CN103987237B - A kind of based on solid absorption driving and the electronic-device radiator of heat pipe intensified heat transfer - Google Patents
A kind of based on solid absorption driving and the electronic-device radiator of heat pipe intensified heat transfer Download PDFInfo
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- CN103987237B CN103987237B CN201410249378.5A CN201410249378A CN103987237B CN 103987237 B CN103987237 B CN 103987237B CN 201410249378 A CN201410249378 A CN 201410249378A CN 103987237 B CN103987237 B CN 103987237B
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Abstract
The invention discloses a kind of driving based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, comprise vaporizer, adsorbent bed, condenser, expansion valve, hot-water heating system and cooling water system；Hot-water heating system comprises boiler and heat exchanger；Cooling water system comprises cooling water tank, condenser and cooling tower；Base of evaporator is evaporation panel, it is possible to being buckled by its lower surface on electronic device heat generating member, be provided with heat pipe group inside vaporizer, vaporizer is connected with adsorbent bed and expansion valve respectively, and the other end of expansion valve is connected with condenser；Adsorbent bed is connected with cooling water tank, boiler, cooling tower, heat exchanger, condenser respectively by pipeline, and the pipeline between adsorbent bed and boiler is provided with heat-exchanger pump, and the pipeline between adsorbent bed and cooling water tank is provided with cooling water pump.What the present invention provided drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, has the advantages such as capacity usage ratio is high, low to driving heat source temperature requirement, easy to control.
Description
Technical field
The present invention relates to a kind of low-grade heat source and utilize technology and electronic device radiating device, in particular it relates to a kind of base
Drive and the electronic-device radiator of heat pipe intensified heat transfer in solid absorption.
Background technology
At present, in China, electronics industry quickly grows, along with high frequency, high speed and the integrated circuit technique of electronic device
Progressive, the performance of electronic device is more and more higher so that caloric value and the heat flow density of unit volume electronic device increase considerably,
For by electronic chip, the maximum heating power of current electronic chip has been over 100w/cm2, but also quickly increasing
Adding, the constraint that the layout of electronic heat dissipation device and design run into gets more and more.
Conventional traditional radiating mode the most air-cooled (forced convertion), owing to its cooling effectiveness is directly proportional to the speed of fan,
When heat flow density reaches certain numerical value, this type of cooling seems unable to do what one wishes.Popular radiating mode also has water-cooled to dissipate
Heat, semiconductor refrigerating and hot pipe technique.
Heat pipe is the heat transfer element with extra high heat conductivility grown up in the sixties in last century, structure comparison
Simply, Fig. 1 is the operation principle sketch of heat pipe, and shell uses metal tube, and its inwall attaches mesh-like wick, to utilize capillary
Power make hydraulic fluid in wick not the restriction of heat pipe position and move.Shell two ends are shut, evacuation in pipe, pour into suitable
The working solution of amount.During work, the hydraulic fluid of evaporator section 18 by heat pipe outside hot fluid heats, draw latent heat evaporation, its steam
Flowing to condensation segment 16 through adiabatic section 17, working solution steam releases latent heat, is condensed into liquid.The latent heat that steam liquefied discharges leads to
Cross tube wall and pass to the cold flow body outside heat pipe.Accumulate in the work by wick capillary force of the condensation water in condensation segment wick
Absorb heat again evaporation with returning to bringing-up section.This circulation of working solution is just delivered to condensation segment heat from bringing-up section.By heat pipe
In the heat pipe heat spreader of Shu Zucheng, by this intermediary of heat pipe, the heat of hot fluid just can pass to cold flow body, it is achieved passes
Thermal process.
