CN103957002A - Grid voltage bootstrapping xor/xnor circuit and grid voltage bootstrapping single-bit full adder - Google Patents
Grid voltage bootstrapping xor/xnor circuit and grid voltage bootstrapping single-bit full adder Download PDFInfo
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Abstract
本发明公开了一种栅压自举异或/同或电路及与求和信号产生电路和进位信号产生电路共同组成的栅压自举一位全加器,特点是栅压自举异或/同或电路包括栅压自举同或产生电路和反相器,其中栅压自举同或产生电路由第一PMOS管、第二PMOS管、第一NMOS管、第二NMOS管、第三NMOS管和第四NMOS管通过特殊的连接方式组成;优点是将异或/同或电路连接成栅压自举电路结构,通过栅极自举效应,提高了第三NMOS管或第四NMOS管的栅极电压,进而使高电平顺利通过第一NMOS管或第二NMOS管,电路输出达到全摆幅,提高了驱动下一级的能力,增大了整体电路的运行速度;全摆幅降低了电路的漏功耗,提高了电路的性能,最终有效地降低了整体电路的延时、功耗及功耗-延时积。
The invention discloses a grid voltage bootstrapping XOR/simultaneous OR circuit and a grid voltage bootstrapping one-bit full adder composed of a summation signal generating circuit and a carry signal generating circuit, which is characterized in that the grid voltage bootstrapping XOR/ The NOR circuit includes a grid voltage bootstrap NOR generation circuit and an inverter, wherein the grid voltage bootstrap NOR generation circuit is composed of a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, and a third NMOS transistor. The transistor and the fourth NMOS transistor are composed of a special connection method; the advantage is that the XOR/NOR circuit is connected into a gate voltage bootstrap circuit structure, and the gate bootstrap effect improves the performance of the third NMOS transistor or the fourth NMOS transistor. Gate voltage, so that the high level passes through the first NMOS tube or the second NMOS tube smoothly, and the circuit output reaches the full swing, which improves the ability to drive the next stage and increases the operating speed of the overall circuit; the full swing is reduced The leakage power consumption of the circuit is reduced, the performance of the circuit is improved, and finally the delay, power consumption and power consumption-delay product of the whole circuit are effectively reduced.
Description
技术领域 technical field
本发明涉及一种异或电路,尤其是一种栅压自举异或/同或电路及栅压自举一位全加器。 The invention relates to an exclusive OR circuit, in particular to a gate voltage bootstrap exclusive OR/simultaneous OR circuit and a gate voltage bootstrap one-bit full adder.
背景技术 Background technique
异或门属于应用较为广泛的门电路之一,往往需要对其进行低功耗的设计。 The XOR gate is one of the most widely used gate circuits, and it is often required to design it with low power consumption.
全加器作为电子系统的基本运算单元,在很多VLSI系统中具有非常广泛的应用,如在高性能微处理器和DSP处理器中,一位全加器的运算能力至关重要。一位全加器运算常常处于高性能处理器系统部件的关键路径中,尤其是在算术逻辑单元中一位全加器的运算性能对处理器的性能起着非常关键的作用。随着微处理器的运算速度越来越快,对快速一位全加器的需求也越来越高。其速度和功耗以及面积等的性能将直接影响到整个集成电路的整体性能。 As the basic computing unit of electronic systems, the full adder is widely used in many VLSI systems. For example, in high-performance microprocessors and DSP processors, the computing power of a full adder is very important. The operation of a full adder is often in the critical path of high-performance processor system components, especially in the arithmetic logic unit, the operation performance of a full adder plays a very critical role in the performance of the processor. As microprocessors become faster and faster, the demand for fast one-bit full adders is also increasing. Its speed, power consumption, and area performance will directly affect the overall performance of the entire integrated circuit.
延时、功耗和功耗-延时积是体现一位全加器性能的主要三个因素,优化这三个因素可以优化全加器的性能从而提高整体系统的性能,其中,功耗-延时积为功耗和延时的乘积,单位为焦耳,因此功耗-延时积是能量的衡量,可以作为一个开关器件性能的度量。许多学者提出多种使用不同逻辑的一位全加器 (见文献A.M. Shams, T.K. Darwish and M.A. Bayoumi, “Performance analysis of low-power 1-bit CMOS full adder cells,” IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol. 10, 2002, pp 20-29.),这些一位全加器虽都有一定效果却也存在明显缺点,第一,存在阈值电压损耗,非全摆幅输出;第二,功耗或者功耗-延时积较大。 Delay, power consumption, and power consumption-delay product are the main three factors that reflect the performance of a full adder. Optimizing these three factors can optimize the performance of the full adder and improve the performance of the overall system. Among them, power consumption- The delay product is the product of power consumption and delay, and the unit is joules. Therefore, the power consumption-delay product is a measure of energy and can be used as a measure of the performance of a switching device. Many scholars have proposed a variety of one-bit full adders using different logics (see A.M. Shams, T.K. Darwish and M.A. Bayoumi, "Performance analysis of low-power 1-bit CMOS full adder cells," IEEE Trans. Very Large Scale Integr. (VLSI) Syst., vol. 10, 2002, pp 20-29.), although these one-bit full adders have certain effects, they also have obvious shortcomings. First, there is threshold voltage loss and non-full swing output; Second, the power consumption or the power consumption-delay product is relatively large.
发明内容 Contents of the invention
本发明所要解决的技术问题是提供一种电路延时、功耗和功耗-延时积均较小的栅压自举异或/同或电路及栅压自举一位全加器。 The technical problem to be solved by the present invention is to provide a grid voltage bootstrap XOR/XOR circuit and a grid voltage bootstrap one-bit full adder with smaller circuit delay, power consumption and power consumption-delay product.
