CN103971934B - Low acoustic noise capacitor - Google Patents
Low acoustic noise capacitor Download PDFInfo
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- CN103971934B CN103971934B CN201410030985.2A CN201410030985A CN103971934B CN 103971934 B CN103971934 B CN 103971934B CN 201410030985 A CN201410030985 A CN 201410030985A CN 103971934 B CN103971934 B CN 103971934B
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Abstract
The application is related to low acoustic noise capacitor.More specifically, the embodiment of description relates generally to be used to be installed on printed circuit board (PCB)（PCB）On capacitor assembly, work as the design that capacitor assembly assigns the acoustic noise that piezoelectric forces are produced on PCB more particularly, to for making capacitor assembly and PCB mechanical isolations to reduce.Termination components in capacitor assembly, comprising the porous conductive layer in capacitor assembly, can reduce the amount for the vibrational energy that PCB is sent to from capacitor.Termination components comprising soft contact layer can also reduce the amount for the vibrational energy for being sent to PCB.Also, the capacitor assembly with the dielectric substance thickeied can reduce the amount for the vibrational energy for being sent to PCB.
Description
Technical field
The embodiment of description relates generally to include the printed circuit board (PCB) of capacitor assembly（PCB）, more particularly, to for
Make capacitor assembly with PCB mechanical isolations to reduce the acoustics produced when capacitor assembly assigns oscillating piezoelectric power on PCB
The design of noise.
Background technology
Printed circuit board (PCB)（PCB）In the various electronic equipments for being usually used in including computer, television set and mobile device.In order to
Various functions are performed, PCB generally comprises the capacitor being installed on PCB.Capacitor can be included by such as ceramic dielectric point
Two conductive plates opened.Certain form of ceramic capacitor can show the characteristic of referred to as piezoelectricity, and the characteristic can cause in ceramics
Portion produces the mechanical strain from the electric field applied.The big I of the strain of generation is with electric-field intensity or across positioned at ceramic material
Both sides two conductors apply voltage difference it is proportional.When capacitor is placed in AC circuits, the ceramics in capacitor can
To expand and shrink according to the frequency for being substantially equal to AC electric power.
This movement can cause Railway Project.First, if the diaphragm mechanical couplings of capacitor and such as PCB, then this
A little expansions and contraction can apply periodic power on PCB.As a result, whole PCB can be vibrated with the harmonic frequency of power supply.When
When driving frequency is substantially equal to PCB resonant frequency, the effect can be particularly evident.PCB vibration can also produce acoustical sound waves.
Under certain situation, obtained sound wave can have the amplitude for being enough to be heard by the user of equipment.Second, excessive vibration can make PCB
On soldering joint and other electrical connection reduction, so as to increase the possibility of equipment failure.
Therefore, it is intended that a kind of make the reliable way of capacitor and PCB mechanical couplings, it is sent to while reducing from capacitor
The amount of PCB vibrational energy.
The content of the invention
Disclosure description reduces the capacitor assembly of the amount of the vibrational energy for the PCB for being sent to capacitor assembly installed above
Embodiment.In one embodiment, capacitor assembly includes：Dielectric portion；First on the surface of dielectric portion
Electrode；With the first termination components of the first conductive electrode electrical couplings；Second electrode on the surface of dielectric portion；With with
Second termination components of the second conductive electrode electrical couplings.Therefore, the first termination components and the second termination components can also be included：Connect
Contact layer；Porous layer；Layer is terminated with inter metal dielectric.
In another embodiment, the method for manufacturing capacitor assembly is described.This method may include：At the end of capacitor
Metal termination layer is formed in portion；Conductive material is deposited on metal termination layer and precursor is deposited on the surface of conductive material.Should
Method also includes：Form electrical conductivity alloy layer；Produce multiple holes to form porous layer in electrical conductivity alloy layer；With on porous layer
Deposit conductive material.
In certain embodiments, capacitor assembly disclosed herein can be included：Dielectric portion；In embedded dielectric portion
First electrode and the first termination components with the first conductive electrode electrical couplings.Also, capacitor assembly can include embedded electricity
Second electrode in media fraction；With the second termination components with the second conductive electrode electrical couplings.Therefore, dielectric portion has
There is the thickness bigger than the thickness of overlapping first electrode and second electrode.
Also, according to some embodiments, the method for forming capacitor assembly can be comprising the embedded dielectric substance of formation
The lamination of interior electrode layer and the formation dielectric layer adjacent with the lamination of electrode layer.This method can also include formation and electrode layer
In at least one electrical contact termination components.
