CN103962718A - Measuring device and die core processing method using same - Google Patents
Measuring device and die core processing method using same Download PDFInfo
- Publication number
- CN103962718A CN103962718A CN201310042652.7A CN201310042652A CN103962718A CN 103962718 A CN103962718 A CN 103962718A CN 201310042652 A CN201310042652 A CN 201310042652A CN 103962718 A CN103962718 A CN 103962718A
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- CN
- China
- Prior art keywords
- die
- laser
- controller
- camera
- grating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2409—Arrangements for indirect observation of the working space using image recording means, e.g. a camera
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
- B23Q17/2471—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of workpieces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention relates to a measuring device used for measuring height of a die core before processing. The measuring device comprises a laser generator, a raster, a camera and a controller. The laser generator is fixedly arranged above the die core, laser light emitted by the laser generator is perpendicular to the upper surface of the die core. The raster is fixedly arranged between the laser generator and the die core and used for dividing the laser light emitted by the laser generator into two channels of light beams with a preset included angle to irradiate the upper surface of the die core. The camera is arranged above the die core and used for taking pictures of the upper surface of the die core. The controller is electrically connected with the camera, receives images taken by the camera and calculates practical height of the die core. The invention further relates to a die core processing method using the measuring device.
Description
Technical field
The present invention relates to a kind of measurement mechanism and use the die processing method of this measurement mechanism.
Background technology
Penetrate with light guide plate mesh point die when using Laser Processing machined, Laser Processing chance moves to apart from die top one level altitude, and this is highly the focal height of the laser pulse light of laser machine, and this focal height is set according to different process requirements.During operation Laser Processing machined site, must manually input the height of processing die, now laser processor answers automatic moving extremely apart from board one certain height, this certain height equals die height and adds focal height, makes Laser Focusing point be positioned at die surface so that processing.
Yet, producing the die that has the LGP of many different sizes on line and can use differing heights, operating personnel's constant error is planted die height and is caused laser processor falling head too many and clash into die, makes laser machine work as machine and even damages.
Summary of the invention
In view of this, be necessary to provide a kind of die processing method that can automatically measure the measurement mechanism of die height man-hour and use this measurement mechanism that adds.
A measurement mechanism, for high to surveying before a die processing.Described measurement mechanism comprises a laser generator, a grating, a camera and a controller.Described laser generator is fixedly arranged on described die top, and the laser that described laser generator penetrates is vertical with a upper surface of described die.Described grating is fixedly arranged between described laser generator and described die, and described grating is for being divided into by the laser of described laser generator transmitting the upper surface that twice have the light beam of a predetermined angle and expose to described die.Described camera is positioned at described die top, for the upper surface photographic images to described die.Described controller and described camera are electrically connected, described controller receives the image of described camera shooting and goes out according to the image calculation of described camera shooting the distance that twice light beam is beaten the point-to-point transmission on the upper surface of described die, and the actual height that calculates die according to the distance between described twice light beam and predetermined angle.
A kind of die processing method, comprise the following steps: a die, a measurement mechanism as above and a laser machine are provided, described die comprises a upper surface, described laser machine comprises a board and a laser processor, described die is positioned on the board of described laser machine, described controller is also electrically connected with described laser processor; Described laser generator sends laser one, and described grating Jiang Gai road laser reflects, and described laser is divided into light beam irradiates that twice have a predetermined angular to the upper surface of described die by described grating; Utilize described camera take described die upper surface image and be sent to described controller, the image calculation that described controller is taken according to described camera goes out the distance D that twice light beam is beaten the point-to-point transmission on the upper surface of described die, and according to the distance between described twice light beam and predetermined angle and then draw the actual height H of described die; Described controller adds the focusing distance of the above laser processor according to the actual height H of described die, calculate between described laser processor and described board along the height L of the upper surface direction of vertical described die, and control described laser processor and be set in this height L; Described controller is controlled described laser processor described die is processed.
Compared with prior art, measurement mechanism of the present invention is divided into by one laser the upper surface that twice expose to die by grating, automatically calculates the actual height of die, without artificial input with camera after taking pictures, both can prevent that laser processor and die from bumping against, and can guarantee machining accuracy again.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of measurement mechanism provided by the invention.
Fig. 2 is the flow chart that uses the die processing method of the measurement mechanism shown in Fig. 1.
Main element symbol description
| Measurement mechanism | 10 |
| Laser generator | 11 |
| Grating | 12 |
| Camera | 13 |
| Controller | 14 |
| Die | 20 |
| Upper surface | 21 |
| Laser machine | 30 |
| Board | 31 |
| Laser processor | 32 |
The following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Below in conjunction with accompanying drawing, will be described in further detail embodiment of the present invention.
Refer to Fig. 1, measurement mechanism 10 of the present invention is for high to surveying before die 20 processing.Described measurement mechanism 10 is arranged on laser machine 30 tops.Described laser machine 30 comprises a board 31 and a laser processor 32.Described die 20 is carried on described board 31.
Described measurement mechanism 10 comprises a laser generator 11, a grating 12, a camera 13 and a controller 14.
Described laser generator 11 is fixedly arranged on described die 20 tops, and a upper surface 21 of the laser of its ejaculation and described die 20 is perpendicular.
Described grating 12 is fixedly arranged between described laser generator 11 and described die 20, and described grating 12 is for being divided into by the laser of described laser generator 11 transmittings the upper surface 21 that twice have the light beam of a predetermined angle and expose to described die 20.
Described camera 13 is positioned at described die 20 tops, for upper surface 21 photographic images to described die 20.
