CN104005036B - A kind of copper powder washing liquid, the method removing copper containing layer body surface copper powder and preparation method of wiring board removing copper powder - Google Patents
A kind of copper powder washing liquid, the method removing copper containing layer body surface copper powder and preparation method of wiring board removing copper powder Download PDFInfo
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- CN104005036B CN104005036B CN201310061859.9A CN201310061859A CN104005036B CN 104005036 B CN104005036 B CN 104005036B CN 201310061859 A CN201310061859 A CN 201310061859A CN 104005036 B CN104005036 B CN 104005036B
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- copper powder
- copper
- washing liquid
- powder washing
- tripolyphosphate
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 177
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 63
- 239000010949 copper Substances 0.000 title claims abstract description 63
- 239000007788 liquid Substances 0.000 title claims abstract description 63
- 238000005406 washing Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 235000019832 sodium triphosphate Nutrition 0.000 claims abstract description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000001117 sulphuric acid Substances 0.000 claims abstract description 22
- 235000011149 sulphuric acid Nutrition 0.000 claims abstract description 22
- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 claims abstract description 19
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims abstract description 16
- 239000007864 aqueous solution Substances 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000001509 sodium citrate Substances 0.000 claims description 4
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical group O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 14
- 238000000576 coating method Methods 0.000 abstract description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 32
- 239000000203 mixture Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- -1 wherein Chemical compound 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002738 chelating agent Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000010668 complexation reaction Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000035943 smell Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- 101000608734 Helianthus annuus 11 kDa late embryogenesis abundant protein Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 239000004141 Sodium laurylsulphate Substances 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000000622 irritating effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 239000000276 potassium ferrocyanide Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000036259 sexual stimuli Effects 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention provides a kind of copper powder washing liquid removing copper powder and remove the method for copper containing layer body surface copper powder, the preparation method of wiring board.The copper powder washing liquid of this removal copper powder is the aqueous solution containing following components: HCl 6 60g/L；Sulphuric acid 9 100g/L；Tripolyphosphate 2 20g/L；Citrate 2 50g/L is little on the actual bodily harm of people, can quickly remove copper powder simultaneously, without impact, coating can be prepared high-quality wiring board.
Description
Technical field
The invention belongs to field of surface technology, particularly relate to a kind of remove copper powder copper powder washing liquid, remove copper containing layer object
The method of surface copper powder and the preparation method of wiring board.
Background technology
Existing relatively multi-product has in matrix surface copper facing such as plastics, such as wiring board etc., and its technique is mainly electroless copper,
But plating solution easily occurs the phenomenon of instability, typically at coating surface or need not copper-plated place copper powder occurs, affect product matter
Amount, typically need to comply with product requirement through past copper powder process etc..
In the general decoating liquids such as existing copper removal powder craft is typically soaked in the acid such as nitric acid of oxidisability, hydrogen peroxide,
But volatilize big based on the decoating liquid of these components, big to actual bodily harm, and it is unfavorable for that technique produces, and also its corrosivity is strong,
Copper coating also can dissolve, copper coating rough surface after process, has a strong impact on the quality of copper coating, reduces yields and product
Product appearance property.
Summary of the invention
The present invention solves the decoating liquid existence harmful property of generation that in prior art, copper removal powder craft is used and waves
Send out sexual stimulus gas, affect the technical problem of the quality of copper coating simultaneously, it is provided that a kind of actual bodily harm to people is little, simultaneously can be fast
Speed is removed copper powder, coating can be prepared without impact the copper powder washing liquid removing copper powder and the removal copper containing layer object of high-quality wiring board
The method of surface copper powder, the preparation method of wiring board.
First purpose of the present invention is to provide a kind of copper powder washing liquid removing copper powder, wherein, copper powder washing liquid for containing with
The aqueous solution of lower component:
HCl 6-60g/L；
Sulphuric acid 9-100g/L；
Tripolyphosphate 2-20g/L；
Citrate 2-50g/L.
Second object of the present invention is to provide a kind of method removing copper containing layer body surface copper powder, including being attached with
The workpiece of copper powder contacts with copper powder washing liquid, and surface of the work contains layers of copper, surface of the work and/or layers of copper surface attachment copper powder, its
In, copper powder washing liquid is above-mentioned copper powder washing liquid.