China's existing solution dehumidification technology is to improve cocnentration factor as goal in research, and multistage flash evaporation seawater desalting be with
Raising water generation ratio is research direction, although both purposes are different, but its core essence is completely the same, i.e. by heat-driven with true
Reciprocal of duty cycle controls, and separates the moisture in solution the most fast and efficiently.And at the beginning of the fundamental driving force solution that moisture constantly separates
Beginning flash temperature and the difference of cooling water temperature, i.e. under the conditions of certain vacuum degree, cool down the speed of water collateral coagulation water vapour certainly
Determine the evaporation rate of moisture in solution, and rate of set depends primarily on cooling water temperature.
For condensation process, there are 2 deficiencies: (1) condensation process " neutralizes " the solidifying of water vapour by the sensible heat of cooling water
Knot latent heat, efficiency is the lowest, and condensation process water vapour quasi-equilibrium pressure is higher, close to 8～50kPa, reduces solution inlet
The degree of superheat, constrains evaporation ends evaporation efficiency；(2) because of temperature reference (the seawater desalination system cooling water master of conventional cooling water
Sea water to be used, general about 25 DEG C, dehumidification solution regeneration then employing cooling tower cooling water, general about 32 DEG C), available low
Grade thermal source scope is restricted, and when such as using 60 DEG C of solution multistage flash evaporation regeneration, both temperature difference only have 28 DEG C, can arrange level
Number is restricted.
For solution flash process, there are 2 deficiencies: (1) this be a face evaporation, disengagement area is limited；(2) with
Continuing of moisture evaporation, bulk solution temperature quickly reduces, i.e. degree of superheat reduction even disappears, and its evaporation intensity subtracts the most therewith
Weak.
It will be apparent that for be in evaporation process solution provide enough heats become keep its evaporation intensity key because of
Element, the coagulability that condenser matches simultaneously is also the important step that this process can persistently be carried out.Multistage currently without opinion
Flash distillation or the desalination technology of low temperature multiple-effect distillation, all use step by step transformation to adapt to sea water or boiling temperature stepped change
Demand, although this design is Multi-class propagation based on heat, but the caving-in bash that single-stage evaporation amount is limited, therefore improve
Single-stage evaporation amount and heat utilization rate then can optimize whole system design.
Summary of the invention
It is an object of the invention to provide a kind of device high for the new heat transfer efficiency of dissipation from electronic devices, heat pipe is strong
Change heat transfer, solid absorption drives, electronic device cooling these three technology combines, and has capacity usage ratio high, to driving heat source temperature
Degree requires the advantages such as low, easy to control.
In order to achieve the above object, the invention provides a kind of driving and the electronics of heat pipe intensified heat transfer based on solid absorption
Device radiator, wherein, this electronic-device radiator comprises vaporizer, adsorbent bed, condenser, expansion valve, hot-water heating system and cold
But water system；Described hot-water heating system comprises the boiler and heat exchanger connected by pipeline；Described cooling water system comprises and passes through
Cooling water tank, condenser and the cooling tower that pipeline connects；Described base of evaporator is evaporation panel, and described evaporation panel can
Its lower surface is closely buckled on electronic device heat generating member, constitute main heat transfer part；Be provided with inside described vaporizer with
The heat pipe group that described evaporation panel is vertical, the bottom of described heat pipe group is fixed with described evaporation panel；Described vaporizer is provided with
Pipeline is connected with adsorbent bed and expansion valve respectively, and the other end of described expansion valve is connected with condenser；Described vaporizer and suction
Pipeline between attached bed is provided with valve；Described adsorbent bed by pipeline respectively with cooling water tank, boiler, cooling tower, change
Hot device, condenser connect, and this pipeline is respectively equipped with valve；Pipeline between described adsorbent bed and boiler is provided with hot water
Pump, it is possible to pumped out by the hot water in boiler, flows into adsorbent bed by valve, then outflows back in heat exchanger by valve, complete
Become circulation；Pipeline between described adsorbent bed and cooling water tank is provided with cooling water pump, it is possible to by the cold water in cooling water tank
