CN103955738A - Double-interface smart card packaging technology and double-interface smart card - Google Patents
Double-interface smart card packaging technology and double-interface smart card Download PDFInfo
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- CN103955738A CN103955738A CN201410191363.8A CN201410191363A CN103955738A CN 103955738 A CN103955738 A CN 103955738A CN 201410191363 A CN201410191363 A CN 201410191363A CN 103955738 A CN103955738 A CN 103955738A
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Abstract
The invention provides a double-interface smart card packaging technology. The double-interface smart card packaging technology includes the following steps that a soft substrate containing a flexible circuit board is manufactured; a non-contact induction antenna and a connecting circuit are machined on the soft substrate; a wafer is bound at the wafer binding position on the soft substrate; a contact disc is installed on the soft substrate, and a surface layer is manufactured; the surface layer and the soft substrate are bound. The invention further provides a double-interface smart card manufactured by adopting the double-interface smart card packaging technology. According to the double-interface smart card and the double-interface smart card packaging technology, an existing double-interface module is divided into the wafer and the contact disc, and wafer binding and contact disc welding are respectively performed on the soft substrate to produce the double-interface smart card. According to the mode of the double-interface smart card packaging technology, conventional processes of groove milling, stay wire picking and butt-joint packaging are omitted, the packaging technology is simplified, and the packaging efficiency is improved.
Description
[technical field]
The present invention relates to double-interface smart card field, the double-interface smart card that relates in particular to a kind of packaging technology of double-interface smart card and adopt this technique to make.
[background technology]
Double-interface card is the smart card that integrates contact and non-contact interface based on single-chip, is made up of PVC layer and chip, coil.Double-interface card has two operation interfaces, both can conduct interviews to chip by the contact of the way of contact, also can visit chip with RF-wise by separated by a distance.
At present, existing double-interface card packaging technology on the market, mainly to adopt enamel covered wire coiling antenna, place it in card base middle layer, again by groove milling with manually copper cash two ends are pulled out, by butt-joint, by copper cash two ends and two interface module welding conductings, non-ly connect and contact function (referring to the record in No. 201210303147.9th, Chinese invention patent application) thereby realize.
The packaging technology mode of this double-interface card, under production run more complicated and efficiency are relatively low.In addition,, because antenna adopts butt-joint mode, exist noncontact to respond to bad hidden danger.
[summary of the invention]
In view of this, be necessary to provide a kind of double-interface smart card packaging technology in fact, its technological process is simple, packaging efficiency is high.
A packaging technology for double-interface smart card, comprises the following steps: make the soft base plate that contains flexible PCB; On described soft base plate, process noncontact induction antenna and connecting circuit; Wafer binding place binding wafer on described soft base plate; On described soft base plate, contact disc is installed; Make surface layer; And by surface layer and the bookbinding of described soft base plate.
Therein at least one embodiment, in the step of the soft base plate that contains flexible PCB in described making, carry out soft base plate described in processing and fabricating according to the shape and size of double-interface smart card.
In at least one embodiment, process in the step of noncontact induction antenna and connecting circuit on described soft base plate therein, described connecting circuit comprises the connecting circuit between described wafer and described contact disc.
In at least one embodiment, in described making surface layer step, the geomery of described surface layer and described soft base plate match therein.
In view of this, the present invention also provides a kind of double-interface smart card that adopts above-mentioned packaging technology to be made.
A kind of double-interface smart card, described smart card comprises soft base plate, antenna, connecting circuit, wafer and contact disc, described soft base plate comprises flexible PCB, described antenna and described connecting circuit are arranged on described soft base plate, described wafer is bundled on described soft base plate and is connected with described antenna, between described wafer and described contact disc, is connected by described connecting circuit.
In at least one embodiment, described contact disc is 8Pin contact disc therein.
In at least one embodiment, the shape of described soft base plate and the shape of described double-interface smart card match therein.
In at least one embodiment, the geomery of described surface layer and described soft base plate match therein.
Existing pair of interface module split into wafer and contact disc by double-interface smart card of the present invention and packaging technology, carries out respectively wafer binding and contact disc welding on soft base plate, thereby realize the production of double-interface smart card.The packaging technology mode of double-interface smart card of the present invention, has saved conventional groove milling, has chosen bracing wire and butt-joint packaging process, has simplified packaging technology, has improved packaging efficiency.
[brief description of the drawings]
Fig. 1 is the structural representation that adopts the soft base plate of the double-interface smart card of preferred embodiment of the present invention.
The structural representation of the Audio Data Line that Fig. 2 adopts for the portable payment terminal in Fig. 1.
[embodiment]
For understanding better the present invention, below with reference to accompanying drawing and instantiation, invention is described in detail.
In order to solve the problem of packaging technology complexity of existing double-interface card, a kind of technique that is different from traditional double interface card of providing of traditional double-interface smart card is provided in the present invention, thereby the double-interface smart card that a kind of technological process is simple, packaging efficiency is high packaging technology is provided.
For the technique of the double-interface smart card to traditional is simplified, the present invention now changes packaging technology and the structure of traditional double-interface smart card, refer to Fig. 1, it (is wafer binding place shown in Fig. 1 that existing pair of interface module (chip) split into wafer 30 by the double-interface smart card of the preferred embodiments of the present invention, represent herein for wafer is installed) and contact disc 40, distinguished dressing on the soft base plate with antenna 20 (flexible PCB, FPC) 10.After wafer 30 bindings, be connected with antenna 20, contact disc 40 is connected with wafer 30 by connecting circuit.So, can make soft base plate 10 there is contact and non-contact function.Contact disc 40 is 8Pin contact disc.