Third object of the present invention is to provide the preparation method of a kind of wiring board, is included in matrix surface plate wire road copper
Layer, then the matrix after the layers of copper of plate wire road contact with copper powder washing liquid the copper powder of generation during removing plate wire road layers of copper, wherein, copper
Powder washing liquid is above-mentioned copper powder washing liquid.
The copper powder washing liquid that the present invention provides, by use HCl, sulphuric acid compound system as the acyclic acidic of copper powder washing liquid
Border, not only makes full use of the characteristic of hydrochloric acid, sulphuric acid, and the copper powder of attachment is easier to the removal that is corroded under the conditions of this combination of acidic,
This combination of acidic condition is on fine and close copper coating without impact simultaneously, and utilizes the strong permeability of hydrochloric acid, can make full use of Fructus Citri Limoniae
Hydrochlorate and the complexation of tripolyphosphate, quick copper removal powder.Simultaneously by citrate and the composition metal complexation of tripolyphosphate
Agent is as builder, by group effect, by the copper powder parcel eccysis weak with matrix or layers of copper adhesion, the surface area of copper powder
Greatly, weak with basal body binding force, the thickness simultaneously adhered to is the most relatively thin, by the infiltration of above-mentioned acid, the network of composition metal chelating agent
Close parcel, help and wash, energy fast-falling matrix surface under ultrasonic effect, or easily gone by acid and chelating agent electrochemical corrosion
Removing, but copper plate is fine and close and strong with the adhesion of matrix, dilute sulfuric acid and dilute hydrochloric acid will not corrode copper plate, and this copper powder washing liquid is to product
Copper coating needed for product is without impact, and citrate and tripolyphosphate and hydrochloric acid, the synergism of sulphuric acid, also protect copper simultaneously
Coating exempts to be corroded, and by citrate and the synergism of tripolyphosphate, it is also possible to improve the removal speed of copper powder,
Substantially increase production efficiency and the quality of production.Acid in the copper powder washing liquid of the present invention simultaneously is the acid that low concentration, oxidisability are weak,
The most not volatilizing, the actual bodily harm to people is the least, relatively environmental protection, it is easy to technique produces.
Detailed description of the invention
The invention provides a kind of copper powder washing liquid removing copper powder, wherein, copper powder washing liquid is water-soluble containing following components
Liquid: HCl 6-60g/L；Sulphuric acid 9-100g/L；Tripolyphosphate 2-20g/L；Citrate 2-50g/L, the copper powder of attachment is more
Easily be corroded removal, and simultaneously on copper coating fine and close, that adhesion is strong without impact, and copper removal powder is fast, substantially increases production
Efficiency and the quality of production, the actual bodily harm to people is the least simultaneously, relatively environmental protection, it is easy to technique produces.
As a kind of preferred implementation of the present invention, further preferably, copper powder washing liquid is water-soluble containing following components
Liquid: HCl 10-50g/L；Sulphuric acid 20-80g/L；Tripolyphosphate 5-15g/L；Citrate 5-40g/L, improves further
The performance of copper powder washing liquid.
Wherein, the various tripolyphosphates that tripolyphosphate is known to the skilled person, generally solubility trimerization
The alkali metal salt etc. of phosphate, such as tripolyphosphate, it is preferable that tripolyphosphate is selected from sodium tripolyphosphate and/or PTPP (potassium tripolyphosphate),
For metal chelating agent, contribute to the removal of copper powder, work in coordination with other components simultaneously.
Wherein, the various citrates that citrate is known to the skilled person, generally soluble citrate,
The alkali metal salt etc. of such as citric acid, it is preferable that citrate one or several in sodium citrate, potassium citrate or citric acid
Kind, for metal chelating agent, contribute to the removal of copper powder, work in coordination with other components simultaneously.
