CN103940147B - Thermal tube radiation top board heating/refrigeration system and method - Google Patents
Thermal tube radiation top board heating/refrigeration system and method Download PDFInfo
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 182
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- 238000004080 punching Methods 0.000 claims description 14
- 238000004049 embossing Methods 0.000 claims description 8
- 230000003416 augmentation Effects 0.000 claims description 6
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- 238000001704 evaporation Methods 0.000 claims description 4
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- 238000007710 freezing Methods 0.000 claims description 4
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- 238000002844 melting Methods 0.000 description 3
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- 238000005034 decoration Methods 0.000 description 2
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Abstract
The present invention relates to a kind of thermal tube radiation top board heating/refrigeration system and method, for indoor heating or refrigeration, this system includes heat-conducting substrate, one or more flat-plate heat pipe being arranged side by side and one or more water pipe, flat-plate heat pipe is laid on above heat-conducting substrate, water pipe is laid on above flat-plate heat pipe, water pipe is arranged in a crossed manner with flat-plate heat pipe, water pipe in heating system connects thermal source by liquid media, water pipe is arranged at the evaporator section of flat-plate heat pipe, the condensation segment of flat-plate heat pipe and heat-conducting substrate heat exchange；Water pipe in refrigeration system connects low-temperature receiver by liquid media, and water pipe is arranged at the condensation segment of flat-plate heat pipe, the evaporator section of flat-plate heat pipe and heat-conducting substrate heat exchange。This system utilizes heat pipe radiotechnology to complete indoor heating or refrigeration, has the advantage that technique is simple, operation safety, efficiency are high and energy-conservation。
Description
Technical field
The present invention relates to radiant heating and radiation refrigeration technology, particularly the system and method for a kind of thermal tube radiation top board heating or refrigeration。
Background technology
Radiant heating technology and radiation refrigeration technology is utilized to carry out indoor heating and refrigeration respectively, be conducive to low-carbon economy and energy-conservation, and it is comfortable, safe and reliable to operation to have radiations heat energy, do not produce the advantages such as harmful influence factor, thus being widely used。Existing radiant heating/refrigeration system is typically with the water pipe of a fixed-caliber and is realized heat supply or cooling by hot water or cold water, it is arranged in floor, metope or ceiling by water pipe radiant heating/refrigeration system, by the connection with water pipe line, the surface making pipeline forms hot/cold radiating surface, pipeline is main heat transfer device, relies on the radiant heat exchange of radiating surface and surrounding to carry out heating or freezing。The namely more traditional and safe mode of a kind of scheme is to adopt serpentine coil, connects water main by collection/water knockout drum, and benefit is not have midway leakage, comparatively safe reliably, shortcoming be caliber big time heat exchange efficiency very low, the caliber hour temperature difference is big and flow resistance is big。For improving heat exchange efficiency and reducing resistance, domestic employing tubule radiant heating/Refrigeration Technique in recent years, namely the plastic tube that the many internal diameters being arranged in parallel are very thin is adopted, i.e. so-called capillary tube (accurately saying do not have any relation with capillary), equal melting welding one water pipe line of connection in one end of each plastic straw, the equal melting welding of the other end of each plastic straw connects another water pipe line, plastic straw and water pipe line melting welding can cause radiant heating/refrigeration system to be susceptible to reveal, aging, and complex process, weak effect, dangerous。
As can be seen here, existing radiant heating/refrigeration system is not that efficiency is low, it is simply that reliability is very poor, and set of system is difficult to realize heating, refrigeration and dehumidification function simultaneously。
Summary of the invention
