CN103998655A - Multi-wire plating line at various levels - Google Patents
Multi-wire plating line at various levels Download PDFInfo
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- CN103998655A CN103998655A CN201280062790.5A CN201280062790A CN103998655A CN 103998655 A CN103998655 A CN 103998655A CN 201280062790 A CN201280062790 A CN 201280062790A CN 103998655 A CN103998655 A CN 103998655A
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- Prior art keywords
- plating
- metallic parts
- height
- elongated metallic
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A process of sequentially plating a plurality of elongated metal members (100, 200) in two or more plating cells (102, 110, 116, 126) comprises the following steps: a) guiding the plurality of elongated metal members (100, 200) at a first level in first direction through a first plating bath (102, 202); b) forcing the plurality of elongated metal members (100, 200) to make a 180 degree turn and to go to a second level different from the first level and guiding the plurality of elongated metal members (100, 200) in a second direction opposite to the first direction through a second plating bath (110, 214); c) forcing the plurality of elongated metal members (100, 200) again to make a 80 degree turn and to go to a third level different from the first level and different from the second level and guiding the plurality of elongated metal members (100, 200) in the first direction. By using various levels, space can be saved and flexibility can be built in existing plating lines.
Description
Technical field
The present invention relates to the method for a plurality of elongated metallic parts of a kind of sequentially plating and a kind of for the equipment of a plurality of elongated metallic parts of plating sequentially.
Background technology
It is known in the art being used for the sequentially method and apparatus of a plurality of elongated metallic parts of plating (for example wire).For example, in the process of manufacturing the steel wire cord of strengthening for tire, standard practices is first to use copper plating steel wire, then uses zinc plating.After the coating of copper and zinc, carry out DIFFUSION TREATMENT, to produce Brass coating on steel wire.As another example, the steel wire using in aquaculture net preferably has cupronickel coating.Described coating can apply by copper plating and nickel plating and heat diffusion treatment subsequently.
Verified these existing many metal wires equipment can provide the metal wire with specific coating ingredients and specific coat-thickness well.Once people wish that metal wire has different coating component or another coat-thickness, the adaptation of these equipment expends time in very much.
These many metal wires plating equipments generally include other module, and for example pickling, rinsing, flux are processed, thermal treatment ...Therefore, these equipment are quite long, and occupy large quantity space, in production line building, are not always useful on the space of other structure.
CN-A-1127309 disclose a kind of in two plating tanks the method for a plurality of elongated metallic parts of plating sequentially, wherein, a plating tank is positioned at the top of another plating tank.But, it is more flexible that described method can not make existing plating production line.And the unwinding operation of elongated metallic parts and winding operation carry out in the same side of equipment, this makes to process very complicated.
Summary of the invention
Main purpose of the present invention is to provide a kind of equipment of many metal wires more flexibly and method.
Another object of the present invention is to provide a kind of joint space-efficient many metal wires equipment and method.
Another object of the present invention is to provide a kind of many metal wires equipment and the method that can use existing installation.
Another object of the present invention is to provide a kind of many metal wires equipment and the method that can manufacture specific product combination.
According to a first aspect of the invention, provide a kind of in two or more plating grooves the method for a plurality of elongated metallic parts of plating sequentially.Said method comprising the steps of:
At the first At The Height, along first direction, guide described a plurality of elongated metallic parts by the first plating pond and may pass through the first rinsing bath;
Force described a plurality of elongated metallic parts to carry out 180 degree and turn to, and arrive second height highly different from first, and pass through the second plating pond along the described a plurality of elongated metallic parts of second direction guiding contrary with first direction;
Force described a plurality of elongated metallic parts again to carry out 180 degree and turn to, and arrive highly different from first and with the second highly different third high degree, and guide described a plurality of elongated metallic parts along first direction.
The example of elongated metallic parts is wire, steel wire cord, steel fiber, copper cash
US-A-3947343 discloses and a kind ofly for degrease and with tin, copper cash has been carried out to electric plating method and device.Contrary with the present invention, it is the production line of monometallic wire.In order to have the plating production line of working at a relatively high speed the length dimension that makes production line to keep limited, copper cash carries out a plurality of loops, and repeatedly advances by two plating grooves, and these of two plating grooves are positioned at another top.For the production line of many metal wires, can not make a plurality of loops by identical plating groove and degrease groove.
Referring again to the present invention, by plating groove being positioned to a plurality of height and turning to by carrying out twice 180 degree, can make many metal wires process flexibly, also save space.For example, in one embodiment, some plating grooves can be skipped, and in another embodiment, use whole plating grooves.
