CN104005061B - A kind of negative leveling agent for electrode plating copper before solar cell - Google Patents
A kind of negative leveling agent for electrode plating copper before solar cell Download PDFInfo
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- CN104005061B CN104005061B CN201410245556.7A CN201410245556A CN104005061B CN 104005061 B CN104005061 B CN 104005061B CN 201410245556 A CN201410245556 A CN 201410245556A CN 104005061 B CN104005061 B CN 104005061B
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Abstract
The invention discloses a kind of negative leveling agent for electrode plating copper before solar cell, the concentration of poly-sulphur organic sulfonate is 0.02 ~ 0.1g/L, the concentration of complexed surfactant is 0.70 ~ 1.3g/L, and the concentration of chlorion is 8 ~ 25mg/L, and the concentration of azo group dyestuff is 0.1 ~ 1g/L, the negative leveling agent of the present invention is by poly-sulphur organic sulfonate crystal grain thinning, improve the covering power of plating solution by complexed surfactant, realize negative leveling ability by chlorion and azo group dyestuff, by changing the composition of electroplate liquid, add suitable negative leveling agent to obtain the current density higher than Seed Layer two edges at micro-peak place of Seed Layer, make the thickness of coating at this place higher than the thickness of coating of Seed Layer both sides, realize the selective growth of coating at different directions, make speed that front electrodes of solar cells Seed Layer grows in the vertical direction higher than horizontal direction growth rate, in obtaining good electrical performance electrode, reduce the increase of light-receiving area as far as possible, reduce shading loss, promote cell integrated efficiency.
Description
Technical field
The present invention relates to solar cell making process field, be specifically related to front electrode plating process for copper.
Background technology
The electrode of crystal silicon solar energy battery is taking silver as main at present, if can use electrical conductivity and silver suitable, but cheap copper replaces the main conducting shell of silver as electrode of solar battery, will significantly reduce the manufacturing cost of solar cell. Serigraphy, because its equipment is simple, technical maturity, becomes the electrode fabrication of current crystal silicon solar energy battery main flow. But along with the continuous increase of solar battery efficiency, to battery electrode, particularly the requirement of front electrode is also more and more harsher, and traditional silk-screened mode is subject to the restriction of its know-why, is difficult to reach the demand of high-efficiency crystal silicon cell narrow linewidth, the front electrode of low resistance. The prepared front electrode section pattern of serigraphy is loose structure, and the electric conductivity of front electrode is caused to remarkable impact.
As everyone knows, the metal level that electro-plating method forms is comparatively fine and close, conducts electricity very well, therefore the improvement of front electrode surface can be by electroplating and solve front electrode surface. Generally first prepare the front electrode Seed Layer of one deck, the width of Seed Layer is at tens of microns, height, 15 microns of left and right, then is electroplated thickening to this Seed Layer, and this Seed Layer can realize by modes such as serigraphy, inkjet printing and aerosol spraying, chemical plating or plating. But, traditional electroplating technology can be in Seed Layer surface coverage the coating of even thickness, when thickness of electrode increases, width is also increasing, because front electrode is generally positioned at the sensitive surface of solar cell, the increase of electrode width will reduce the light-receiving area of battery, thereby reduces short circuit current and efficiency. In traditional electrical depositing process, in order to make the coating of matrix surface acquisition uniform thickness, the method for generally taking to add leveling agent in plating solution. Its principle is to add after leveling agent, and the current density at the micro-paddy of electrode surface place will be greater than the current density at micro-peak place, is now greater than the thickness of coating at micro-peak place in the thickness of coating of Wei Guchu, reaches leveling effect. Research shows, only have and can on electrode, adsorb and the additive that electrodeposition process plays inhibition is just had to leveling effect, the leveling ability of additive and its cathodic polarization ability have strong correlation, only have the additive that increases cathodic polarization just may play leveling effect, may play negative leveling effect if add the material that reduces to polarize, that is to say that the current density at the micro-peak of electrode surface place is higher than Wei Guchu, the thickness of coating at micro-peak place is also higher.
Summary of the invention
Goal of the invention: the object of the invention is in order to overcome the deficiencies in the prior art, a kind of negative leveling agent for electrode plating copper before solar cell is provided, can be before solar cell prepare the coating in different directions selective growth in the Seed Layer of electrode, thickness of electrode increase is greater than width to be increased.
Technical scheme: a kind of negative leveling agent for electrode plating copper before solar cell, the aqueous solution that contains poly-sulphur organic sulfonate, complexed surfactant, chlorion and azo group dyestuff, wherein, the concentration of poly-sulphur organic sulfonate is 0.02 ~ 0.1g/L, the concentration of complexed surfactant is 0.70 ~ 1.3g/L, the concentration of chlorion is 8 ~ 25mg/L, and the concentration of azo group dyestuff is 0.1 ~ 1g/L.
Further, described poly-sulphur organic sulfonate is poly-dithiopropane sodium sulfonate, sodium polydithio-dipropyl sulfonate or poly-dithiopropane sodium sulfonate of phenyl.
