CN103971934A - Low Acoustic Noise Capacitors - Google Patents
Low Acoustic Noise Capacitors Download PDFInfo
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- CN103971934A CN103971934A CN201410030985.2A CN201410030985A CN103971934A CN 103971934 A CN103971934 A CN 103971934A CN 201410030985 A CN201410030985 A CN 201410030985A CN 103971934 A CN103971934 A CN 103971934A
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Abstract
The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.
Description
Technical field
The embodiment describing relates generally to the printed circuit board (PCB) (PCB) that comprises capacitor assembly, more specifically, relates to for making capacitor assembly and PCB mechanical isolation to reduce the design of the acoustic noise producing in the time that capacitor assembly is given vibration piezoelectric forces on PCB.
Background technology
Printed circuit board (PCB) (PCB) is usually used in comprising in the various electronic equipments of computer, television set and mobile device.In order to carry out various functions, PCB generally comprises the capacitor being installed on PCB.Capacitor can comprise two conductive plates that separated such as ceramic dielectric.The ceramic capacitor of some type can show the characteristic that is called piezoelectricity, and this characteristic can cause being derived from the inner generation of pottery the mechanical strain of the electric field applying.The large I of strain producing and electric field strength or the voltage difference applying across two conductors of both sides that are positioned at ceramic material are proportional.In the time that capacitor is placed in AC circuit, the pottery in capacitor can expand and shrink according to being substantially equal to the frequency of AC electric power.
This movement can cause several problems.First,, if capacitor is coupled with the membrane mechanical such as PCB, these expansions and contraction can apply periodic power on PCB so.As a result of, the harmonic frequency vibration that whole PCB can power supply.In the time that driving frequency is substantially equal to the resonance frequency of PCB, this effect can be obvious especially.The vibration of PCB also can produce acoustical sound waves.In some cases, the sound wave obtaining can have is enough to the amplitude heard by the user of equipment.The second, excessive vibration can make soldering joint and other the electrical connection on PCB weaken, thereby increases the possibility of equipment failure.
Therefore, wish a kind of reliable mode that makes capacitor and PCB mechanical couplings, reduce the amount that is sent to the vibrational energy of PCB from capacitor simultaneously.
Summary of the invention
The disclosure is described to reduce and is sent to the embodiment that the capacitor assembly of the amount of the vibrational energy of the PCB of capacitor assembly is installed above.In one embodiment, capacitor assembly comprises: dielectric portion; At lip-deep first electrode of dielectric portion; The first termination components with the first conductive electrode electrical couplings; At lip-deep second electrode of dielectric portion; With with the second termination components of the second conductive electrode electrical couplings.Therefore, the first termination components and the second termination components also can comprise: contact layer; Porous layer; With inter metal dielectric termination layer.
In another embodiment, the method for the manufacture of capacitor assembly is described.The method can comprise: on the end of capacitor, form metal termination layer; On metal termination layer deposits conductive material and on the surface of electric conducting material precursors to deposit.The method also comprises: form electrical conductivity alloy layer; In electrical conductivity alloy layer, produce multiple holes to form porous layer; With deposits conductive material on porous layer.
In certain embodiments, capacitor assembly disclosed herein can comprise: dielectric portion; Embed the first electrode in dielectric portion and the first termination components with the first conductive electrode electrical couplings.And capacitor assembly can comprise the second electrode embedding in dielectric portion; With with the second termination components of the second conductive electrode electrical couplings.Therefore, dielectric portion has the large thickness of thickness than overlapping the first electrode and the second electrode.
And according to some embodiment, the method that is used to form capacitor assembly can comprise the lamination of electrode layer and the adjacent dielectric layer of lamination of formation and electrode layer that form in embedding dielectric substance.The method also can comprise the termination components of at least one electrical contact in formation and electrode layer.
In certain embodiments, the method that is used to form capacitor assembly can comprise formation dielectric and electrode layer, and is formed for the soft termination layer of electrical couplings electrode layer.The method also can be included on soft termination layer deposits conductive material to provide voltage difference to capacitor assembly.The method can comprise: form the dielectric portion with the battery lead plate that forms capacitor connection; Increase the thickness of top and/or bottom ceramic segment; Be used for capacitor is connected with the capacitor of PCB electrical couplings with termination.In certain embodiments, the method can comprise the execution first cascade stage; Carried out for the second stacked stage; With two laminations are carried out to laminations.