In addition, by plating groove is arranged in to a plurality of height, can existing production line be escalated into for larger product mix by one or more other plating grooves being added on existing production line, not need more big-length simultaneously.
In the first embodiment of aforesaid method, by after the second plating pond, in step b, along second direction, in the second At The Height guiding elongated metallic parts, pass through the second rinsing bath.
In the second embodiment of aforesaid method, in step c, along first direction, in third high degree place guiding elongated metallic parts, pass through the second rinsing bath.
In the preferred design of described embodiment, the second plating pond is positioned at the first horizontal position.The second rinsing bath is positioned at the second horizontal position.The first level attitude and the second level attitude are not overlapping, thereby avoid being spilled over to plating pond or being spilled over to rinsing bath from plating pond from rinsing bath.
Preferably, from first highly arrive second and third high degree after, along first direction by described a plurality of elongated metallic parts from third high degree lead back to first height.
Conventionally, existing installation is only positioned at the first height.
According to the present invention, increased by the second height and third high degree, and the possibility of additional plating is provided.After the described additional plating by the second height and third high degree, elongated metallic parts is along directed time first height of first direction.The rest part of production line (for example other plating or Wiring apparatus) does not need to change.
Most preferably, upper height has the base portion of holding, for example, to prevent that liquid (electrolytic solution, acid, chemical agent) from arriving floor level.Holding base portion will avoid overflowing for the operator on floor of coating solution or rinse water to produce danger.Hold base portion and also by avoiding, on floor, produce larger liquid spilling.In addition, hold the further processing that base portion is very beneficial for controlling liquid under leakage or unforeseen circumstances.
As optional mode of the present invention, a plating groove can be in floor level, and another plating groove can be positioned at underground height.Term " underground height " refers to the height lower than floor level, like this, at the plating groove of floor level, can be located at underground height plating groove above.
Plating groove can one be positioned at another top or not like this.
Plating groove can be plating tank or chemistry or without electric plating groove.
In a plurality of plating grooves of the present invention, identical or different metal can be plated in elongated metal element.
According to a second aspect of the invention, provide a kind of for the equipment of a plurality of elongated metallic parts of plating sequentially.Described equipment comprises two or more plating ponds.Described equipment comprises:
A) the first plating pond, described the first plating pond is positioned at the first At The Height;
B) for guiding described a plurality of elongated metallic parts to pass through the device in the first plating pond along first direction;
C) the second plating pond, described the second plating pond is positioned at second At The Height highly different from first;
D) for forcing described a plurality of elongated metallic parts to carry out the device of second direction arrival the second height that 180 degree turn to and edge is contrary with first direction;
E) for guiding described a plurality of elongated metallic parts by the device in the second plating pond;
F) for force described a plurality of elongated metallic parts again carry out 180 degree turn to and arrive highly different from first and with the device of the second highly different third high degree;
G) for guide the device of described a plurality of elongated metallic parts along first direction at third high degree place.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment of the many plating production lines highly of many metal wires.
Fig. 2 is the schematic diagram of the second embodiment of the many plating production lines highly of many metal wires.
Fig. 3 has represented many metal wires scheme of the present invention.
Embodiment
Fig. 1 has represented that how many height scheme is can be for making plating production line have handiness.
First wire 100 is conducted through for copper-plated plating tank 102, subsequently by rinse tank 104.Plating tank 102 and rinse tank 104 are all positioned at floor level 106.
Make wire 100 electronegative, and as negative electrode.Plating groove 102 comprises electrolytic solution and wants plating to the metal ion of the metal on wire 100.For example, electrolytic solution can be Cuprocitrol, copper amine, cupric tartrate, copper sulfate, cupric pyrophosphate, cupric fluoborate or cupric cyanide.Anode is formed by the soluble copper anode being placed on supporting plate.Cathode current density is 1 and 20A/dm
2between change.The speed of wire can change between 10m/min and 150m/min.Four, five or even more rinse tank 104 can arranged in series.Before entering each rinse tank, by wiper, carry out cleaning wire line.
This wiper can be taked various ways, the mechanical wiper for example contacting with metal wire, use vacuum pumping liquid from metal wire suction type wiper, use point to the pressurized air of metal wire in case remove adhesion liquid wiper or be the wiper of narrow form of tubes.
Then, by guide reel 108 and 109 guiding steel wire lines 100, to high altitude more, at described more high altitude place, they are by for copper-plated the second plating tank 110.Guide reel 112,113 is delivered to even higher height by wire 100, and guiding steel wire line 100 is by rinse tank 114.
Wire 100 keeps a little while at described more high altitude place, and passes through for the first zinc-plated plating tank 116.
