CN105762302A - OLED reinforced packaging method - Google Patents

OLED reinforced packaging method Download PDF

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Publication number
CN105762302A
CN105762302A CN201410782869.6A CN201410782869A CN105762302A CN 105762302 A CN105762302 A CN 105762302A CN 201410782869 A CN201410782869 A CN 201410782869A CN 105762302 A CN105762302 A CN 105762302A
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CN
China
Prior art keywords
packaging
supply pipeline
heat supply
oled
thermal source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410782869.6A
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan CCO Display Technology Co Ltd
Original Assignee
Sichuan CCO Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan CCO Display Technology Co Ltd filed Critical Sichuan CCO Display Technology Co Ltd
Priority to CN201410782869.6A priority Critical patent/CN105762302A/en
Publication of CN105762302A publication Critical patent/CN105762302A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an OLED reinforced packaging method. The method comprises the following steps of S1, coating a gluing agent on a packaging substrate; S2, installing a photosensitive plate, wherein the photosensitive plate includes a heating line and a cooling pad; the heating line is distributed along with a direction of the gluing agent coated on the packaging substrate; and the cooling pad is located on an organic EL luminescence area on the substrate; S3, using a heat source to contact the heating line so that the gluing agent is solidified; S4, carrying out burr inspection; S5, carrying out burr processing; S6, cleaning a panel; S7, carrying out block sealing wiring inspection; and S8, carrying out vacuum packaging. The method has advantages that through using the photosensitive plate possessing the heating line and the cooling pad, a solidification effect of the gluing agent can be reinforced; and simultaneously organic EL luminescence area thermalization caused by heating solidification can be prevented.

Description

OLED strengthens method for packing
Technical field
The invention belongs to OLED Display Technique field, relate to the encapsulation technology of OLED, particularly to a kind of strengthening method for packing for OLED encapsulation.
Background technology
In flat panel display, Organic Light Emitting Diode (OrganicLight-EmittingDiode, OLED) display is frivolous with it, active illuminating, fast-response speed, wide viewing angle, rich color and the many merits such as high brightness, low-power consumption and high-low temperature resistant and to be known as by industry be third generation Display Technique after liquid crystal display (LCD).Active OLED (ActiveMatrixOLED, AMOLED) also referred to as Activematric OLED, AMOLED is driven because of the method by integrated thin-film transistor (TFT) in each pixel and capacitor and by capacitor maintenance voltage, thus large scale, resolution panels can be realized, it is the developing direction of the emphasis of current research and following Display Technique.
Oled substrate includes the region for being coated with plastering agent 1 (conventional plastering agent is UV resin) and organic EL light-emitting zone (pixel region); EnCapGlass (or EnCapSusCan) is coated by existing OLED encapsulation mostly first by UVResin (UV resin); then when irradiation UV solidifies; for preventing from being irradiated to ActiveArea (organic EL light-emitting zone) cause performance change or damage for the UV light solidified, ProtectMask (protection mask plate) need to be used to be covered in light-emitting zone when UV solidifies.And carry out being solidified with certain restriction owing to using UV to irradiate, so, need separately Glass to put into the situation carrying out secondary solidification in Oven (oven) after also occurring in that solidification laminating.
Due to UV resin-coated after solidify time, it is necessary to resin is irradiated the stability that guarantee solidifies by a large amount of light, and therefore, the life-span of light source being used as to irradiate also can significantly reduce, and then adds maintenance cost.And for strengthen solidification effect and product is put into oven adds strong cured time, organic EL light-emitting zone can be caused cause thermal damage by the heat of oven.
Summary of the invention
The invention aims to solve existing OLED encapsulation method need light source irradiation UV resin and adopt the multi-steps such as oven solidification, and curing process may result in the deficiencies such as organic EL light-emitting zone heat loss, it is proposed that a kind of OLED strengthens method for packing.
The technical scheme is that
1.OLED strengthens method for packing, including step:
S1, on base plate for packaging be coated with plastering agent;
S2, installation photographic plate, described photographic plate includes heat supply pipeline and heat sink, the plastering agent directional spreding that described heat supply pipeline is coated with along base plate for packaging, and heat sink is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline make plastering agent solidify;
S4, burr inspection;
S5, burr process;
S6, panel clean;
S7, block sealing-in ray examination;
S8, vacuum packaging.
Further, described plastering agent is specially UV resin.
Further, thermal source contacts with heat supply pipeline from orientation substrate or cover plate direction and is used for providing heat.
Further, multiple thermals source contact with heat supply pipeline from orientation substrate and cover plate direction simultaneously and are used for providing heat.
Further, it is characterised in that make thermal source and base plate for packaging close contact by acting on the external force of thermal source.
Beneficial effects of the present invention: the OLED of the present invention is strengthened method for packing and had the photographic plate of HeatingLine (heat supply pipeline) and Coolingpad (heat sink/device) function by use, the solidification effect of plastering agent can be strengthened, the transconversion into heat of the organic EL light-emitting zone (pixel region) caused that simultaneously can prevent from being heating and curing.
Detailed description of the invention
Embodiments of the invention are to design according to principles of the invention, and below in conjunction with specific embodiment, the invention will be further elaborated.
The OLED of the present embodiment strengthens method for packing, including step:
S1, on base plate for packaging be coated with plastering agent;
S2, installation photographic plate, described photographic plate includes heat supply pipeline and heat sink, the plastering agent directional spreding that described heat supply pipeline is coated with along base plate for packaging, and heat sink is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline make plastering agent solidify;S4, burr inspection;
S5, burr process;
S6, panel clean;
S7, block sealing-in ray examination;
S8, vacuum packaging.
Owing to UV resin is applied to OLED encapsulation technology maturation, encapsulation performance is stable, and therefore plastering agent preferably employs UV resin in the present embodiment.Generally, thermal source according to practical situation, can such as consider the factor such as equipment mounting condition and cost, selects to adopt to contact with heat supply pipeline from orientation substrate or cover plate direction and is used for providing heat.But, in order to improve curing efficiency, and then realizing improving product line production capacity or reducing product line cost, the scheme of the present embodiment preferably employs multiple thermal source and contacts for providing heat with heat supply pipeline with cover plate direction from orientation substrate simultaneously.Two blocks of thermal source plates 3 provide heat from substrate 5 and cover plate 4 both direction respectively, and the thermo-contact adopted the structure solidification can effectively ensure that solidification effect, improves curing efficiency simultaneously.
The present embodiment needs according to above-mentioned method for packing, devise a kind of OLED being exclusively used in said method and strengthen package specific photographic plate, this photographic plate includes heat supply pipeline and heat sink, described heat sink shape is consistent with oled substrate organic EL light-emitting zone, and when heat supply pipeline distribution patterns is with encapsulation, plastering agent coated pattern is consistent.
Those of ordinary skill in the art is it will be appreciated that embodiment described here is to aid in reader understanding's principles of the invention, it should be understood that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete deformation and combination without departing from essence of the present invention according to these technology disclosed by the invention enlightenment, and these deformation and combination remain in protection scope of the present invention.

