CN103940147A - System and method for heat pipe radiation type top board heating/refrigeration - Google Patents
System and method for heat pipe radiation type top board heating/refrigeration Download PDFInfo
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 83
- 238000005057 refrigeration Methods 0.000 title claims abstract description 71
- 230000005855 radiation Effects 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 182
- 239000000758 substrate Substances 0.000 claims abstract description 128
- 238000009833 condensation Methods 0.000 claims abstract description 32
- 230000005494 condensation Effects 0.000 claims abstract description 32
- 238000005516 engineering process Methods 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 230000008020 evaporation Effects 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims description 18
- 238000004080 punching Methods 0.000 claims description 14
- 238000004049 embossing Methods 0.000 claims description 8
- 230000003416 augmentation Effects 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 230000008901 benefit Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 239000010902 straw Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000007791 dehumidification Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 210000005239 tubule Anatomy 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
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Abstract
The invention relates to a system and method for heat pipe radiation type top board heating/refrigeration. The system and method are used for indoor heating or refrigeration. The system comprises a heat conduction substrate, one or more flat heat pipes arranged side by side and one or more water pipes. The flat heat pipes are laid above the heat conduction substrate. The water pipes are laid above the flat heat pipes. The water pipes and the flat heat pipes are arranged in an intersecting mode. The water pipes in the system for heat pipe radiation type top board heating are communicated with a heat source through liquid media. The water pipes are arranged on evaporation sections of the flat heat pipes. Heat is exchanged between condensation sections of the flat heat pipes and the heat conduction substrate. The water pipes in the system for heat pipe radiation type top board refrigeration are communicated with a cold source through liquid media. The water pipes are arranged on the condensation sections of the flat heat pipes. Heat is exchanged between the evaporation sections of the flat heat pipes and the heat conduction substrate. According to the system, indoor heating or refrigeration is achieved according to the heat pipe radiation technology and the system has the advantages of being simple in process, safe in operation, high in efficiency and capable of saving energy.
Description
Technical field
The present invention relates to radiant heating and radiation refrigeration technology, the particularly system and method for the heating of a kind of thermal tube radiation top board or refrigeration.
Background technology
Utilize radiant heating technology and radiation refrigeration technology to carry out respectively indoor heating and refrigeration, be conducive to low-carbon economy and energy-conservation, and it is comfortable, safe and reliable to operation to have radiations heat energy, does not produce the advantages such as harmful influence factor, thereby be widely used.Existing radiant heating/refrigeration system normally adopts the water pipe of a fixed-caliber to realize heat supply or cooling by hot water or cold water, be arranged in floor, metope or ceiling by water pipe radiant heating/refrigeration system, by with being communicated with of water pipe line, make the surface of pipeline form hot/cold radiating surface, pipeline is main heat transfer unit (HTU), relies on the radiant heat exchange of radiating surface and surrounding environment heat or freeze.Scheme i.e. more traditional and safe mode is to adopt a serpentine coil, connects water main by collection/water knockout drum, and benefit is to there will not be midway to reveal, comparatively safe reliably, shortcoming be caliber when large heat exchange efficiency very low, the caliber hour temperature difference is large and flow resistance is large.For improving heat exchange efficiency and reducing resistance, domestic employing tubule radiant heating/Refrigeration Technique in recent years, adopt the many plastic tubes that the internal diameter being arranged in parallel is very thin, be so-called capillary (accurately saying with capillary without any relation), the equal melting welding in one end of each plastic straw is communicated with a water pipe line, the equal melting welding of the other end of each plastic straw is communicated with another water pipe line, plastic straw and water pipe line melting welding meeting cause radiant heating/refrigeration system easily reveal, aging, and complex process, weak effect, risk are very big.
As can be seen here, existing radiant heating/refrigeration system is not that efficiency is low, is exactly that reliability is very poor, and a cover system is difficult to realize heating, refrigeration and dehumidification function simultaneously.
Summary of the invention
The present invention is directed to easy leakage that existing radiant heating/Refrigeration Technique exists, aging, complex process, cost high, have a big risk and the problem such as efficiency is low, the system of the heating of a kind of thermal tube radiation top board or refrigeration is proposed, utilize heat pipe radiotechnology to complete indoor heating or refrigeration, also can realize dehumidifying simultaneously, have advantages of that technique is simple, security of operation, efficiency be high, in addition, because flat-plate heat pipe does not need power drive, also can realize more traditional radiant heating/refrigeration system and save the energy-saving effect of pump merit.The invention still further relates to the method for the heating of a kind of thermal tube radiation top board or refrigeration.