Described controller 14 is all electrically connected with described camera 13 and described laser processor 32, for the actual height of die 20 described in the image calculation that receives the image of described camera 13 shootings and take according to described camera 13, and according to the actual height of described die 20, the position of described laser processor 32 is controlled.
Refer to Fig. 2, for using the flow chart of the die processing method of measurement mechanism 10 as mentioned above, it comprises the following steps:
S101 a: die 20, measurement mechanism 10 as above and a laser machine 30 are provided, described die 20 are positioned on the board 31 of described laser machine 30;
S102: described laser generator 11 sends laser one, described grating 12Jiang Gai road laser reflects, and described laser is divided into light beam irradiates that twice have a predetermined angular to the upper surface 21 of described die 20 by described grating 12;
Because the refractive index of described grating 12 is certain, therefore, the predetermined angle of twice light beam is θ.In present embodiment, the predetermined angle theta of twice light beam is 30 °;
S103: utilize described camera 13 take the image of two light beam spots on the upper surface 21 of described die 20 and be sent to described controller 14, the image calculation that described controller 14 is taken according to described camera 13 goes out the distance D that twice light beam is beaten the point-to-point transmission on the upper surface 21 of described die 20, and according to formula H
2=D/tan θ, H=H
1-H
2, and then can draw the actual height H of described die 20, wherein H
1for between described grating 12 and described board 31 along the distance of upper surface 21 directions of vertical described die 20, described H
2for between grating 12 and described die 20 along the distance of upper surface 21 directions of vertical described die 20;
S104: described controller 14 adds the focusing distance of the above laser processor 32 according to the actual height H of described die 20, calculate between described laser processor 32 and described board 31 along the height L of upper surface 21 directions of vertical described die 20, and control described laser processor 32 and be set in this height L;
S105: described controller 14 is controlled 32 pairs of described dies 20 of described laser processor and processed.
Compared with prior art, measurement mechanism of the present invention is divided into by one laser the upper surface that twice expose to die by grating, automatically calculates the actual height of die, without artificial input with camera after taking pictures, both can prevent that laser processor and die from bumping against, and can guarantee machining accuracy again.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection domain of the claims in the present invention.
Claims (4)
1. a measurement mechanism, for high to surveying before a die processing, described measurement mechanism comprises a laser generator, one grating, one camera and a controller, described laser generator is fixedly arranged on described die top, the laser that described laser generator penetrates is vertical with a upper surface of described die, described grating is fixedly arranged between described laser generator and described die, described grating is for being divided into by the laser of described laser generator transmitting the upper surface that twice have the light beam of a predetermined angle and expose to described die, described camera is positioned at described die top, for the upper surface photographic images to described die, described controller and described camera are electrically connected, described controller receives the image of described camera shooting and goes out according to the image calculation of described camera shooting the distance that twice light beam is beaten the point-to-point transmission on the upper surface of described die, and the actual height that calculates die according to the distance between described twice light beam and predetermined angle.
2. a die processing method, comprises the following steps:
One die, a measurement mechanism as claimed in claim 1 and a laser machine are provided, described die comprises a upper surface, described laser machine comprises a board and a laser processor, described die is positioned on the board of described laser machine, described controller is also electrically connected with described laser processor;
Described laser generator sends laser one, and described grating Jiang Gai road laser reflects, and described laser is divided into light beam irradiates that twice have a predetermined angular to the upper surface of described die by described grating;
Utilize described camera take described die upper surface image and be sent to described controller, the image calculation that described controller is taken according to described camera goes out the distance D that twice light beam is beaten the point-to-point transmission on the upper surface of described die, and according to the distance between described twice light beam and predetermined angle and then draw the actual height H of described die;
Described controller adds the focusing distance of the above laser processor according to the actual height H of described die, calculate between described laser processor and described board along the height L of the upper surface direction of vertical described die, and control described laser processor and be set in this height L;
Described controller is controlled described laser processor described die is processed.
3. die processing method as claimed in claim 2, is characterized in that: the predetermined angle between described twice laser is θ, θ=30 °.
4. die processing method as claimed in claim 3, is characterized in that: described controller is according to formula H
2=D/tan θ, H=H
1-H
2, draw the actual height H of die, wherein H
1for between described grating and described board along the distance of the upper surface direction of vertical described die, H
2for between described grating and described die along the distance of the upper surface direction of vertical described die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310042652.7A CN103962718A (en) | 2013-02-04 | 2013-02-04 | Measuring device and die core processing method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310042652.7A CN103962718A (en) | 2013-02-04 | 2013-02-04 | Measuring device and die core processing method using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103962718A true CN103962718A (en) | 2014-08-06 |
Family
ID=51232982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310042652.7A Pending CN103962718A (en) | 2013-02-04 | 2013-02-04 | Measuring device and die core processing method using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103962718A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107717559A (en) * | 2017-10-09 | 2018-02-23 | 蓝思科技（长沙）有限公司 | A kind of CNC machine and its cylinder clamp on-line checking foolproof method and system |
| CN115255611A (en) * | 2022-07-21 | 2022-11-01 | 武汉逸飞激光股份有限公司 | Laser head welding device and visual height measurement method |
-
2013
- 2013-02-04 CN CN201310042652.7A patent/CN103962718A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107717559A (en) * | 2017-10-09 | 2018-02-23 | 蓝思科技（长沙）有限公司 | A kind of CNC machine and its cylinder clamp on-line checking foolproof method and system |
| CN115255611A (en) * | 2022-07-21 | 2022-11-01 | 武汉逸飞激光股份有限公司 | Laser head welding device and visual height measurement method |
| CN115255611B (en) * | 2022-07-21 | 2023-11-10 | 武汉逸飞激光股份有限公司 | Laser head welding device and visual height measurement method |
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Application publication date: 20140806 |