Pump out, enter adsorbent bed by valve and adsorb, exit into cooling tower cooling by valve after absorption and come back to again
Cooling water tank, completes circulation.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described expansion
Valve can be by cold-producing medium throttling atomization, inside vaporizer internal spray full whole vaporizer.Cold-producing medium is the most nontoxic
The substitute HFC-123(dichlorotrifluoroethane of pollution-free and non-flammable refrigeration working medium), HFC134a(tetrafluoroethane), R290
(propane), HFC-152(Difluoroethane), HFC-22(monochlorodifluoromethane) etc. one in working medium or by two kinds therein
Or two or more mix.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described evaporation
The heat pipe diameter range of the described heat pipe group within device is 4-16mm, and length range is 150-200mm；Described heat pipe uses circle
Pipe or flat tube.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described heat pipe
Substituted the upper surface of traditional welding procedure and evaporation panel by related industries processor such as punching etc. bottom the heat pipe of group
One plane of fixing formation, the lower surface simultaneously evaporating panel can be buckled in above electronic device heat generating member.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described heat pipe
The mode using fork row inside vaporizer arranges, along the half that heat pipe spacing is pipe diameter length of the flow direction of cold-producing medium,
Spacing and the pipe diameter length of every two heat exhausting pipes on vertical cold-producing medium flow direction are equal.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described heat pipe
Inside being provided with wick, its structure is any one in screen net structure, fibre structure, groove structure, sintering cored structure.According to work
Matter is different, can be pumped into negative pressure by demand in pipe.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described absorption
Bed is internal is provided with the solid absorbent that can adsorb water vapour, such as silica gel, zeolite etc., and its surface adsorption pressure can reach
1kPa～2kPa.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described absorption
It is one group that bed uses two, and often group comprises the first adsorbent bed and the second adsorbent bed；The first described adsorbent bed and the second adsorbent bed
Between be provided with circulation of fluid pump.During two switch, circulatory fluid flow, it is achieved the backheat between two.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described first
The first adsorbent bed internal duct and the second adsorbent bed internal duct it is respectively equipped with inside adsorbent bed and the second adsorbent bed, and by it
Respectively the most all be connected cooling tower, heat exchanger, and cooling water tank, boiler pipeline connection.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described electronics
The heat-insulation layer that adiabator such as foam class makes it is coated with on connecting line in device radiator.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described electronics
The heat pipe for thermal conductivity coefficient of device radiator is 105The W/m s order of magnitude.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described electronics
The driving heat source that device radiator uses comes from the low-grade heat source of 55-90 DEG C, including solar energy and industrial exhaust heat, used heat
Deng.
Above-mentioned drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, wherein, and described electronics
Device radiator is after unlatching, and the expanded valve of cold-producing medium water is atomized, sprays and be full of whole vaporizer, washes away the heat pipe of fork row
Group, in evaporation panel and tube surface heat absorption evaporation, takes away the heat dissipation capacity of electronic device.Two adsorbent beds instead of compressor
Effect sucks water vapour, and the solid absorbent being filled in adsorbent bed, such as silica gel, zeolite etc. utilize to be had water vapour strongly
Adsorption quickly catches water vapour.When water vapour is adsorbed, a large amount of heat of adsorption can be released, by the logical cooling of two adsorbent beds
Water keeps absorbability, until adsorbing saturated.At this moment by the low-grade hot water of 55-90 DEG C, solid absorbent can be carried out
Desorption.By the switching of valve, make two adsorbent bed alternating sorbent desorptions, it is ensured that persistently carrying out of water separation process.Its
Middle cooling water and hot water are provided by cooling water system and hot-water heating system, and form the interior circulation closed.
What the present invention provided drives the electronic-device radiator with heat pipe intensified heat transfer to have following excellent based on solid absorption
Point:
1. cold-producing medium can be atomized, spray and be full of whole vaporizer by expansion valve, adds the heat transfer area of cold-producing medium, by force
Change diabatic process.