In other embodiment, form the method for capacitor assembly and comprise electrode and dielectric layer are laminated to object height; With regulation position on top ceramic layer is cut to the specific degree of depth.
Be combined as the following detailed description of accompanying drawing reading that example illustrates the principle of the embodiment of description, the other side of embodiment disclosed herein and advantage become fairly obvious.
Brief description of the drawings
With reference to following description and accompanying drawing, can understand better the embodiment of description.In addition, with reference to following description and accompanying drawing, can understand better the advantage of the embodiment of description.These accompanying drawings do not limit can be to the form of the embodiment proposition of describing and any variation of details.Any this variation does not deviate from the spirit and scope of the embodiment of description.
Figure 1A represents the front view of the existing PCB that comprises capacitor.
Figure 1B represents the top view of existing capacitor, and it illustrates typical displacement bimorph.
Fig. 1 C represents the front view of the existing PCB that comprises capacitor, illustrates how displacement bimorph can be sent to PCB.
Fig. 2 A represents capacitor to be fixed to the means of PCB.
Fig. 2 B represents capacitor to be fixed to the means of PCB.
Fig. 3 A represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Fig. 3 B represent according to some embodiment for making the part diagram of termination components of the minimized capacitor assembly of acoustic noise.
Fig. 4 represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
Fig. 5 A represent according to some embodiment for making the electrode termination layer of the minimized capacitor assembly of acoustic noise.
Fig. 5 B represent according to some embodiment for making the electrode termination layer of the minimized capacitor assembly of acoustic noise.
Fig. 6 represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
Fig. 7 A represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Fig. 7 B represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Fig. 7 C represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Fig. 8 represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
Fig. 9 A represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Fig. 9 B represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Figure 10 A represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
Figure 10 B represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
Figure 11 represent according to some embodiment for making the minimized capacitor assembly of acoustic noise.
Figure 12 represents to illustrate the flow chart that is formed for the processing that makes the minimized capacitor assembly of acoustic noise according to some embodiment.
In the accompanying drawings, comprise same or similar structure, use or process by the key element that same or similar Reference numeral represents.
Embodiment
In this part, describe according to the representative applications of the application's method and apparatus.It is only to expand linguistic context and help to understand the embodiment describing that these examples are provided.Therefore, to those skilled in the art, can be in the case of there is no to implement some or all in these specific details the embodiment of description.In other cases, for fear of the embodiment that unnecessarily obscures description, do not describe known treatment step in detail.Other application is possible, makes following example should not be regarded as restriction.
In following detailed description, with reference to accompanying drawing, these accompanying drawings form a part for specification, and, in these accompanying drawings, illustrate according to the specific embodiment of the embodiment describing as explanation.Although fully describe these embodiment in detail to make those skilled in the art can implement the embodiment describing, should be understood that these examples are not restrictive; Making to use other embodiment, and, can in the case of the spirit and scope of embodiment that do not deviate from description, propose to change.
Can in various electronic equipments, find the PCB that comprises ceramic capacitor.Especially, hand-hold electronic equipments can comprise the PCB with multiple ceramic capacitors.In the time applying alternating electric field across ceramic capacitor, can in ceramic material, produce the mechanical strain of alternation.Strain can be the result for the intrinsic piezoelectric property of the dielectric substance of capacitor assembly, and generally in the time using high dielectric material, increases the weight of.For the dielectric substance of the capacitor assembly for having the size reducing, situation may be exactly like this.Unless this movement is isolated, otherwise vibrational energy can be delivered to PCB from capacitor, thereby produces the acoustic noise that can be heard by the user of equipment.The scope of the typical frequencies of the acoustic vibration of the noise that generation can be listened is about 20Hz～about 20KHz.Can reduce by the suitable termination components in capacitor assembly the amount of the vibrational energy that is delivered to PCB.And the capacitor assembly with additional dielectric substance can reduce the amount of the vibrational energy that is delivered to PCB.Therefore, the power being applied on PCB can reduce, thereby any acoustic noise of the movement that is derived from capacitor is minimized.
Figure 1A represents the end view of the existing assembly 100 that comprises the capacitor 102 being coupled with PCB110.Capacitor 102 can comprise two termination cases 106 and dielectric 104.Termination case 106 can be by forming such as any electric conducting material of copper or nickel or metal glass frit.And dielectric 104 can be formed by any suitable insulator.Due to the stable performance under the higher dielectric constant of pottery, high AC frequency and lower price, conventionally use pottery to be used for creating dielectric 104.Capacitor 102 can be by using scolder 108 and PCB110 coupling.PCB110 can comprise several substrate layers and be arranged on the electric traces of the various parts that comprise capacitor 102 on PCB110 for electrical couplings.Scolder 108 can form filler rod between PCB110 and capacitor 102, thereby at electrode 106 and be coupled to the machinery and the electrical connection that provide stronger between the welding disk pattern of the electric traces on PCB110.
