CN103972426A - OLED (Organic Light-Emitting Diode) reinforced packaging method and special light sensing plate - Google Patents
OLED (Organic Light-Emitting Diode) reinforced packaging method and special light sensing plate Download PDFInfo
- Publication number
- CN103972426A CN103972426A CN201410225710.4A CN201410225710A CN103972426A CN 103972426 A CN103972426 A CN 103972426A CN 201410225710 A CN201410225710 A CN 201410225710A CN 103972426 A CN103972426 A CN 103972426A
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- Prior art keywords
- oled
- supply pipeline
- heat supply
- heating panel
- organic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses an OLED reinforced packaging method which comprises the following steps: step S1, coating a packaging substrate with an adhesive; step S2, mounting a light sensing plate which comprises heating lines and cooling pads, wherein the heating lines are distributed along the direction in which the packaging substrate is coated with the adhesive, and the cooling pads are arranged in an organic EL (Electroluminescence) light emission region on the substrate; and step S3, using a heat source to have contact with the heating lines so as to cure the adhesive. A special light sensing plate for reinforced packaging of an OLED is characterized by comprising the heating lines and the cooling pads, wherein the cooling pads are in accordance with the organic EL light emission region of an OLED substrate in shape, and the heating lines are distributed in a pattern in accordance with the coating pattern of the adhesive in a packaging process. The beneficial effects are that the method can be used for enhancing the curing effect of the adhesive by using the light sensing plate having the functions of the heating lines and the cooling pads and also preventing thermalization of the organic EL light emission region caused by oven heating.
Description
Technical field
The invention belongs to OLED Display Technique field, relate to the encapsulation technology of OLED, particularly a kind of strengthening method for packing for OLED encapsulation and the special-purpose photographic plate of realizing above-mentioned method for packing.
Background technology
In flat panel display, display is frivolous with it for Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED), active illuminating, fast-response speed, wide viewing angle, rich color and the many merits such as high brightness, low-power consumption and high-low temperature resistant and by industry, to be known as be the third generation Display Technique after liquid crystal display (LCD).Active OLED (ActiveMatrix OLED, AMOLED) also referred to as active matrix OLED, AMOLED is because driving by integrated thin-film transistor (TFT) and capacitor in each pixel and by the method that capacitor maintains voltage, thereby can realize large scale, resolution panels, be the emphasis of current research and the developing direction of following Display Technique.
As shown in Figure 1; on oled substrate, comprise for being coated with region and organic EL light-emitting zone (pixel region) of plastering agent 1 (conventional plastering agent is UV resin); first existing OLED encapsulation is used UV Resin (UV resin) to be coated with EnCap Glass (or EnCap Sus Can) mostly; when then irradiating UV and being cured; for preventing that being mapped to Active Area (organic EL light-emitting zone) for the curing illumination of UV causes performance change or damage, need when solidifying, UV use Protect Mask (protection mask plate) to be covered in light-emitting zone.And owing to using UV to irradiate, be cured certain restriction, so, also occurred needing separately Glass to be put into the situation that Oven (baking oven) carries out regelate after curing laminating.
Because UV is resin-coated rear when curing, need a large amount of light to irradiate the curing stability of guarantee to resin, therefore, also can significantly reduce as the life-span of the light source irradiating, and then increase maintenance cost.And when product being put into baking oven and strengthens solidifying for strengthening solidification effect, the heat of baking oven can cause cause thermal damage to organic EL light-emitting zone.
Summary of the invention
The object of the invention is needs light source to irradiate UV resin and adopts baking oven the multi-step such as to solidify in order to solve existing OLED method for packing, and curing process may cause the deficiencies such as organic EL light-emitting zone thermal loss, propose a kind of OLED strengthening method for packing, and proposed a kind of special-purpose photographic plate of realizing described method for packing simultaneously.
Technical scheme of the present invention is:
OLED strengthens method for packing, it is characterized in that, comprises step:
S1, on base plate for packaging, be coated with plastering agent;
S2, installation photographic plate, described photographic plate comprises heat supply pipeline and heating panel, and described heat supply pipeline distributes along the plastering agent direction being coated with on base plate for packaging, and heating panel is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline solidify plastering agent.
Further, described plastering agent is specially UV resin.
Concrete, thermal source contacts and is used for providing heat with heat supply pipeline from orientation substrate or cover plate direction.
