ground connection respectively, the first end of the 13 capacitor C 13 connects the 48 pin WIFI ANT of the first chip U1, the first end of the 15 capacitor C 15 connects WIFI antenna, is the WIFI signal receiving end of WIFI receiving circuit 112.In the present embodiment, preferably there is bluetooth receiving circuit 111 and WIFI receiving circuit 112 simultaneously.
As shown in Figure 3 and Figure 5, main control unit 12 is for being processed into vibration signal by external control signal.Main control unit 12 can comprise the 6th resistance R the 6, the 11 resistance R 11 and have the first chip U1 of the first pin to the 49 pins, the first chip U1 comprises the high level pin VCC3V3 for being connected with high level, the 6th resistance R 6 is connected between high level pin VCC3V3 and the 23 pin SWDIO of the first chip U1, and the 11 resistance R 11 is connected between the 24 pin SWDCLK and ground of the first chip U1.Understandably, the first pin of the first chip U1, the 12 pin, the 35 pin and the 36 pin are high level pin VCC3V3.
As shown in Figure 3 and Figure 6, electric motor units 13 is connected with main control unit 12, for driving barred body 100 vibrations according to vibration signal in corresponding vibration mode.Shown in Fig. 1, electric motor units 13 comprises the first motor circuit 131 and the second motor circuit 132, the first motor circuit 131 is positioned at clavate main body 101 heads, the second motor circuit 132 is positioned on the end of lateral body 102, wherein: the first motor circuit 131 comprises the first resistance R 1, the 4th resistance R 4, the first diode D1, the second capacitor C 2, the 16 capacitor C 16, the first motor JPl and the first audion Q1, the negative pole of the first diode D1, the first end of the first end of the second capacitor C 2 and the first motor JPl is connected respectively the second end of the first resistance R 1, the positive pole of the first diode D1, the second end of the second capacitor C 2 and the second end of the first motor JPl are connected respectively the colelctor electrode of the first audion Q1, the second end of the 4th resistance R 4 connects the base stage of the first audion Q1, the 16 capacitor C 16 is connected between the base stage and emitter stage of the first audion Q1, the grounded emitter of the first audion Q1, the first end of the 4th resistance R 4 connects the 45 pin PWMl of the first chip U1.The first end of the first resistance R 1 connects the second potential end VBAT.The second motor circuit 132 comprises the second resistance R 2, the 5th resistance R 5, the second diode D2, the 3rd capacitor C 3, the 17 capacitor C 17, the second motor JP2 and the second audion Q2, the negative pole of the second diode D2, the first end of the first end of the 3rd capacitor C 3 and the second motor JP2 is connected respectively the second end of the second resistance R 2, the positive pole of the second diode D2, the second end of the 3rd capacitor C 3 and the second end of the second motor JP2 are connected respectively the colelctor electrode of the second audion Q2, the second end of the 5th resistance R 5 connects the base stage of the second audion Q2, the 17 capacitor C 17 is connected between the base stage and emitter stage of the second audion Q2, the grounded emitter of the second audion Q2, the first end of the 5th resistance R 5 connects the 45 pin PWMl of the first chip U1.The first end of the second resistance R 2 connects the second potential end VBAT.
As shown in Figure 3, power supply unit 14 comprises charging circuit 141, testing circuit 142 and power circuit 143, charging circuit 141 is connected with testing circuit 142, power circuit 143 and electric motor units 13 respectively, testing circuit 142 is connected with main control unit 12 respectively with power circuit 143, and power circuit 143 is connected with electrification reset unit 18.
