CN103985432A - PCB silver paste and preparing method thereof - Google Patents

Abstract

PCB silver paste is prepared, by weight, of 0.6 to 1 part of glycerinum polyoxyethylene ether, 10 to 15 parts of tin powder of 1 to 10 micrometers, 10 to 15 parts of copper powder of 1 to 10 micrometers, 50 to 60 parts of silver powder of 1 to 10 micrometers, 10 to 13 parts of D BE, 8 to 10 parts of biaphenol F epoxy resin, 1 to 2 parts of triethylene tetramin, 11 to 14 parts of glass powder, 1 to 2 parts of activated aluminum oxide, 3 to 5 parts of tetrahydrofuran, 0.3 to 0.6 part of cobalt naphthenate, 1 to 2 parts of gallic acid and 1 to 2 parts of calcium lignosulphonate. According to the PCB silver paste, the tin powder and the copper powder are added, and thus the dosage of the silver powder is saved; due to the fact that the activated aluminum oxide is added, electric conductive powder can be prevented from agglomerating to influence electric conductivity; the adhesive force of the PCB silver paste to the PCB is good, printing is easy, a circuit is continuous and clear, and the rate of finished products is high.

Description

A kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof

Technical field

The invention belongs to electric slurry technical field, relate in particular to a kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof.

Background technology

In modern microelectronics industry, people require more and more higher to electronic devices and components, produce and adopt procedures, standardization to carry out reducing costs more, printed circuit board (PCB) (PCB) is exactly that this demand that is applicable to microelectronics industry is born, the electric slurries such as corresponding conductor paste, electrode slurry, dielectric paste and resistance slurry with regard to the new requirement of demand, grout slurry and printed circuit board (PCB) (PCB) match, and the research of carrying out new conductor paste is also just imperative.

In general, the main component of electric slurry includes function mutually as metal, noble metal powder etc., and inorganic binder is as glass powder, oxide powder etc., organic binder bond, other solvent and additive.Conventionally, function in electric slurry plays electric action mutually, have good electric conductivity, generally by metal dust or noble metal powder, is served as, conventional metal dust has copper powder, aluminium powder, zinc powder, nickel powder etc., and conventional precious metal powder has bronze, silver powder, platinum powder, palladium powder etc.Inorganic binder plays fixedly electric slurry and, to base material, generally by oxide powder and glass powder, is served as, but this composition is lower at the proportion of electric slurry, and what have does not even have; Organic binder bond mainly plays a part to make slurry to have certain shape, is easy to printing or coating, mainly containing macromolecule resin, little molecule resin etc. serves as, along with this part effect in electric slurry of the progress of chemical industry technology is more and more outstanding, especially when being applied to silk screen printing, the composition that changes organic binder bond just can change the printing of electric slurry, dry, sintering character.

In existing electric slurry field, it is high that silver is that slurry has conductance, and stable performance, with the feature such as substrate bond strength is large, is widely used in the production of the electronic devices and components such as integrated circuit, multi-chip module, thin film switch.But silver is precious metal, cost is higher, and the silver powder major part in existing silver paste is micron-sized powder, and the thicknesses of layers of the slurry that it is made, printing performance etc. have significant limitation for present high-end precision instrument; On the other hand, printed circuit board (PCB) adopted printing conductive copper slurry to make conducting wire more in the past, but it is easily oxidized to exist conductive copper paste, and in the useful life of having reduced printed circuit board (PCB), conductive copper paste can not be printed as meticulousr circuit.Therefore size, shape, the kind that need to study metal dust in electrocondution slurry reduce costs, improve conductance to realize, improve the object of printing accuracy.

Binding agent in conductive silver paste has a significant impact for the rate of finished products of circuit printing, such as volatility of viscosity, caking property, adhesive force, levelability, film forming, solvent etc., all can impact the printing performance of circuit, there is pore, the phenomenon such as open circuit, also there will be sometimes organic substance volatilized after glassy phase not yet start to melt, the phenomenon that causes conducting wire to come off from stock, scraps conducting wire, so the performance need of organic binder bond improves.