2. the heat conductivity of heat pipe is 105The W/m s order of magnitude, for the 10 of copper3～104Times, heat can be transmitted rapidly, heat
Nest of tubes is equivalent to add the heat transfer area of evaporation panel, has higher evaporation rate.
3. can fill different working medium in heat pipe or be pumped into negative pressure, adapting to different operating temperature demands.
4. the mode of fork row makes refrigerant fluid transversal flow tube surface, adds the disturbance of cold-producing medium, enhances
Heat transfer.
5. use the switching of many adsorbent beds, and take backheat measure, the persistence that the system that can guarantee that is run and the raising thermal efficiency.
6. driving heat source comes from the low-grade heat source of 55-90 DEG C, including solar energy and industrial exhaust heat, used heat etc., has
Fabulous energy-saving effect.
Accompanying drawing explanation
Fig. 1 is the operation principle schematic diagram of existing heat pipe.
Fig. 2 is the structural representation based on solid absorption driving with the electronic-device radiator of heat pipe intensified heat transfer of the present invention
Figure.
Fig. 3 is the adsorbent bed office based on solid absorption driving with the electronic-device radiator of heat pipe intensified heat transfer of the present invention
Portion's schematic diagram.
Detailed description of the invention
Below in conjunction with accompanying drawing, the detailed description of the invention of the present invention is further described.
As in figure 2 it is shown, the electronic-device radiator based on solid absorption driving with heat pipe intensified heat transfer that the present invention provides,
Comprise vaporizer 13, adsorbent bed 15, condenser 2, expansion valve 1, hot-water heating system and cooling water system.
Hot-water heating system comprises the boiler 6 and heat exchanger 5 connected by pipeline.
Cooling water system comprises cooling water tank 4, condenser 2 and the cooling tower 3 connected by pipeline.
For evaporation panel 12 bottom vaporizer 13, its lower surface can closely be buckled by evaporation panel 12 to be sent out at electronic device
On warmware 11, constitute main heat transfer part；Vaporizer 13 is internal is provided with the heat pipe group 14 vertical with evaporating panel 12, heat pipe group 14
Bottom fix with evaporation panel 12.
Vaporizer 13 is provided with pipeline and is connected with adsorbent bed 15 and expansion valve 1 respectively, the other end of expansion valve 1 and condenser 2
Connect.Expansion valve 1 can be by cold-producing medium throttling atomization, to vaporizer 13 internal spray full whole vaporizer 13 inside.System
Cryogen is preferably the substitute HFC-123(dichlorotrifluoroethane of nontoxic pollution-free and non-flammable refrigeration working medium), HFC134a
(tetrafluoroethane), R290(propane), HFC-152(Difluoroethane), HFC-22(monochlorodifluoromethane) etc. one in working medium or
Person is to be mixed by therein two or more.
The heat pipe diameter range of the heat pipe group 14 within vaporizer 13 is 4-16mm, and length range is 150-200mm；Heat pipe
Use pipe or flat tube.Traditional Welder is substituted by related industries processor such as punching etc. bottom the heat pipe of heat pipe group 14
Skill is fixing with the upper surface of evaporation panel 12 forms a plane, and the lower surface of evaporation panel 12 can be buckled in electronic device simultaneously
On heat generating member 11.Heat pipe uses the mode of fork row to arrange, along between the heat pipe of the flow direction of cold-producing medium inside vaporizer 13
Spacing and the pipe diameter length of every two heat exhausting pipes in the half for pipe diameter length, vertical cold-producing medium flow direction are equal.Heat pipe
Inside being provided with wick, its structure is any one in screen net structure, fibre structure, groove structure, sintering cored structure.According to work
Matter is different, can be pumped into negative pressure by demand in heating pipe.The heat pipe for thermal conductivity coefficient of electronic-device radiator is 105W/m s quantity
Level.
Adsorbent bed 15 is internal is provided with the solid absorbent that can adsorb water vapour, such as silica gel, zeolite etc., its surface adsorption
Pressure can reach 1kPa～2kPa.