Each component can be dissolved in water by the preparation of copper powder washing liquid, can be according to actual feelings to the mixing order of addition of each material
Condition is adjusted, the present invention preferably select mass concentration be the hydrochloric acid of 37wt%, mass concentration be that the sulphuric acid of 98wt% is joined
Put, such as, can be that the sulphuric acid of 98 wt % is by 5-by 5-50ml/L, mass concentration by hydrochloric acid that mass concentration is 37 wt %
50ml/L, tripolyphosphate become aqueous solution by 2-20g/L and citrate by the proportional arrangement of 2-50g/L, mix, permissible
Use first dilute sulphuric acid, hydrochloric acid, add tripolyphosphate, citrate solid etc. afterwards.
Invention also provides a kind of method removing copper containing layer body surface copper powder, including being attached with the work of copper powder
Part contacts with copper powder washing liquid, and described surface of the work contains layers of copper, described surface of the work and/or layers of copper surface attachment copper powder, its
In, copper powder washing liquid is above-mentioned copper powder washing liquid.
Wherein, surface of the work contain layers of copper refer to surface of the work can by rear preparation attachment by the way of contain copper coating etc., also
Can be workpiece this as copper, or top layer is copper etc..Preferably, workpiece is that surface attachment has the plastic workpiece of metal copper layer, surface
It is attached with ceramic workpiece or the metallic copper workpiece of metal copper layer.Wherein, copper powder can be attached to the layers of copper surface of densification, it is possible to
To be attached to be not required to the surface of the work of attachment copper elsewhere, it is more weak with the adhesion of surface of the work, is washed by copper powder
Liquid removes the copper powder of above-mentioned attachment.
Preferably, the temperature of copper powder washing liquid is 5-50 DEG C, and the time of contact is 3-30min；Further preferably, copper powder washing liquid
Temperature is 10-40 DEG C, and the time of contact is 5-20min.Wherein, the various contacts that can be known to the skilled person are contacted
Mode, such as, coat, drip, impregnating.The present invention is preferably and soaks, and being partly submerged in of eccysis copper powder will be needed to configure by workpiece
Copper powder washing liquid in a period of time.
Invention also provides the preparation method of a kind of wiring board, be included in matrix surface plate wire road layers of copper, then will plating
Matrix after circuit layers of copper contacts the copper powder produced during removing plate wire road layers of copper with copper powder washing liquid, and wherein, copper powder washing liquid is
Above-mentioned copper powder washing liquid.
Preferably, the temperature of copper powder washing liquid is 5-50 DEG C, and the time of contact is 3-30min；Further preferably, copper powder washing liquid
Temperature is 10-40 DEG C, and the time of contact is 5-20min.Wherein, the various contacts that can be known to the skilled person are contacted
Mode, such as, coat, drip, impregnating.The present invention is preferably and soaks, and being partly submerged in of eccysis copper powder will be needed to configure by workpiece
Copper powder washing liquid in a period of time.
Wherein, matrix can be any electrically non-conductive material, such as plastic cement, pottery etc., forms conducting wire by copper plate,
A kind of preferred implementation as the present invention, it is preferable that matrix is plastics.
The present invention is preferred, is contacted with under ultrasound condition and carries out, copper powder washing liquid and ultrasonic synergism, improves copper further
The eccysis effect of powder and eccysis speed.
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with
Embodiment, is further elaborated to the present invention.Should be appreciated that specific embodiment described herein is only in order to explain
The present invention, is not intended to limit the present invention.
Embodiment 1-8
By the formula of table 1 first by the sulphuric acid (98wt%) after dilution, hydrochloric acid (37wt%) mixing, then add successively in solution
Enter tripolyphosphate, citrate, mix homogeneously, obtain copper powder Wash Samples S1-S7.
Table 1
Comparative example 1
By formula as below by the sulphuric acid (98wt%) after dilution, hydrochloric acid (37 wt %) mix homogeneously, obtain copper powder washing liquid sample
Product DS1.
Hydrochloric acid (37 wt %) 20ml/L, sulphuric acid (98wt%) 30ml/L.
Comparative example 2
By formula as below first by the sulphuric acid (98wt%) after dilution, hydrochloric acid (37 wt %) mixing, then add in solution
Sodium tripolyphosphate, mix homogeneously, obtain copper powder Wash Samples DS2.
Hydrochloric acid (37 wt %) 20ml/L, sulphuric acid (98wt%) 30ml/L, sodium tripolyphosphate 10g/L.