At present a lot of inorganic binders adopt glass dust, glass dust is made by materials such as metal oxide, silica, if fusing point is too high, also occur organic substance volatilized after glassy phase not yet start to melt, the phenomenon that the conducting wire that causes being obtained by conductive silver paste comes off from stock, scraps conducting wire; And in current glass dust, much contain the harmful substances such as plumbous, and unfavorable to environment, therefore need to develop the glass dust that performance is more excellent.

Summary of the invention

The object of the present invention is to provide a kind of PCB printed circuit board (PCB) silver slurry and preparation method thereof, this silver slurry has been saved the consumption of silver powder, and circuit board adhesive force is good, easily printing, and circuit is continuous, clear, and rate of finished products is high.

Technical scheme of the present invention is as follows:

A kind of PCB printed circuit board (PCB) silver slurry, is characterized in that being made by the raw material of following weight portion: glycerin polyoxyethylene ether 0.6-1,1-10 μ m glass putty 10-15,1-10 μ m copper powder 10-15,1-10 μ m silver powder 50-60, DBE 10-13, bisphenol F epoxy resin 8-10, triethylene tetramine 1-2, glass dust 11-14, activated alumina 1-2, oxolane 3-5, cobalt naphthenate 0.3-0.6, gallic acid 1-2, wooden calcium 1-2;

Described glass dust is made by the raw material of following weight portion: bismuth telluride 15-17, Si0 ₂16-19, Bi ₂0 ₃7-9, BaO5-8, Al ₂0 ₃3-5, B ₂o ₃17-23, V ₂o ₅4-7, Na ₂o1-2, nano aluminum nitride powder 1-2; Preparation method is: by bismuth telluride, Si0 ₂, Bi ₂0 ₃, BaO, Al ₂0 ₃, B ₂o ₃, V ₂o ₅, Na ₂o mixes, put into crucible and become liquid 1100-1400 ℃ of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 9-13 μ m powder, obtain.

The preparation method of described PCB printed circuit board (PCB) silver slurry, is characterized in that comprising the following steps:

(1) DBE, oxolane, gallic acid are mixed, add bisphenol F epoxy resin, be heated to 80-83 ℃, being stirred to resin all dissolves, add again glycerin polyoxyethylene ether, wooden calcium to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;

(2) glass dust, activated alumina are mixed, under 5000-7000 rev/min of stirring, add 1-10 μ m glass putty, 1-10 μ m copper powder, stir 10-20 minute, add again 1-10 μ m silver powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 30-50 minute, ultrasonic dispersion 6-8 minute, obtains uniform slurry again;

(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.06-0.09MPa, and the deaeration time is 9-12 minute, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 10000-18000 centipoise, obtain.

Beneficial effect of the present invention

Silver slurry of the present invention, by adding glass putty and copper powder, has been saved the consumption of silver powder; By adding activated alumina, can prevent conductive powder reunion, affect conductivity; This silver slurry is good to circuit board adhesive force, easily printing, and circuit is continuous, clear, and rate of finished products is high; Glass dust of the present invention contains nano aluminum nitride powder, and heat conduction is fast, and fusing is fast, is easy to circuit curing molding.

Embodiment

A kind of PCB printed circuit board (PCB) silver slurry, by following weight portion (kilogram) raw material make: glycerin polyoxyethylene ether 0.8,1-10 μ m glass putty 13,1-10 μ m copper powder 13,1-10 μ m silver powder 55, DBE 12, bisphenol F epoxy resin 9, triethylene tetramine 1.5, glass dust 12, activated alumina 1.5, oxolane 4, cobalt naphthenate 0.5, gallic acid 1.5, wooden calcium 1.5;

Described glass dust by following weight portion (kilogram) raw material make: bismuth telluride 16, Si0 ₂17, Bi ₂0 ₃8, BaO7, Al ₂0 ₃4, B ₂o ₃20, V ₂o ₅6, Na ₂o1.5, nano aluminum nitride powder 1.5; Preparation method is: by bismuth telluride, Si0 ₂, Bi ₂0 ₃, BaO, Al ₂0 ₃, B ₂o ₃, V ₂o ₅, Na ₂o mixes, put into crucible and become liquid 1300 ℃ of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.13MPa, and the deaeration time is 7 minutes, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 11 μ m powder, obtain.