Wherein, shown in Fig. 7, charging circuit 141 comprises the 8th resistance R 8, the 4th capacitor C 4, the 5th capacitor C 5, the 6th capacitor C 6, the 7th capacitor C 7, the 8th capacitor C 8, the 28 capacitor C 28, the 4th interface JP4, the 5th interface JP5 and the 7th chip U7, the 7th chip U7 comprises the first pin to the five pins, the first end of the 4th interface JP4 connects the 4th pin of the 7th chip U7, the second end ground connection of the 4th interface JP4, the 5th capacitor C 5 is connected between the first end and the second end of the 4th interface JP4, the first pin of the 7th chip U7 connects the tenth pin CHAGDET of the first chip U1, the second pin ground connection of the 7th chip U7, the 3rd pin of the 7th chip U7 connects the first end of the 5th interface JP5, the 5th interface JP5 of the 7th chip U7 is by the 8th resistance R 8 ground connection, the second end ground connection of the 5th interface JP5, the first end of the 4th interface JP4 is the first potential end VCC5V, the first end of the 5th interface JP5 is the second potential end VBAT, the 4th capacitor C 4, the 6th capacitor C 6, the 7th capacitor C 7, the first end of the 8th capacitor C 8 and the 28 capacitor C 28 5 is connected in respectively the high level pin VCC3V3 of the first chip U1 in parallel, the 4th capacitor C 4, the 6th capacitor C 6, the 7th capacitor C 7, the second end ground connection of the 8th capacitor C 8 and the 28 capacitor C 28 5, the 4th capacitor C 4, the 6th capacitor C 6, the 7th capacitor C 7, the first end of the 8th capacitor C 8 and the 28 capacitor C 28 5 is connected the 7th test point TP7.
Shown in Fig. 8, testing circuit 142 comprises the 18 resistance R 18, the 19 resistance R 19, the 21 resistance R 21, the 22 resistance R 22 and the 23 resistance R 23, wherein, the first end of the 18 resistance R 18 and the 19 resistance R 19 is all connected the 7th pin BAT DET of the first chip U1, the second end of the 18 resistance R 18 connects the second potential end VBAT, the first end of the 21 resistance R 21 and the 22 resistance R 22 is all connected the 6th pin USB DET of the first chip U1, the second end of the 21 resistance R 21 connects the first potential end VCC5V, the second end of the 19 resistance R 19 and the 22 resistance R 22 is ground connection respectively, the 23 resistance R 23 one end connect the tenth pin CHAGDET of the first chip U1, the other end connects the high level pin VCC3V3 of the first chip U1.
Shown in Fig. 9, power circuit 143 comprises the 9th resistance R 9, the tenth resistance R 10, the 17 resistance R 17, the 20 resistance R 20, the 24 resistance R 24, the 29 resistance R 29, the 9th capacitor C 9, the 18 capacitor C 18, the 27 capacitor C 27, the 29 capacitor C 29, the 3rd diode D3, the 4th diode D4, the 5th diode D5, the first interrupteur SW l and the 6th chip U6, wherein, the second end of the 9th resistance R 9, the second end of the tenth resistance R 10 is connected with the first end of the 17 resistance R 17, the first end of the 9th resistance R 9 connects the 8th pin INCREASE of the first chip U1, the first end of the tenth resistance R 10 connects the second potential end VBAT by the first interrupteur SW l, the second end ground connection of the 17 resistance R 17.The negative pole of the negative pole of the 3rd diode D3, the 4th diode D4 is connected with the negative pole of the 5th diode D5, the positive pole of the 3rd diode D3 connects the 3rd potential end VCC9V by the 24 resistance R 24, the positive pole of the 4th diode D4 connects the first end of the 17 resistance R 17, and the positive pole of the 5th diode D5 connects the 9th pin PWREN of the first chip U1.The 6th chip U6 comprises six pins, and wherein, the first pin connects the second potential end VBAT, and the first pin is respectively by the 9th capacitor C 9 and the 29 capacitor C 29 ground connection.The second pin ground connection of the 6th chip U6, the 3rd pin connects the high level pin VCC3V3 of the first chip U1.The 27 capacitor C 27 and the 20 resistance R 20 are connected in parallel between the 3rd pin and the 4th pin of the 6th chip U6.The 4th pin of the 6th chip U6 and the 5th pin are respectively by the 29 resistance R 29 and the 18 capacitor C 18 ground connection.The 6th pin of the 6th chip U6 connects the negative pole of the 5th diode D5.
Understandably, the first potential end VCC5V is 5V, and the second potential end VBAT is charging end, and the 3rd potential end VCC9V is 9V.
As shown in Fig. 3 and Figure 10, pushbutton unit 15 is connected with main control unit 12, for manually adjusting barred body 100 mode of vibrations.Pushbutton unit 15 comprises the 15 resistance R the 15, the 16 resistance R 16, second switch SW2 and the 3rd interrupteur SW 3.Wherein, the 15 first end of resistance R 15 and the first end of the 16 resistance R 16 are connected respectively the high level pin VCC3V3 of the first chip U1, and the second end of the 15 resistance R 15 is connected respectively the second end of second switch SW2 and the second end of the 3rd interrupteur SW 3 with the second end of the 16 resistance R 16.The first end of second switch SW2 and the 3rd interrupteur SW 3 is ground connection respectively.The second end of the 15 resistance R 15 and the second end of the 16 resistance R 16 are connected respectively the 43 pin MODE and the 42 pin REDUCE of the first chip U1, and the 43 pin MODE and the 42 pin REDUCE of the first chip U1 are respectively the 5th test point TP5 and the 6th test point TP6.