Claims (5)

1.OLED strengthens method for packing, it is characterised in that include step:
S1, on base plate for packaging be coated with plastering agent;
S2, installation photographic plate, described photographic plate includes heat supply pipeline and heat sink, the plastering agent directional spreding that described heat supply pipeline is coated with along base plate for packaging, and heat sink is positioned at the organic EL light-emitting zone on substrate;
S3, use thermal source contact heat supply pipeline make plastering agent solidify;
S4, burr inspection;
S5, burr process;
S6, panel clean;
S7, block sealing-in ray examination;
S8, vacuum packaging.
2. method according to claim 1, it is characterised in that described plastering agent is specially UV resin.
3. method according to claim 1 and 2, it is characterised in that thermal source contacts with heat supply pipeline from orientation substrate or cover plate direction and is used for providing heat.
4. method according to claim 1, it is characterised in that multiple thermals source contact with heat supply pipeline from orientation substrate and cover plate direction simultaneously and are used for providing heat.
5. method according to claim 4, it is characterised in that make thermal source and base plate for packaging close contact by acting on the external force of thermal source.
CN201410782869.6A 2014-12-16 2014-12-16 OLED reinforced packaging method Pending CN105762302A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410782869.6A CN105762302A (en) 2014-12-16 2014-12-16 OLED reinforced packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410782869.6A CN105762302A (en) 2014-12-16 2014-12-16 OLED reinforced packaging method

Publications (1)

Publication Number Publication Date
CN105762302A true CN105762302A (en) 2016-07-13

Family

ID=56337143

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410782869.6A Pending CN105762302A (en) 2014-12-16 2014-12-16 OLED reinforced packaging method

Country Status (1)

Country Link
CN (1) CN105762302A (en)

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160713

WD01 Invention patent application deemed withdrawn after publication