The preparation method of described PCB printed circuit board (PCB) silver slurry, comprises the following steps:

(1) DBE, oxolane, gallic acid are mixed, add bisphenol F epoxy resin, be heated to 81 ℃, being stirred to resin all dissolves, add again glycerin polyoxyethylene ether, wooden calcium to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;

(2) glass dust, activated alumina are mixed, under 6000 revs/min of stirrings, add 1-10 μ m glass putty, 1-10 μ m copper powder, stir 15 minutes, add again 1-10 μ m silver powder, stir 15 minutes, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 40 minutes, ultrasonic dispersion is 7 minutes again, obtains uniform slurry;

(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.07MPa, and the deaeration time is 10 minutes, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 14000 centipoises, obtain.

Test data:

The silver slurry that the present embodiment is obtained is printed onto on PCB circuit board by the mode of silk screen printing, is then warming up at 640 ℃ and solidifies and form conducting wire in 6 minutes, thereby obtain conducting wire plate.The wiring width that records conducting wire is 0.7mm, average film thickness 5 μ m, and wire distribution distance is 0.7mm, resistivity is 4.6 * 10 ^-5Ω m.

Producing in the manner described above 1000 of conducting wire plates in batches, is combined well with PCB circuit board in conducting wire, and svelteness continuously, does not have the conducting wire of circuit board to come off from stock, rate of finished products 100%.

Claims (2)

1. a PCB printed circuit board (PCB) silver slurry, is characterized in that being made by the raw material of following weight portion: glycerin polyoxyethylene ether 0.6-1,1-10 μ m glass putty 10-15,1-10 μ m copper powder 10-15,1-10 μ m silver powder 50-60, DBE 10-13, bisphenol F epoxy resin 8-10, triethylene tetramine 1-2, glass dust 11-14, activated alumina 1-2, oxolane 3-5, cobalt naphthenate 0.3-0.6, gallic acid 1-2, wooden calcium 1-2;

Described glass dust is made by the raw material of following weight portion: bismuth telluride 15-17, Si0 ₂16-19, Bi ₂0 ₃7-9, BaO5-8, Al ₂0 ₃3-5, B ₂o ₃17-23, V ₂o ₅4-7, Na ₂o1-2, nano aluminum nitride powder 1-2; Preparation method is: by bismuth telluride, Si0 ₂, Bi ₂0 ₃, BaO, Al ₂0 ₃, B ₂o ₃, V ₂o ₅, Na ₂o mixes, put into crucible and become liquid 1100-1400 ℃ of heat fused, add again nano aluminum nitride powder, after stirring, carry out vacuum defoamation, vacuum degree is 0.10-0.14MPa, and the deaeration time is 6-9 minute, pour in mould and shape again, carry out again shrend, send in ball mill and pulverize, sieve, obtain 9-13 μ m powder, obtain.

2. the preparation method that PCB printed circuit board (PCB) silver according to claim 1 is starched, is characterized in that comprising the following steps:

(1) DBE, oxolane, gallic acid are mixed, add bisphenol F epoxy resin, be heated to 80-83 ℃, being stirred to resin all dissolves, add again glycerin polyoxyethylene ether, wooden calcium to stir, with 500 object gauzes, filter, remove impurity and obtain organic carrier;

(2) glass dust, activated alumina are mixed, under 5000-7000 rev/min of stirring, add 1-10 μ m glass putty, 1-10 μ m copper powder, stir 10-20 minute, add again 1-10 μ m silver powder, stir 10-20 minute, then add in organic carrier together with other residual componentss, in ball mill, mix and disperse 30-50 minute, ultrasonic dispersion 6-8 minute, obtains uniform slurry again;

(3) slurry step (2) being obtained carries out vacuum defoamation, and vacuum degree is 0.06-0.09MPa, and the deaeration time is 9-12 minute, then in three-high mill, grind, rolling, to silver-colored slurry viscosity be 10000-18000 centipoise, obtain.