CN103974535B - Printed circuit substrate - Google Patents
Printed circuit substrate Download PDFInfo
- Publication number
- CN103974535B CN103974535B CN201410182093.4A CN201410182093A CN103974535B CN 103974535 B CN103974535 B CN 103974535B CN 201410182093 A CN201410182093 A CN 201410182093A CN 103974535 B CN103974535 B CN 103974535B
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- CN
- China
- Prior art keywords
- printed substrate
- draw
- groove
- printed circuit
- buckle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The invention discloses a printed circuit substrate. The printed circuit substrate is formed by sequentially arranging a first printed circuit chip, a second printed circuit chip, a third printed circuit chip and a fourth printed circuit chip in parallel. The first printed circuit chip, the second printed circuit chip, the third printed circuit chip and the fourth printed circuit chip are connected through connecting strings. First clamping buckles are clamped in the side walls of the first printed circuit chip and provided with clamping grooves, and the clamping grooves are clamped in the side walls of the first printed circuit chip and are of a U shape. The first printed circuit chip is provided with first through holes. Second clamping buckles are clamped in the side walls of the second printed circuit chip and provided with clamping grooves, and the clamping grooves are clamped in the side walls of the second printed circuit chip and are of a U shape. According to the printed circuit substrate, the first printed circuit chip, the second printed circuit chip, the third printed circuit chip and the fourth printed circuit chip can be installed together in an overlapped mode, so that the area for installing electronic components is larger, and efficiency is greatly enhanced.
Description
Technical field
The present invention relates to a kind of tellite.
Background technology
In prior art, such as patent ZL200810302038.9 discloses a kind of printed circuit board (PCB), and it includes a plate body,
One through hole is offered on plate body, printed circuit board (PCB) is fixedly connected with earth element by through hole.The surface of this printed circuit board (PCB)
Surrounding in through hole is provided with a tin coating, and tin coating is contacted with earth element and printed circuit board (PCB) is kept electrically with earth element
Conducting.The surrounding of through hole is provided with for stoping the tin cream of this tin coating from flowing into the solder mask of this through hole.This printed circuit board (PCB) can not
Realize closed assembly function, electronics zero device area is installed little.
Content of the invention
In view of the shortcomings of the prior art, the invention provides one kind can be stacked, electronic unit face is installed
Amass and more increase, the tellite that efficiency greatly improves.
To achieve these goals, the present invention is to realize by the following technical solutions：
A kind of tellite, including the first printed substrate being arranged in parallel successively, the second printed substrate,
3rd printed substrate and the 4th printed substrate, described first printed substrate, the second printed substrate,
Three printed substrates and the 4th printed substrate are connected by connecting rope, and the side wall of the first printed substrate is connected with
First buckle, the first buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the first printed substrate, and draw-in groove is U-shaped shape, and first
Printed substrate is provided with the first perforation, and the side wall of the second printed substrate is connected with the second buckle, and the second buckle is provided with card
Groove, draw-in groove is connected to the side wall of the second printed substrate, and draw-in groove is U-shaped shape, and the second printed substrate is provided with second and wears
Hole, the side wall of the 3rd printed substrate is connected with the 3rd buckle, and the 3rd buckle is provided with draw-in groove, and draw-in groove is connected to the 3rd printing electricity
The side wall of roadbed piece, draw-in groove is U-shaped shape, and the 3rd printed substrate is provided with the 3rd perforation, the side of the 4th printed substrate
Wall is connected with the 4th buckle, and the 4th buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the 4th printed substrate, and draw-in groove is U-shaped
Shape, the 4th printed substrate is provided with the 4th perforation, connecting rope be interspersed in the first perforation, second perforation, the 3rd perforation and
In 4th perforation.
Further, described first printed substrate is connected with connect band.
Further, described connect band is VELCRO connect band.
Further, described first printed substrate, the second printed substrate, the 3rd printed substrate and
The shape size of four printed substrates is identical.
Further, described first printed substrate, the second printed substrate, the 3rd printed substrate and
The surface of four printed substrates is provided with layer of silica gel.
Beneficial effects of the present invention：Due to described first printed substrate, the second printed substrate, the 3rd printing electricity
Roadbed piece and the 4th printed substrate are connected by connecting rope, and the side wall of the first printed substrate is connected with the first card
Button, the first buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the first printed substrate, and draw-in groove is U-shaped shape, the first printing electricity
Roadbed piece is provided with the first perforation, and the side wall of the second printed substrate is connected with the second buckle, and the second buckle is provided with draw-in groove, draw-in groove
It is connected to the side wall of the second printed substrate, draw-in groove is U-shaped shape, the second printed substrate is provided with the second perforation, the 3rd
The side wall of printed substrate is connected with the 3rd buckle, and the 3rd buckle is provided with draw-in groove, and draw-in groove is connected to the 3rd printed substrate
Side wall, draw-in groove is U-shaped shape, and the 3rd printed substrate is provided with the 3rd perforation, the side wall clamping of the 4th printed substrate
There is the 4th buckle, the 4th buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the 4th printed substrate, draw-in groove is U-shaped shape, the
Four printed substrates are provided with the 4th perforation, and connecting rope is interspersed in the first perforation, the second perforation, the 3rd perforation and the 4th perforation
In, thus by connecting rope can make the first printed substrate, the second printed substrate, the 3rd printed substrate and
4th printed substrate is stacked, and installs electronic unit area and more increases, efficiency greatly improves.