In certain embodiments, for formed capacitor assembly method can comprising forming dielectric and electrode layer, and
Form the soft termination layer for electrical couplings electrode layer.This method can be additionally included on soft termination layer deposition conductive material with to electricity
Container assemblies provide voltage difference.This method can be included：Form the dielectric portion with the battery lead plate for forming capacitor connection；Increase
Plus the thickness of top and/or bottom ceramic segment；It is used to be connected capacitor and the capacitor of PCB electrical couplings with termination.
In some embodiments, this method can include the execution first cascade stage；Perform second and be laminated the stage；With to two lamination execution levels
Pressure.
In some other embodiments, the method for forming capacitor assembly is high comprising electrode and dielectric layer are laminated into target
Degree；Top ceramic layer is cut into specific depth with defined position.
It is combined as example and shows that the accompanying drawing of the principle of the embodiment described reads following detailed description, it is disclosed herein
Embodiment other side and advantage become apparent upon.
Brief description of the drawings
With reference to following description and accompanying drawing, the embodiment of description is better understood.In addition, with reference to following description and attached
Figure, is better understood the advantage of the embodiment of description.These accompanying drawings do not limit the form that the embodiment of description can be proposed and
Any change of details.Spirit and scope of any this change without departing substantially from the embodiment of description.
Figure 1A represents the front view of the existing PCB comprising capacitor.
Figure 1B represents the top view of existing capacitor, and it shows typical displacement bimorph.
Fig. 1 C represent the front view of the existing PCB comprising capacitor, show how displacement bimorph can be sent to PCB.
Fig. 2A represents to be fixed to capacitor into PCB means.
Fig. 2 B represent to be fixed to capacitor into PCB means.
Fig. 3 A represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Fig. 3 B represent the termination components in the capacitor assembly for being used to minimize acoustic noise according to some embodiments
Part diagram.
Fig. 4 represents to show the processing of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
Flow chart.
Fig. 5 A represent the electrode termination in the capacitor assembly for being used to minimize acoustic noise according to some embodiments
Layer.
Fig. 5 B represent the electrode termination in the capacitor assembly for being used to minimize acoustic noise according to some embodiments
Layer.
Fig. 6 represents to show the processing of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
Flow chart.
Fig. 7 A represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Fig. 7 B represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Fig. 7 C represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Fig. 8 represents to show the processing of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
Flow chart.
Fig. 9 A represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Fig. 9 B represent the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Figure 10 A represent to show the place of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
The flow chart of reason.
Figure 10 B represent to show the place of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
The flow chart of reason.
Figure 11 represents the capacitor assembly for being used to minimize acoustic noise according to some embodiments.
Figure 12 represents to show the place of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
The flow chart of reason.
In the accompanying drawings, the key element represented with same or similar reference comprising same or similar structure, using or
Process.
Embodiment
According to the present processes and the representative applications of device described in this part.It is only expansion to provide these examples
Big linguistic context simultaneously helps to understand the embodiment of description.Therefore, to those skilled in the art, can there is no these specific
Implement the embodiment of description in the case of some or all of details.In other cases, in order to avoid unnecessarily mixing
Confuse the embodiment of description, be not described in known process step.Others application is possible so that following example is not
It should be viewed as a limitation.
In following detailed description, referring to the drawings, a part for these accompanying drawings formation specification, also, at these
The specific embodiment for showing the embodiment according to description as explaining in accompanying drawing.Although fully describe in detail these embodiments with
Those skilled in the art are enabled to implement the embodiment of description, it should be appreciated that these examples are not restricted；Allow to
Using other embodiments, also, change can be proposed in the case of without departing substantially from the spirit and scope of the embodiment of description.
The PCB comprising ceramic capacitor can be found in electronic equipment of various.Especially, hand-hold electronic equipments can include tool
There is the PCB of multiple ceramic capacitors.When applying alternating electric field across ceramic capacitor, alternation can be produced in ceramic material
Mechanical strain.Strain can be the result of the intrinsic piezoelectric property of the dielectric substance for capacitor assembly, and typically exist
Aggravated during using high dielectric material.For the dielectric substance in the capacitor assembly for the size with reduction, situation can
Can be exactly such.Unless this movement is isolated, otherwise, vibrational energy can be delivered to PCB from capacitor, can be set so as to produce
The acoustic noise that standby user hears.The scope for producing the typical frequencies of the acoustic vibration of audible noise is about 20Hz~about
20KHz.The amount for the vibrational energy for being delivered to PCB can be reduced by the appropriate termination components in capacitor assembly.Also, have
The capacitor assembly of additional dielectric substance can reduce the amount for the vibrational energy for being delivered to PCB.Therefore, it is applied on PCB
Power can reduce, so that any acoustic noise of the movement from capacitor is minimized.