Further, in order to improve curing efficiency, a plurality of thermals source contact and are used for providing heat with heat supply pipeline with cover plate direction from orientation substrate simultaneously.
Further, by acting on the external force of thermal source, make thermal source and base plate for packaging close contact.
OLED strengthening package specific photographic plate, is characterized in that, comprise heat supply pipeline and heating panel, described heating panel shape is consistent with the organic EL light-emitting zone of oled substrate, and heat supply pipeline distribution patterns plastering agent coated pattern when encapsulating is consistent.
Further, above-mentioned special-purpose photographic plate comprises the heating panel of a plurality of array arrangements, cuts apart, for realizing the oled substrate encapsulation that comprises a plurality of organic EL light-emitting zones between each heating panel by heat supply pipeline.
Beneficial effect of the present invention: OLED strengthening method for packing of the present invention has the photographic plate of Heating Line (heat supply pipeline) and Cooling pad (heating panel/device) function by use, can strengthen the solidification effect of plastering agent, the thermalization of the organic EL light-emitting zone (pixel region) that causes of simultaneously can preventing from being heating and curing.
Accompanying drawing explanation
Fig. 1 is oled substrate encapsulating structure schematic diagram;
Fig. 2 is OLED strengthening method for packing preferred embodiment encapsulation principle schematic of the present invention;
Fig. 3 is the special-purpose photographic plate preferred embodiment of OLED strengthening method for packing of the present invention structural representation.
Embodiment
Embodiments of the invention are that principle according to the present invention designs, and below in conjunction with accompanying drawing and specific embodiment, the invention will be further elaborated.
The OLED strengthening method for packing of the present embodiment, comprises step:
S1, on base plate for packaging, be coated with plastering agent;
S2, installation photographic plate, described photographic plate comprises heat supply pipeline and heating panel, and described heat supply pipeline distributes along the plastering agent direction being coated with on base plate for packaging, and heating panel is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline solidify plastering agent.
Because UV resin is applied to OLED encapsulation technology maturation, encapsulation performance is stable, and therefore plastering agent preferably adopts UV resin in the present embodiment.Conventionally, thermal source can, according to actual conditions, such as considering the factors such as equipment mounting condition and cost, be selected to adopt to contact and be used for providing heat with heat supply pipeline from orientation substrate or cover plate direction.But, in order to improve curing efficiency, and then realize improving and produce line production capacity or reduce and produce line cost, the scheme optimization of the present embodiment adopts a plurality of thermals source from orientation substrate, to contact and be used for providing heat with heat supply pipeline with cover plate direction simultaneously.Concrete principle is referring to Fig. 2, and two blocks of thermal source plates 3 provide heat from substrate 5 and cover plate 4 both directions respectively, adopts the thermo-contact of this kind of structure to solidify and can effectively guarantee solidification effect, improves curing efficiency simultaneously.
The present embodiment is according to the needs of above-mentioned method for packing, designed a kind of OLED strengthening package specific photographic plate that is exclusively used in said method, this photographic plate comprises heat supply pipeline and heating panel, described heating panel shape is consistent with the organic EL light-emitting zone of oled substrate, heat supply pipeline distribution patterns with when encapsulation plastering agent coated pattern consistent.
As shown in Figure 3, in actual production, oled substrate generally includes polylith independence light-emitting zone or pixel region, and the requirement to encapsulation is each packaging area individual packages, in order to improve the packaging efficiency to this kind of substrate, above-mentioned special-purpose photographic plate comprises the heating panel 7 of a plurality of array arrangements, between each heating panel, by heat supply pipeline, cuts apart 6, for realizing the oled substrate encapsulation that comprises a plurality of organic EL light-emitting zones.In order to strengthen the heat-transfer effect of thermal source and heat supply pipeline, the present embodiment makes thermal source and base plate for packaging close contact by acting on the external force of thermal source.If still there is the situations such as the not obvious or percent defective of solidification effect is high, still can adopt based on the above method tradition to append curing method, product is put into baking oven and again solidify.