Figure 1B represents the top view of capacitor, illustrates how in the time standing electric field internal strain can change the shape of capacitor 102.Capacitor 102 can comprise for dielectric ferroelectric material (such as high-k X5R/X7R pottery).Due to the crystal orientation in material, ferroelectric material can produce electric field when strained.This process also can be put upside down, thereby means ferroelectric material inflatable and contraction in the time being placed in electric field.And the intensity of expansion and the large I of shrinking and electric field is proportional.Profile 112 represents the typical way that can be out of shape in the situation that there is electric field by the capacitor 102 forming such as ceramic ferroelectric material.As shown in the figure, the upper surface of capacitor 102 and lower surface can be outwardly-bent, and near surface electrode 106 can curve inwardly.It should be noted that the deflection shown in Figure 1B exaggerated to show better the pattern that capacitor 102 is out of shape.In the time applying the electric field of alternation to capacitor 102, such as the AC circuit in the situation that, the expansion of ceramic material and shrink can be in company with the cyclomorphosis of the change in voltage at capacitor 102 two ends.Therefore, profile 112(dotted line) can illustrate when executing alive polarity is the first state and typically be out of shape, and, profile 113(dotted line) can illustrate that executing alive polarity is to be typically out of shape in the second state (with the first opposite states) time.
Fig. 1 C represents the front view of the existing assembly 100 that comprises the capacitor 102 being coupled with PCB110.As shown in Figure 1B, capacitor 102 is shown the deformation state that can occur in the time that the ceramic material in capacitor 102 is in electric field.In the time that the voltage difference at capacitor 102 two ends increases, the bottom surface of capacitor 102 can be outwardly-bent, thereby on PCB110, apply power.And the increase of voltage can cause near end face electrode 106 of capacitor 102 to curve inwardly, thereby pulls scolder filler rod 108.The combination pulling on downward power and scolder filler rod 108 on PCB110 can cause PCB110 in the region around capacitor 102 to bottom offset.In the time that capacitor 102 is arranged in AC circuit, this downward displacement can according to AC frequency period change.As a result of, PCB110 can be according to the frequency vibration of harmonic wave that equals AC frequency or AC frequency.When on the resonance frequency of the PCB110 harmonic wave in AC or AC frequency or when neighbouring, the amplitude of vibration can be obvious especially.This vibration can cause PCB110 to be used as speaker diaphragm, thereby produces acoustic noise.In some cases, this acoustic noise can have is enough to amplitude that the user of device is heard.
Fig. 2 A and Fig. 2 B represent several prior art schemes that are delivered to the amount of the vibrational energy of PCB110 from capacitor 102 for reducing.In Fig. 2 A, prior art assembly 200 is shown.Connector 202 can be taked to be connected with the termination case of capacitor 102 and the form of the metal connector that is coupled with PCB110 by using such as soldering (soldering) or such as the technology of any amount of the welding of Laser Welding.Metal connector 202 can be designed to prevent that any between capacitor 102 and PCB110 from directly contacting and absorbing any mechanical oscillation of transmitting from the termination case of capacitor 102.But metal connector 202 can obviously increase the height of assembly 200.The equipment in many present age, such as mobile phone, has strict space requirement to PCB assembly, and this can hinder with assembly 200 and similarly be designed for isolating capacitor 102.In Fig. 2 B, prior art assembly 201 is shown.Assembly 201 can comprise the insertion plate 206 between capacitor 102 and PCB110.Insert plate 206 electrical connection between the corresponding welding disk pattern on electrode and the PCB110 on capacitor 102 can be provided.And inserting plate 206 can be formed by the material that is designed to alleviate any displacement in capacitor 102, thereby reduce the amount of the vibrational energy that is delivered to PCB110.But assembly 200 also can exceed the spatial limitation in much equipment.Insert plate 206 and can increase the footprint area of capacitor 102 on PCB110 and the height of increase capacitor 102.These spaces increases can hinder assembly 201 for many designs.Some trials that solve the problem of the acoustic noise being coupled with PCB layer 110 comprise the height of increase capacitor on PCB110.