Technical scheme of the present invention is as follows:
A kind of thermal tube radiation top board heating/refrigeration system, for indoor heating or refrigeration, it is characterized in that, comprise heat-conducting substrate, one or more flat-plate heat pipe being arranged side by side and one or more water pipe, described flat-plate heat pipe is laid on heat-conducting substrate top, described water pipe is laid on flat-plate heat pipe top, described water pipe and flat-plate heat pipe are arranged in a crossed manner, water pipe in described heating system is communicated with thermal source by liquid media, described water pipe is arranged at the evaporator section of described flat-plate heat pipe, the condensation segment of described flat-plate heat pipe and heat-conducting substrate heat exchange; Water pipe in described refrigeration system is communicated with low-temperature receiver by liquid media, and described water pipe is arranged at the condensation segment of described flat-plate heat pipe, the evaporator section of described flat-plate heat pipe and heat-conducting substrate heat exchange.
Described flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, described flat-plate heat pipe be metal material through extruding or stamping forming, in it, there are two and two the micro heat pipe array structures that are arranged side by side above, the pipe sidewall interconnection of described micro heat pipe, described micro heat pipe inwall has capillary slot or micro-fin, and the equivalent diameter of described micro heat pipe is 0.3mm～4.5mm.
Described water pipe is vertical with flat-plate heat pipe to be arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction.
The metallic plate that described heat-conducting substrate is one of the forming; Or for being grating type, multiple heat-conducting substrates arrange the total substrate forming, the flat-plate heat pipe of the opposite position of laying on the heat-conducting substrate that described each grating type is arranged is Integral flat-plate heat pipe or by the interconnective multiple flat-plate heat pipes of platen surface of self, and the water pipe of the opposite position of laying on described each flat-plate heat pipe is overall water pipe or multiple water pipes of being connected by joint.
Described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described flat-plate heat pipe and water pipe are directly fitted, the water pipe tube wall of described water pipe and flat-plate heat pipe joint place is band-tube type heat exchange structure, or described water pipe is flat water pipe the direct and flat-plate heat pipe laminating by its flat horizontal surface; When described flat-plate heat pipe and water pipe are fitted indirectly, described flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating.
Described heat-conducting substrate is aluminium sheet;
And/or, on heat-conducting substrate, be provided with the punching of making by punching technology, or be provided with the embossing that embossed technology is made, or be provided with the fin of augmentation of heat transfer function;
And/or, on flat-plate heat pipe surface or heat-conducting substrate surface scribble functional coat;
And/or at least one side of described heat-conducting substrate is provided with gutter.
A kind of thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, it is characterized in that, adopt the thermal source of one or more water pipe utilization inside or low-temperature receiver and one or more flat-plate heat pipe to carry out heat exchange, described water pipe is laid on flat-plate heat pipe top, described water pipe and flat-plate heat pipe intersect laying, while carrying out heating, water pipe are communicated with to thermal source by liquid media, utilize the thermal source of water pipe inside and the evaporator section of flat-plate heat pipe to carry out heat exchange; While refrigeration, water pipe is communicated with to low-temperature receiver by liquid media, utilize the low-temperature receiver of water pipe inside and the condensation segment of flat-plate heat pipe to carry out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, the heat-conducting substrate that flat-plate heat pipe and its below are laid carries out heat exchange, reaches the object of heating or refrigeration.
In the time carrying out heat pipe radiant heating, described cross current thermal source, described water pipe contacts with the direct or indirect face of evaporator section of flat-plate heat pipe, the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, the evaporator section of flat-plate heat pipe absorbs the heat of water pipe inside, by condensation segment heat release dissipation of heat is extremely indoor through heat-conducting substrate, reach the object of indoor heating again; In the time carrying out heat pipe radiation refrigeration, described cross current low-temperature receiver, described water pipe contacts with the direct or indirect face of condensation segment of flat-plate heat pipe, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, carry out heat exchange by the low-temperature receiver in condensation segment and the water pipe of flat-plate heat pipe, indoor heat is absorbed by the evaporator section of flat-plate heat pipe through heat-conducting substrate simultaneously, reaches the object of indoor refrigeration.