Figure 1A represents the side view of the existing component 100 comprising the capacitor 102 coupled with PCB110.Capacitor 102 can
Include two termination cases 106 and dielectric 104.Termination case 106 can by such as copper or nickel or glassy metal frit any conduction
Material is formed.Also, dielectric 104 can be formed by any appropriate insulator.Due to the higher dielectric constant of ceramics, high AC frequencies
The performance of stabilization under rate and relatively low price, are used to create dielectric 104 usually using ceramics.Capacitor 102 can be by making
Coupled with solder 108 with PCB110.PCB110 can be arranged on the bag on PCB110 comprising several substrate layers and for electrical couplings
The electric traces of various parts containing capacitor 102.Solder 108 can form filler rod between PCB110 and capacitor 102, so that
Stronger be mechanically and electrically is provided between electrode 106 and the welding disk pattern for the electric traces being coupled on PCB110.
Figure 1B represents the top view of capacitor, shows how internal strain can change capacitor 102 when being subjected to electric field
Shape.Capacitor 102, which can be included, is used for dielectric ferroelectric material（Such as high-k X5R/X7R ceramics）.Due to material
Interior crystal orientation, ferroelectric material through it is strained when can produce electric field.The process can also be overturned, so as to mean ferroelectric material
It may expand and shrink when being placed in electric field.Also, expansion and the big I shunk are proportional to the intensity of electric field.Profile
The typical way that the capacitor 102 that 112 expressions are formed by such as ceramic ferroelectric material can be deformed in the presence of an electrical field.
As illustrated, the upper and lower surface of capacitor 102 can be bent outwardly, also, the surface near electrode 106 can be inwardly curved
It is bent.It should be noted that the deflection shown in Figure 1B is exaggerated to the pattern that preferably performance capacitor 102 is deformed.When to capacitor
During the electric field of 102 application alternations, such as in the case of AC circuits, the expansion and contraction of ceramic material can be in company with capacitors 102
The cyclomorphosis of the voltage change at two ends.Therefore, profile 112（Dotted line）Allusion quotation when can show to apply alive polarity for first state
The deformation of type, also, profile 113（Dotted line）Alive polarity can be shown to apply for the second state（It is opposite with first state）Shi Dian
The deformation of type.
Fig. 1 C represent the front view of the existing component 100 comprising the capacitor 102 coupled with PCB110.As shown in Figure 1B,
Capacitor 102 is shown in the deformation state that may occur in which when the ceramic material in capacitor 102 is in electric field.Work as capacitor
During the voltage difference increase at 102 two ends, the bottom surface of capacitor 102 can be bent outwardly, so that the applying power on PCB110.Also, electricity
The increase of pressure can cause the end face near electrode 106 of capacitor 102 to curve inwardly, so as to pull solder fillets 108.
Downward power on PCB110 combines the area that can cause PCB110 around capacitor 102 with the pulling on solder fillets 108
In domain to bottom offset.When capacitor 102 is located in AC circuits, the downward displacement can change according to AC frequency cycles
Become.As a result, PCB110 can be according to equal to AC frequencies or the vibration of the frequency of the harmonic wave of AC frequencies.When PCB110 resonance frequency
When rate is on or near the harmonic wave of AC or AC frequencies, the amplitude of vibration can be particularly evident.The vibration can cause PCB110 to be used as
Speaker diaphragm, so as to produce acoustic noise.In some cases, the acoustic noise can have the user for being sufficient so that device to listen
The amplitude arrived.