Comprise for making capacitor body become firm to reduce the enhancing ceramic segment of undesirable acoustic noise according to the capacitor assembly of embodiment more disclosed herein.Therefore the undesirable acoustic noise that, is derived from the piezoelectric strain in the pottery being contained in capacitor assembly weakens or deflection in the level of parts.Therefore, the embodiment consistent with the disclosure relaxes PCB trace layout and for the fixing condition of the capacitor of PCB and constraint.The embodiment consistent with the disclosure comprise be guided through piezoelectricity bring out strain produce power so that its capacitor assembly away from PCB makes not produce or obviously alleviate undesirable noise.
Fig. 3 A represent according to some embodiment for making the minimized capacitor assembly 300 of acoustic noise.Assembly 300 comprises dielectric portion 104, embeds alternation electrode 106 and the first and second termination components 350 in dielectric portion 104.The first and second termination components 350 respectively with the first and second electrode 106 electrical couplings.Termination components 350 provides voltage by PCB110 to electrode 106.In Fig. 3 A, cartesian coordinate system Z-X is shown " highly " direction (or " vertically " direction) of Z axis sensing capacitor assembly 300.For the embodiment of the capacitor assembly consistent with the disclosure, although same cartesian coordinate system is shown following, should be understood that capacitor assembly is only indicative with respect to the specific orientation of reference axis.It will be understood by those skilled in the art that in the embodiment consistent with the disclosure, many other formations are possible.
The first and second termination components 350 can be along the whole height of Z direction covering capacitor assembly 300.Each in the first and second termination components 350 comprises contact layer 310, porous, electrically conductive layer 320 and inter metal dielectric termination layer 330.Therefore, in certain embodiments, contact layer 310 is formed by the electric conducting material such as tin (Sn) or tin/lead alloy (Sn/Pb) that is formed a certain thickness.Porous layer 320 can comprise the porous layer such as the electric conducting material of nickel (Ni) or nickel alloy.Referring to Fig. 3 B, porous layer 320 is described in more detail.
Fig. 3 B represent according to some embodiment for making the part diagram of inter metal dielectric termination components 350 of the minimized capacitor assembly of acoustic noise.Fig. 3 B illustrates a part for the porous layer 320 adjacent with a part for termination layer 330.Thus, porous layer 320 can comprise (all or in part) Round Porous wimble structure as the intermediate layer between termination layer 330 and contact layer 310.Therefore,, in the time forming assembly, the partially porous structure in layer 320 can be guaranteed enough leach resistances.By this way, layer 320 can be used as damper/cushion pad/buffer with impact-absorbing, minimizes thereby make to bring out acoustics coupling strain and soldering joint and PCB from the piezoelectricity on capacitor.In certain embodiments, Round Porous wimble structure is made up of the electric conducting material such as Ni.
Fig. 4 represents the flow chart that is formed for the processing 400 that makes the minimized capacitor assembly of acoustic noise according to some embodiment.In certain embodiments, process 400 and can cause capacitor assembly 300(as described in detail above referring to above Fig. 3 A) capacitor assembly.
Step 402 is included in and on dielectric base plate, forms metal termination layer.In certain embodiments, metal termination layer can be metal glass frit termination case, and dielectric base plate can be if the dielectric portion 104(of dielectric electrode assemblie 300 is referring to above Fig. 3 A and Fig. 3 B), embedding battery lead plate 106 wherein comprised.Step 404 is included in deposits conductive material on the metal termination layer of step 402.Therefore, step 404 can be included in electronickelling on the termination layer being formed in step 402 to form the layer of predetermined thickness.In certain embodiments, step 404 can be included in electroless plating nickel on the termination case being formed in step 402.Step 406 is included in precursors to deposit material on the surface that is formed at the nickel dam in step 404.Therefore, the precursor material using in step 406 can be other metal of aluminium, aluminium China ink or some, or wraps metallic liquid, or the liquid that comprises electric conducting material.Step 408 comprises formation electrical conductivity alloy layer.In certain embodiments, step 408 can comprise the high temperature sintering step that is used to form nickel alumin(i)um alloy.Step 410 is included in electrical conductivity alloy layer and produces hole to form porous layer.Therefore, step 410 can comprise and optionally leaches step, to remove aluminium from the electrical conductivity alloy layer forming step 408.Step 412 is included in deposits conductive material on the porous layer being formed in step 410.In certain embodiments, step 412 is included in and on the loose structure that is derived from step 410, deposits Sn or Sn/Pb alloy.