As shown in Fig. 3 and Figure 11, memory element 16 is connected with main control unit 12, for storage information.Memory element 16 comprises the 13 resistance R the 13, the 14 resistance R 14 and the second chip U2, wherein, the first end of the 13 resistance R 13 and the 14 resistance R 14 is all connected the high level pin VCC3V3 of the first chip U1, and the second end of the 13 resistance R 13 and the 14 resistance R 14 is connected respectively the 4th pin SDA and the 5th pin SCL of the first chip U1.The second chip U2 has the first pin to the eight pins, wherein, and the equal ground connection of the first pin to the four pin.The 5th pin of the second chip U2 connects the 4th pin SDA of the first chip U1, the 6th pin of the second chip U2 connects the 5th pin SCL of the first chip U1, the 7th pin of the second chip U2 connects the 3rd pin 12C WP of the first chip U1, and the 8th pin of the second chip U2 connects the high level pin VCC3V3 of the first chip U1.
As shown in Fig. 3 and Figure 12, LED unit 17 is connected with main control unit 12, for carrying out LED demonstration.LED unit 17 comprises the 27 resistance R the 27, the 28 resistance R 28, a LEDl and the 2nd LED2.Wherein, the forward end of the forward end of the one LEDl and the 2nd LED2 is connected respectively the 40 pin RED_LED and the 41 pin BLUE_LED of the first chip U1, the negative end of the negative end of the one LEDl and the 2nd LED2 is connected respectively the 27 first end of resistance R 27 and the first end of the 28 resistance R 28, the equal ground connection of the second end of the second end of the 27 resistance R 27 and the 28 resistance R 28.
As shown in Fig. 3 and Figure 13, electrification reset unit 18 connects respectively main control unit 12 and power supply unit 14.Electrification reset unit 18 comprises the 12 resistance R the 12, the 23 capacitor C 23 and the 3rd audion Q3, and wherein, the first end of the 23 capacitor C 23 connects the 3rd potential end VCC9V, and the second end of the 23 capacitor C 23 connects the base stage of the 3rd audion Q3.The 12 resistance R 12 one end connect the 3rd audion Q3 base stage, other end ground connection.The grounded emitter of the 3rd audion Q3, colelctor electrode connects the 23 pin SWDIO of the first chip U1.
As shown in Fig. 3 and Figure 14, clock unit 19 connects respectively main control unit 12 and power supply unit 14.Clock unit 19 comprises the 21 capacitor C the 21, the 22 capacitor C 22 and crystal oscillator X1, wherein, the 21 first end of capacitor C 21 and the first end of the 22 capacitor C 22 are connected respectively the 38 pin BT_XIN and the 37 pin BT_XO of the first chip U1, the equal ground connection of the second end of the second end of the 21 capacitor C 21 and the 22 capacitor C 22.A foot of crystal oscillator X1 connects the first end of the 21 capacitor C 21, and two feet and tripod be ground connection respectively, and four feet connect the first end of the 22 capacitor C 22.
The above is only the preferred embodiment of the present invention, and protection scope of the present invention is also not only confined to above-described embodiment, and all technical schemes belonging under thinking of the present invention all belong to protection scope of the present invention.It should be pointed out that for those skilled in the art, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (10)

1. an intelligent sound vibrating head system, involving vibrations rod (10), described vibrating head (10) comprises barred body (100), power supply unit (14) and electric motor units (13); It is characterized in that, in described barred body (100), be also provided with radio receiving unit (11) and main control unit (12), described radio receiving unit (11) receives by the external control signal of voice messaging conversion gained and is sent to described main control unit (12), described main control unit (12) is controlled described electric motor units (12) according to described external control signal, and then drives described barred body (100) to work in corresponding vibration mode by described electric motor units (12).
2. intelligent sound vibrating head system according to claim 1, it is characterized in that, also comprise mobile device (20), described mobile device (20) comprises voice collector unit (21), the Audio Processing Unit (22) being connected successively and the wireless transmitting unit (23) communicating to connect with described radio receiving unit (11).