Adsorbent bed 15 uses two to be one group, and often group comprises the first adsorbent bed 7 and the second adsorbent bed 8；First adsorbent bed 7 He
Circulation of fluid pump b-3 it is provided with between second adsorbent bed 8.During two switch, circulatory fluid flow, it is achieved returning between two
Heat.
First adsorbent bed 7 and the second adsorbent bed 8 inside are respectively equipped with in the first adsorbent bed internal duct 9 and the second adsorbent bed
Portion's pipeline 10, and by its respectively the most all be connected cooling tower 3, heat exchanger 5, and cooling water tank 4, boiler 6 pipeline connection.
That is, the first adsorbent bed 7 and the second adsorbent bed 8 by pipeline respectively with cooling water tank 4, boiler 6, cooling tower 3, heat exchanger 4, cold
Condenser 2 connects, and this pipeline is respectively equipped with valve v-11 and v-13, v-12 and v-10, v-2 and v-9, v-3 and v-8, v-4 and v-
7.Pipeline between vaporizer and the first adsorbent bed 7 and the second adsorbent bed 8 is provided with valve v-1, v-5.Shown in Figure 3.
Pipeline between adsorbent bed 15 and boiler 6 is provided with heat-exchanger pump b-2, it is possible to pumped out by the hot water in boiler 6,
Flow into adsorbent bed 15 by valve v-12, v-10, then outflow back in heat exchanger 5 by valve v-3, v-8, complete circulation.
Pipeline between adsorbent bed 15 and cooling water tank 4 is provided with cooling water pump b-1, it is possible to cold by cooling water tank 4
Water pumps out, and enters adsorbent bed 15 by valve v-11, v-13 and adsorbs, is exited into by valve v-2, v-9 after absorption
Cooling tower 3 cools down and comes back to cooling water tank 4 again, completes circulation.
The heat-insulation layer that adiabator such as foam class makes it is coated with on connecting line in electronic-device radiator.
The driving heat source that electronic-device radiator uses comes from the low-grade heat source of 55-90 DEG C, including solar energy and work
Amateurish heat, used heat etc..
What the present invention provided drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, its work process
As follows: this radiator is after unlatching, and the expanded valve of cold-producing medium water 1 is atomized, sprays and is full of whole vaporizer 13, wash away fork row's
Heat pipe group 14, in evaporation panel 12 and tube surface heat absorption evaporation, takes away the heat dissipation capacity of electronic device.Two adsorbent beds instead of
The effect of compressor sucks water vapour, is filled in the solid absorbent in adsorbent bed 15, such as silica gel, zeolite etc. and utilizes water steaming
Vapour has strong adsorption effect and quickly catches water vapour.When water vapour is adsorbed, a large amount of heat of adsorption can be released, by two suctions
Attached bed logical cooling water keeps absorbability, until adsorbing saturated.At this moment the low-grade hot water of 55-90 DEG C can be passed through to solid
Adsorbent is desorbed.By the switching of valve, make two adsorbent bed alternating sorbent desorptions, it is ensured that holding of water separation process
Continue and carry out.Wherein cooling water and hot water are provided by cooling water system and hot-water heating system, and form the interior circulation closed.
What the present invention provided drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, firstly for existing
Some vaporizers are transformed:
The first step: evaporation panel 12(copper coin thin slice) upper punching constitutes the end cap (i.e. heat pipe evaporator section 18) of heat pipe, heat pipe
The end cap of group 14 is overall at same plane.
Second step: machining is connected to the package (i.e. heat pipe adiabatic section 17) of heat pipe on end cap.
3rd step: make heat pipe inner wall attach mesh-like wick, and pour into appropriate working solution.
4th step: according to needing interior for pipe evacuation, shut the seal head end (i.e. heat pipe condenser section 16) of package, heat pipe and heat
The mode using fork row between pipe arranges.