Fig. 5 A represent according to some embodiment for making the electrode termination layer 530A of the minimized capacitor assembly 500A of acoustic noise.Therefore, electrode termination layer 530A can comprise soft Cu termination layer.Electrode termination layer 530A forms on the surface of dielectric layer 104, and with battery lead plate 106(referring to above Fig. 1～3) electrical couplings.In certain embodiments, by electroplating or sputter Cu layer, form electrode termination layer 530A on dielectric layer 104.In certain embodiments, on termination layer 530A, deposit Sn or Sn/Pb alloy so that its surface can be installed on PCB layer 110.
Fig. 5 B represent according to some embodiment for making the electrode termination layer 530B of the minimized capacitor assembly 500B of acoustic noise.With electrode 530A(referring to Fig. 5 A) in same, electrode termination layer 530B comprises soft Cu termination layer, also has in dielectric portion of entering 104 extending or " finger " for how much with electrical couplings battery lead plate 106.The size and dimension of the such soft Cu termination of electrode termination layer 530B is controlled, to be formed for the pattern of selection size of soldering joint.In certain embodiments, Sn or Sn/Pb alloy deposition are upper in termination layer 530A, so that its surface can be installed on PCB layer 110.Therefore, in certain embodiments, form the soldering joint reducing together with the Topcoating of electrode termination layer 530B and Sn or Sn/Pb, this soldering joint enough conductivity is provided and from capacitor assembly to PCB in limited mechanical couplings.
In certain embodiments, electrode termination layer 530A can form on the face parallel with the face of PCB110, and 530B can form on the face vertical with the face of PCB110., in certain embodiments, can form abreast the face (referring to Fig. 3 A and Fig. 3 B) in the dielectric portion 104 of upper surface forming electrode 106 with Z axis.
Fig. 6 represents the flow chart that is formed for the processing 600 that makes the minimized capacitor assembly of acoustic noise according to some embodiment.Therefore, process 600 and can be used to form assembly 500A described above in detail and 500B(referring to Fig. 5 A and Fig. 5 B) such capacitor assembly.
Step 602 comprises formation dielectric and electrical layer.For example, step 602 can comprise form if the dielectric portion 104(that comprises battery lead plate 106 is referring to Fig. 3 A) dielectric and electrical layer.
The capacitor that step 604 comprises in termination capacitor device assembly connects.Step 604 can comprise the soft metal termination layer that is formed for the electrical layer that electrical couplings forms in step 602.In certain embodiments, step 604 is included in deposits conductive material (for example, termination layer 530A and 530B, referring to Fig. 5 A and Fig. 5 B) on the surface of the dielectric that is formed in step 602 and electrical layer.For example, step 604 can comprise electroplate or electroless plating for termination capacitor device connect deposition materials.Step 604 also can comprise to form and has the pattern of internal electrode.In certain embodiments, step 604 can comprise formation such as the pattern in electrode termination layer 530B.The capacitor that step 606 is included in the termination in step 604 connects upper deposition Sn or Sn/Pb alloy.
Fig. 7 A represent according to some embodiment for making the minimized capacitor assembly 700A of acoustic noise.Assembly 700A comprises the dielectric portion 704A along Z direction with the height of expansion.Therefore, the height of the expansion of part 704A comprises additional dielectric substance on the part that comprises battery lead plate 106.And assembly 700A comprises the termination components 750 that covers whole height along the Z direction of capacitor assembly 704A.
Fig. 7 B represent according to some embodiment for making the minimized capacitor assembly 700B of acoustic noise.Assembly 700B comprises the dielectric portion 704B along Z direction with the height of expansion.Therefore, the height of the expansion of part 704B with the overlapping part of battery lead plate 106 on and under comprise additional dielectric substance.And assembly 700B comprises the termination components 750 that covers whole height along the Z direction of capacitor assembly 704B.
Fig. 7 C represent according to some embodiment for making the minimized capacitor assembly 700C of acoustic noise.Assembly 700C comprises the dielectric portion 704C along Z direction with the height of expansion.Therefore, the height of the expansion of part 704C comprises additional dielectric substance below the part that comprises battery lead plate 106.And assembly 700C comprises the termination components 750 that covers whole height along the Z direction of capacitor assembly 704C.
In the time that dielectric layer produces piezoelectric strain by the electric field that applies, dielectric layer 704A, the 704B of thickening and 704C can limiting capacitance device assembly along the strain of Z direction.Therefore,, in the embodiment consistent with the disclosure, the mechanical couplings entering in PCB layer 110 reduces.