Brief description
Fig. 1 is the structural representation of tellite of the present invention.
Specific embodiment
Technological means, creation characteristic, reached purpose and effect for making the present invention realize are easy to understand, with reference to
Specific embodiment, is expanded on further the present invention.
As shown in figure 1, a kind of tellite, print including the first printed substrate 1, second being arranged in parallel successively
Brush circuit substrate 4, the 3rd printed substrate 7 and the 4th printed substrate 10, the first printed substrate 1, second prints
Brush circuit substrate 4, the 3rd printed substrate 7 and the 4th printed substrate 10 are connected by connecting rope 13, the first printing
The side wall of circuit substrate 1 is connected with the first buckle 2, and the first buckle 2 is provided with draw-in groove, and draw-in groove is connected to the first printed substrate 1
Side wall, draw-in groove is U-shaped shape, and the first printed substrate 1 is provided with the first perforation 3, the side wall card of the second printed substrate 4
It is connected to the second buckle 5, the second buckle 5 is provided with draw-in groove, and draw-in groove is connected to the side wall of the second printed substrate 4, draw-in groove is U-shaped shape
Shape, the second printed substrate 4 is provided with the second perforation 6, and the side wall of the 3rd printed substrate 7 is connected with the 3rd buckle 8, and the 3rd
Buckle 8 is provided with draw-in groove, and draw-in groove is connected to the side wall of the 3rd printed substrate 7, and draw-in groove is U-shaped shape, the 3rd printed circuit base
Piece 7 is provided with the 3rd perforation 9, and the side wall of the 4th printed substrate 10 is connected with the 4th buckle 11, and the 4th buckle 11 is provided with draw-in groove,
Draw-in groove is connected to the side wall of the 4th printed substrate 10, and draw-in groove is U-shaped shape, and the 4th printed substrate 10 is provided with the 4th and wears
Hole 12, connecting rope 13 is interspersed in the first perforation 3, second and bores a hole in the 6, the 3rd perforation 9 and the 4th perforation 12, the first printed circuit
Substrate 1 is connected with connect band 14, and connect band 14 is VELCRO connect band, the first printed substrate 1, the second printed substrate
4th, the shape size of the 3rd printed substrate 7 and the 4th printed substrate 10 is identical, the first printed substrate 1,
The surface of two printed substrates 4, the 3rd printed substrate 7 and the 4th printed substrate 10 is provided with layer of silica gel, connects
Rope 13 is flexible rope.
Tellite of the present invention, because electricity is printed in the first printed substrate 1, the second printed substrate the 4, the 3rd
Roadbed piece 7 and the 4th printed substrate 10 are connected by connecting rope 13, and the side wall of the first printed substrate 1 is connected with
One buckle 2, the first buckle 2 is provided with draw-in groove, and draw-in groove is connected to the side wall of the first printed substrate 1, and draw-in groove is U-shaped shape, the
One printed substrate 1 is provided with the first perforation 3, and the side wall of the second printed substrate 4 is connected with the second buckle 5, the second buckle 5
It is provided with draw-in groove, draw-in groove is connected to the side wall of the second printed substrate 4, draw-in groove is U-shaped shape, the second printed substrate 4 sets
There is the second perforation 6, the side wall of the 3rd printed substrate 7 is connected with the 3rd buckle 8, the 3rd buckle 8 is provided with draw-in groove, draw-in groove clamping
In the side wall of the 3rd printed substrate 7, draw-in groove is U-shaped shape, and the 3rd printed substrate 7 is provided with the 3rd perforation 9, the 4th print
The side wall of brush circuit substrate 10 is connected with the 4th buckle 11, and the 4th buckle 11 is provided with draw-in groove, and draw-in groove is connected to the 4th printed circuit
The side wall of substrate 10, draw-in groove is U-shaped shape, and the 4th printed substrate 10 is provided with the 4th perforation 12, and connecting rope 13 is interspersed in the
In one perforation the 3, second perforation the 6, the 3rd perforation 9 and the 4th perforation 12, so the first printing electricity can be made by connecting rope 13
Roadbed piece 1, the second printed substrate 4, the 3rd printed substrate 7 and the 4th printed substrate 10 are stacked,
Electronic unit area is installed more increase, efficiency greatly improves.And by the first buckle 2, the second buckle 5, the 3rd buckle 8 and the
Four buckles 11 can make the first printed substrate 1, the second printed substrate 4, the 3rd printed substrate 7 and the 4th print
Brush circuit substrate 10 leaves space each other.Because the first printed substrate 1 is connected with connect band 14, connect band 14 is evil spirit
Art patch connect band is it is possible to fix the first printed substrate 1, the second printed substrate 4, the 3rd printed substrate
7 and the 4th printed substrate 10.Due to the first printed substrate 1, the second printed substrate 4, the 3rd printed circuit
The surface of substrate 7 and the 4th printed substrate 10 is provided with layer of silica gel, so waterproof.Because connecting rope 13 is flexible rope, institute
Good with elasticity.