本发明解决上述技术问题所采用的技术方案为:一种栅压自举异或/同或电路,包括栅压自举同或产生电路和反相器,所述的栅压自举同或产生电路包括第一PMOS管、第二PMOS管、第一NMOS管、第二NMOS管、第三NMOS管和第四NMOS管,所述的第一PMOS管的源极与外部电源的正极相连,所述的第一PMOS管的漏极与所述的第二PMOS管的源极相连,所述的第一PMOS管的栅极分别与所述的第一NMOS管的源极及所述的第三NMOS管的源极相连,所述的第二PMOS管的衬底与外部电源的正极相连,所述的第二PMOS管的栅极分别与所述的第二NMOS管的源极及所述的第四NMOS管的源极相连,所述的第二PMOS管的漏极分别与所述的第一NMOS管的漏极、所述的第二NMOS管的漏极及所述的反相器的输入端相连,所述的第二PMOS管的漏极作为栅压自举异或/同或电路的同或输出端,所述的反相器的输出端作为栅压自举异或/同或电路的异或输出端,所述的第一NMOS管的栅极与所述的第四NMOS管的漏极相连,所述的第一NMOS管的衬底接地,所述的第三NMOS管的栅极与外部电源的正极相连,所述的第三NMOS管的漏极与所述的第二NMOS管的栅极相连,所述的第二NMOS管的衬底接地,所述的第四NMOS管的栅极与外部电源的正极相连。 The technical solution adopted by the present invention to solve the above-mentioned technical problems is: a grid voltage bootstrap NOR/NOR circuit, including a grid voltage bootstrap NOR generation circuit and an inverter, and the grid voltage bootstrap NOR generation circuit The circuit includes a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor and a fourth NMOS transistor, the source of the first PMOS transistor is connected to the positive pole of an external power supply, and the The drain of the first PMOS transistor is connected to the source of the second PMOS transistor, and the gate of the first PMOS transistor is respectively connected to the source of the first NMOS transistor and the third The source of the NMOS transistor is connected, the substrate of the second PMOS transistor is connected to the positive pole of the external power supply, the gate of the second PMOS transistor is connected to the source of the second NMOS transistor and the The source of the fourth NMOS transistor is connected, and the drain of the second PMOS transistor is respectively connected to the drain of the first NMOS transistor, the drain of the second NMOS transistor and the inverter. The input terminals are connected, the drain of the second PMOS transistor is used as the NOR output terminal of the gate voltage bootstrap XOR/NOR circuit, and the output terminal of the inverter is used as the grid voltage bootstrap XOR/Same OR The XOR output end of the circuit, the gate of the first NMOS transistor is connected to the drain of the fourth NMOS transistor, the substrate of the first NMOS transistor is grounded, and the gate of the third NMOS transistor is connected to the ground. The gate is connected to the anode of the external power supply, the drain of the third NMOS transistor is connected to the gate of the second NMOS transistor, the substrate of the second NMOS transistor is grounded, and the fourth NMOS transistor is grounded. The grid of the tube is connected to the positive pole of the external power supply.
所述的反相器包括第三PMOS管和第五NMOS管,所述的第三PMOS管的栅极分别与所述的第二PMOS管的漏极及所述的第五NMOS管的栅极相连,所述的第三PMOS管的源极与外部电源的正极相连,所述的第三PMOS管的漏极与所述的第五NMOS管的漏极相连,所述的第三PMOS管的漏极作为栅压自举异或/同或电路的异或输出端,所述的第五NMOS管的源极接地。 The inverter includes a third PMOS transistor and a fifth NMOS transistor, the gate of the third PMOS transistor is connected to the drain of the second PMOS transistor and the gate of the fifth NMOS transistor respectively connected, the source of the third PMOS transistor is connected to the positive pole of the external power supply, the drain of the third PMOS transistor is connected to the drain of the fifth NMOS transistor, and the drain of the third PMOS transistor The drain serves as the exclusive OR output terminal of the gate voltage bootstrap exclusive OR/simultaneous OR circuit, and the source of the fifth NMOS transistor is grounded.
使用上述栅压自举异或/同或电路组成的栅压自举一位全加器,包括栅压自举异或/同或电路、求和信号产生电路和进位信号产生电路,所述的求和信号产生电路包括第四PMOS管、第五PMOS管、第六NMOS管和第七NMOS管,所述的进位信号产生电路包括第六PMOS管、第七PMOS管、第八NMOS管和第九NMOS管,所述的第四PMOS管的栅极分别与所述的第三PMOS管的漏极、所述的第五PMOS管的源极、所述的第八NMOS管的栅极及所述的第七PMOS管的栅极相连,所述的第四PMOS管的源极分别与所述的第六NMOS管的源极、所述的第七NMOS管的栅极、所述的第五PMOS管的栅极、所述的第六PMOS管的源极及所述的第八NMOS管的源极相连,所述的第四PMOS管的源极作为栅压自举一位全加器的进位输入端,所述的第六NMOS管的衬底接地,所述的第四PMOS管的漏极分别与所述的第六NMOS管的漏极、所述的第七NMOS管的漏极及所述的第五PMOS管的漏极相连,所述的第四PMOS管的漏极作为栅压自举一位全加器的求和输出端,所述的第四PMOS管的衬底与外部电源的正极相连,所述的第五PMOS管的衬底与外部电源的正极相连,所述的第六NMOS管的栅极分别与所述的第七NMOS管的源极、所述的第二PMOS管的漏极、所述的第六PMOS管的栅极及所述的第九NMOS管的栅极相连,所述的第七NMOS管的衬底接地,所述的第七PMOS管的源极分别与所述的第九NMOS管的源极及所述的第三NMOS管的源极相连,所述的第六PMOS管的漏极分别与所述的第八NMOS管的漏极、所述的第七PMOS管的漏极及所述的第九NMOS管的漏极相连,所述的第六PMOS管的漏极作为栅压自举一位全加器的进位输出端,所述的第六PMOS管的衬底及所述的第七PMOS管的衬底均与外部电源的正极相连,所述的第八NMOS管的衬底与所述的第九NMOS管的衬底均接地。上述栅压自举一位全加器的内部节点都达到全摆幅,提高了驱动下一级的能力,易于在低电压工作条件下使用,且不会引起逻辑混乱。 The grid voltage bootstrap one-bit full adder composed of the above-mentioned grid voltage bootstrap XOR/NOR circuit includes a grid voltage bootstrap XOR/XOR circuit, a sum signal generation circuit and a carry signal generation circuit, the described The sum signal generating circuit includes a fourth PMOS transistor, a fifth PMOS transistor, a sixth NMOS transistor, and a seventh NMOS transistor, and the carry signal generating circuit includes a sixth PMOS transistor, a seventh PMOS transistor, an eighth NMOS transistor, and a seventh NMOS transistor. Nine NMOS transistors, the gate of the fourth PMOS transistor is connected to the drain of the third PMOS transistor, the source of the fifth PMOS transistor, the gate of the eighth NMOS transistor and the gate of the eighth NMOS transistor. The gate of the seventh PMOS transistor is connected, and the source of the fourth PMOS transistor is respectively connected to the source of the sixth NMOS transistor, the gate of the seventh NMOS transistor, and the fifth The gate of the PMOS transistor, the source of the sixth PMOS transistor and the source of the eighth NMOS transistor are connected, and the source of the fourth PMOS transistor is used as a gate voltage bootstrap one-bit full adder Carry input terminal, the substrate of the sixth NMOS transistor is grounded, the drain of the fourth PMOS transistor is connected to the drain of the sixth NMOS transistor, the drain of the seventh NMOS transistor and the drain of the seventh NMOS transistor respectively. The drain of the fifth PMOS transistor is connected, the drain of the fourth PMOS transistor is used as the summation