Fig. 8 represents to illustrate the flow chart that is formed for the processing 800 that makes the minimized capacitor assembly of acoustic noise according to some embodiment.Step 802 comprises the dielectric portion that forms the battery lead plate with the connection of formation capacitor.Therefore, step 802 can comprise formation dielectric portion, such as the part 704A discussing in detail above, 704B and 704C(referring to Fig. 7 A～7C).Step 804 comprises the thickness that increases dielectric portion.The capacitor that step 806 comprises in termination capacitor device assembly connects.In certain embodiments, step 806 can comprise step 604 described above in detail and 606(referring to Fig. 6).And in certain embodiments, step 806 can comprise the termination components (referring to termination components 750, Fig. 7 A～7C) of the whole height that forms covering capacitor assembly.
Fig. 9 A represent according to some embodiment for making the minimized capacitor assembly 900A of acoustic noise.Capacitor 900A comprises the dielectric portion 704A along Z direction with the height of expansion.Therefore, the height of the expansion of part 704A in the overlapping part of electrode 106 on.And, assembly 900A comprise along with the termination components 950 of the overlapping Z direction cover part height of electrode 106.
Fig. 9 B represent according to some embodiment for making the minimized capacitor assembly 900B of acoustic noise.Assembly 900B comprises the dielectric portion 904B adjacent with dielectric portion 904A.Dielectric portion 904A comprises electrode 106, and dielectric portion 904B extends the height of dielectric substance along Z direction.The termination components 950 of the whole height that assembly 900A comprises covering dielectric part 904A.According to some embodiment, dielectric portion 904B has the lateral dimension (along directions X) reducing with respect to dielectric portion 904A.This guarantees that termination case parcel capacitor is better to be engaged.
Because the dielectric layer (or multiple layer, as assembly 900B) of thickening has limited strain along Z direction, the embodiment shown in Fig. 9 A and Fig. 9 B provides the acoustics coupling in PCB110 that enters still less.In certain embodiments, assembly 900A and 900B also provide the termination components reducing 950 that comprises package structure, thereby provide good termination to engage.The size that reduces termination components 950 is wished for simplifying manufacturing step.
Figure 10 A represents to illustrate the flow chart that is formed for the 1000A that makes the minimized capacitor assembly of acoustic noise according to some embodiment.For example, the step of processing in 1000 can cause capacitor assembly 900B(described above in detail referring to Fig. 9 B).
Step 1010 comprises the stacked stage for the bottom of capacitor assembly and top.As above with describe in detail like that, bottom can be as the part 904A in capacitor assembly 900B, and top can be if part 904B(is referring to Fig. 9 B).Therefore, step 1010 can comprise partially or completely and to carry out step 402～412 of processing in 400, process step 602～608 in 600, processes any or their combination in any in step 802～804 in 800.For example, step 1010 can comprise staggered conductive layer and dielectric substance, and conductive layer forms the electrode in capacitor assembly.Certain region (for example, part 904B, referring to Fig. 9 B) that step 1020 comprises the top layer of covering the dielectric substance creating in step 1010.Step 1020 is guaranteed to cover region and not affected by cutting/cutting step 1030 subsequently.Step 1030 is included on unlapped position the top layer of the lamination that cutting or cutting obtain in step 1010.Therefore, for example,, with respect to bottom (, part 904A, referring to Fig. 9 B), reduce the lateral dimension (X-axis) at the top (for example, part 904B, referring to Fig. 9 B) in assembly.Step 1040 comprises cutting in cleaning step 1030 and the residue of cutting.Step 1050 comprises removes the mask using in step 1020.
Figure 10 B represents to illustrate the flow chart that is formed for the processing 1000B that makes the minimized capacitor assembly of acoustic noise according to some embodiment.For example, the step of processing in 1000 can cause capacitor assembly 900B(described above in detail referring to Fig. 9 B).
Step 1060 comprises the stacked stage.Step 1060 can comprise the lamination (for example, part 904A, referring to Fig. 9 A) that forms the conductive layer in embedding dielectric substance described above in detail.Step 1060 also can comprise formation does not have to embed the dielectric layer (for example, part 904B) of electrode material wherein.Height reflection termination height (for example, termination components 950, referring to Fig. 9 B) with the overlapping lamination of conductive layer.Therefore, step 1010 can comprise partially or completely and to carry out step 402～412 of processing in 400, process step 602～608 in 600, processes any or their combination in any in step 802～804 in 800.For example, the stage of layered dielectric layer can comprise staggered conductive layer and dielectric substance, and conductive layer forms the electrode in capacitor assembly.Step 1070 comprises and is laminated in step 1010 the first lamination that comprises conductive layer that forms and second dielectric laminated.For example, step 1070 can comprise laminated portion 904A and 904A, thereby produces capacitor assembly 900B(referring to Fig. 9 B).