The present invention is directed to that existing radiant heating/Refrigeration Technique exists easily reveal, the problem such as aging, complex process, cost high, have a big risk and efficiency is low, the system of a kind of thermal tube radiation top board heating or refrigeration is proposed, heat pipe radiotechnology is utilized to complete indoor heating or refrigeration, also can realize dehumidifying simultaneously, have that technique is simple, run safety, advantage that efficiency is high, in addition, owing to flat-plate heat pipe does not need power drive, also can realize relatively conventional radiation heating/refrigeration system and save the energy-saving effect of pump merit。A kind of method that the invention still further relates to thermal tube radiation top board heating or refrigeration。
Technical scheme is as follows:
A kind of thermal tube radiation top board heating/refrigeration system, for indoor heating or refrigeration, it is characterized in that, including heat-conducting substrate, one or more flat-plate heat pipe being arranged side by side and one or more water pipe, described flat-plate heat pipe is laid on above heat-conducting substrate, described water pipe is laid on above flat-plate heat pipe, described water pipe is arranged in a crossed manner with flat-plate heat pipe, water pipe in described heating system connects thermal source by liquid media, described water pipe is arranged at the evaporator section of described flat-plate heat pipe, the condensation segment of described flat-plate heat pipe and heat-conducting substrate heat exchange；Water pipe in described refrigeration system connects low-temperature receiver by liquid media, and described water pipe is arranged at the condensation segment of described flat-plate heat pipe, the evaporator section of described flat-plate heat pipe and heat-conducting substrate heat exchange。
Described flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, described flat-plate heat pipe be metal material through extruding or stamping forming, there are two and micro heat pipe array structure that two or more is arranged side by side in it, the tube side wall interconnection of described micro heat pipe, described micro heat pipe inwall has capillary slot or micro-fin, and the equivalent diameter of described micro heat pipe is 0.3mm～4.5mm。
Described water pipe and flat-plate heat pipe are vertically arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction。
The metallic plate that described heat-conducting substrate is one of the forming；Or for multiple heat-conducting substrates be grating type arrange total substrate, the flat-plate heat pipe of the opposite position laid on the heat-conducting substrate of described each grating type arrangement is Integral flat-plate heat pipe or the interconnective multiple flat-plate heat pipes of platen surface passing through self, and the water pipe of the opposite position that described each flat-plate heat pipe is laid is overall water pipe or the multiple water pipes being connected by joint。
Described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described flat-plate heat pipe and water pipe are directly fitted, the water pipe tube wall of described water pipe and flat-plate heat pipe joint place is band-tube type heat exchange structure, or described water pipe is flat water tubes and is directly fitted with flat-plate heat pipe by its flat horizontal surface；When described flat-plate heat pipe and water pipe are fitted indirectly, described flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating。
Described heat-conducting substrate is aluminium sheet；
And/or, heat-conducting substrate is provided with the punching that punching technology is made, or is provided with the embossing that embossed technology is made, or be provided with the fin of augmentation of heat transfer function；
And/or, scribble functional coat on flat-plate heat pipe surface or heat-conducting substrate surface；
And/or, at least side of described heat-conducting substrate is provided with gutter。
A kind of thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, it is characterized in that, the thermal source within the utilization of one or more water pipe or low-temperature receiver and one or more flat-plate heat pipe is adopted to carry out heat exchange, described water pipe is laid on above flat-plate heat pipe, described water pipe and flat-plate heat pipe intersect laying, when carrying out heating, by liquid media, water pipe are connected thermal source, utilize the evaporator section of thermal source within water pipe and flat-plate heat pipe to carry out heat exchange；When freezing, water pipe is connected low-temperature receiver by liquid media, the condensation segment utilizing the low-temperature receiver within water pipe and flat-plate heat pipe carries out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, make flat-plate heat pipe carry out heat exchange with the heat-conducting substrate laid below, reach the purpose of heating or refrigeration。