Incorporated by reference to consulting Fig. 2, the packaging technology of the double-interface smart card that the present invention preferably implements comprises the following steps:
Step S01, makes soft base plate 10.Carry out processing and fabricating soft base plate 10 according to the parameter such as shape, size of double-interface smart card.
Step S02 carries out antenna 20 and the processing of corresponding connecting circuit on soft base plate 10.On soft base plate 10, process the connecting circuit between antenna 20 and wafer 30 and contact disc 40.
Step S03 binds wafer 30 on soft base plate 10.Wafer binding place binding wafer 30 on soft base plate 10.
Step S04 installs contact disc 40 on soft base plate 10.On soft base plate 10, on the position of correspondence, contact disc 40 is installed, now soft base plate 10 has possessed contact and the two interface functions of noncontact simultaneously.
Step S05, makes surface layer.Make surface layer according to the shape of smart card and soft base plate, size.
Step S06, by surface layer and soft base plate laminating bookbinding, can generate double-interface smart card.
Existing pair of interface module split into wafer and contact disc by double-interface smart card of the present invention and packaging technology, on soft base plate, carry out respectively wafer binding and contact disc welding, now, soft base plate after dressing has possessed contact and non-connection function, again itself and printing face layer bookbinding are laminated into card base, thereby realize the production of double-interface smart card.
Compared with prior art, the packaging technology of double-interface smart card of the present invention and the double-interface smart card that adopts this technique to make at least have following advantage:
(1) the packaging technology mode of double-interface smart card of the present invention, has saved conventional groove milling, has chosen bracing wire and butt-joint packaging process, has simplified packaging technology, has improved packaging efficiency;
(2) in double-interface smart card of the present invention and packaging technology thereof, antenna adopts contact and wafer binding mode, and docking closely, has been eliminated noncontact and responded to bad hidden danger;
(3) traditional packaging technology, due to secondary groove milling on card base, is therefore blocked base back side module vestige obvious, saves groove milling step in double-interface smart card of the present invention and packaging technology thereof, obviously improves module vestige outward appearance, has promoted product quality.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (8)
1. a packaging technology for double-interface smart card, comprises the following steps:
The soft base plate that making contains flexible PCB;
On described soft base plate, process noncontact induction antenna and connecting circuit;
Wafer binding place binding wafer on described soft base plate;
On described soft base plate, contact disc is installed;
Make surface layer; And
By surface layer and the bookbinding of described soft base plate.
2. the packaging technology of double-interface smart card according to claim 1, is characterized in that: in the step of the soft base plate that contains flexible PCB in described making, carry out soft base plate described in processing and fabricating according to the shape and size of double-interface smart card.
3. the packaging technology of double-interface smart card according to claim 1, is characterized in that: on described soft base plate, process in the step of noncontact induction antenna and connecting circuit, described connecting circuit comprises the connecting circuit between described wafer and described contact disc.
4. the packaging technology of double-interface smart card according to claim 1, is characterized in that: in described making surface layer step, the geomery of described surface layer and described soft base plate match.
5. the double-interface smart card that packaging technology according to claim 1 is made, it is characterized in that: described smart card comprises soft base plate, antenna, connecting circuit, wafer and contact disc, described soft base plate comprises flexible PCB, described antenna and described connecting circuit are arranged on described soft base plate, described wafer is bundled on described soft base plate and is connected with described antenna, between described wafer and described contact disc, is connected by described connecting circuit.
6. double-interface smart card according to claim 5, is characterized in that: described contact disc is 8Pin contact disc.
7. double-interface smart card according to claim 5, is characterized in that: the shape of described soft base plate and the shape of described double-interface smart card match.
8. double-interface smart card according to claim 7, is characterized in that: the geomery of described surface layer and described soft base plate match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191363.8A CN103955738A (en) | 2014-05-08 | 2014-05-08 | Double-interface smart card packaging technology and double-interface smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191363.8A CN103955738A (en) | 2014-05-08 | 2014-05-08 | Double-interface smart card packaging technology and double-interface smart card |
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| Publication Number | Publication Date |
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| CN103955738A true CN103955738A (en) | 2014-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410191363.8A Pending CN103955738A (en) | 2014-05-08 | 2014-05-08 | Double-interface smart card packaging technology and double-interface smart card |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100019397A1 (en) * | 2007-07-23 | 2010-01-28 | Sunpil Youn | Electrical connections for multichip modules |
| CN201974836U (en) * | 2011-03-25 | 2011-09-14 | 北京意诚信通智能卡股份有限公司 | Contactless IC (integrated circuit) card for miniature bus |
| CN102509149A (en) * | 2011-11-01 | 2012-06-20 | 上海祯显电子科技有限公司 | Novel double-interface smart card module |
| CN203520435U (en) * | 2013-09-04 | 2014-04-02 | 北京意诚信通智能卡股份有限公司 | Anti-detached type integrated circuit IC card |
-
2014
- 2014-05-08 CN CN201410191363.8A patent/CN103955738A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100019397A1 (en) * | 2007-07-23 | 2010-01-28 | Sunpil Youn | Electrical connections for multichip modules |
| CN201974836U (en) * | 2011-03-25 | 2011-09-14 | 北京意诚信通智能卡股份有限公司 | Contactless IC (integrated circuit) card for miniature bus |
| CN102509149A (en) * | 2011-11-01 | 2012-06-20 | 上海祯显电子科技有限公司 | Novel double-interface smart card module |
| CN203520435U (en) * | 2013-09-04 | 2014-04-02 | 北京意诚信通智能卡股份有限公司 | Anti-detached type integrated circuit IC card |
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Application publication date: 20140730 |
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| RJ01 | Rejection of invention patent application after publication |