Further, described complexed surfactant comprises polyethers nonionic surface active agent and anionic surfactant, the mass ratio of described polyethers nonionic surface active agent and anionic surfactant is 1:1 ~ 10:1, the complexed surfactant of this mass ratio plays hydrotropy, wetting and light effect in plating solution, can reduce plating solution surface tension, reduce the generation of pin hole in coating and the covering power of raising plating solution simultaneously.
Further, described polyethers nonionic surface active agent is polyethylene glycol, ethoxylated dodecyl alcohol, octanol APEO or secondary alcohol APEO, and described anionic surfactant is dodecyl sodium sulfate, anion polyimides or neopelex.
Further, described azo group dyestuff is benzidine azo dyes, benzanilide azo dyes, benzene sulfonyl aniline azo dyes, diaminonaphthalene type azo dyes, heterocycle azo dyestuff or toluylene azodyes.
Preferably, the concentration of described negative leveling agent in electroplate liquid is 5 ~ 80ml/L.
Beneficial effect: the negative leveling agent of the present invention is by poly-sulphur organic sulfonate crystal grain thinning, improve the covering power of plating solution by complexed surfactant, realize negative leveling ability by chlorion and azo group dyestuff, by changing the composition of electroplate liquid, add suitable negative leveling agent to obtain the current density higher than Seed Layer two edges at micro-peak place of Seed Layer, make the thickness of coating at this place higher than the thickness of coating of Seed Layer both sides, realize the selective growth of coating at different directions, make speed that front electrodes of solar cells Seed Layer grows in the vertical direction higher than horizontal direction growth rate, in obtaining good electrical performance electrode, reduce the increase of light-receiving area as far as possible, reduce shading loss, promote cell integrated efficiency, and coating performance and plating solution performance are not less than like product, there is in addition technique simple, environmental friendliness, the feature such as with low cost and applied widely.
Detailed description of the invention
Below technical solution of the present invention is elaborated, but protection scope of the present invention is not limited to described embodiment.
Embodiment 1:A kind of negative leveling agent for electrode plating copper before solar cell, to contain the poly-dithiopropane sodium sulfonate of phenyl that concentration is 0.05g/L, total concentration is polyethers nonionic surface active agent ethoxylated dodecyl alcohol and the anionic surfactant dodecyl sodium sulfate of 0.8g/L, wherein, the mass ratio of ethoxylated dodecyl alcohol and dodecyl sodium sulfate is 2:1, concentration is the chlorion of 15mg/L, the aqueous solution of the heterocycle azo dyestuff (directly red) that concentration is 0.5g/L.
The negative leveling agent of this front electrodes of solar cells electro-coppering carries out electro-coppering process for upsetting for single crystal silicon solar cell Seed Layer, and the width of initial seed layer is 10 microns, is highly 5 microns. Solar cell being put into the copper electroplating liquid of the negative leveling agent 20mL/L of embodiment electroplates, electroplate after 5 minutes and take out, obtain the evenly copper coating of light of outward appearance, width is 29 microns, be highly 18 microns, vertical direction growth rate be 2.6 μ m/min higher than horizontal direction growth rate 1.9 μ m/min, efficiency of solar cell brings up to 19.2% from 18.5%.
Embodiment 2:A kind of negative leveling agent for electrode plating copper before solar cell, to be 0.09g/L containing poly-dithiopropane sodium sulfonate concentration, nonionic surface active agent octanol APEO and anionic surfactant neopelex total concentration are 1.1g/L, wherein, the mass ratio of nonionic surface active agent octanol APEO and anionic surfactant neopelex is 4:1, chlorine ion concentration is 19mg/L, the aqueous solution that benzidine azo dyes (direct black 38) concentration is 0.8g/L.
The negative leveling agent of this front electrodes of solar cells electro-coppering is for carrying out electro-coppering process for upsetting to polycrystalline silicon solar cell Seed Layer, and the width of initial seed layer is 28 microns, is highly 8 microns. Solar cell is put into containing the copper electroplating liquid of the negative leveling agent 50mL/L of the present embodiment and electroplated, electroplate after 3 minutes and take out, obtain the evenly copper coating of light of outward appearance, width is 35 microns, be highly 15 microns, vertical direction growth rate be 2.3 μ m/min higher than horizontal direction growth rate 1.2 μ m/min, efficiency of solar cell brings up to 17.7% from 16.8%.
Embodiment 3:A kind of negative leveling agent for electrode plating copper before solar cell, to contain the sodium polydithio-dipropyl sulfonate that concentration is 0.02g/L, total concentration is polyethers nonionic surface active agent polyethylene glycol and the anionic surfactant anion polyimides of 1.3g/L, wherein, the mass ratio of polyethylene glycol and anion polyimides is 1:1, concentration is the chlorion of 8mg/L, the aqueous solution of the benzene sulfonyl aniline azo dyes (direct black 168) that concentration is 1g/L.