Zinc plating tank 116 can comprise zinc cyanide, zinc sulfate, zinc chloride, zinc fluoroborate and zinc pyrophosphate.
Guide reel 118,119 is delivered to lower a little height by wire 100, and guiding steel wire line 100 is by rinse tank 120.
Provide and hold base plate 122 as the base portion for groove 110,114,116 and 120.The described base plate 122 that holds preferably includes border or edge, for preventing that liquid from flowing through to floor 106.Holding base plate 122 is manufactured by the material that tolerates the chemical agent of using in plating pond.Hold base plate and can comprise slit, to allow wire 100 to pass through.These slits are preferably also provided with border or edge.
Guide reel 123,124 returns to floor 106 by wire 100, and at this place, wire carries out the second plating of zinc in electrolytic plating pool 126.One group of rinse tank 128 is positioned at the downstream of zinc plating groove 126.
At upper height place, rinse tank 114 is not preferably directly positioned at the top of plating groove 110.For plating groove 116, be like this, described plating groove 116 is not preferably positioned at the top of rinse tank 120 yet.Doing is like this groove for fear of below a groove is spilled over to.Taking appropriate action to avoid overflowing like this in the situation that, can locate more compactly (one above another).
The equipment of Fig. 1 can be used as follows.
When only needing thin Brass coating (=copper+zinc+thermodiffusion subsequently), as the situation of the wire for tyre steel wire cord, wire 100 can be advanced forward by linear, and can skip plating groove and rinse tank at upper height place.
When the thicker Brass coating of hope, as for strengthening the wire of rubber hose, the structure of Fig. 1 and wiring (effectively using upper height) are very suitable.This structure can apply thicker coating, and needn't reduce the inlet wire speed of wire 100.
In the structure of Fig. 1, in the situation that plating groove 102 and 110 has identical electrolytic solution, people can skip rinse tank 104.In the situation that plating tank 116 and 126 has identical electrolytic solution, be also like this, at this moment can skip rinse tank 120.
Fig. 2 has represented can in the situation that not needing more big-length, upgrade to the plating production line for ternary alloy coating for the existing plating production line of binary alloy coating.
Wire 200 is first through copper plating tank 202, subsequently by rinse tank 204.Copper plating tank 202 and rinse tank are all positioned at floor level 206.
Then, wire 200 carries out zinc plating in zinc plating tank 208.Then, wire 200 carries out rinsing in rinse tank 210.Zinc plating groove 208 and rinse tank are also positioned at floor level 206.
Guide reel 211 and 212 is delivered to upper height by wire 200, at described upper height place, in the plating groove 214 without electric with the 3rd metal (being cobalt) plating wire 200.Other guide reel 216,217 is delivered to even more high altitude by wire 200, in described more high altitude place, wire 200 rinsing in rinse tank 218.Without electric plating groove 214 and rinse tank 218, be positioned at and hold on base plate 220.
Except cobalt, electrochemical potential is greater than other element (for example iron, nickel, the manganese of zinc ...) also can in the plating groove without electric, be plated on zinc.
Guide reel 221,222 returns to floor level by wire 200, then, wire is carried out to heat diffusion treatment (not shown), to produce ternary alloy coating on wire 200.
Structure and wiring are for apply the structure of ternary alloy copper-zinc-cobalt coating on wire as shown in Figure 2.For more common brass binary alloy coating, can skip upper height.
Fig. 1 and 2 has just schematically represented plating groove and rinse tank.Conventionally, these plating grooves and rinse tank at the heat treated equipment for wire (for example, for the stove of austenitizing, after and then patenting pond) before.In addition, pickling tub and clean pond are positioned at the upstream of plating groove and rinse tank just.
Fig. 3 has represented many metal wires scheme of the present invention.Whole equipment and each plating groove 300 and rinse tank are designed to process a plurality of parallel steel wire lines 302 simultaneously.The number of the wire 302 extending in parallel can be changed to 32 and be changed to 64 and Geng Duo from 12.A plurality of parallel steel wire lines 302 are directed to electrolysis liquid pool 304, and cross guide reel 306 and lead to more high altitude (not shown).
Above-mentioned example comes from the wire field for rubber reinforcement.Similar devices can be for other field.For example, wire can be coated with copper, nickel and tin, to be provided for the corrosion-resistant and anti-pollution coating of aquaculture object.