Fig. 2A and Fig. 2 B represent the several existing of the amount for reducing the vibrational energy that PCB110 is delivered to from capacitor 102
Technical scheme.In fig. 2a, it shows prior art component 200.Connector 202 can be taken can be by using such as soldering
（soldering）Or any number of technology of the welding of such as Laser Welding be connected with the termination case of capacitor 102 and with
The form of the metal connector of PCB110 couplings.Metal connector 202 is designed to prevent between capacitor 102 and PCB110
Any directly contact and absorb any mechanical oscillation transmitted from the termination case of capacitor 102.But, metal connector
202 can substantially increase the height of component 200.Many contemporary equipment, such as mobile phone has strict sky to PCB components
Between require, this can interfere with it is similar with component 200 be designed for isolating capacitor 102.In fig. 2b, prior art component is shown
201.Component 201 can include the insertion plate 206 being located between capacitor 102 and PCB110.Insertion plate 206 can provide capacitor
Electrical connection between electrode on 102 and the corresponding welding disk pattern on PCB110.Also, inserting plate 206 can be by being designed
Material for any displacement in mitigation capacitor 102 is formed, so as to reduce the amount for the vibrational energy for being delivered to PCB110.But
It is that component 200 can also exceed the space limitation in many equipment.Insertion plate 206 can increase the accounting on PCB110 of capacitor 102
According to area and increase the height of capacitor 102.The increase of these spaces, which can interfere with component 201, to be used in many designs.Some solutions
The trial of the problem of acoustic noise certainly coupled with PCB layer 110 includes height increase capacitor on PCB110.
Being included according to the capacitor assembly of some embodiments disclosed herein is used to cause capacitor body to become firm with reduction
The enhancing ceramic segment of undesirable acoustic noise.Therefore, from the piezoelectric strain being contained in the ceramics in capacitor assembly
Undesirable acoustic noise weaken or deflect in the level of part.Therefore, the embodiment consistent with the disclosure relaxes PCB prints
Mark be laid out and for PCB capacitor fix condition and constraint.The embodiment consistent with the disclosure passes through piezoelectricity comprising guiding
Induce the power of strain generation to make it away from PCB capacitor assembly so that do not produce or substantially mitigate undesirable noise.
Fig. 3 A represent the capacitor assembly 300 for being used to minimize acoustic noise according to some embodiments.Component 300 is wrapped
Containing the termination components 350 of alternate electrodes 106 and first and second in dielectric portion 104, embedded dielectric portion 104.First
With the second termination components 350 respectively with the electrical couplings of the first and second electrode 106.Termination components 350 are by PCB110 to electrode
106 provide voltage.In figure 3 a, cartesian coordinate system Z-X is shown as " height " direction that Z axis points to capacitor assembly 300（Or
" vertical " direction）.Although the implementation below for the capacitor assembly consistent with the disclosure exemplifies same cartesian coordinate system,
It should be understood that capacitor assembly is only explanatory relative to the specific orientation of reference axis.It will be understood by those skilled in the art that
In the embodiment consistent with the disclosure, many other compositions are possible.
First and second termination components 350 can along Z-direction covering capacitor component 300 whole height.First and second
Each in termination components 350 includes contact layer 310, porous conductive layer 320 and inter metal dielectric termination layer 330.Therefore, exist
In some embodiments, contact layer 310 is by being formed such as tin of a certain thickness（Sn）Or tin/metal（Sn/Pb）Conduction
Material is formed.Porous layer 320 can include such as nickel（Ni）Or the porous layer of the conductive material of nickel alloy.It is more detailed referring to Fig. 3 B
Porous layer 320 carefully is described.
Fig. 3 B represent that the metal electricity in the capacitor assembly for being used to minimize acoustic noise according to some embodiments is situated between
The part diagram of matter termination components 350.Fig. 3 B show the part with a part of adjacent porous layer 320 of termination layer 330.Just
For this, porous layer 320 can be included（All or in part）Porous conical structure is as between termination layer 330 and contact layer 310
Intermediate layer.Therefore, when forming component, the partially porous structure in layer 320 can ensure that enough leach resistances.With this side
Formula, layer 320 can be used as damper/cushion pad/buffer to absorb impact, so that the piezoelectricity come in sufficient power from capacitor induces strain
Couple minimum with the acoustics of soldering joint and PCB.In certain embodiments, porous conical structure by such as Ni conduction material
Material is made.
Fig. 4 represents the processing 400 of the capacitor assembly for making acoustic noise minimum according to the formation of some embodiments
Flow chart.In certain embodiments, processing 400 can cause capacitor assembly 300 as described in detail above（More than
Fig. 3 A）Capacitor assembly.