The method of above embodiment and special-purpose photographic plate and existing method have following difference: 1, utilize the method for thermo-contact, adopt thermal source directly to contact heat supply pipeline, can effectively guarantee solidification effect and curing efficiency; 2, the method for logical heat transfer cure adhesive, can make heat more concentrate on the region that is coated with plastering agent, reduces the impact on organic EL light-emitting zone; When 3, on a Glass, most products all exist, the method for useful chessboard of go shape can improve to solidify gets off; 4, by using cooling pad (heating panel) effectively to protect organic EL light-emitting zone, prevent thermalization; 5, adopt many thermals source multi-direction curing, improve curing efficiency; 6, the method that thermo-contact and pressure are applied simultaneously strengthens the heat-transfer effect of thermal source and heat supply pipeline; 7, initial cure and with append solidify identical, multi-stage curing method.
Those of ordinary skill in the art will appreciate that, embodiment described here is in order to help reader understanding's principle of the present invention, should be understood to that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not depart from essence of the present invention according to these technology enlightenments disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
Claims (7)
1.OLED strengthens method for packing, it is characterized in that, comprises step:
S1, on base plate for packaging, be coated with plastering agent;
S2, installation photographic plate, described photographic plate comprises heat supply pipeline and heating panel, and described heat supply pipeline distributes along the plastering agent direction being coated with on base plate for packaging, and heating panel is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline solidify plastering agent.
2. method according to claim 1, is characterized in that, described plastering agent is specially UV resin.
3. method according to claim 1 and 2, is characterized in that, thermal source contacts and is used for providing heat with heat supply pipeline from orientation substrate or cover plate direction.
4. method according to claim 1, is characterized in that, a plurality of thermals source contact and are used for providing heat with heat supply pipeline with cover plate direction from orientation substrate simultaneously.
5. method according to claim 4, is characterized in that, by acting on the external force of thermal source, makes thermal source and base plate for packaging close contact.
6.OLED strengthening package specific photographic plate, is characterized in that, comprise heat supply pipeline and heating panel, described heating panel shape is consistent with the organic EL light-emitting zone of oled substrate, and heat supply pipeline distribution patterns plastering agent coated pattern when encapsulating is consistent.
7. photographic plate according to claim 6, is characterized in that, special-purpose photographic plate comprises the heating panel of a plurality of array arrangements, cuts apart, for realizing the oled substrate encapsulation that comprises a plurality of organic EL light-emitting zones between each heating panel by heat supply pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410225710.4A CN103972426A (en) | 2014-05-27 | 2014-05-27 | OLED (Organic Light-Emitting Diode) reinforced packaging method and special light sensing plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410225710.4A CN103972426A (en) | 2014-05-27 | 2014-05-27 | OLED (Organic Light-Emitting Diode) reinforced packaging method and special light sensing plate |
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| CN103972426A true CN103972426A (en) | 2014-08-06 |
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| CN201410225710.4A Pending CN103972426A (en) | 2014-05-27 | 2014-05-27 | OLED (Organic Light-Emitting Diode) reinforced packaging method and special light sensing plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098101A (en) * | 2015-07-23 | 2015-11-25 | 四川虹视显示技术有限公司 | OLED packaging line solidifying and device aging system |
| CN106384743A (en) * | 2016-10-20 | 2017-02-08 | 武汉华星光电技术有限公司 | Oled display and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060079615A (en) * | 2005-01-03 | 2006-07-06 | 오리온전기 주식회사 | Method for encapsulating organic light emitting diode |
| KR20130010247A (en) * | 2011-07-18 | 2013-01-28 | 윤근천 | The press stage that use to encapsulating for an organic light-emitting diode manufacturing instrument |
-
2014
- 2014-05-27 CN CN201410225710.4A patent/CN103972426A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060079615A (en) * | 2005-01-03 | 2006-07-06 | 오리온전기 주식회사 | Method for encapsulating organic light emitting diode |
| KR20130010247A (en) * | 2011-07-18 | 2013-01-28 | 윤근천 | The press stage that use to encapsulating for an organic light-emitting diode manufacturing instrument |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105098101A (en) * | 2015-07-23 | 2015-11-25 | 四川虹视显示技术有限公司 | OLED packaging line solidifying and device aging system |
| CN106384743A (en) * | 2016-10-20 | 2017-02-08 | 武汉华星光电技术有限公司 | Oled display and manufacturing method thereof |
| CN106384743B (en) * | 2016-10-20 | 2019-12-24 | 武汉华星光电技术有限公司 | OLED display and manufacturing method thereof |
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Application publication date: 20140806 |