output of the grid voltage bootstrap one-bit full adder, and the substrate of the fourth PMOS transistor is connected to the external The positive pole of the power supply is connected, the substrate of the fifth PMOS transistor is connected to the positive pole of the external power supply, the gate of the sixth NMOS transistor is connected to the source of the seventh NMOS transistor, the second The drain of the PMOS transistor, the gate of the sixth PMOS transistor and the gate of the ninth NMOS transistor are connected, the substrate of the seventh NMOS transistor is grounded, and the source of the seventh PMOS transistor The poles are respectively connected to the source of the ninth NMOS transistor and the source of the third NMOS transistor, and the drain of the sixth PMOS transistor is respectively connected to the drain of the eighth NMOS transistor and the drain of the eighth NMOS transistor. The drain of the seventh PMOS transistor and the drain of the ninth NMOS transistor are connected, the drain of the sixth PMOS transistor is used as the carry output terminal of the grid voltage bootstrap one-bit full adder, and the Both the substrate of the sixth PMOS transistor and the substrate of the seventh PMOS transistor are connected to the anode of the external power supply, and the substrates of the eighth NMOS transistor and the ninth NMOS transistor are grounded. The internal nodes of the above-mentioned gate voltage bootstrap one-bit full adder reach full swing, which improves the ability to drive the next stage, and is easy to use under low-voltage working conditions without causing logic confusion.
所述的第一PMOS管的沟道长度、所述的第二PMOS管的沟道长度、所述的第三PMOS管的沟道长度、所述的第四PMOS管的沟道长度、所述的第五PMOS管的沟道长度、所述的第六PMOS管的沟道长度、所述的第七PMOS管的沟道长度、所述的第一NMOS管的沟道长度、所述的第二NMOS管的沟道长度、所述的第三NMOS管的沟道长度、所述的第四NMOS管的沟道长度、所述的第五NMOS管的沟道长度、所述的第六NMOS管的沟道长度、所述的第七NMOS管的沟道长度、所述的第八NMOS管的沟道长度和所述的第九NMOS管的沟道长度均为标准工艺下最小沟道长度的1~1.2倍。 The channel length of the first PMOS transistor, the channel length of the second PMOS transistor, the channel length of the third PMOS transistor, the channel length of the fourth PMOS transistor, the The channel length of the fifth PMOS transistor, the channel length of the sixth PMOS transistor, the channel length of the seventh PMOS transistor, the channel length of the first NMOS transistor, and the channel length of the first NMOS transistor The channel length of the second NMOS transistor, the channel length of the third NMOS transistor, the channel length of the fourth NMOS transistor, the channel length of the fifth NMOS transistor, and the sixth NMOS transistor The channel length of the tube, the channel length of the seventh NMOS tube, the channel length of the eighth NMOS tube and the channel length of the ninth NMOS tube are the minimum channel lengths under the standard process 1~1.2 times of that.
与现有技术相比,本发明的优点在于将异或/同或电路连接成栅压自举电路结构,通过栅极自举效应,提高了第三NMOS管或第四NMOS管的栅极电压,进而使高电平顺利通过第一NMOS管或第二NMOS管,电路输出达到全摆幅,提高了驱动下一级的能力,增大了整体电路的运行速度;全摆幅降低了电路的漏功耗,提高了电路的性能,最终有效地降低了整体电路的延时、功耗及功耗-延时积。 Compared with the prior art, the present invention has the advantage that the XOR/XOR circuit is connected into a gate voltage bootstrap circuit structure, and the gate voltage of the third NMOS transistor or the fourth NMOS transistor is increased through the grid bootstrap effect , so that the high level passes through the first NMOS tube or the second NMOS tube smoothly, and the circuit output reaches the full swing, which improves the ability to drive the next stage and increases the operating speed of the overall circuit; the full swing reduces the circuit's Leakage power consumption improves the performance of the circuit, and finally effectively reduces the delay, power consumption and power consumption-delay product of the overall circuit. the
附图说明 Description of drawings
图1为基于CMOS互补逻辑结构的异或/同或(CCMOS-XX)电路的结构图; Figure 1 is a structural diagram of an exclusive-or/same-or (CCMOS-XX) circuit based on a CMOS complementary logic structure;
图2为基于传输门逻辑结构的异或/同或(TG-XX)电路的结构图; Figure 2 is a structural diagram of an exclusive-or/simultaneous-or (TG-XX) circuit based on a transmission gate logic structure;
图3为基于传输管逻辑结构的异或/同或(CPL-XX)电路的结构图; Figure 3 is a structural diagram of an exclusive-or/same-or (CPL-XX) circuit based on the logical structure of the transmission tube;
图4为求和信号产生电路单元结构图; Fig. 4 is a summation signal generating circuit unit structural diagram;
图5为进位信号产生电路单元结构图; Fig. 5 is a structural diagram of a carry signal generation circuit unit;
图6为基于CMOS互补逻辑结构的异或/同或电路单元的一位全加器(CCMOS-XX-ADDER)的电路结构图; Figure 6 is a circuit structure diagram of a one-bit full adder (CCMOS-XX-ADDER) based on an XOR/XOR circuit unit of a CMOS complementary logic structure;
图7为基于传输门逻辑异或/同或电路单元的一位全加器(TG-XX-ADDER)的电路结构图; Figure 7 is a circuit structure diagram of a one-bit full adder (TG-XX-ADDER) based on transmission gate logic XOR/XOR circuit unit;
图8为基于传输管逻辑异或/同或电路单元的一位全加器(CPL-XX-ADDER)的电路结构图; Figure 8 is a circuit structure diagram of a one-bit full adder (CPL-XX-ADDER) based on the logical XOR/XOR circuit unit of the transmission tube;
图9为本发明的栅压自举异或/同或电路的结构图; Fig. 9 is a structural diagram of the grid voltage bootstrapping XOR/XOR circuit of the present invention;
图10为本发明的栅压自举一位全加器的电路结构图; Fig. 10 is the circuit structure diagram of the grid voltage bootstrapping one full adder of the present invention;
图11为本发明的栅压自举一位全加器的基于SMIC130nm标准工艺仿真波形图; Fig. 11 is the simulation waveform diagram based on the SMIC130nm standard process of the grid voltage bootstrapping one-bit full adder of the present invention;
图12为本发明的栅压自举一位全加器的基于PTM90nm标准工艺仿真波形图; Fig. 12 is the simulation waveform diagram based on the PTM90nm standard process of the grid voltage bootstrapping one-bit full adder of the present invention;
图13为本发明的栅压自举一位全加器的基于PTM45nm标准工艺仿真波形图。 FIG. 13 is a simulation waveform diagram of the gate voltage bootstrap 1-bit full adder based on the PTM45nm standard process of the present invention.