When carrying out heat pipe radiant heating, described cross current thermal source, described water pipe face direct or indirect with the evaporator section of flat-plate heat pipe contacts, the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, the evaporator section of flat-plate heat pipe absorbs the heat within water pipe, again through condensation segment heat release and through heat-conducting substrate, heat is distributed to indoor, reach the purpose of indoor heating；When carrying out heat pipe radiation refrigeration, described cross current low-temperature receiver, described water pipe face direct or indirect with the condensation segment of flat-plate heat pipe contacts, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, heat exchange is carried out with the low-temperature receiver in water pipe by the condensation segment of flat-plate heat pipe, simultaneously indoor heat is absorbed by the evaporator section of flat-plate heat pipe through heat-conducting substrate, reaches the purpose of indoor refrigeration。
In the method, when described flat-plate heat pipe is two or more, each flat-plate heat pipe is arranged side by side, and described water pipe and each flat-plate heat pipe are vertically arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction；
And/or, described flat-plate heat pipe and water pipe are directly or indirectly laminating, during described direct laminating, water pipe is set to band-tube type heat exchange structure at the tube wall with flat-plate heat pipe joint place, or the water pipe adopted is flat water tubes and is directly fitted with flat-plate heat pipe by its flat horizontal surface；During described indirect laminating, flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating。
Heat-conducting substrate is arranged at indoor roof, flat-plate heat pipe level is laid on the top of heat-conducting substrate, described water pipe level is laid on the top of flat-plate heat pipe, and on heat-conducting substrate, make punching by punching technology, or make embossing on heat-conducting substrate by embossed technology, or the fin of augmentation of heat transfer function has been set on heat-conducting substrate；Or scribble functional coat on flat-plate heat pipe surface or heat-conducting substrate surface；Or at least side of heat-conducting substrate is provided with gutter；
And/or, the metallic plate that described heat-conducting substrate is one of the forming；Or for multiple heat-conducting substrates be grating type arrange total substrate, the flat-plate heat pipe of the opposite position laid on the heat-conducting substrate of described each grating type arrangement is Integral flat-plate heat pipe or the interconnective multiple flat-plate heat pipes of platen surface passing through self, and the water pipe of the opposite position that described each flat-plate heat pipe is laid is overall water pipe or the multiple water pipes being connected by joint。
The technique effect of the present invention is as follows:
The present invention relates to a kind of thermal tube radiation top board heating/refrigeration system, including heat-conducting substrate, flat-plate heat pipe and water pipe, flat-plate heat pipe is laid on above heat-conducting substrate, water pipe is laid on above flat-plate heat pipe, heat exchange is carried out by the thermal source connected in water pipe or low-temperature receiver and flat-plate heat pipe, phase-change heat-exchange in flat-plate heat pipe, self-assembling formation heat pipe effect, and then flat-plate heat pipe carries out heat exchange by heat-conducting substrate, distribute through heat-conducting substrate with the energy by the thermal source connected in water pipe or low-temperature receiver, reach the effect of indoor heating or refrigeration, in other words, heating system is that the heat that the one end of flat-plate heat pipe thermal source from the water pipe of contact absorbs is radiated by heat-conducting substrate for the heated flat plate heat pipe other end and cross-ventilation gives off heat to indoor, the heat of Indoor Thermal air that refrigeration system is the cold heat absorbing surrounding objects radiation that absorbs of the one end of flat-plate heat pipe low-temperature receiver from the water pipe of contact and the cooling flat plate heat pipe other end is absorbed by heat-conducting substrate。System of the present invention is unpowered Transfer Technology, with the medium in flat-plate heat pipe for heating agent, with the cold/heat source in water pipe and heat-conducting substrate collectively form with hot and cold radiation be principal character top board refrigeration or heating system, realize heating, refrigeration and dehumidification function by set of system。