In the method, described flat-plate heat pipe is when more than two, and each flat-plate heat pipe is arranged side by side, and described water pipe is vertical with each flat-plate heat pipe to be arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction;
And/or, described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described direct laminating, water pipe is being set to band-tube type heat exchange structure with the tube wall of flat-plate heat pipe joint place, or the water pipe adopting is flat water pipe the direct and flat-plate heat pipe laminating by its flat horizontal surface; When described indirect laminating, flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating.
Heat-conducting substrate is arranged to indoor roof, flat-plate heat pipe level is laid on the top of heat-conducting substrate, described water pipe level is laid on the top of flat-plate heat pipe, and on heat-conducting substrate, make punching by punching technology, or on heat-conducting substrate, make embossing by embossed technology, or the fin of augmentation of heat transfer function is set on heat-conducting substrate; Or on flat-plate heat pipe surface or heat-conducting substrate surface scribble functional coat; Or be provided with gutter at least one side of heat-conducting substrate;
And/or, the metallic plate that described heat-conducting substrate is one of the forming; Or for being grating type, multiple heat-conducting substrates arrange the total substrate forming, the flat-plate heat pipe of the opposite position of laying on the heat-conducting substrate that described each grating type is arranged is Integral flat-plate heat pipe or by the interconnective multiple flat-plate heat pipes of platen surface of self, and the water pipe of the opposite position of laying on described each flat-plate heat pipe is overall water pipe or multiple water pipes of being connected by joint.
Technique effect of the present invention is as follows:
The present invention relates to a kind of thermal tube radiation top board heating/refrigeration system, comprise heat-conducting substrate, flat-plate heat pipe and water pipe, flat-plate heat pipe is laid on heat-conducting substrate top, water pipe is laid on flat-plate heat pipe top, carry out heat exchange by the thermal source that is communicated with in water pipe or low-temperature receiver and flat-plate heat pipe, phase-change heat-exchange in flat-plate heat pipe, self-assembling formation heat pipe effect, and then flat-plate heat pipe carries out heat exchange by heat-conducting substrate, so that the energy of the thermal source being communicated with in water pipe or low-temperature receiver is distributed through heat-conducting substrate, reach the effect of indoor heating or refrigeration, in other words, heating system is that heat that one end of flat-plate heat pipe thermal source from the water pipe of contact absorbs is used for the heated plate heat pipe other end and gives off heat to indoor by heat-conducting substrate radiation and cross-ventilation, refrigeration system be flat-plate heat pipe one end from contact water pipe low-temperature receiver absorb the cold around heat of object radiation and the heat of the Indoor Thermal air that the cooling flat plate heat pipe other end absorbs by heat-conducting substrate of absorbing.System of the present invention is unpowered Transfer Technology, taking the medium in flat-plate heat pipe as heating agent, jointly form top board refrigeration or the heating system taking hot and cold radiation as principal character with cold/heat source and heat-conducting substrate in water pipe, realize heating, refrigeration and dehumidification function by a cover system.Described system is carried out indoor heating or refrigeration by heat pipe radiotechnology, laminating laying process is without welding between tube and tube, the problems such as the easy leakage having avoided adopting tubule radiotechnology to cause, aging, complex process, cost be high, have a big risk and efficiency is low, because flat-plate heat pipe does not need power drive, also can realize more traditional radiant heating/refrigeration system and save the energy-saving effect of pump merit, the employing of heat-conducting substrate has improved the speed of flat-plate heat pipe and room air heat exchange, that heat-conducting substrate also has advantages of is attractive in appearance, decoration and structural strength large.The surface area of the platen surface of flat-plate heat pipe is large, therefore equivalent thermal resistance is very little, large and the ineffective problem of the flow resistance of simultaneously having avoided prior art to adopt serpentine coil or plastic straw to cause, and parts convenient disassembly in system, can freely install, also there is technique simple, work safety, reliability is high, compact conformation, heat transfer efficiency is high, cooling or the high advantage of heating efficiency.
Flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, flat-plate heat pipe be preferably metal material through extruding or stamping forming, in it, there are two and two the micro heat pipe array structures that are arranged side by side above, the pipe sidewall interconnection of micro heat pipe, the equivalent diameter of micro heat pipe is 0.3mm～4.5mm.Micro heat pipe inwall has capillary slot or micro-fin, can realize flat-plate heat pipe when micro heat pipe array structure in roof water placing flat time, also can normally work.The flat-plate heat pipe technique of this structure is simple, easy to make, with low cost, like this in the time of working medium evaporation endothermic in endotherm section, liquid working substance can flow to rapidly heat release section and carry out condensation heat release in the micro heat pipe of this applicable size, the heat pipe effect of the flat-plate heat pipe of above-mentioned equivalent diameter is more rapidly with abundant, can make heat exchange even, reach the optimum state of flat-plate heat pipe effect, further improve the heat exchange efficiency of whole flat plate heat pipe type heat-exchanger rig, flat-plate heat pipe is uniformly distributed many on heat-conducting substrate, heat radiation evenly, make the indoor cold air of heat-conducting substrate conduction cold or hot-air heat energy enough more rapidly uniformly and flat-plate heat pipe carry out heat exchange, improve heating or refrigerating efficiency.
Water pipe is vertical with flat-plate heat pipe to be arranged, can reduce water pipe and lay area, and the heat in water pipe can be conducted on each flat-plate heat pipe equably, water pipe is uniformly distributed more than two along flat-plate heat pipe length direction, make indoor heating or cryogenic temperature even, and improve the operating efficiency of system.Flat-plate heat pipe and water pipe are directly fitted or are indirectly fitted by band-tube type heat exchanger, and plane between flat-plate heat pipe and water pipe is fitted tightly, and increase the heat exchange area of water pipe and flat-plate heat pipe, reduce thermal resistance, improve the operating efficiency of system.
The metallic plate that heat-conducting substrate is one of the forming is set or arranges for multiple heat-conducting substrates are grating type the total substrate forming, flat-plate heat pipe and water pipe are to should grid whole installation, so that the overall applicability of indoor roof, strengthen the practicality of heat pipe radiant heating/refrigeration system.
The invention still further relates to a kind of thermal tube radiation top board heating/refrigerating method, according to heat pipe radiotechnology, adopt the thermal source of one or more water pipe utilization inside or low-temperature receiver and intersect one or more flat-plate heat pipe of laying and carry out heat exchange, and make the heat-conducting substrate of flat-plate heat pipe and laying carry out heat exchange, when heating, be heat that the thermal source from the water pipe of an end in contact of flat-plate heat pipe absorbs heat the other end give off heat to by heat-conducting substrate radiation and cross-ventilation indoor, thereby realize the object of indoor heating; When refrigeration, be low-temperature receiver from the water pipe of an end in contact of flat-plate heat pipe absorb cold come the heat of the Indoor Thermal air that absorbs by heat-conducting substrate of the cooling other end, thereby realize the object of indoor refrigeration.The method realizes top board heating or refrigeration by heat pipe radiotechnology, can also realize dehumidification function, avoid prior art to adopt the pipe of the fine internal diameter that tubule radiotechnology or plastic material make to carry out the drawback that heating or heat exchange bring, thermal tube radiation top board heating/refrigerating method of the present invention is simple to operate, has high reliability and efficient advantage.
Brief description of the drawings
Fig. 1 is the first preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention.
Fig. 2 is the Facad structure schematic diagram of Fig. 1.
Fig. 3 is the second preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention.
Fig. 4 is the third preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention.
In figure, each label lists as follows:
1-heat-conducting substrate; 2-flat-plate heat pipe; 3-water pipe; 4-band-tube type heat exchanger.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention will be described.
The present invention relates to a kind of thermal tube radiation top board heating/refrigeration system, this system can be used for indoor heating or refrigeration, and as depicted in figs. 1 and 2, Fig. 1 is overall structure schematic diagram to its structure, the Facad structure schematic diagram that Fig. 2 is Fig. 1.This system comprises heat-conducting substrate 1, flat-plate heat pipe 2 and water pipe 3, and wherein, flat-plate heat pipe 2 can be one, or many flat-plate heat pipes 2 that are arranged side by side as depicted in figs. 1 and 2, and water pipe 3 also can be one, or many water pipes 3 as depicted in figs. 1 and 2.Flat-plate heat pipe 2 is laid on heat-conducting substrate 1 top, water pipe 3 is laid on flat-plate heat pipe 2 tops, can be understood as this system is to set gradually water pipe 3 from upper strata toward lower floor, flat-plate heat pipe 2 and heat-conducting substrate 1, water pipe 3 is arranged in a crossed manner with flat-plate heat pipe 2, preferably water pipe 3 and the mutual vertical setting of flat-plate heat pipe 2, in water pipe, be communicated with thermal source or low-temperature receiver by liquid media, in the time being communicated with thermal source by liquid media in water pipe 3, the present invention forms heat pipe panel type heating system, this liquid media is thermal medium, can be water or anti-icing fluid or refrigeration working medium etc., now water pipe 3 is arranged at the evaporator section of flat-plate heat pipe 2, the condensation segment of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange, in the time being communicated with low-temperature receiver by liquid media in water pipe 3, the present invention forms heat pipe radiation refrigeration system, this liquid media is cold media, can be water or anti-icing fluid or refrigeration working medium etc., now water pipe 3 be arranged at the condensation segment of flat-plate heat pipe 2, the evaporator section of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange.