具体实施方式 Detailed ways
以下结合附图实施例对本发明作进一步详细描述。 The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
实施例一:如图9所示,一种栅压自举异或/同或电路,包括栅压自举同或产生电路和反相器,栅压自举同或产生电路包括第一PMOS管、第二PMOS管、第一NMOS管、第二NMOS管、第三NMOS管和第四NMOS管,反相器包括第三PMOS管和第五NMOS管,第一PMOS管的源极与外部电源的正极相连,第一PMOS管的漏极与第二PMOS管的源极相连,第一PMOS管的栅极分别与第一NMOS管的源极及第三NMOS管的源极相连,第二PMOS管的衬底与外部电源的正极相连,第二PMOS管的栅极分别与第二NMOS管的源极及第四NMOS管的源极相连,第二PMOS管的漏极分别与第一NMOS管的漏极、第二NMOS管的漏极、第三PMOS管的栅极及第五NMOS管的栅极相连,第二PMOS管的漏极作为栅压自举异或/同或电路的同或输出端,第三PMOS管的源极与外部电源的正极相连,第三PMOS管的漏极与第五NMOS管的漏极相连,第三PMOS管的漏极作为栅压自举异或/同或电路的异或输出端,第五NMOS管的源极接地,第一NMOS管的栅极与第四NMOS管的漏极相连,第一NMOS管的衬底接地,第三NMOS管的栅极与外部电源的正极相连,第三NMOS管的漏极与第二NMOS管的栅极相连,第二NMOS管的衬底接地,第四NMOS管的栅极与外部电源的正极相连。 Embodiment 1: As shown in FIG. 9, a grid voltage bootstrap NOR/NOR circuit includes a grid voltage bootstrap NOR generation circuit and an inverter, and the grid voltage bootstrap NOR generation circuit includes a first PMOS transistor , the second PMOS tube, the first NMOS tube, the second NMOS tube, the third NMOS tube and the fourth NMOS tube, the inverter includes the third PMOS tube and the fifth NMOS tube, the source of the first PMOS tube is connected to the external power supply The drain of the first PMOS transistor is connected to the source of the second PMOS transistor, the gate of the first PMOS transistor is respectively connected to the source of the first NMOS transistor and the source of the third NMOS transistor, and the second PMOS transistor is connected to the source of the third NMOS transistor. The substrate of the transistor is connected to the positive pole of the external power supply, the gate of the second PMOS transistor is respectively connected to the source of the second NMOS transistor and the source of the fourth NMOS transistor, and the drain of the second PMOS transistor is connected to the source of the first NMOS transistor respectively. The drain of the second NMOS transistor, the drain of the second NMOS transistor, the gate of the third PMOS transistor and the gate of the fifth NMOS transistor are connected, and the drain of the second PMOS transistor is used as the NOR of the gate voltage bootstrapped XOR/NOR circuit At the output terminal, the source of the third PMOS transistor is connected to the positive pole of the external power supply, the drain of the third PMOS transistor is connected to the drain of the fifth NMOS transistor, and the drain of the third PMOS transistor is used as a gate voltage bootstrap XOR/Same The exclusive OR output terminal of the OR circuit, the source of the fifth NMOS transistor is grounded, the gate of the first NMOS transistor is connected to the drain of the fourth NMOS transistor, the substrate of the first NMOS transistor is grounded, and the gate of the third NMOS transistor The drain of the third NMOS transistor is connected to the gate of the second NMOS transistor, the substrate of the second NMOS transistor is grounded, and the gate of the fourth NMOS transistor is connected to the positive electrode of the external power supply.
第一PMOS管的沟道长度、第二PMOS管的沟道长度、第三PMOS管的沟道长度、第四PMOS管的沟道长度、第五PMOS管的沟道长度、第六PMOS管的沟道长度、第七PMOS管的沟道长度、第一NMOS管的沟道长度、第二NMOS管的沟道长度、第三NMOS管的沟道长度、第四NMOS管的沟道长度、第五NMOS管的沟道长度、第六NMOS管的沟道长度、第七NMOS管的沟道长度、第八NMOS管的沟道长度和第九NMOS管在SMIC130nm标准工艺下的沟道长度均为130nm。 The channel length of the first PMOS transistor, the channel length of the second PMOS transistor, the channel length of the third PMOS transistor, the channel length of the fourth PMOS transistor, the channel length of the fifth PMOS transistor, and the channel length of the sixth PMOS transistor channel length, the channel length of the seventh PMOS transistor, the channel length of the first NMOS transistor, the channel length of the second NMOS transistor, the channel length of the third NMOS transistor, the channel length of the fourth NMOS transistor, the channel length of the The channel length of the fifth NMOS transistor, the channel length of the sixth NMOS transistor, the channel length of the seventh NMOS transistor, the channel length of the eighth NMOS transistor, and the channel length of the ninth NMOS transistor under the SMIC130nm standard process are all 130nm.