Described system carries out indoor heating or refrigeration by heat pipe radiotechnology, laminating laying process is without welding between tube and tube, avoid adopt that tubule radiotechnology causes easily reveal, the problem such as aging, complex process, cost high, have a big risk and efficiency is low, owing to flat-plate heat pipe does not need power drive, also can realize relatively conventional radiation heating/refrigeration system and save the energy-saving effect of pump merit, the employing of heat-conducting substrate improves the speed of flat-plate heat pipe and room air heat exchange, and heat-conducting substrate also has attractive in appearance, decoration and the big advantage of structural strength。The surface area of the platen surface of flat-plate heat pipe is big, therefore equivalent thermal resistance is very little, avoid prior art adopts flow resistance that serpentine coil or plastic straw cause big and ineffective problem simultaneously, and the parts convenient disassembly in system, can freely install, also there is technique simple, work safety, reliability is high, compact conformation, the advantage that heat transfer efficiency height, cooling or heating efficiency are high。
Flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, flat-plate heat pipe be preferably metal material through extruding or stamping forming, there are two and micro heat pipe array structure that two or more is arranged side by side in it, the tube side wall interconnection of micro heat pipe, the equivalent diameter of micro heat pipe is 0.3mm～4.5mm。Micro heat pipe inwall has capillary slot or micro-fin, it is possible to achieve when the flat-plate heat pipe of micro heat pipe array structure can also normal operation when roof water placing flat。The flat-plate heat pipe technique of this structure is simple, easy to make, with low cost, so when working medium evaporation endothermic in endotherm section, liquid working substance can flow to rapidly heat release section in the micro heat pipe of this applicable size and carry out condensation heat release, the heat pipe effect of the flat-plate heat pipe of above-mentioned equivalent diameter is more rapidly with abundant, enable to heat exchange uniform, reach the optimum state of flat-plate heat pipe effect, further increase the heat exchange efficiency of whole flat plate heat pipe type heat-exchanger rig, flat-plate heat pipe is uniformly distributed many on heat-conducting substrate, heat radiation is uniformly, the heat making the cold or hot-air of the cold air inside that heat-conducting substrate conducts uniform more rapidly and flat-plate heat pipe can carry out heat exchange, improve heating or refrigerating efficiency。
Water pipe and flat-plate heat pipe are vertically arranged, can reducing water pipe and lay area, and can be conducted to each flat-plate heat pipe by the even heat in water pipe, water pipe is uniformly distributed more than two along flat-plate heat pipe length direction, make indoor heating or cryogenic temperature uniform, and improve the work efficiency of system。Flat-plate heat pipe and water pipe are directly fitted or are indirectly fitted by band-tube type heat exchanger so that between flat-plate heat pipe and water pipe, plane fits tightly, and increase the heat exchange area of water pipe and flat-plate heat pipe, reduce thermal resistance, improve the work efficiency of system。
Metallic plate that heat-conducting substrate is one of the forming is set or be the total substrate that grating type arranges for multiple heat-conducting substrates, flat-plate heat pipe and water pipe are to should grid whole installation, so that the overall applicability of indoor roof, enhance the practicality of heat pipe radiant heating/refrigeration system。
The invention still further relates to a kind of thermal tube radiation top board heating/refrigerating method, according to heat pipe radiotechnology, adopt one or more water pipe to utilize internal thermal source or low-temperature receiver and intersect one or more flat-plate heat pipe of laying and carry out heat exchange, and make the heat-conducting substrate of flat-plate heat pipe and laying carry out heat exchange, it is the heat that absorbs of thermal source from the water pipe of the end thereof contacts of flat-plate heat pipe during heating to heat the other end and radiated by heat-conducting substrate and cross-ventilation gives off heat to indoor, thus realizing the purpose of indoor heating；It is the heat cooling down the Indoor Thermal air that the other end absorbs by heat-conducting substrate that absorbs of low-temperature receiver from the water pipe of the end thereof contacts of flat-plate heat pipe during refrigeration, thus realizing the purpose of indoor refrigeration。The method realizes top board heating or refrigeration by heat pipe radiotechnology, dehumidification function can also be realized, avoid the drawback that the pipe of the fine internal diameter that prior art adopts tubule radiotechnology or plastic material to make carries out heating or heat exchange brings, thermal tube radiation top board heating/refrigerating method of the present invention is simple to operate, has high reliability and efficient advantage。