Step 402 includes formation metal termination layer on the dielectric substrate.In certain embodiments, metal termination layer can be with
It is glassy metal frit termination case, also, dielectric base plate can be such as the dielectric portion 104 of dielectric electrode assemblie 300（Referring to
Fig. 3 A and Fig. 3 B above）Like that, comprising the battery lead plate 106 being embedded.Step 404 is included in the metal termination of step 402
Conductive material is deposited on layer.Therefore, to can be included in the upper electronickelling of termination layer being formed in step 402 pre- to be formed for step 404
Determine the layer of thickness.In certain embodiments, step 404 can be included in electroless plating nickel on the termination case being formed in step 402.
Step 406 is included on the surface for the nickel dam being formed in step 404 and deposits precursor material.Therefore, use in a step 406
Precursor material can be that aluminium, aluminium is black or some other metals, or the liquid comprising metal, or the liquid comprising conductive material.
Step 408, which is included, forms electrical conductivity alloy layer.In certain embodiments, step 408 can include the high temperature for being used for forming nickel alumin(i)um alloy
Sintering step.Step 410 is included in electrical conductivity alloy layer and produces hole to form porous layer.Therefore, step 410 can include selection
Property leaching step, with from formed in a step 408 electrical conductivity alloy layer remove aluminium.Step 412 is included in and is formed at step 410
In porous layer on deposit conductive material.In certain embodiments, step 412 is included on the loose structure from step 410
Deposit Sn or Sn/Pb alloys.
Fig. 5 A represent the electrode in the capacitor assembly 500A for being used to minimize acoustic noise according to some embodiments
Terminate layer 530A.Therefore, electrode termination layer 530A can terminate layer comprising soft Cu.Electrode terminates layer 530A in dielectric layer 104
On surface formed, and with battery lead plate 106（Fig. 1~3 more than）Electrical couplings.In certain embodiments, by electricity
Cu layers are electroplated or sputtered on dielectric layer 104, form electrode termination layer 530A.In certain embodiments, sunk on termination layer 530A
Product Sn or Sn/Pb alloys are so that its surface may be mounted on PCB layer 110.
Fig. 5 B represent the electrode in the capacitor assembly 500B for being used to minimize acoustic noise according to some embodiments
Terminate layer 530B.With electrode 530A（Referring to Fig. 5 A）In it is same, electrode termination layer 530B terminates layer comprising soft Cu, also with entrance
Geometry extension with electrical couplings battery lead plate 106 or " finger " in dielectric portion 104.Soft Cu as electrode termination layer 530B
The size and dimension of termination is controlled, to form the pattern of the selection size for soldering joint.In certain embodiments, Sn or
Sn/Pb alloy depositions are on termination layer 530A, so that its surface may be mounted on PCB layer 110.Therefore, in certain embodiments,
Electrode termination layer 530B forms the soldering joint of reduction together with Sn or Sn/Pb Topcoating, and the soldering joint provides enough
Electric conductivity and from capacitor assembly to PCB in limited mechanical couplings.
In certain embodiments, electrode termination layer 530A can be formed on the face parallel with PCB110 face, also, 530B
It can be formed on the face vertical with PCB110 face.I.e., in certain embodiments, it can be formed parallel to form electricity above with Z axis
Face in the dielectric portion 104 of pole 106（Referring to Fig. 3 A and Fig. 3 B）.
Fig. 6 represents the processing 600 of the capacitor assembly for making acoustic noise minimum according to the formation of some embodiments
Flow chart.Therefore, processing 600 may be used to form component 500A and 500B described above in detail（Referring to Fig. 5 A and Fig. 5 B）
Such capacitor assembly.
Step 602 includes and forms dielectric and electrical layer.For example, step 602 can be comprising formation as comprising battery lead plate 106
Dielectric portion 104（Referring to Fig. 3 A）Such dielectric and electrical layer.
Step 604 includes the capacitor connection in termination capacitor device assembly.Step 604 can be used for electrical couplings comprising being formed
The soft metal termination layer of the electrical layer formed in step 602.In certain embodiments, step 604 is included in and is formed at step
Dielectric in 602 and deposit conductive material on the surface of electrical layer（For example, termination layer 530A and 530B, referring to Fig. 5 A and figure
5B）.For example, step 604 can be used for the deposition materials that terminating capacitor is connected comprising plating or electroless plating.Step 604 is also
There can be the pattern of internal electrode comprising formation.In certain embodiments, step 604 such as can terminate layer comprising being formed in electrode
Pattern in 530B.Step 606 deposits Sn or Sn/Pb alloys in the capacitor connection comprising termination in step 604.