5th step: the evaporation panel 12 after repacking above is held on electronic device 11.
What the present invention provided drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, operationally,
Cold-producing medium is lowered the temperature by expansion valve 1 blood pressure lowering, is sprayed onto vaporizer 13 after being atomized.Hydraulic fluid in heat pipe evaporator section 18 is by electronics
The evaporation of heat that device distributes, its steam flows to condensation segment 16 through adiabatic section 17 and condenses, the latent heat of releasing managed outer laterally
The cold-producing medium atomization drop absorption washed away.Accumulate in the effect by wick capillary force of the condensation water in condensation segment 16 wick
Returning to evaporator section 18 absorb heat evaporation, it is achieved circulation, the heat that electronic device is distributed constantly is delivered to condensation from evaporator section 18 again
Section 16.Becoming water vapour after cold-producing medium heat absorption, and be connected with adsorbent bed by pipeline, two adsorbent beds 15 are alternately connected with cooling water
Or hot water, to realize adsorbing and being desorbed simultaneously, it is ensured that being carried out continuously of process.Condenser 2 is connected with adsorbent bed 15 by pipeline,
After condenser 2 condensation formation condensed fluid is lowered the temperature by expansion valve 1 blood pressure lowering, it is again introduced into vaporizer 13 forms kind of refrigeration cycle；Circulation
Hot water heated by low-temperature heat source by heat exchanger 5 after enter boiler 6, then by heat-exchanger pump b-2 be pumped to adsorbent bed 15 realize follow
Ring.Recirculated cooling water is cooled after tower 3 cools down and enters cooling water tank 4, is pumped to condenser 2 He respectively at cooled water pump b-1
Adsorbent bed 15 realizes circulation.
What the present invention provided drives based on solid absorption and the electronic-device radiator of heat pipe intensified heat transfer, by heat pipe intensified
Heat transfer, solid absorption drive, electronic device cooling these three technology combines, and have capacity usage ratio high, to driving heat source temperature
Require the advantages such as low, easy to control.
Although present disclosure has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read foregoing, for the present invention's
Multiple amendment and replacement all will be apparent from.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (8)
1. one kind drives and the electronic-device radiator of heat pipe intensified heat transfer based on solid absorption, it is characterised in that this electronics device
Part radiator comprises vaporizer (13), adsorbent bed (15), condenser (2), expansion valve (1), hot-water heating system and cooling water system；
Described hot-water heating system comprises the boiler (6) and heat exchanger (5) connected by pipeline；
Described cooling water system comprises cooling water tank (4), condenser (2) and the cooling tower (3) connected by pipeline；
Described vaporizer (13) bottom is evaporation panel (12), and its lower surface can closely be buckled by described evaporation panel (12)
On electronic device heat generating member (11)；Described vaporizer (13) is internal is provided with the heat pipe group vertical with described evaporation panel (12)
(14), the bottom of described heat pipe group (14) is fixed with described evaporation panel (12)；
Described vaporizer (13) is provided with pipeline and is connected with adsorbent bed (15) and expansion valve (1) respectively, described expansion valve (1) another
One end is connected with condenser (2)；Pipeline between described vaporizer (13) and adsorbent bed (15) is provided with valve；Described is swollen
Swollen valve (1) can be by cold-producing medium throttling atomization, to vaporizer (13) internal spray full vaporizer (13) inside；
Described adsorbent bed (15) by pipeline respectively with cooling water tank (4), boiler (6), cooling tower (3), heat exchanger (5),
Condenser (2) connects, and this pipeline is respectively equipped with valve；Internal being provided with of described adsorbent bed (15) can adsorb consolidating of water vapour
Body adsorbent, its surface adsorption pressure can reach 1kPa～2kPa；
Pipeline between described adsorbent bed (15) and boiler (6) is provided with heat-exchanger pump (b-2), it is possible to by boiler (6)
Hot water pump out, flow into adsorbent bed (15) by valve, then outflow back in heat exchanger (5) by valve, complete to circulate；
Pipeline between described adsorbent bed (15) and cooling water tank (4) is provided with cooling water pump (b-1), it is possible to by cooling water tank
(4) cold water in pumps out, and enters adsorbent bed (15) by valve and adsorbs, exits into cooling tower by valve after absorption
(3) cooling comes back to cooling water tank (4) again, completes circulation；
The driving heat source that described electronic-device radiator uses comes from the low-grade heat source of 55-90 DEG C.