Accompanying drawing explanation
Fig. 1 is the first preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention。
Fig. 2 is the Facad structure schematic diagram of Fig. 1。
Fig. 3 is the second preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention。
Fig. 4 is the third preferred structure schematic diagram of thermal tube radiation top board heating/refrigeration system of the present invention。
In figure, each label lists as follows:
1-heat-conducting substrate；2-flat-plate heat pipe；3-water pipe；4-band-tube type heat exchanger。
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention will be described。
The present invention relates to a kind of thermal tube radiation top board heating/refrigeration system, namely this system can be used for indoor heating or refrigeration, and as depicted in figs. 1 and 2, Fig. 1 is overall structure schematic diagram to its structure, and Fig. 2 is the Facad structure schematic diagram of Fig. 1。This system includes heat-conducting substrate 1, flat-plate heat pipe 2 and water pipe 3, and wherein, flat-plate heat pipe 2 can be one, or the many flat-plate heat pipes 2 being arranged side by side as depicted in figs. 1 and 2, and water pipe 3 can also be one, or many water pipes 3 as depicted in figs. 1 and 2。Flat-plate heat pipe 2 is laid on above heat-conducting substrate 1, water pipe 3 is laid on above flat-plate heat pipe 2, can be understood as this system is set gradually water pipe 3 from upper strata toward lower floor, flat-plate heat pipe 2 and heat-conducting substrate 1, water pipe 3 is arranged in a crossed manner with flat-plate heat pipe 2, preferred water pipe 3 is arranged in a mutually vertical manner with flat-plate heat pipe 2, by liquid media connection thermal source or low-temperature receiver in water pipe, when connecting thermal source by liquid media in water pipe 3, the present invention forms heat pipe panel type heating system, this liquid media is thermal medium, can be water or anti-icing fluid or refrigeration working medium etc., now water pipe 3 is arranged at the evaporator section of flat-plate heat pipe 2, the condensation segment of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange；When connecting low-temperature receiver by liquid media in water pipe 3, the present invention forms heat pipe radiation refrigeration system, this liquid media is cold media, can being water or anti-icing fluid or refrigeration working medium etc., now water pipe 3 be arranged at the condensation segment of flat-plate heat pipe 2, the evaporator section of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange。
Preferred structure shown in Fig. 1 and Fig. 2 is to be uniformly arranged many two flat-plate heat pipes 2 on heat-conducting substrate 1；When only with a flat-plate heat pipe, the middle part of heat-conducting substrate 1 can be positioned in, now can adopt a very wide flat-plate heat pipe。Flat-plate heat pipe 2 can be metal material through extruding or stamping forming, there are two and micro heat pipe array structure that two or more is arranged side by side in it, the tube side wall interconnection of micro heat pipe, the equivalent diameter of this micro heat pipe can be 0.3mm～4.5mm。Micro heat pipe is the cavity body structure that flat-plate heat pipe is internally formed, and is the reinforcement of flat-plate heat pipe, is absent from air chamber between tube and tube between micro heat pipe and micro heat pipe, enhances bearing capacity and safe and reliable property。Micro heat pipe inwall has capillary slot or micro-fin, it is possible to achieve when the flat-plate heat pipe 2 of micro heat pipe array structure can normal operation when roof water placing flat。The heat pipe that micro heat pipe in flat-plate heat pipe 2 is independent from, flat-plate heat pipe 2 forms micro heat pipe array structure；It is of course also possible to arrange flat-plate heat pipe 2 through extruding or stamping forming there is two and the via-hole array slab construction being arranged side by side above in it for metal material so that flat-plate heat pipe operationally forms integral heat pipe structure。Flat-plate heat pipe 2 ensures to form heat pipe effect, liquid working substance flows along each micro heat pipe in flat-plate heat pipe, make one end of horizontally disposed flat-plate heat pipe as evaporator section (endotherm section can also be known as), the other end is as condensation segment (can also be known as heat release section), carry out the heat energy of indoor or the uniform recovery of cold energy, realize the purpose of indoor heating or refrigeration, have the advantages that heat transfer efficiency is high。