List of reference characters
Fig. 1
100 wires
102 copper plating tanks
104 rinse tanks
106 floor levels
108 guide reels
109 guide reels
110 copper plating tanks
112 guide reels
113 guide reels
114 rinse tanks
116 zinc plating tanks
118 guide reels
119 guide reels
120 rinse tanks
122 hold base plate
123 guide reels
124 guide reels
126 zinc plating tanks
128 rinse tanks
Fig. 2
200 wires
202 copper plating tanks
204 rinse tanks
206 floor levels
208 zinc plating tanks
210 rinse tanks
211 guide reels
212 guide reels
214 without electric cobalt plating groove
216 guide reels
217 guide reels
218 rinse tanks
220 hold base plate
221 guide reels
222 guide reels
Fig. 3
The plating of metal wire more than 300 groove
302 wires
304 plating ponds
306 guide reels
Claims (9)
1. a method for a plurality of elongated metallic parts of plating sequentially in two or more plating ponds, said method comprising the steps of:
A) at the first At The Height, along the described a plurality of elongated metallic parts of first direction guiding, pass through the first plating pond;
B) make described a plurality of elongated metallic parts carry out 180 degree and turn to, and arrival second height highly different from described first, and pass through the second plating pond along the described a plurality of elongated metallic parts of second direction guiding contrary with described first direction;
C) make described a plurality of elongated metallic parts again carry out 180 degree and turn to, and arrival is highly different from described first and with the described second highly different third high degree, and along the described a plurality of elongated metallic parts of described first direction guiding.
2. method according to claim 1, wherein: by after described the second plating pond, in step b, along described second direction, at described the second At The Height, guide described elongated metallic parts by the second rinsing bath.
3. method according to claim 1, wherein: in step c, along described first direction, at described third high degree place, guide described elongated metallic parts by the second rinsing bath.
4. method according to claim 3, wherein: described the second plating pond is positioned at the first horizontal position, described the second rinsing bath is positioned at the second horizontal position, described the first level attitude and described the second level attitude are not overlapping, thereby avoid being spilled over to described plating pond or being spilled over to described rinsing bath from described plating pond from described rinsing bath.
5. according to the method described in aforementioned any one claim, wherein: described a plurality of metal wires are also along described first direction from directed time described the first height of described third high degree.
6. according to the method described in aforementioned any one claim, wherein: described the second height is higher than described the first height.
7. method according to claim 6, wherein: described third high degree is higher than described the second height.
8. method according to claim 7, also comprises: provide the base portion that holds below described the second height and described third high degree, to prevent that liquid from arriving floor level.
9. for an equipment for a plurality of elongated metallic parts of plating sequentially in two or more plating ponds, described equipment comprises:
A) the first plating pond, described the first plating pond is positioned at the first At The Height;
B) for guiding described a plurality of elongated metallic parts to pass through the device in described the first plating pond along first direction;
C) the second plating pond, described the second plating pond is positioned at second At The Height highly different from described first;
D) for making described a plurality of elongated metallic parts carry out 180 degree, turn to the device that also arrives described the second height along the second direction contrary with described first direction;
E) for guiding described a plurality of elongated metallic parts by the device in described the second plating pond;
F) for make described a plurality of elongated metallic parts again carry out that 180 degree turn to and arrival is highly different from described first and with the device of the described second highly different third high degree;
G) for guide the device of described a plurality of elongated metallic parts along described first direction at described third high degree place.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12154053.8 | 2012-02-06 | ||
| EP12154053 | 2012-02-06 | ||
| PCT/EP2012/075240 WO2013117269A1 (en) | 2012-02-06 | 2012-12-12 | Multi-wire plating line at various levels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103998655A true CN103998655A (en) | 2014-08-20 |
Family
ID=47351678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280062790.5A Pending CN103998655A (en) | 2012-02-06 | 2012-12-12 | Multi-wire plating line at various levels |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103998655A (en) |
| WO (1) | WO2013117269A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105420799A (en) * | 2015-12-30 | 2016-03-23 | 长沙岱勒新材料科技股份有限公司 | Plating tank, diamond fretsaw manufacturing device and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652731B (en) * | 2021-08-20 | 2022-07-29 | 四川威纳尔特种电子材料有限公司 | Conductive guide wheel device of metal wire and electroplating production line |
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| US4388157A (en) * | 1981-03-07 | 1983-06-14 | Galentan Ag | Method of applying coverings in the form of completely or not completely closed loops |
| CN1127309A (en) * | 1994-08-25 | 1996-07-24 | 柳义秀 | Multi-layered electroplating apparatus for plating a wire |
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| US4388157A (en) * | 1981-03-07 | 1983-06-14 | Galentan Ag | Method of applying coverings in the form of completely or not completely closed loops |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105420799A (en) * | 2015-12-30 | 2016-03-23 | 长沙岱勒新材料科技股份有限公司 | Plating tank, diamond fretsaw manufacturing device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013117269A1 (en) | 2013-08-15 |
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Application publication date: 20140820 |
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