实施例二:其余部分与实施例一相同,其不同之处在于第一PMOS管的沟道长度、第二PMOS管的沟道长度、第三PMOS管的沟道长度、第四PMOS管的沟道长度、第五PMOS管的沟道长度、第六PMOS管的沟道长度、第七PMOS管的沟道长度、第一NMOS管的沟道长度、第二NMOS管的沟道长度、第三NMOS管的沟道长度、第四NMOS管的沟道长度、第五NMOS管的沟道长度、第六NMOS管的沟道长度、第七NMOS管的沟道长度、第八NMOS管的沟道长度和第九NMOS管在PTM90nm标准工艺下的沟道长度均为90nm。 Embodiment 2: the remaining parts are the same as Embodiment 1, except that the channel length of the first PMOS transistor, the channel length of the second PMOS transistor, the channel length of the third PMOS transistor, and the channel length of the fourth PMOS transistor are different. channel length, the channel length of the fifth PMOS transistor, the channel length of the sixth PMOS transistor, the channel length of the seventh PMOS transistor, the channel length of the first NMOS transistor, the channel length of the second NMOS transistor, the third The channel length of the NMOS transistor, the channel length of the fourth NMOS transistor, the channel length of the fifth NMOS transistor, the channel length of the sixth NMOS transistor, the channel length of the seventh NMOS transistor, and the channel length of the eighth NMOS transistor The length and the channel length of the ninth NMOS transistor under the PTM90nm standard process are both 90nm.
实施例三:其余部分与实施例一相同,其不同之处在于第一PMOS管的沟道长度、第二PMOS管的沟道长度、第三PMOS管的沟道长度、第四PMOS管的沟道长度、第五PMOS管的沟道长度、第六PMOS管的沟道长度、第七PMOS管的沟道长度、第一NMOS管的沟道长度、第二NMOS管的沟道长度、第三NMOS管的沟道长度、第四NMOS管的沟道长度、第五NMOS管的沟道长度、第六NMOS管的沟道长度、第七NMOS管的沟道长度、第八NMOS管的沟道长度和第九NMOS管在PTM45nm标准工艺下的沟道长度均为50nm。 Embodiment three: the remaining parts are the same as in embodiment one, except that the channel length of the first PMOS transistor, the channel length of the second PMOS transistor, the channel length of the third PMOS transistor, and the channel length of the fourth PMOS transistor are different. channel length, the channel length of the fifth PMOS transistor, the channel length of the sixth PMOS transistor, the channel length of the seventh PMOS transistor, the channel length of the first NMOS transistor, the channel length of the second NMOS transistor, the third The channel length of the NMOS transistor, the channel length of the fourth NMOS transistor, the channel length of the fifth NMOS transistor, the channel length of the sixth NMOS transistor, the channel length of the seventh NMOS transistor, and the channel length of the eighth NMOS transistor Both the channel length of the ninth NMOS transistor and the channel length of the PTM45nm standard process are 50nm.
为了比较本发明所提出的栅压自举异或/同或电路分别在SMIC130nm、PTM90nm及PTM45nm这三种标准工艺下相对于基于CMOS互补逻辑结构的异或/同或(CCMOS-XX)电路、基于传输门逻辑结构的异或/同或(TG-XX)电路和基于传输管逻辑结构的异或/同或(CPL-XX)电路这三种传统的异或/同或电路的性能特点,使用电路仿真工具HSPICE在电路的输入频率为100Mhz的条件下对四种电路结构进行了仿真比较分析,对应的电源电压分别为1.2V、1V、1V 。 In order to compare the gate voltage bootstrapping XOR/XOR circuit proposed by the present invention under the three standard technologies of SMIC130nm, PTM90nm and PTM45nm with respect to the XOR/Same-OR (CCMOS-XX) circuit based on CMOS complementary logic structure, The performance characteristics of the three traditional exclusive-or/same-or (TG-XX) circuits based on the transmission gate logic structure and the exclusive-or/same-or (CPL-XX) circuit based on the transmission pipe logic structure, Using the circuit simulation tool HSPICE to simulate and compare the four circuit structures under the condition that the input frequency of the circuit is 100Mhz, the corresponding power supply voltages are 1.2V, 1V, and 1V respectively.
表1 在SMIC130nm标准工艺下本发明的栅压自举异或/同或电路与三种传统的异或/同或电路的性能比较 Table 1 Performance comparison between the gate voltage bootstrap XOR/SOR circuit of the present invention and three traditional XOR/SOR circuits under the SMIC130nm standard process
从表1中可以得出:本发明的栅压自举异或/同或电路与三种传统的异或/同或电路在SMIC130nm标准工艺下相比,延时分别降低了25.4%、8.4%及44.8%,平均总功耗分别降低了42.2%、9.1%及14%,功耗-延时积分别降低了56.9%、16.7%及52.6%。 It can be drawn from Table 1 that the gate voltage bootstrapping XOR/NOR circuit of the present invention is compared with three traditional XOR/NOR circuits under the SMIC130nm standard process, and the delay is reduced by 25.4% and 8.4% respectively and 44.8%, the average total power consumption was reduced by 42.2%, 9.1% and 14% respectively, and the power consumption-delay product was reduced by 56.9%, 16.7% and 52.6% respectively.
表2在 PTM90nm标准工艺下本发明的栅压自举异或/同或电路与三种传统的异或/同或电路的性能比较 Table 2 Performance Comparison of Gate Voltage Bootstrap XOR/Same-OR Circuit and Three Traditional XOR/Same-OR Circuits under PTM90nm Standard Technology
从表2中可以得出:本发明的栅压自举异或/同或电路与三种传统的异或/同或电路在PTM90nm标准工艺下相比,延时分别降低了19%、7.8%及56.1%,平均总功耗分别降低了38.4%、12.2%及13.4%,功耗-延时积分别降低了50.1%、19%及62%。 It can be drawn from Table 2 that the gate voltage bootstrap XOR/NOR circuit of the present invention is compared with three traditional XOR/NOR circuits under the PTM90nm standard process, and the delay is reduced by 19% and 7.8% respectively and 56.1%, the average total power consumption was reduced by 38.4%, 12.2% and 13.4% respectively, and the power consumption-delay product was reduced by 50.1%, 19% and 62% respectively. the
表3在 PTM45nm标准工艺下本发明的栅压自举异或/同或电路与三种传统的异或/同或电路的性能比较 Table 3 Performance Comparison of Gate Voltage Bootstrap XOR/Same-OR Circuit and Three Traditional XOR/Same-OR Circuits under PTM45nm Standard Technology
从表3中可以得出:从表2中可以得出:本发明的栅压自举异或/同或电路与三种传统的异或/同或电路在PTM45nm标准工艺下相比,延时分别降低了30.9%、17.1%及64%,平均总功耗分别降低了33.5%、8.6%及9.7%,功耗-延时积分别降低了54%、24.3%及67.5%。 From Table 3, it can be drawn that: from Table 2, it can be drawn that the gate voltage bootstrap XOR/NOR circuit of the present invention is compared with three traditional XOR/NOR circuits under the PTM45nm standard process, and the time delay Respectively reduced by 30.9%, 17.1% and 64%, the average total power consumption was reduced by 33.5%, 8.6% and 9.7% respectively, and the power consumption-delay product was reduced by 54%, 24.3% and 67.5% respectively.