Fig. 7 A represent the capacitor assembly 700A for being used to minimize acoustic noise according to some embodiments.Component 700A
Include the dielectric portion 704A of the height along Z-direction with extension.Therefore, the height of part 704A extension is including electrode
Additional dielectric substance is included on the part of plate 106.Also, component 700A includes the Z-direction along capacitor assembly 704A
Cover the termination components 750 of whole height.
Fig. 7 B represent the capacitor assembly 700B for being used to minimize acoustic noise according to some embodiments.Component 700B
Include the dielectric portion 704B of the height along Z-direction with extension.Therefore, the height of part 704B extension with battery lead plate
Additional dielectric substance is included above and below 106 overlapping parts.Also, component 700B is included along capacitor assembly 704B
Z-direction cover the termination components 750 of whole height.
Fig. 7 C represent the capacitor assembly 700C for being used to minimize acoustic noise according to some embodiments.Component 700C
Include the dielectric portion 704C of the height along Z-direction with extension.Therefore, the height of part 704C extension is including electrode
Additional dielectric substance is included below in the part of plate 106.Also, component 700C includes the Z-direction along capacitor assembly 704C
Cover the termination components 750 of whole height.
When dielectric layer produces piezoelectric strain by the electric field of application, dielectric layer 704A, 704B and 704C of thickening
Can strain of the limiting capacitance device assembly along Z-direction.Therefore, in the embodiment consistent with the disclosure, into PCB layer 110
Mechanical couplings are reduced.
Fig. 8 represents to show the processing of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
800 flow chart.Step 802 has the dielectric portion for the battery lead plate for forming capacitor connection comprising being formed.Therefore, step
802 can be comprising forming dielectric portion, part 704A, 704B and 704C such as discussed in detail above（Referring to Fig. 7 A~7C）.
Step 804 includes the thickness of increase dielectric portion.Step 806 includes the capacitor connection in termination capacitor device assembly.One
In a little embodiments, step 806 can include step 604 described above in detail and 606（Referring to Fig. 6）.Also, in some embodiments
In, step 806 can include the termination components for the whole height for forming covering capacitor component（Referring to termination components 750, Fig. 7 A~
7C）.
Fig. 9 A represent the capacitor assembly 900A for being used to minimize acoustic noise according to some embodiments.Capacitor
900A includes the dielectric portion 704A for the height for having extension along Z-direction.Therefore, the height of part 704A extension be in
On the overlapping part of electrode 106.Also, component 900A includes the end along the Z-direction covering part height overlapping with electrode 106
Connect element 950.
Fig. 9 B represent the capacitor assembly 900B for being used to minimize acoustic noise according to some embodiments.Component 900B
Include the dielectric portion 904B adjacent with dielectric portion 904A.Dielectric portion 904A includes electrode 106, also, electricity is situated between
Matter part 904B extends the height of dielectric substance along Z-direction.Component 900A includes covering dielectric part 904A whole height
The termination components 950 of degree.According to some embodiments, dielectric portion 904B has the horizontal stroke reduced relative to dielectric portion 904A
To size（In X direction）.This ensures termination case parcel capacitor preferably to be engaged.
Due to the dielectric layer of thickening（Or multiple layers, such as component 900B）There is limited strain, Fig. 9 A and figure along Z-direction
Embodiment shown in 9B provides the acoustics coupling in less entrance PCB110.In certain embodiments, component 900A and 900B
The termination components 950 of the reduction comprising package structure are also provided, so as to provide good termination engagement.Reduce termination components 950
Size be desirable to for simplifying manufacturing step.
Figure 10 A represent to show the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
1000A flow chart.For example, the step in processing 1000 can cause capacitor assembly 900B described above in detail（Referring to figure
9B）.
Step 1010 includes the bottom for capacitor assembly and the stacking stage at top.As above with detailed description that
Sample, bottom can be such as the part 904A in capacitor assembly 900B, also, top can be such as part 904B（Referring to Fig. 9 B）.Cause
This, step 1010 can comprising partially or completely perform processing 400 in step 402~412, processing 600 in step 602~
608th, any one in step 802~804 in processing 800 or their any combination.For example, step 1010 can be comprising staggeredly
Electrode in conductive layer and dielectric substance, conductive layer formation capacitor assembly.Step 1020 is included and covered in step 1010
Some region of the top layer of the dielectric substance of establishment（For example, part 904B, referring to Fig. 9 B）.Step 1020 ensures to cover region
Do not influenceed by subsequent cutting/cutting step 1030.Step 1030 is cut on unlapped position or cutting is in step
The top layer of the lamination obtained in 1010.Accordingly, with respect to bottom（For example, part 904A, referring to Fig. 9 B）, reduce the top in component
Portion（For example, part 904B, referring to Fig. 9 B）Lateral dimension（X-axis）.Step 1040 include cleaning step 1030 in cutting and
The residue of cutting.The mask that step 1050 is used in step 1020 comprising removal.