Comparative example 3
By formula as below first by the sulphuric acid (98wt%) after dilution, hydrochloric acid (37 wt %) mixing, then add in solution
Sodium citrate, mix homogeneously, obtain copper powder Wash Samples DS3.
Hydrochloric acid (37 wt %) 20ml/L, sulphuric acid (98wt%) 30ml/L, sodium citrate 25g/L.
Comparative example 4
By formula as below elder generation dilute sulphuric acid (98wt%), it is subsequently adding hydrogen peroxide (35wt%), mix homogeneously, obtains copper powder and wash
Liquid sample DS4.
Sulphuric acid (98wt%) 50ml/L, hydrogen peroxide (35wt%) 40ml/L.
Performance test
Taking the antenna workpiece that DSM3730 material injection is good, through laser activation, the parameter of laser activation is: power (W):
8；Frequency (KHz): 25；Laser Trace speed (mm/s): 1200.Copper facing 2.5h in the chemical bronze plating liquid of table 2 is put into, temperature after oil removing
Spend 50 DEG C, be covered with copper powder on visible work-piece after taking out workpiece, impregnated in copper powder Wash Samples S1-S7 and DS1-DS3 respectively, temperature
Spend 30 DEG C, and ultrasonic (ultrasonic electric current is adjusted to 2A), range estimation is taken out workpiece after being completely removed to copper powder, is obtained antenna sample S11-
S77 and DS11-DS33, each copper powder Wash Samples repeatable test 4PCS workpiece, when recording the removal of each surface of the work copper powder
Between.The abnormal smells from the patient size of produced irritative gas during copper powder removed in record simultaneously, and observe antenna sample surfaces metal
Whether layers of copper is corroded phenomenon.
Taking the antenna workpiece that DSM3730 material injection is good and laser activation is crossed, the parameter of laser activation is: power (W): 8；
Frequency (KHz): 25；Laser Trace speed (mm/s): 1200.Copper facing 2.5h, temperature in the chemical bronze plating liquid of table 2 is put into after oil removing
50 DEG C, it is covered with copper powder on visible work-piece after taking out workpiece, impregnated in copper powder Wash Samples S1 and DS4 respectively, temperature 30 DEG C, mesh
Survey and after being completely removed to copper powder, take out workpiece, obtain antenna sample S88 and DS44, each repeatable test of copper powder Wash Samples
4PCS workpiece, records the removal time of each surface of the work copper powder.Produced zest gas during copper powder removed in record simultaneously
The abnormal smells from the patient size of body, and observe antenna sample surfaces metal copper layer and whether be corroded phenomenon.
Test result such as table 3.
Table 2
| Copper sulfate pentahydrate | 15g/L | EDETATE SODIUM | 30g/L |
| Rocchelle's salt | 15g/L | Sodium lauryl sulphate | 0.01g/L |
| Sodium hydroxide | 15g/L | Formaldehyde | 4g/L |
| Potassium ferrocyanide | 0.01g/L | Bipyridyl: | 0.01g/L |
Table 3
| Antenna sample | Remove the time of copper powder | Penetrating odor size during copper removal powder | The change of copper plate after copper removal powder |
| S11 | 190s | Nothing | No |
| S22 | 300s | Nothing | No |
| S33 | 180s | Nothing | No |
| S44 | 400s | Nothing | No |
| S55 | 180s | Nothing | Observing under scanning electron microscope and have very slight erosion point, perusal does not goes out. |
| S66 | 1600s | Nothing | No |
| S77 | 200s | Nothing | No |
| S88 | More than 3000s | Nothing | No |
| DS11 | Part copper powder difficulty is had to remove | Nothing | No |
| DS22 | 820s | Nothing | No |
| DS33 | 870s | Nothing | No |
| DS44 | 30s | Greatly | Large area is corroded |
The copper powder washing liquid that the present invention provides, by HCl, the infiltration of the compound system of sulphuric acid, the network of composition metal chelating agent
Close parcel, help and wash, under ultrasonic effect can the copper powder of quick eccysis matrix surface attachment, but to the copper coating needed for product without
Impact, protects copper coating, can also improve the removal speed of copper powder simultaneously, substantially increase production efficiency and the quality of production.