由上述的比较数据可见,在不影响电路性能的前提下,本发明所提出的栅压自举异或/同或电路较以上所述的三种传统的异或/同或电路具有延时小、平均总功耗低及功耗-延时积较小的优点。 It can be seen from the above comparative data that, without affecting the circuit performance, the gate voltage bootstrap XOR/NOR circuit proposed by the present invention has a smaller delay than the above three traditional XOR/NOR circuits. , low average total power consumption and small power consumption-delay product.
实施例四:如图10所示,使用实施例一的栅压自举异或/同或电路组成的栅压自举一位全加器,包括栅压自举异或/同或电路、求和信号产生电路和进位信号产生电路,求和信号产生电路包括第四PMOS管、第五PMOS管、第六NMOS管和第七NMOS管,进位信号产生电路包括第六PMOS管、第七PMOS管、第八NMOS管和第九NMOS管,第四PMOS管的栅极分别与第三PMOS管的漏极、第五PMOS管的源极、第八NMOS管的栅极及第七PMOS管的栅极相连,第四PMOS管的源极分别与第六NMOS管的源极、第七NMOS管的栅极、第五PMOS管的栅极、第六PMOS管的源极及第八NMOS管的源极相连,第四PMOS管的源极作为栅压自举一位全加器的进位输入端,第六NMOS管的衬底接地,第四PMOS管的漏极分别与第六NMOS管的漏极、第七NMOS管的漏极及第五PMOS管的漏极相连,第四PMOS管的漏极作为栅压自举一位全加器的求和输出端,第四PMOS管的衬底与外部电源的正极相连,第五PMOS管的衬底与外部电源的正极相连,第六NMOS管的栅极分别与第七NMOS管的源极、第二PMOS管的漏极、第六PMOS管的栅极及第九NMOS管的栅极相连,第七NMOS管的衬底接地,第七PMOS管的源极分别与第九NMOS管的源极及第三NMOS管的源极相连,第六PMOS管的漏极分别与第八NMOS管的漏极、第七PMOS管的漏极及第九NMOS管的漏极相连,第六PMOS管的漏极作为栅压自举一位全加器的进位输出端,第六PMOS管的衬底及第七PMOS管的衬底均与外部电源的正极相连,第八NMOS管的衬底与第九NMOS管的衬底均接地。 Embodiment 4: As shown in FIG. 10 , the grid voltage bootstrapping one-bit full adder composed of the grid voltage bootstrapping XOR/NOR circuit of Embodiment 1 is used, including the grid voltage bootstrapping XOR/XOR circuit, A sum signal generating circuit and a carry signal generating circuit, the sum signal generating circuit includes a fourth PMOS transistor, a fifth PMOS transistor, a sixth NMOS transistor, and a seventh NMOS transistor, and the carry signal generating circuit includes a sixth PMOS transistor and a seventh PMOS transistor , the eighth NMOS transistor and the ninth NMOS transistor, the gate of the fourth PMOS transistor is respectively connected to the drain of the third PMOS transistor, the source of the fifth PMOS transistor, the gate of the eighth NMOS transistor and the gate of the seventh PMOS transistor The source of the fourth PMOS transistor is connected to the source of the sixth NMOS transistor, the gate of the seventh NMOS transistor, the gate of the fifth PMOS transistor, the source of the sixth PMOS transistor, and the source of the eighth NMOS transistor. The source of the fourth PMOS transistor is used as the carry input terminal of the gate voltage bootstrap one-bit full adder, the substrate of the sixth NMOS transistor is grounded, and the drain of the fourth PMOS transistor is respectively connected to the drain of the sixth NMOS transistor. , the drain of the seventh NMOS transistor is connected to the drain of the fifth PMOS transistor, the drain of the fourth PMOS transistor is used as the summation output end of a full adder for gate voltage bootstrapping, the substrate of the fourth PMOS transistor is connected to the external The positive pole of the power supply is connected, the substrate of the fifth PMOS transistor is connected to the positive pole of the external power supply, the gate of the sixth NMOS transistor is connected to the source electrode of the seventh NMOS transistor, the drain electrode of the second PMOS transistor, and the gate of the sixth PMOS transistor respectively. pole and the gate of the ninth NMOS transistor are connected, the substrate of the seventh NMOS transistor is grounded, the source of the seventh PMOS transistor is respectively connected to the source of the ninth NMOS transistor and the source of the third NMOS transistor, and the sixth PMOS transistor The drains of the eighth NMOS transistor, the drains of the seventh PMOS transistor and the drains of the ninth NMOS transistor are respectively connected, and the drain of the sixth PMOS transistor is used as the carry output of the gate voltage bootstrap one-bit full adder Both the substrates of the sixth PMOS transistor and the seventh PMOS transistor are connected to the anode of the external power supply, and the substrates of the eighth NMOS transistor and the ninth NMOS transistor are both grounded.
实施例四的栅压自举一位全加器中的栅压自举异或/同或电路还可采用实施例二或实施例三的电路结构。 The gate voltage bootstrap XOR/XOR circuit in the gate voltage bootstrap of the fourth embodiment can also adopt the circuit structure of the second or third embodiment.
为了比较本发明所提出的栅压自举一位全加器分别在SMIC130nm、PTM90nm及PTM45nm这三种标准工艺下相对于基于CMOS互补逻辑结构的异或/同或电路单元的一位全加器(CCMOS-XX-ADDER)、基于传输门逻辑异或/同或电路单元的一位全加器(TG-XX-ADDER)和基于传输管逻辑异或/同或电路单元的一位全加器(CPL-XX-ADDER)这三种传统的一位全加器的性能特点,使用电路仿真工具HSPICE在电路的输入频率为100Mhz的条件下对四种全加器的电路结构进行了仿真比较分析,对应的电源电压分别为1.2V、1V、1V。 In order to compare the grid voltage bootstrapping one full adder that the present invention proposes under these three kinds of standard technology of SMIC130nm, PTM90nm and PTM45nm respectively with respect to the one full adder of the exclusive OR/same OR circuit unit based on CMOS complementary logic structure (CCMOS-XX-ADDER), one-bit full adder based on transmission gate logic XOR/XOR circuit unit (TG-XX-ADDER) and one-bit full adder based on transmission tube logic XOR/XOR circuit unit (CPL-XX-ADDER) The performance characteristics of these three traditional one-bit full adders, using the circuit simulation tool HSPICE to simulate and compare the circuit structures of the four full adders under the condition that the input frequency of the circuit is 100Mhz , and the corresponding power supply voltages are 1.2V, 1V, and 1V respectively.