Figure 10 B represent to show the place of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
Manage 1000B flow chart.For example, the step in processing 1000 can cause capacitor assembly 900B described above in detail（Referring to
Fig. 9 B）.
Step 1060 includes the stacking stage.Step 1060 can be included and formed in embedded dielectric substance described above in detail
Conductive layer lamination（For example, part 904A, referring to Fig. 9 A）.The electrode that step 1060 can be embedded also comprising formation
The dielectric layer of material（For example, part 904B）.The height reflection termination height of the lamination overlapping with conductive layer（For example, termination
Element 950, referring to Fig. 9 B）.Therefore, step 1010 can include step 402~412, place partially or completely performed in processing 400
Any one in step 802~804 in step 602~608, processing 800 in reason 600 or their any combination.For example,
The electrode that the stage of layered dielectric layer can be formed in capacitor assembly comprising staggeredly conductive layer and dielectric substance, conductive layer.
The first lamination comprising conductive layer and second that step 1070 is formed in step 1010 comprising lamination are dielectric laminated.For example,
Step 1070 can include laminated portion 904A and 904A, so as to produce capacitor assembly 900B（Referring to Fig. 9 B）.
Step 1070 can be included on the second lamination being formed in step 1060, under or up and down lamination first fold
Layer.Also, the shape and size of the first lamination can be different from the shape and size of the second lamination formed in step 1060.And
And, in certain embodiments, the second lamination and the first lamination formed in step 1010 can have different shape and size.
Therefore, in certain embodiments, the capacitor assembly from processing 1000B can have asymmetric profile along Z axis.In some realities
Apply in example, the capacitor assembly from processing 1000B there can be symmetrical profile along Z axis.In order to reduce the shape in sintering step
Into or due in equipment operation caused by the thermal shock of Lock-in crackle risk, there are symmetrical profiles along Z-direction
What capacitor assembly was desirable to.
Figure 11 represents the side view of the capacitor assembly 1100 for being used to minimize acoustic noise according to some embodiments.
Capacitor assembly 1100 includes the side wall thickeied along height or Z-direction.Therefore, answered when in dielectric layer 1104 by electric field generation
During change, the acoustics that the side wall limitation of thickening enters in PCB110 is coupled.Thus, can be along the side substantially vertical with PCB surface
To formation battery lead plate 106.Therefore, in certain embodiments, electric field is parallel substantially with the face of PCB layer 110.For electrical couplings
The termination components of battery lead plate 106 can be the glassy metal frit termination case or soft Cu termination cases according to existing processing（For example,
Layer 530A and 530B are terminated, referring to Fig. 5 A and Fig. 5 B）Or combinations thereof.Also porous nickel sheet can be added（For example, termination components
350, referring to Fig. 3 A）.
Figure 12 represents to show the place of the capacitor assembly according to the formation of some embodiments for making acoustic noise minimum
The flow chart of reason 1200.For example, the step in processing 1200 can cause capacitor assembly 1100 described above in detail（Referring to figure
11）.Step 1210 has the dielectric portion of battery lead plate comprising being formed.Therefore, step 1210 can be walked as described in detail above
Rapid 802（Referring to Fig. 8）Like that.Step 1210 includes the height dimension of increase dielectric substance.Step 1230 is included in increased
Sidewall upper connects capacitor connection.
With capacitor assembly 700A, 700B, 700C（Referring to Fig. 7 A~7C）、900A、900B（Referring to Fig. 9 A~9B）With
1100（Referring to Figure 11）Consistent embodiment can include additional dielectric material not overlapping with the region with battery lead plate 106
Material.The additional dielectric substance can have limited influence on the electromagnetic performance of capacitor assembly, and mitigate equipment
There is strong influence in mechanical couplings into PCB110.Therefore, some embodiments may include relative to comprising battery lead plate 106
Dielectric substance amount about 15%~about 50% additional dielectric substance.It will be understood by those skilled in the art that additional electrical
The amount of dielectric material can change according to the desired result processed on material, cost and noise mitigate.