Preferred structure shown in Fig. 1 and Fig. 2 is that many two flat-plate heat pipes 2 are evenly set on heat-conducting substrate 1; In the time only adopting a flat-plate heat pipe, can be arranged at the middle part of heat-conducting substrate 1, now can adopt a very wide flat-plate heat pipe.Flat-plate heat pipe 2 can be metal material through extruding or stamping forming, in it, there are two and two the micro heat pipe array structures that are arranged side by side above, the pipe sidewall interconnection of micro heat pipe, the equivalent diameter of this micro heat pipe can be 0.3mm～4.5mm.Micro heat pipe is the inner cavity body structure forming of flat-plate heat pipe, between micro heat pipe and micro heat pipe, is the reinforcement of flat-plate heat pipe, does not have air chamber between tube and tube, has strengthened bearing capacity and safe and reliable property.Micro heat pipe inwall has capillary slot or micro-fin, can realize flat-plate heat pipe 2 when micro heat pipe array structure in roof water placing flat time, can normally work.Micro heat pipe in flat-plate heat pipe 2 is separate heat pipe, and flat-plate heat pipe 2 forms micro heat pipe array structure; Certainly, flat-plate heat pipe 2 also can be set for metal material is through extruding or stamping formingly have two and the via-hole array slab construction that is arranged side by side above in it, make flat-plate heat pipe in the time of work, form integral heat pipe structure.Flat-plate heat pipe 2 ensures to form heat pipe effect, liquid working substance flows along the each micro heat pipe in flat-plate heat pipe, make one end of horizontally disposed flat-plate heat pipe as evaporator section (also can be called is endotherm section), the other end is as condensation segment (also can be called is heat release section), carry out the even recovery of indoor heat energy or cold energy, realize the object of indoor heating or refrigeration, have the advantages that heat transfer efficiency is high.Owing to preferably adopting extruding or Sheet Metal Forming Technology to make flat-plate heat pipe, technique is simple, has reduced cost of manufacture, has strengthened bearing capacity and safe and reliable property, has avoided again the problem that equivalent thermal resistance is large and heat exchange efficiency is low.Water pipe 3 is uniformly distributed two (can certainly be one or be uniformly distributed more than two) along flat-plate heat pipe 2 length directions, flat-plate heat pipe 2 can directly or indirectly be fitted with water pipe 3, in the time that both directly fit, can be set to band-tube type heat exchange structure at the water pipe tube wall of joint place by water pipe 3, water pipe 3 is realized with flat-plate heat pipe 2 and being fitted tightly by this band-tube type heat exchange structure of self; In addition, in the time that both directly fit, can also directly water pipe 3 be set to flat water pipe, this flat water pipe has flat horizontal surface, in flat water pipe for single cavity and cross section are rectangle, by flat horizontal surface directly and flat-plate heat pipe 2 fit, structure as shown in Figure 3; In the time that both fit indirectly, flat-plate heat pipe 2 can fit tightly with water pipe 3 by band-tube type heat exchanger 4 as shown in Figure 2, and band-tube type heat exchanger 4 is axially provided with the through hole of placing water pipe 3.