Step 1070 can be included on the second lamination being formed in step 1060, under or upper and lower lamination the first lamination.And the shape and size of the first lamination can be different from the shape and size of the second lamination forming in step 1060.And in certain embodiments, the second lamination and the first lamination that form in step 1010 can have different shape and size.Therefore, in certain embodiments, the capacitor assembly that is derived from processing 1000B can have asymmetric profile along Z axis.In certain embodiments, be derived from and process the capacitor assembly of 1000B and can there is symmetrical profile along Z axis.For the risk of the crackle that reduces in sintering step to form or cause due to the thermal shock of Lock-in in equipment operating, the capacitor assembly along Z direction with symmetrical profiles is wished.
Figure 11 represent according to some embodiment for making the end view of the minimized capacitor assembly 1100 of acoustic noise.Capacitor assembly 1100 comprises along the sidewall of height or the thickening of Z direction.Therefore,, when in the time that dielectric layer 1104 produces strain by electric field, the sidewall restriction of thickening enters the acoustics coupling in PCB110.Thus, can be along forming battery lead plate 106 with the direction of PCB face perpendicular.Therefore, in certain embodiments, electric field is substantially parallel with the face of PCB layer 110.Termination components for electrical couplings battery lead plate 106 for example can be, according to the metal glass frit termination case of existing processing or soft Cu termination case (, termination layer 530A and 530B, referring to Fig. 5 A and Fig. 5 B) or their combination.Also can add porous nickel dam (for example, termination components 350, referring to Fig. 3 A).
Figure 12 represents to illustrate the flow chart that is formed for the processing 1200 that makes the minimized capacitor assembly of acoustic noise according to some embodiment.For example, the step of processing in 1200 can cause capacitor assembly 1100(described above in detail referring to Figure 11).Step 1210 comprises to form and has the dielectric portion of battery lead plate.Therefore, step 1210 as described in detail above step 802(referring to Fig. 8) like that.Step 1210 comprises the height dimension that increases dielectric substance.The sidewall upper that step 1230 is included in increase connects capacitor connection.
With capacitor assembly 700A, 700B, 700C(referring to Fig. 7 A～7C), 900A, 900B(be referring to Fig. 9 A～9B) and 1100(referring to Figure 11) consistent embodiment can comprise not and the additional dielectric substance of region overlapping with battery lead plate 106.This additional dielectric substance can have limited impact on the electromagnetic performance of capacitor assembly, and on the mechanical couplings in PCB110, has strong impact alleviating equipment.Therefore, some embodiment can comprise the additional dielectric substance with respect to the amount approximately 15%～approximately 50% of the dielectric substance that comprises battery lead plate 106.The amount that it will be understood by those skilled in the art that additional dielectric material can change according to the result of the hope alleviating about materials processing, cost and noise.
Above description is used specific term to make it possible to understand fully the embodiment of description for illustrative purposes.But, it will be understood by those skilled in the art that the embodiment that implements to describe does not need these specific details.Therefore, the above description of specific embodiment is to provide for the object of explaining and describe.They are not detailed or the embodiment of description will be limited to disclosed definite form.It will be understood by those skilled in the art that, in view of above instruction, many modifications and changes are possible.
Claims (20)
1. a capacitor assembly, comprising:
Dielectric portion;
At lip-deep first electrode of described dielectric portion;
The first termination components with the first conductive electrode electrical couplings;
At described lip-deep second electrode of described dielectric portion; With
With the second termination components of the second conductive electrode electrical couplings, described the first termination components and the second termination components also comprise:
Contact layer;
Porous, electrically conductive layer; With
Metal glass frit termination case.
2. according to the capacitor assembly of claim 1, wherein, described dielectric portion has the thickness larger than the vertical thickness along short transverse, and described vertical thickness comprises the first electrode and the second electrode.
3. according to the capacitor assembly of claim 1, wherein, a part for described porous, electrically conductive layer and described the first termination components is adjacent with a part for described the second termination components.