3. intelligent sound vibrating head system according to claim 1 and 2, it is characterized in that, described vibrating head (10) also comprises for manually adjusting the pushbutton unit (15) of described barred body (100) mode of vibration, for the memory element (16) of storing described vibration signal, LED unit (17), electrification reset unit (18) and clock unit (19), described pushbutton unit (15), described memory element (16), described LED unit (17), described electrification reset unit (18) is connected with described main control unit (12) respectively with described clock unit (19), described electrification reset unit (18) is connected with described power supply unit (14) respectively with described electric motor units (13).
4. intelligent sound vibrating head system according to claim 3, it is characterized in that, described main control unit (12) comprises the 6th resistance (R6), the 11 resistance (R11) and there is first chip (U1) of the first pin to the 49 pins, described the first chip (U1) comprises the high level pin (VCC3V3) for being connected with high level, described the 6th resistance (R6) is connected between described high level pin (VCC3V3) and the 23 pin (SWDIO) of described the first chip (U1), described the 11 resistance (R11) is connected between the 24 pin (SWDCLK) and ground of described the first chip (U1).
5. intelligent sound vibrating head system according to claim 4, it is characterized in that, described radio receiving unit (11) comprises at least one in bluetooth receiving circuit (111), WIFI receiving circuit (112), infrared receiving circuit, Zigbee receiving circuit, 3G/4G receiving circuit, UWB receiving circuit and infrared receiving circuit.
6. intelligent sound vibrating head system according to claim 5, it is characterized in that, described radio receiving unit (11) is bluetooth receiving circuit (111), described bluetooth receiving circuit (111) comprises the first inductance (L1), the second inductance (L2), the 3rd inductance (L3), the tenth electric capacity (C10), the 11 electric capacity (C11), the 12 electric capacity (C12) and the 14 electric capacity (C14), wherein, the second end of described the first inductance (L1) is connected with the first end of described the second inductance (L2), the second end of described the second inductance (L2) is connected with the first end of described the tenth electric capacity (C10), the first end of described the 11 electric capacity (C11) connects the first end of described the first inductance (L1), the second end of described the 11 electric capacity (C11) connects the first end of described the 3rd inductance (L3), the first end of described the 3rd inductance (L3) connects the first end of described the 12 electric capacity (C12), the second end of described the 3rd inductance (L3) connects the first end of described the 14 electric capacity (C14), described the tenth electric capacity (C10), described the 12 electric capacity (C12) and described the 14 electric capacity (C14) three's the equal ground connection of the second end, the first end of described the first inductance (L1) connects the 32 pin (ANT2) of described the first chip (U1), the second end of described the first inductance (L1) connects the 31 pin (ANT1) of described the first chip (U1), the second end of described the second inductance (L2) connects the 30 pin (VDD_PA) of described the first chip (U1), the second end of described the 3rd inductance (L3) is the Bluetooth signal receiving terminal of described bluetooth receiving circuit (111).
7. intelligent sound vibrating head system according to claim 5, it is characterized in that, described radio receiving unit (11) is WIFI receiving circuit (112), described WIFI receiving circuit (112) comprises the 4th inductance (L4), the 13 electric capacity (C13) and the 15 electric capacity (C15), wherein, the two ends of described the 4th inductance (L4) connect respectively described the 13 first end of electric capacity (C13) and the first end of described the 15 electric capacity (C15), the equal ground connection of the second end of the second end of described the 13 electric capacity (C13) and described the 15 electric capacity (C15), the first end of described the 13 electric capacity (C13) connects the 48 pin (WIFI ANT) of described the first chip (U1), the first end of described the 15 electric capacity (C15) is the WIFI signal receiving end of described WIFI receiving circuit (112).
8. intelligent sound vibrating head system according to claim 4, it is characterized in that, described power supply unit (14) comprises charging circuit (141), testing circuit (142) and power circuit (143), described charging circuit (141) is connected with described testing circuit (142), described power circuit (143) and described electric motor units (13) respectively, described testing circuit (142) is connected with described main control unit (12) respectively with described power circuit (143), and described power circuit (143) is connected with described electrification reset unit (18).