Heat-conducting substrate 1 can be arranged at indoor roof, can also on heat-conducting substrate 1, add decorative layer.It is a kind of radiant panel that heat-conducting substrate 1 can be regarded as.On heat-conducting substrate, can be provided with the punching of making by punching technology, punching can make the inside and outside both sides of heat-conducting substrate form convection current; On heat-conducting substrate, can also be provided with the embossing that embossed technology is made, embossing can strengthen the heat exchange area of heat-conducting substrate; On heat-conducting substrate, can also be provided with the fin of augmentation of heat transfer function, heat-conducting substrate is by punching, embossing and connect the modes such as fin and all can strengthen and the exchange capability of heat of air.That heat-conducting substrate has advantages of is attractive in appearance, decoration and structural strength large.Can be bonding by high strength heat conductive silica gel between flat-plate heat pipe 2 and heat-conducting substrate 1.On flat-plate heat pipe 2 surfaces or heat-conducting substrate 1 surface can also scribble various functional coats, as ceramic coating, scribble functional coat and can make flat-plate heat pipe or heat-conducting substrate as thering is corrosion proof function, self-cleaning function, degerming (as photocatalyst) and strengthening the function of infrared radiation coefficient (as pottery, aluminium powder etc.) or the function of strengthening radiant heat transfer.Can also be provided with gutter at least one side of heat-conducting substrate 1, avoid having ponding on heat-conducting substrate 1, further improve the operating efficiency of system of the present invention.
Heat-conducting substrate 1 preferably can adopt metallic plate, the aluminium sheet that for example heat transfer efficiency is high.Heat-conducting substrate 1 can be integrally formed metallic plate, and the third structure of system shown in the present that also can be as shown in Figure 4, is to be grating type by multiple heat-conducting substrates 1 to arrange the total substrate forming.The flat-plate heat pipe 2 of the opposite position of laying on the heat-conducting substrate 1 that each grating type is arranged can be the Integral flat-plate heat pipe shown in Fig. 4 or other as by the interconnective multiple flat-plate heat pipes of platen surface of flat-plate heat pipe self, the interior corresponding flat-plate heat pipe of each grid successively face be connected to form the long flat-plate heat pipe of length.The water pipe 3 of the opposite position of laying on each flat-plate heat pipe 2 also can for the overall water pipe shown in Fig. 4 or other be as the multiple water pipes that are connected by joint.
System of the present invention is during as heating system, water pipe 3 can directly be communicated with thermal source, also can introduce thermal source by heat pump or underground water heat exchange, now the evaporator section of flat-plate heat pipe 2 and water pipe 3 are directly or indirectly fitted to carry out heat exchange, the condensation segment of flat-plate heat pipe 2 and heat-conducting substrate 1 carry out heat exchange, the heat radiation circumference object of the condensation segment of flat-plate heat pipe 2 by the thermal source in the water pipe 3 of the cold of cold air in heat-conducting substrate 1 absorption chamber the contact of the evaporator section by flat-plate heat pipe 2 and heat the air passing through, thus realize the object of indoor heating.System of the present invention is during as refrigeration system, water pipe can directly be communicated with low-temperature receiver, also can be communicated with refrigeration machine or other low-temperature receiver, now the condensation segment of flat-plate heat pipe 2 and described water pipe 3 are directly or indirectly fitted to carry out heat exchange, the evaporator section of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange, carry out heat exchange by the low-temperature receiver in condensation segment and the water pipe 3 of flat-plate heat pipe 2, indoor heat is absorbed by the evaporator section of flat-plate heat pipe 2 by heat-conducting substrate 1 simultaneously, reaches the object of indoor refrigeration.
The invention still further relates to a kind of thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, can adopt the thermal source of one or more water pipe utilization inside or low-temperature receiver and one or more flat-plate heat pipe to carry out heat exchange, water pipe is laid on to flat-plate heat pipe top, water pipe and flat-plate heat pipe are intersected to laying, while carrying out heating, water pipe is communicated with to thermal source by liquid media, utilizes the thermal source of water pipe inside and the evaporator section of flat-plate heat pipe to carry out heat exchange; While refrigeration, water pipe is communicated with to low-temperature receiver by liquid media, utilize the low-temperature receiver of water pipe inside and the condensation segment of flat-plate heat pipe to carry out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, the heat-conducting substrate that flat-plate heat pipe and its below are laid carries out heat exchange, reaches the object of heating or refrigeration.