Ultimate principle and principal character and the advantages of the present invention of the present invention have been shown and described above.The technology of the industry
, it should be appreciated that the present invention is not restricted to the described embodiments, the simply explanation described in above-described embodiment and description is originally for personnel
The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these changes
Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and its
Equivalent thereof.
Claims (1)
1. a kind of tellite, including the first printed substrate being arranged in parallel successively, the second printed substrate,
Three printed substrates and the 4th printed substrate it is characterised in that：Described first printed substrate, the second printing electricity
Roadbed piece, the 3rd printed substrate and the 4th printed substrate are connected by connecting rope, the first printed substrate
Side wall is connected with the first buckle, and the first buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the first printed substrate, and draw-in groove is U
Type shape, the first printed substrate is provided with the first perforation, and the side wall of the second printed substrate is connected with the second buckle, and second
Buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the second printed substrate, and draw-in groove is U-shaped shape, the second printed substrate
It is provided with the second perforation, the side wall of the 3rd printed substrate is connected with the 3rd buckle, and the 3rd buckle is provided with draw-in groove, and draw-in groove is connected to
The side wall of the 3rd printed substrate, draw-in groove is U-shaped shape, and the 3rd printed substrate is provided with the 3rd perforation, the 4th printing electricity
The side wall of roadbed piece is connected with the 4th buckle, and the 4th buckle is provided with draw-in groove, and draw-in groove is connected to the side wall of the 4th printed substrate,
Draw-in groove is U-shaped shape, and the 4th printed substrate is provided with the 4th perforation, connecting rope be interspersed in the first perforation, the second perforation, the 3rd
In perforation and the 4th perforation；Described first printed substrate is connected with connect band；Described connect band is VELCRO connect band；
Described first printed substrate, the second printed substrate, the 3rd printed substrate and the 4th printed substrate
Shape size is identical；Described first printed substrate, the second printed substrate, the 3rd printed substrate and the 4th print
The surface of brush circuit substrate is provided with layer of silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182093.4A CN103974535B (en) | 2014-04-30 | 2014-04-30 | Printed circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182093.4A CN103974535B (en) | 2014-04-30 | 2014-04-30 | Printed circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103974535A CN103974535A (en) | 2014-08-06 |
| CN103974535B true CN103974535B (en) | 2017-02-15 |
Family
ID=51243417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410182093.4A Expired - Fee Related CN103974535B (en) | 2014-04-30 | 2014-04-30 | Printed circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103974535B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04280667A (en) * | 1991-03-08 | 1992-10-06 | Hitachi Ltd | High integrated semiconductor device |
| JPH04280696A (en) * | 1991-03-08 | 1992-10-06 | Hitachi Ltd | High integrated semiconductor device |
| CN2684524Y (en) * | 2004-03-15 | 2005-03-09 | 英业达股份有限公司 | Circuit board overlapping device |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN203912335U (en) * | 2014-04-30 | 2014-10-29 | 苏州倍辰莱电子科技有限公司 | Printed circuit board |
-
2014
- 2014-04-30 CN CN201410182093.4A patent/CN103974535B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04280667A (en) * | 1991-03-08 | 1992-10-06 | Hitachi Ltd | High integrated semiconductor device |
| JPH04280696A (en) * | 1991-03-08 | 1992-10-06 | Hitachi Ltd | High integrated semiconductor device |
| CN2684524Y (en) * | 2004-03-15 | 2005-03-09 | 英业达股份有限公司 | Circuit board overlapping device |
| CN103619124A (en) * | 2013-11-25 | 2014-03-05 | 广东依顿电子科技股份有限公司 | Method for producing circuit board thin plates |
| CN203912335U (en) * | 2014-04-30 | 2014-10-29 | 苏州倍辰莱电子科技有限公司 | Printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103974535A (en) | 2014-08-06 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170207 Address after: Suzhou City, Jiangsu province 215316 high tech Zone in Kunshan City, North Okitomo Road No. 10 Patentee after: KUNSHAN YIBANGTAI AUTO PARTS MANUFACTURING CO., LTD. Address before: 215325 Kunshan City, Jiangsu Province, Zhouzhuang Town, the same port road, No. 9, No. Patentee before: Suzhou Bei Chenlai Electronic Science and Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170907 Address after: 215325 Kunshan City, Jiangsu Province, Zhouzhuang Town, the same port road, No. 9, No. Patentee after: Suzhou Bei Chenlai Electronic Science and Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215316 high tech Zone in Kunshan City, North Okitomo Road No. 10 Patentee before: KUNSHAN YIBANGTAI AUTO PARTS MANUFACTURING CO., LTD. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170215 Termination date: 20170430 |
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| CF01 | Termination of patent right due to non-payment of annual fee |