9. intelligent sound vibrating head system according to claim 8, it is characterized in that, described charging circuit (141) comprises the 8th resistance (R8), the 4th electric capacity (C4), the 5th electric capacity (C5), the 6th electric capacity (C6), the 7th electric capacity (C7), the 8th electric capacity (C8), the 28 electric capacity (C28), the 4th interface (JP4), the 5th interface (JP5) and the 7th chip (U7), described the 7th chip (U7) comprises the first pin to the five pins, the first end of described the 4th interface (JP4) connects the 4th pin of described the 7th chip (U7), the second end ground connection of described the 4th interface (JP4), described the 5th electric capacity (C5) is connected between the first end and the second end of described the 4th interface (JP4), the first pin of described the 7th chip (U7) connects the tenth pin (CHAGDET) of described the first chip (U1), the second pin ground connection of described the 7th chip (U7), the 3rd pin of described the 7th chip (U7) connects the first end of described the 5th interface (JP5), the 5th pin of described the 7th chip (U7) is by described the 8th resistance (R8) ground connection, the second end ground connection of described the 5th interface (JP5), the first end of described the 4th interface (JP4) is the first potential end (VCC5V), the first end of described the 5th interface (JP5) is the second potential end (VBAT), described the 4th electric capacity (C4), described the 6th electric capacity (C6), described the 7th electric capacity (C7), the first end of described the 8th electric capacity (C8) and described the 28 electric capacity (C28) five is in parallel to be respectively connected with the high level pin (VCC3V3) of described the first chip (U1), described the 4th electric capacity (C4), described the 6th electric capacity (C6), described the 7th electric capacity (C7), the second end ground connection of described the 8th electric capacity (C8) and described the 28 electric capacity (C28) five, described the 4th electric capacity (C4), described the 6th electric capacity (C6), described the 7th electric capacity (C7), the first end of described the 8th electric capacity (C8) and described the 28 electric capacity (C28) five is connected the 7th test point (TP7).
10. intelligent sound vibrating head system according to claim 9, it is characterized in that, described barred body (100) comprises clavate main body (101) and the lateral body (102) stretching out laterally from described clavate main body (101) tail end, described electric motor units (13) comprises the first motor circuit (131) and the second motor circuit (132), described the first motor circuit (131) is positioned at described clavate main body (101) head, described the second motor circuit (132) is positioned on the end of described lateral body (102), wherein, described the first motor circuit (131) comprises the first resistance (R1), the 4th resistance (R4), the first diode (D1), the second electric capacity (C2), the 16 electric capacity (C16), the first motor (JP1) and the first audion (Q1), the negative pole of described the first diode (D1), the first end of described the second electric capacity (C2) and the first end of described the first motor (JP1) are connected respectively the second end of described the first resistance (R1), the positive pole of described the first diode (D1), the second end of described the second electric capacity (C2) and the second end of described the first motor (JP1) are connected respectively the colelctor electrode of described the first audion (Q1), the second end of described the 4th resistance (R4) connects the base stage of described the first audion (Q1), described the 16 electric capacity (C16) is connected between the base stage and emitter stage of described the first audion (Q1), the grounded emitter of described the first audion (Q1), the first end of described the 4th resistance (R4) connects the 45 pin (PWM1) of described the first chip (U1), the first end of described the first resistance (R1) connects described the second potential end (VBAT).
CN201410089000.3A 2014-03-11 2014-03-11 Intelligent sound vibrating head system Expired - Fee Related CN104013522B (en)

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Publication number Priority date Publication date Assignee Title
CN105708672A (en) * 2016-01-22 2016-06-29 颜华 Electronic device

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CN2282874Y (en) * 1996-07-31 1998-06-03 程自耕 Sound controlled massage combined device
GB2447877A (en) * 2007-03-28 2008-10-01 Alan James Black A vibrator responsive to music or speech
CN201299763Y (en) * 2008-10-23 2009-09-02 钟林树 Dildo drive system of Bluetooth massager
CN203154249U (en) * 2013-01-11 2013-08-28 杨大成 Bluetooth voice-controlled variable frequency masturbation device

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
CN2282874Y (en) * 1996-07-31 1998-06-03 程自耕 Sound controlled massage combined device
GB2447877A (en) * 2007-03-28 2008-10-01 Alan James Black A vibrator responsive to music or speech
CN201299763Y (en) * 2008-10-23 2009-09-02 钟林树 Dildo drive system of Bluetooth massager
CN203154249U (en) * 2013-01-11 2013-08-28 杨大成 Bluetooth voice-controlled variable frequency masturbation device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105708672A (en) * 2016-01-22 2016-06-29 颜华 Electronic device

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