The negative leveling agent of this front electrodes of solar cells electro-coppering carries out electro-coppering process for upsetting for single crystal silicon solar cell Seed Layer, and the width of initial seed layer is 14 microns, is highly 6.5 microns. Solar cell is put into containing the copper electroplating liquid of the negative leveling agent 5mL/L of the present embodiment and electroplated, electroplate after 8 minutes and take out, obtain the evenly copper coating of light of outward appearance, width is 30 microns, be highly 17 microns, vertical direction growth rate be 1.3 μ m/min higher than horizontal direction growth rate 1 μ m/min, efficiency of solar cell brings up to 19.1% from 18.8%.
Embodiment 4:A kind of negative leveling agent for electrode plating copper before solar cell, to contain the poly-dithiopropane sodium sulfonate of phenyl that concentration is 0.1g/L, total concentration is polyethers nonionic surface active agent secondary alcohol APEO and the anionic surfactant dodecyl sodium sulfate of 0.7g/L, wherein, the mass ratio of polyethylene glycol and anion polyimides is 10:1, concentration is the chlorion of 25mg/L, the aqueous solution of the benzene sulfonyl aniline azo dyes (direct green 59) that concentration is 0.1g/L.
The negative leveling agent of this front electrodes of solar cells electro-coppering carries out electro-coppering process for upsetting for polycrystalline silicon solar cell Seed Layer, and the width of initial seed layer is 30 microns, is highly 10 microns. Solar cell is put into containing the copper electroplating liquid of the negative leveling agent 80mL/L of the present embodiment and electroplated, electroplate after 7 minutes and take out, obtain the evenly copper coating of light of outward appearance, width is 45 microns, be highly 21 microns, vertical direction growth rate be 1.6 μ m/min higher than horizontal direction growth rate 1.1 μ m/min, efficiency of solar cell brings up to 17.4% from 16.5%.
As mentioned above, although represented and explained the present invention with reference to specific preferred embodiment, it shall not be construed as the restriction to the present invention self. Not departing under the spirit and scope of the present invention prerequisite of claims definition, can make in the form and details various variations to it.
Claims (6)
1. the negative leveling agent for electrode plating copper before solar cell, it is characterized in that: be the aqueous solution that contains poly-sulphur organic sulfonate, complexed surfactant, chlorion and azo group dyestuff, wherein, described complexed surfactant is polyethers nonionic surface active agent and anionic surfactant, the concentration of poly-sulphur organic sulfonate is 0.02 ~ 0.1g/L, the concentration of complexed surfactant is 0.70 ~ 1.3g/L, the concentration of chlorion is 8 ~ 25mg/L, and the concentration of azo group dyestuff is 0.1 ~ 1g/L.
2. the negative leveling agent for electrode plating copper before solar cell according to claim 1, is characterized in that: described poly-sulphur organic sulfonate is poly-dithiopropane sodium sulfonate, sodium polydithio-dipropyl sulfonate or poly-dithiopropane sodium sulfonate of phenyl.
3. the negative leveling agent for electrode plating copper before solar cell according to claim 1, is characterized in that: the mass ratio of described polyethers nonionic surface active agent and anionic surfactant is 1:1 ~ 10:1.
4. the negative leveling agent for electrode plating copper before solar cell according to claim 3, it is characterized in that: described polyethers nonionic surface active agent is polyethylene glycol, ethoxylated dodecyl alcohol, octanol APEO or secondary alcohol APEO, described anionic surfactant is dodecyl sodium sulfate, anion polyimides or neopelex.
5. the negative leveling agent for electrode plating copper before solar cell according to claim 1, is characterized in that: described azo group dyestuff is benzidine azo dyes, benzanilide azo dyes, benzene sulfonyl aniline azo dyes, diaminonaphthalene type azo dyes, heterocycle azo dyestuff or toluylene azodyes.
6. the negative leveling agent for electrode plating copper before solar cell according to claim 1, is characterized in that: the concentration of described negative leveling agent in electroplate liquid is 5 ~ 80ml/L.
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| CN106609385B (en) * | 2017-03-13 | 2018-03-30 | 广州睿邦新材料科技有限公司 | Electro-coppering fills and leads up brightening agent for acid copper electroplating with height |
| CN112126952A (en) * | 2020-09-22 | 2020-12-25 | 广州三孚新材料科技股份有限公司 | Copper electroplating solution for heterojunction solar cell and preparation method thereof |
| CN112760682B (en) * | 2020-12-30 | 2022-04-19 | 铜陵市华创新材料有限公司 | Electrolyte for improving pinhole of 4.5-micron lithium ion electrolytic copper foil |
| CN114351194B (en) * | 2022-01-27 | 2023-06-20 | 电子科技大学 | Plating solution and process for electroplating copper on printed circuit through hole |
| TWI807907B (en) * | 2022-07-07 | 2023-07-01 | 國立雲林科技大學 | Method for electroplating copper on aluminum-doped zinc oxide electrode |
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| CN101392396A (en) * | 2008-10-16 | 2009-03-25 | 上海工程技术大学 | Process for forming peak-like convex nickel coating on surface of metal substrate |
| CN102021616A (en) * | 2009-09-16 | 2011-04-20 | 上村工业株式会社 | Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath |
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