Making flat-plate heat pipe owing to preferably employing extruding or Sheet Metal Forming Technology, technique is simple, reduces cost of manufacture, enhances bearing capacity and safe and reliable property, turn avoid the problem that equivalent thermal resistance is big and heat exchange efficiency is low。Water pipe 3 is uniformly distributed two (can certainly be one or be uniformly distributed more than two) along flat-plate heat pipe 2 length direction, flat-plate heat pipe 2 and water pipe 3 can directly or indirectly be fitted, the water pipe 3 water pipe tube wall in joint place can be set to band-tube type heat exchange structure when both directly fit, and water pipe 3 realizes fitting tightly with flat-plate heat pipe 2 by this band-tube type heat exchange structure of self；Additionally, directly water pipe 3 can also be set to flat water tubes when both directly fit, this flat water tubes has flat horizontal surface, and flat water tubes is interior is rectangle for single cavity and cross section, is directly fitted with flat-plate heat pipe 2 by flat horizontal surface, structure as shown in Figure 3；The band-tube type heat exchanger 4 that flat-plate heat pipe 2 can pass through as shown in Figure 2 when both fit indirectly fits tightly with water pipe 3, and band-tube type heat exchanger 4 is axially arranged the through hole placing water pipe 3。
Heat-conducting substrate 1 can be arranged at indoor roof, it is also possible to adds decorative layer on heat-conducting substrate 1。It is a kind of radiant panel that heat-conducting substrate 1 can be regarded as。Can being provided with the punching that punching technology is made on heat-conducting substrate, punching can so that forming convection current inside and outside heat-conducting substrate；Being also provided with the embossing that embossed technology is made on heat-conducting substrate, embossing can strengthen the heat exchange area of heat-conducting substrate；Being also provided with the fin of augmentation of heat transfer function on heat-conducting substrate, heat-conducting substrate all can strengthen the exchange capability of heat with air by modes such as punching, embossing and connection fins。Heat-conducting substrate has attractive in appearance, decoration and the big advantage of structural strength。High intensity heat conductive silica gel can be passed through bonding between flat-plate heat pipe 2 with heat-conducting substrate 1。Various functional coat can also be scribbled on flat-plate heat pipe 2 surface or heat-conducting substrate 1 surface, such as ceramic coating, scribbling functional coat can so that flat-plate heat pipe or heat-conducting substrate be as having corrosion proof function, self-cleaning function, degerming (such as photocatalyst) and strengthening the function of infrared radiation coefficient (such as pottery, aluminium powder etc.) or the function of strengthening radiant heat transfer。At least side of heat-conducting substrate 1 can also be provided with gutter, it is to avoid heat-conducting substrate 1 exists hydrops, improve the work efficiency of present system further。
Heat-conducting substrate 1 preferably can adopt metallic plate, for instance the aluminium sheet that heat transfer efficiency is high。Heat-conducting substrate 1 can be integrally formed metallic plate, it is also possible to the third structure of illustrated system as shown in Figure 4, is the total substrate arranged in grating type by multiple heat-conducting substrates 1。The flat-plate heat pipe 2 of the opposite position laid on the heat-conducting substrate 1 of each grating type arrangement can be the Integral flat-plate heat pipe shown in Fig. 4 or other is as by the interconnective multiple flat-plate heat pipes of the platen surface of flat-plate heat pipe self, namely corresponding in each grid flat-plate heat pipe face successively connects the flat-plate heat pipe that formation length is long。The water pipe 3 of the opposite position laid on each flat-plate heat pipe 2 can also for the overall water pipe shown in Fig. 4 or other multiple water pipes as being connected by joint。
When system of the present invention is as heating system, water pipe 3 can directly connect thermal source, heat pump can also be passed through or subsoil water heat exchange introduces thermal source, now the evaporator section of flat-plate heat pipe 2 and water pipe 3 directly or indirectly fit to carry out heat exchange, the condensation segment of flat-plate heat pipe 2 and heat-conducting substrate 1 carry out heat exchange, the condensation segment of flat-plate heat pipe 2 is absorbed the heat radiation circumference object of the thermal source in the cold of cold air inside the water pipe 3 that contacted by the evaporator section of flat-plate heat pipe 2 and heats the air passed through by heat-conducting substrate 1, thus realizing the purpose of indoor heating。