2. drive based on solid absorption as claimed in claim 1 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
Being, the heat pipe diameter range of the described heat pipe group (14) that described vaporizer (13) is internal is 4-16mm, and length range is
150-200mm；Described heat pipe uses pipe or flat tube.
3. drive based on solid absorption as claimed in claim 2 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
It is, is fixed by the upper surface of punching operation with evaporation panel (12) bottom the heat pipe of described heat pipe group (14).
4. drive based on solid absorption as claimed in claim 3 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
Being, described heat pipe arranges, along between the heat pipe of the flow direction of cold-producing medium in the internal mode using fork row of vaporizer (13)
Spacing and the pipe diameter length of every two heat exhausting pipes in the half for pipe diameter length, vertical cold-producing medium flow direction are equal.
5. drive based on solid absorption as claimed in claim 4 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
Being, be provided with wick in described heat pipe, its structure is in screen net structure, fibre structure, groove structure, sintering cored structure
Any one.
6. drive based on solid absorption as claimed in claim 1 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
Being, it is one group that described adsorbent bed (15) uses two, and often group comprises the first adsorbent bed (7) and the second adsorbent bed (8)；Described
The first adsorbent bed (7) and the second adsorbent bed (8) between be provided with circulation of fluid pump.
7. drive based on solid absorption as claimed in claim 6 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
Being, described the first adsorbent bed (7) and the second adsorbent bed (8) be internal is respectively equipped with the first adsorbent bed internal duct (9) and the
Two adsorbent bed internal duct (10), and by its respectively the most all be connected cooling tower (3), heat exchanger (5), and cooling water tank (4),
The pipeline connection of boiler (6).
8. drive based on solid absorption as claimed in claim 1 and the electronic-device radiator of heat pipe intensified heat transfer, its feature
It is, the described connecting line in electronic-device radiator is coated with the heat-insulation layer that adiabator makes.
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| CN107580443B (en) * | 2016-07-04 | 2024-01-30 | 香江科技股份有限公司 | Comprehensive cooling system of data center based on waste heat recovery and control method thereof |
| CN107101293A (en) * | 2017-02-14 | 2017-08-29 | 王泳荃 | A kind of method that utilization solar energy provides Cooling and Heat Source |
| CN106949653B (en) * | 2017-04-06 | 2019-12-10 | 北京百度网讯科技有限公司 | Cooling system applied to data center |
| CN108631186B (en) * | 2018-05-30 | 2020-05-15 | 山东翔晟电力工程有限公司 | Environment-friendly energy-saving transformer box |
| CN113847745A (en) * | 2020-09-25 | 2021-12-28 | 中国科学院广州能源研究所 | Heat pipe type heat-taking integrated cold-electric heat combined-use mining-using integrated geothermal system |
| CN114144023A (en) * | 2021-10-26 | 2022-03-04 | 华为数字能源技术有限公司 | Cooling system and data center |
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| US8436489B2 (en) * | 2009-06-29 | 2013-05-07 | Lightsail Energy, Inc. | Compressed air energy storage system utilizing two-phase flow to facilitate heat exchange |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387468A (en) * | 2008-10-24 | 2009-03-18 | 上海理工大学 | Domestic electric heating adsorption type refrigerator hot water apparatus system |
| CN103424018A (en) * | 2012-05-14 | 2013-12-04 | 施耐德电器工业公司 | Liquid phase-change heat transfer type pumping cooling system with booster pump |
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