Acid in the copper powder washing liquid of the present invention simultaneously is the acid that low concentration, oxidisability are weak, does not the most volatilize, to the actual bodily harm of people also
Little, relatively environmental protection, it is easy to technique produces.
Claims (11)
1. the copper powder washing liquid removing copper powder, it is characterised in that described copper powder washing liquid is the aqueous solution containing following components:
HCl 6-60g/L；
Sulphuric acid 9-100g/L；
Tripolyphosphate 2-20g/L；
Citrate 2-50g/L.
Copper powder washing liquid the most according to claim 1, it is characterised in that described copper powder washing liquid is water-soluble containing following components
Liquid:
HCl 10-50g/L；
Sulphuric acid 20-80g/L；
Tripolyphosphate 5-15g/L；
Citrate 5-40g/L.
Copper powder washing liquid the most according to claim 1 and 2, it is characterised in that described tripolyphosphate is selected from sodium tripolyphosphate
And/or PTPP (potassium tripolyphosphate).
Copper powder washing liquid the most according to claim 1 and 2, it is characterised in that described citrate is selected from sodium citrate, Fructus Citri Limoniae
One or more in acid potassium or citric acid.
5. the method removing copper containing layer body surface copper powder, contacts with copper powder washing liquid including by the workpiece being attached with copper powder,
Described surface of the work contains layers of copper, described surface of the work and/or layers of copper surface attachment has copper powder, described copper powder washing liquid to be that right is wanted
Seek the copper powder washing liquid described in 1-4 any one.
Method the most according to claim 5, it is characterised in that described workpiece is the plastic cement work that surface attachment has metal copper layer
Part, surface attachment have ceramic workpiece or the metallic copper workpiece of metal copper layer.
Method the most according to claim 5, it is characterised in that the temperature of described copper powder washing liquid is 5-50 DEG C, described contact
Time be 3-30min.
8. the preparation method of a wiring board, it is characterised in that be included in matrix surface plate wire road layers of copper, then by plate wire road layers of copper
After matrix contact with copper powder washing liquid remove plate wire road layers of copper during the copper powder that produces, described copper powder washing liquid is claim 1-
Copper powder washing liquid described in 4 any one.
Method the most according to claim 8, it is characterised in that the temperature of described copper powder washing liquid is 5-50 DEG C, described contact
Time be 3-30min.
Method the most according to claim 8, it is characterised in that described matrix is plastics.
11. methods according to claim 8, it is characterised in that described in be contacted with under ultrasound condition and carry out.
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| CN201310061859.9A CN104005036B (en) | 2013-02-27 | 2013-02-27 | A kind of copper powder washing liquid, the method removing copper containing layer body surface copper powder and preparation method of wiring board removing copper powder |
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| CN104831294B (en) * | 2015-04-28 | 2018-03-06 | 丰城市华丰金属制品有限责任公司 | A kind of electrician's copper litz wire cleaning agent |
| CN107759109A (en) * | 2017-09-22 | 2018-03-06 | 深圳市永安精细化工有限公司 | Glass is removed under a kind of normal temperature, coating takes off plating solution on ceramics |
| CN113699000A (en) * | 2021-08-24 | 2021-11-26 | 福达合金材料股份有限公司 | Cleaning agent for removing stains on surface of rivet electrical contact and application of cleaning agent |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1896314A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Stabilized decoating liquid |
| CN101748408A (en) * | 2008-12-11 | 2010-06-23 | 长沙铂鲨环保设备有限公司 | Acidic copper dissolution solution |
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| JP2000017462A (en) * | 1998-07-03 | 2000-01-18 | Kenshin Ka | Copper etching method and device therefor |
| US6592433B2 (en) * | 1999-12-31 | 2003-07-15 | Intel Corporation | Method for defect reduction |
| CA2300492A1 (en) * | 2000-03-13 | 2001-09-13 | Henkel Corporation | Removal of "copper kiss" from pickling high copper alloys |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1896314A (en) * | 2005-07-11 | 2007-01-17 | 佛山市顺德区汉达精密电子科技有限公司 | Stabilized decoating liquid |
| CN101748408A (en) * | 2008-12-11 | 2010-06-23 | 长沙铂鲨环保设备有限公司 | Acidic copper dissolution solution |
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