表4在SMIC130nm标准工艺下本发明的栅压自举一位全加器与三种传统的一位全加器的性能比较 Table 4 under the SMIC130nm standard process, the performance comparison of the gate voltage bootstrap one-bit full adder of the present invention and three traditional one-bit full adders
从表4中可以得出:本发明的栅压自举一位全加器与三种传统的一位全加器在SMIC130nm工艺下的延时分别降低了19.4%、12%及38.2%,平均总功耗分别降低了15.5%、3.6%及4.6%,功耗-延时积分别降低了31.9%、15.2%及41%。 From Table 4, it can be drawn that the delay of the gate voltage bootstrap one-bit full adder of the present invention and three kinds of traditional one-bit full adders under the SMIC130nm process has been reduced by 19.4%, 12% and 38.2% respectively, with an average The total power consumption is reduced by 15.5%, 3.6% and 4.6%, respectively, and the power-delay product is reduced by 31.9%, 15.2% and 41%, respectively.
表5在PTM90nm标准工艺下本发明的栅压自举一位全加器与三种传统的一位全加器的性能比较 Table 5 under the PTM90nm standard process, the performance comparison of the gate voltage bootstrapping one-bit full adder of the present invention and three traditional one-bit full adders
从表5中可以得出:本发明的栅压自举一位全加器与三种传统的一位全加器在PTM90nm工艺下的延时分别降低了8.3%、0.7%及32.2%,平均总功耗分别降低了27.1%、13.4%及12.8%,功耗-延时积分别降低了33.2%、14%及40.9%。 From Table 5, it can be drawn that the time delay of the gate voltage bootstrap one-bit full adder of the present invention and three kinds of traditional one-bit full adders under the PTM90nm process has been reduced by 8.3%, 0.7% and 32.2% respectively, with an average The total power consumption is reduced by 27.1%, 13.4% and 12.8%, respectively, and the power-delay product is reduced by 33.2%, 14% and 40.9%, respectively.
表6在PTM45nm标准工艺下本发明的栅压自举一位全加器与三种传统的一位全加器电路的性能比较 Table 6 Under the PTM45nm standard process, the gate voltage bootstrapping one-bit full adder of the present invention is compared with the performance of three traditional one-bit full adder circuits
从表6中可以得出:本发明的栅压自举一位全加器与三种传统的一位全加器电路在PTM45nm工艺下的延时分别降低了10.4%、3.4%及35.6%,平均总功耗分别降低了26.8%、12.1%及9.1%,功耗-延时积分别降低了34.5%、15.1%及41.4%。 From Table 6, it can be drawn that the delay of the grid voltage bootstrapping one full adder of the present invention and three kinds of traditional one full adder circuits under the PTM45nm process has been reduced by 10.4%, 3.4% and 35.6% respectively, The average total power consumption is reduced by 26.8%, 12.1% and 9.1%, respectively, and the power-delay product is reduced by 34.5%, 15.1% and 41.4%, respectively.
由上述的比较数据可见,在不影响电路性能的前提下,本发明的栅压自举一位全加器较以上所述的三种传统的一位全加器具有延时小、平均总功耗低及功耗-延时积较小的优点。 As can be seen from the above comparison data, under the premise of not affecting the performance of the circuit, the gate voltage bootstrap one-bit full adder of the present invention has the advantages of small delay and average total power The advantages of low power consumption and small power-delay product.
表7 本发明的栅压自举一位全加器的单元状态转换表 Table 7 The cell state transition table of the grid voltage bootstrapping one-bit full adder of the present invention
由图11~图13的仿真波形图结合表7的结果可见,本发明的栅压自举一位全加器具有正确的逻辑功能。 It can be seen from the simulation waveform diagrams in FIGS. 11 to 13 combined with the results in Table 7 that the gate voltage bootstrap one-bit full adder of the present invention has correct logic functions.
Claims (4)
- A Bootstrap XOR/with or circuit, it is characterized in that comprising that Bootstrap is same or produce circuit and inverter, described Bootstrap with or produce circuit and comprise a PMOS pipe, the 2nd PMOS pipe, the one NMOS pipe, the 2nd NMOS pipe, the 3rd NMOS pipe and the 4th NMOS pipe, described a source electrode for PMOS pipe and the positive pole of external power source are connected, the drain electrode of a described PMOS pipe is connected with the source electrode of the 2nd described PMOS pipe, the grid of a described PMOS pipe is connected with the source electrode of the source electrode of a described NMOS pipe and described the 3rd NMOS pipe respectively, described the 2nd substrate of PMOS pipe and the positive pole of external power source are connected, the grid of the 2nd described PMOS pipe is connected with the source electrode of the source electrode of described the 2nd NMOS pipe and described the 4th NMOS pipe respectively, the drain electrode of the 2nd described PMOS pipe respectively with the drain electrode of a described NMOS pipe, the input of the drain electrode of the 2nd described NMOS pipe and described inverter is connected, the drain electrode of the 2nd described PMOS pipe as Bootstrap XOR/with or the same or output of circuit, the output of described inverter as Bootstrap XOR/with or the XOR output of circuit, the grid of a described NMOS pipe is connected with the drain electrode of the 4th described NMOS pipe, the substrate ground connection of a described NMOS pipe, described the 3rd grid of NMOS pipe and the positive pole of external power source are connected, the drain electrode of the 3rd described NMOS pipe is connected with the grid of the 2nd described NMOS pipe, the substrate ground connection of the 2nd described NMOS pipe, described the 4th grid of NMOS pipe and the positive pole of external power source are connected.
- A kind of Bootstrap XOR according to claim 1/with or circuit, it is characterized in that described inverter comprises the 3rd PMOS pipe and the 5th NMOS pipe, the grid of the 3rd described PMOS pipe is connected with the grid of the drain electrode of described the 2nd PMOS pipe and described the 5th NMOS pipe respectively, described the 3rd source electrode of PMOS pipe and the positive pole of external power source are connected, the drain electrode of the 3rd described PMOS pipe is connected with the drain electrode of the 5th described NMOS pipe, the drain electrode of the 3rd described PMOS pipe as Bootstrap XOR/with or the XOR output of circuit, the source ground of the 5th described NMOS pipe.