Thermal tube radiation top board heating/refrigerating method of the present invention is corresponding with above-mentioned thermal tube radiation top board heating/refrigeration system.Particularly, can be with reference to figure 1-4, in the time carrying out heat pipe radiant heating, make cross current thermal source, water pipe contacts with the direct or indirect face of evaporator section of flat-plate heat pipe, and the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, and the evaporator section of flat-plate heat pipe absorbs the heat of water pipe inside, by condensation segment heat release dissipation of heat is extremely indoor through heat-conducting substrate, reach the object of indoor heating again; In the time carrying out heat pipe radiation refrigeration, make cross current low-temperature receiver, water pipe contacts with the direct or indirect face of condensation segment of flat-plate heat pipe, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, carry out heat exchange by the low-temperature receiver in condensation segment and the water pipe of flat-plate heat pipe, indoor heat is absorbed by the evaporator section of flat-plate heat pipe by heat-conducting substrate simultaneously, reaches the object of indoor refrigeration.When flat-plate heat pipe is preferably more than two, each flat-plate heat pipe is arranged side by side, and water pipe is vertical with each flat-plate heat pipe to be arranged, and water pipe is uniformly distributed more than two along flat-plate heat pipe length direction.Flat-plate heat pipe and water pipe can directly be fitted, now can water pipe and the water pipe tube wall of flat-plate heat pipe joint place be set to band-tube type heat exchange structure, or the water pipe adopting is flat water pipe and directly fits with flat-plate heat pipe by the flat horizontal surface of this flat water pipe; Flat-plate heat pipe also can be fitted indirectly with water pipe, and now flat-plate heat pipe can be by band-tube type heat exchanger and water pipe laminating.
When the application of thermal tube radiation top board heating of the present invention/refrigerating method, heat-conducting substrate can be arranged to indoor roof, flat-plate heat pipe level be laid on to the top of heat-conducting substrate, water pipe level is laid on to the top of flat-plate heat pipe.Can also on heat-conducting substrate, make by punching technology punching, or on heat-conducting substrate, make embossing by embossed technology, or the fin of augmentation of heat transfer function has been set on heat-conducting substrate.On flat-plate heat pipe surface or heat-conducting substrate surface can scribble functional coat; Preferably be provided with gutter at least one side of heat-conducting substrate.The metallic plate that heat-conducting substrate can be one of the forming or be grating type and arrange the total substrate forming as Fig. 4 is set to multiple heat-conducting substrates, the flat-plate heat pipe of the opposite position of laying on the heat-conducting substrate that each grating type is arranged is Integral flat-plate heat pipe or by the interconnective multiple flat-plate heat pipes of platen surface of self, and the water pipe of the opposite position of laying on described each flat-plate heat pipe is overall water pipe or multiple water pipes of being connected by joint.
It should be pointed out that the above detailed description of the invention can make the invention of those skilled in the art's comprehend, but do not limit the present invention in any way creation.Therefore; although this description has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can modify or be equal to replacement the invention; in a word, all do not depart from technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection domain of the invention patent.
Claims (10)
1. a thermal tube radiation top board heating/refrigeration system, for indoor heating or refrigeration, it is characterized in that, comprise heat-conducting substrate, one or more flat-plate heat pipe being arranged side by side and one or more water pipe, described flat-plate heat pipe is laid on heat-conducting substrate top, described water pipe is laid on flat-plate heat pipe top, described water pipe and flat-plate heat pipe are arranged in a crossed manner, water pipe in described heating system is communicated with thermal source by liquid media, described water pipe is arranged at the evaporator section of described flat-plate heat pipe, the condensation segment of described flat-plate heat pipe and heat-conducting substrate heat exchange; Water pipe in described refrigeration system is communicated with low-temperature receiver by liquid media, and described water pipe is arranged at the condensation segment of described flat-plate heat pipe, the evaporator section of described flat-plate heat pipe and heat-conducting substrate heat exchange.
2. thermal tube radiation top board heating/refrigeration system according to claim 1, it is characterized in that, described flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, described flat-plate heat pipe be metal material through extruding or stamping forming, in it, there are two and two the micro heat pipe array structures that are arranged side by side above, the pipe sidewall interconnection of described micro heat pipe, described micro heat pipe inwall has capillary slot or micro-fin, and the equivalent diameter of described micro heat pipe is 0.3mm～4.5mm.
3. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, is characterized in that, described water pipe is vertical with flat-plate heat pipe to be arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction.
4. thermal tube radiation top board heating/refrigeration system according to claim 1, is characterized in that the metallic plate that described heat-conducting substrate is one of the forming; Or for being grating type, multiple heat-conducting substrates arrange the total substrate forming, the flat-plate heat pipe of the opposite position of laying on the heat-conducting substrate that described each grating type is arranged is Integral flat-plate heat pipe or by the interconnective multiple flat-plate heat pipes of platen surface of self, and the water pipe of the opposite position of laying on described each flat-plate heat pipe is overall water pipe or multiple water pipes of being connected by joint.
5. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, it is characterized in that, described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described flat-plate heat pipe and water pipe are directly fitted, the water pipe tube wall of described water pipe and flat-plate heat pipe joint place is band-tube type heat exchange structure, or described water pipe is flat water pipe the direct and flat-plate heat pipe laminating by its flat horizontal surface; When described flat-plate heat pipe and water pipe are fitted indirectly, described flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating.
6. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, is characterized in that, described heat-conducting substrate is aluminium sheet;
And/or, on heat-conducting substrate, be provided with the punching of making by punching technology, or be provided with the embossing that embossed technology is made, or be provided with the fin of augmentation of heat transfer function;
And/or, on flat-plate heat pipe surface or heat-conducting substrate surface scribble functional coat;
And/or at least one side of described heat-conducting substrate is provided with gutter.
7. a thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, it is characterized in that, adopt the thermal source of one or more water pipe utilization inside or low-temperature receiver and one or more flat-plate heat pipe to carry out heat exchange, described water pipe is laid on flat-plate heat pipe top, described water pipe and flat-plate heat pipe intersect laying, while carrying out heating, water pipe are communicated with to thermal source by liquid media, utilize the thermal source of water pipe inside and the evaporator section of flat-plate heat pipe to carry out heat exchange; While refrigeration, water pipe is communicated with to low-temperature receiver by liquid media, utilize the low-temperature receiver of water pipe inside and the condensation segment of flat-plate heat pipe to carry out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, the heat-conducting substrate that flat-plate heat pipe and its below are laid carries out heat exchange, reaches the object of heating or refrigeration.
8. thermal tube radiation top board heating/refrigerating method according to claim 7, it is characterized in that, in the time carrying out heat pipe radiant heating, described cross current thermal source, described water pipe contacts with the direct or indirect face of evaporator section of flat-plate heat pipe, and the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, and the evaporator section of flat-plate heat pipe absorbs the heat of water pipe inside, by condensation segment heat release dissipation of heat is extremely indoor through heat-conducting substrate, reach the object of indoor heating again; In the time carrying out heat pipe radiation refrigeration, described cross current low-temperature receiver, described water pipe contacts with the direct or indirect face of condensation segment of flat-plate heat pipe, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, carry out heat exchange by the low-temperature receiver in condensation segment and the water pipe of flat-plate heat pipe, indoor heat is absorbed by the evaporator section of flat-plate heat pipe through heat-conducting substrate simultaneously, reaches the object of indoor refrigeration.
9. thermal tube radiation top board heating/refrigerating method according to claim 8, it is characterized in that, described flat-plate heat pipe is when more than two, and each flat-plate heat pipe is arranged side by side, described water pipe is vertical with each flat-plate heat pipe to be arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction;
And/or, described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described direct laminating, water pipe is being set to band-tube type heat exchange structure with the tube wall of flat-plate heat pipe joint place, or the water pipe adopting is flat water pipe the direct and flat-plate heat pipe laminating by its flat horizontal surface; When described indirect laminating, flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating.
10. according to the thermal tube radiation top board heating/refrigerating method one of claim 7 to 9 Suo Shu, it is characterized in that, heat-conducting substrate is arranged to indoor roof, flat-plate heat pipe level is laid on the top of heat-conducting substrate, described water pipe level is laid on the top of flat-plate heat pipe, and on heat-conducting substrate, make punching by punching technology, or on heat-conducting substrate, make embossing by embossed technology, or the fin of augmentation of heat transfer function has been set on heat-conducting substrate; Or on flat-plate heat pipe surface or heat-conducting substrate surface scribble functional coat; Or be provided with gutter at least one side of heat-conducting substrate;
And/or, the metallic plate that described heat-conducting substrate is one of the forming; Or for being grating type, multiple heat-conducting substrates arrange the total substrate forming, the flat-plate heat pipe of the opposite position of laying on the heat-conducting substrate that described each grating type is arranged is Integral flat-plate heat pipe or by the interconnective multiple flat-plate heat pipes of platen surface of self, and the water pipe of the opposite position of laying on described each flat-plate heat pipe is overall water pipe or multiple water pipes of being connected by joint.
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