Description above enables to be completely understood by the implementation of description using specific term for illustrative purposes
Example.But, it will be understood by those skilled in the art that the embodiment for implementing description does not need these specific details.Therefore, it is specific
The above description of embodiment be in order at and explain and the purpose of description is provided.They are not realities detailed or by description
Apply example and be limited to disclosed definite form.It will be understood by those skilled in the art that in view of the teaching of the above, many modifications and changes
It is possible.
Claims (10)
1. a kind of capacitor assembly, including：
Dielectric portion；
It is arranged in the first electrode in the dielectric portion；
With the first termination components of first electrode electrical couplings；
It is arranged in the second electrode in the dielectric portion；With
With the second termination components of second electrode electrical couplings, wherein the first end connects every in element and the second termination components
It is individual including：
Outermost conductive contact layer,
Most the inside glassy metal termination layer, and
There is the porous knot of circular cone directly between the outermost conductive contact layer and the most the inside glassy metal termination layer
The porous nickel alumin(i)um alloy conductive layer of structure.
2. capacitor assembly according to claim 1, wherein, the dielectric portion has than along the vertical of short transverse
The big horizontal breadth of thickness, the vertical thickness includes first electrode and second electrode.
3. capacitor assembly according to claim 1, wherein, the outermost conductive contact layer includes tin or tin/lead is closed
At least one in gold.
4. capacitor assembly according to claim 1, wherein, the circular cone loose structure includes partly or completely porous
Conical structure.
5. according to capacitor assembly according to any one of claims 1 to 4, wherein, first termination components or second
At least one in termination components is extended in the dielectric portion.
6. a kind of printing board PCB being used in hand-hold electronic equipments, including：
Electric component, comprising：
Dielectric portion；
First termination components；
Second termination components, wherein, each including in first termination components and second termination components：
The outermost conductive contact layer positioned relative to the dielectric portion,
Most the inside glassy metal termination layer, and
Porous nickel alumin(i)um alloy directly between the outermost conductive contact layer and the most the inside glassy metal termination layer is led
Electric layer, wherein the porous nickel aluminium alloy conductive layer includes conical structure.
7. PCB according to claim 6, wherein, the dielectric portion is characterized by being more than the dielectric portion
The horizontal breadth of the vertical thickness divided.
8. PCB according to claim 6, wherein, the electric component includes electrode, and the electrode is disposed in institute
State in dielectric portion.
9. PCB according to claim 6, wherein, the outermost conductive contact layer is included in tin or tin/metal extremely
It is few one.
10. the PCB according to any one of claim 6~9, wherein, first termination components or the second termination components
In at least one extend in the dielectric portion.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361759935P | 2013-02-01 | 2013-02-01 | |
| US61/759,935 | 2013-02-01 | ||
| US13/872,000 US9287049B2 (en) | 2013-02-01 | 2013-04-26 | Low acoustic noise capacitors |
| US13/872,000 | 2013-04-26 |
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| CN103971934A CN103971934A (en) | 2014-08-06 |
| CN103971934B true CN103971934B (en) | 2017-08-01 |
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| CN201410030985.2A Active CN103971934B (en) | 2013-02-01 | 2014-01-22 | Low acoustic noise capacitor |
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| CN110662352A (en) * | 2019-10-28 | 2020-01-07 | 维沃移动通信有限公司 | Circuit board device, processing method thereof and mobile terminal |
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|---|---|---|---|---|
| CN1321410A (en) * | 1999-09-02 | 2001-11-07 | 伊比登株式会社 | Printed wiring board and method of producing same |
| CN1154130C (en) * | 1998-04-07 | 2004-06-16 | 株式会社村田制作所 | Ceramic electronic assembly and production method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006186316A (en) * | 2004-11-30 | 2006-07-13 | Kyocera Corp | Ceramic electronic component and laminated ceramic capacitor |
| JP2012094671A (en) * | 2010-10-27 | 2012-05-17 | Tdk Corp | Electronic component |
| JP5267583B2 (en) * | 2011-01-21 | 2013-08-21 | 株式会社村田製作所 | Multilayer ceramic electronic components |
| US9287049B2 (en) * | 2013-02-01 | 2016-03-15 | Apple Inc. | Low acoustic noise capacitors |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154130C (en) * | 1998-04-07 | 2004-06-16 | 株式会社村田制作所 | Ceramic electronic assembly and production method thereof |
| CN1321410A (en) * | 1999-09-02 | 2001-11-07 | 伊比登株式会社 | Printed wiring board and method of producing same |
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