- Right to use require Bootstrap XOR described in 1/with or the Bootstrap one-bit full addres of the electric circuit constitute, it is characterized in that comprising Bootstrap XOR/same or circuit, summing signal produces circuit and carry signal produces circuit, described summing signal produces circuit and comprises the 4th PMOS pipe, the 5th PMOS pipe, the 6th NMOS pipe and the 7th NMOS pipe, described carry signal produces circuit and comprises the 6th PMOS pipe, the 7th PMOS pipe, the 8th NMOS pipe and the 9th NMOS pipe, the grid of the 4th described PMOS pipe respectively with the drain electrode of described the 3rd PMOS pipe, the source electrode of the 5th described PMOS pipe, the grid of the grid of the 8th described NMOS pipe and the 7th described PMOS pipe is connected, the source electrode of the 4th described PMOS pipe respectively with the source electrode of described the 6th NMOS pipe, the grid of the 7th described NMOS pipe, the grid of the 5th described PMOS pipe, the source electrode of the source electrode of the 6th described PMOS pipe and the 8th described NMOS pipe is connected, the source electrode of the 4th described PMOS pipe is as the carry input of Bootstrap one-bit full addres, the substrate ground connection of the 6th described NMOS pipe, the drain electrode of the 4th described PMOS pipe respectively with the drain electrode of described the 6th NMOS pipe, the drain electrode of the drain electrode of the 7th described NMOS pipe and the 5th described PMOS pipe is connected, the drain electrode of the 4th described PMOS pipe is as the summation output of Bootstrap one-bit full addres, described the 4th substrate of PMOS pipe and the positive pole of external power source are connected, described the 5th substrate of PMOS pipe and the positive pole of external power source are connected, the grid of the 6th described NMOS pipe respectively with the source electrode of described the 7th NMOS pipe, the drain electrode of the 2nd described PMOS pipe, the grid of the grid of the 6th described PMOS pipe and the 9th described NMOS pipe is connected, the substrate ground connection of the 7th described NMOS pipe, the source electrode of the 7th described PMOS pipe is connected with the source electrode of the source electrode of described the 9th NMOS pipe and described the 3rd NMOS pipe respectively, the drain electrode of the 6th described PMOS pipe respectively with the drain electrode of described the 8th NMOS pipe, the drain electrode of the drain electrode of the 7th described PMOS pipe and the 9th described NMOS pipe is connected, the drain electrode of the 6th described PMOS pipe is as the carry output of Bootstrap one-bit full addres, the substrate of the substrate of the 6th described PMOS pipe and the 7th described PMOS pipe is all connected with the positive pole of external power source, the equal ground connection of substrate of the substrate of the 8th described NMOS pipe and the 9th described NMOS pipe.
- 4. Bootstrap one-bit full addres according to claim 3, the channel length that it is characterized in that a described PMOS pipe, the channel length of the 2nd described PMOS pipe, the channel length of the 3rd described PMOS pipe, the channel length of the 4th described PMOS pipe, the channel length of the 5th described PMOS pipe, the channel length of the 6th described PMOS pipe, the channel length of the 7th described PMOS pipe, the channel length of a described NMOS pipe, the channel length of the 2nd described NMOS pipe, the channel length of the 3rd described NMOS pipe, the channel length of the 4th described NMOS pipe, the channel length of the 5th described NMOS pipe, the channel length of the 6th described NMOS pipe, the channel length of the 7th described NMOS pipe, the channel length of the channel length of the 8th described NMOS pipe and the 9th described NMOS pipe is 1 ~ 1.2 times of minimum channel length under standard technology.
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CN106385250A (en) * | 2016-09-21 | 2017-02-08 | 宁波大学 | FinFET (Fin Field-Effect Transistor) split gate structure complementary symmetric logic-based Inclusive OR-exclusive OR circuit |
CN106452428A (en) * | 2016-09-21 | 2017-02-22 | 宁波大学 | One-bit full adder based on FinFET (Fin Field-Effect Transistor) device M3 structure mixed logic |
CN110868201A (en) * | 2019-12-05 | 2020-03-06 | 深圳能芯半导体有限公司 | Low-power-consumption quick-response level conversion circuit |
CN110995238A (en) * | 2019-11-26 | 2020-04-10 | 宁波大学 | Full adder based on swing amplitude recovery transmission tube logic |
CN113098494A (en) * | 2021-03-31 | 2021-07-09 | 北京源启先进微电子有限公司 | Full adder |
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CN201000759Y (en) * | 2007-01-19 | 2008-01-02 | 深圳市远望谷信息技术股份有限公司 | High voltage switch circuit |
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EP1745548A2 (en) * | 2004-05-14 | 2007-01-24 | Université Catholique de Louvain | Low swing current mode logic family |
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CN106385250A (en) * | 2016-09-21 | 2017-02-08 | 宁波大学 | FinFET (Fin Field-Effect Transistor) split gate structure complementary symmetric logic-based Inclusive OR-exclusive OR circuit |
CN106452428A (en) * | 2016-09-21 | 2017-02-22 | 宁波大学 | One-bit full adder based on FinFET (Fin Field-Effect Transistor) device M3 structure mixed logic |
CN106452428B (en) * | 2016-09-21 | 2018-11-20 | 宁波大学 | A kind of one-bit full addres based on FinFET M3 structure mixed logic |
CN106385250B (en) * | 2016-09-21 | 2018-11-30 | 宁波大学 | A kind of same or XOR circuit based on FinFET grid dividing structure mutual symmetry logic |
CN110995238A (en) * | 2019-11-26 | 2020-04-10 | 宁波大学 | Full adder based on swing amplitude recovery transmission tube logic |
CN110995238B (en) * | 2019-11-26 | 2023-04-25 | 宁波大学 | A Full Adder Based on Swing Restoration Transfer Tube Logic |
CN110868201A (en) * | 2019-12-05 | 2020-03-06 | 深圳能芯半导体有限公司 | Low-power-consumption quick-response level conversion circuit |
CN113098494A (en) * | 2021-03-31 | 2021-07-09 | 北京源启先进微电子有限公司 | Full adder |
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