4. according to the capacitor assembly of claim 1, wherein, between described porous, electrically conductive layer in described the first termination layer and the second termination layer and described contact layer, comprise loose structure.
5. according to the capacitor assembly of claim 1～4, wherein, at least one in described the first termination components and the second termination components extends in described dielectric portion with finger shape.
6. for a printing board PCB for hand-hold electronic equipments, comprising:
Multiple substrate layers;
The multiple electric components that form in described multiple substrate layers;
For multiple electric traces of multiple electric components described in electrical couplings; With
Capacitor assembly, this capacitor assembly comprises:
Dielectric portion;
Be embedded in the first electrode in described dielectric portion;
The first termination components with the first conductive electrode electrical couplings;
Be embedded in the second electrode in described dielectric portion; With
With the second termination components of the second conductive electrode electrical couplings, wherein,
Described dielectric portion has the thickness larger than the vertical thickness along short transverse, and described vertical thickness comprises the first electrode and the second electrode.
7. according to the PCB of claim 6, wherein, the dielectric portion of described capacitor assembly has the thickness larger than the vertical thickness along short transverse, and described vertical thickness comprises the first electrode and the second electrode.
8. according to the PCB of claim 6, wherein, described the first electrode forms along substantially vertical with in multiple PCB substrate layers one direction with at least one in the second electrode.
9. according to the PCB of claim 6, wherein, a part for described porous, electrically conductive layer and described the first termination components is adjacent with a part for described the second termination components.
10. according to the PCB of claim 6, wherein, between described porous, electrically conductive layer in described the first termination layer and the second termination layer and described contact layer, comprise loose structure.
11. according to the PCB of claim 6～10, and wherein, at least one in described the first termination components and the second termination components extends in described dielectric portion with finger shape.
12. 1 kinds are used to form the method for capacitor assembly, and described method comprises:
Formation is embedded in the lamination of the electrode layer in dielectric substance;
Form the dielectric layer adjacent with the lamination of described electrode layer;
Increase the thickness along first direction of described dielectric layer;
The termination components of at least one electrical contact in formation and described electrode layer;
Formation capacitor connects; With
Make described capacitor assembly and printing board PCB electrical couplings.
13. according to the method for claim 12, and wherein, the end that formation termination components is included in the lamination of described electrode layer forms metal termination layer; And comprise:
Deposits conductive material on described metal termination layer;
Plated metal or metal precursor on the surface of described electric conducting material;
Form electrical conductivity alloy layer;
In described electrical conductivity alloy layer, produce multiple holes to form porous layer; With
Deposits conductive material on described porous layer.
14. according to the method for claim 12, wherein, forms termination components and comprises the soft metal termination layer that is formed for electrical layer described in electrical couplings; With
Deposits conductive material on described soft termination layer.
15. according to the method for claim 14, also comprises that the size at the bottom at dielectric and electrode layer by controlling described soft metal termination layer and/or sidepiece place and pattern control the size of scolder filler rod.
16. according to the method for claim 12, also comprises described first direction is chosen as with to be suitable for a side with the capacitor assembly of PCB substrate layer mechanical couplings substantially parallel.
17. according to the method for claim 12, also comprises and described first direction is chosen as and is suitable for and a side perpendicular of the capacitor assembly of PCB substrate layer mechanical couplings.
18. according to the method for claim 12, also comprises:
Carried out for the second stacked stage; With
Carry out second layer lamination and at least one the lamination of lamination that is embedded in the described electrode layer in described dielectric substance.
19. according to the method for claim 18, and wherein, the execution first cascade stage comprises formation and is embedded in the battery lead plate in described dielectric substance.
20. according to the method for claim 12～19, also comprises:
The stage is covered in execution; With
Carry out the cutting stage.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361759935P | 2013-02-01 | 2013-02-01 | |
| US61/759,935 | 2013-02-01 | ||
| US13/872,000 US9287049B2 (en) | 2013-02-01 | 2013-04-26 | Low acoustic noise capacitors |
| US13/872,000 | 2013-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103971934A true CN103971934A (en) | 2014-08-06 |
| CN103971934B CN103971934B (en) | 2017-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410030985.2A Active CN103971934B (en) | 2013-02-01 | 2014-01-22 | Low acoustic noise capacitor |
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| CN110662352A (en) * | 2019-10-28 | 2020-01-07 | 维沃移动通信有限公司 | Circuit board device, processing method thereof and mobile terminal |
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| CN103971934B (en) | 2017-08-01 |
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