When system of the present invention is as refrigeration system, water pipe can directly connect low-temperature receiver, refrigeration machine or other low-temperature receiver can also be connected, now the condensation segment of flat-plate heat pipe 2 and described water pipe 3 directly or indirectly fit to carry out heat exchange, the evaporator section of flat-plate heat pipe 2 and heat-conducting substrate 1 heat exchange, carrying out heat exchange by the condensation segment of flat-plate heat pipe 2 with the low-temperature receiver in water pipe 3, simultaneously indoor heat is absorbed by the evaporator section of flat-plate heat pipe 2 by heat-conducting substrate 1, reaches the purpose of indoor refrigeration。
The invention still further relates to a kind of thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, the thermal source within the utilization of one or more water pipe or low-temperature receiver and one or more flat-plate heat pipe can be adopted to carry out heat exchange, water pipe is laid on above flat-plate heat pipe, water pipe and flat-plate heat pipe are intersected laying, when carrying out heating, water pipe is connected thermal source by liquid media, utilize the evaporator section of the thermal source within water pipe and flat-plate heat pipe to carry out heat exchange；When freezing, water pipe is connected low-temperature receiver by liquid media, the condensation segment utilizing the low-temperature receiver within water pipe and flat-plate heat pipe carries out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, make flat-plate heat pipe carry out heat exchange with the heat-conducting substrate laid below, reach the purpose of heating or refrigeration。
The thermal tube radiation top board heating/refrigerating method of the present invention is corresponding with above-mentioned thermal tube radiation top board heating/refrigeration system。Specifically, it is referred to Fig. 14, when carrying out heat pipe radiant heating, make cross current thermal source, water pipe face direct or indirect with the evaporator section of flat-plate heat pipe contacts, and the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, and the evaporator section of flat-plate heat pipe absorbs the heat within water pipe, again through condensation segment heat release and through heat-conducting substrate, heat is distributed to indoor, reach the purpose of indoor heating；When carrying out heat pipe radiation refrigeration, make cross current low-temperature receiver, water pipe face direct or indirect with the condensation segment of flat-plate heat pipe contacts, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, heat exchange is carried out with the low-temperature receiver in water pipe by the condensation segment of flat-plate heat pipe, simultaneously indoor heat is absorbed by the evaporator section of flat-plate heat pipe by heat-conducting substrate, reaches the purpose of indoor refrigeration。When flat-plate heat pipe is preferably two or more, each flat-plate heat pipe is arranged side by side, and water pipe and each flat-plate heat pipe are vertically arranged, and water pipe is uniformly distributed more than two along flat-plate heat pipe length direction。Flat-plate heat pipe and water pipe can directly be fitted, and the water pipe tube wall of water pipe Yu flat-plate heat pipe joint place now can be set to band-tube type heat exchange structure, or the water pipe adopted is flat water tubes and is directly fitted with flat-plate heat pipe by the flat horizontal surface of this flat water tubes；Flat-plate heat pipe can also be fitted indirectly with water pipe, and now flat-plate heat pipe can pass through band-tube type heat exchanger and water pipe laminating。
During the thermal tube radiation top board heating of the present invention/refrigerating method application, it is possible to heat-conducting substrate is arranged at indoor roof, flat-plate heat pipe level is laid on the top of heat-conducting substrate, water pipe level is laid on the top of flat-plate heat pipe。Punching technology can also be passed through on heat-conducting substrate, make punching, or on heat-conducting substrate, make embossing by embossed technology, or the fin of augmentation of heat transfer function has been set on heat-conducting substrate。Functional coat can be scribbled on flat-plate heat pipe surface or heat-conducting substrate surface；At least side preferably in heat-conducting substrate is provided with gutter。Metallic plate that heat-conducting substrate can be one of the forming or as Fig. 4 is set to the total substrate that multiple heat-conducting substrate is grating type arrangement, the flat-plate heat pipe of the opposite position laid on the heat-conducting substrate of each grating type arrangement is Integral flat-plate heat pipe or the interconnective multiple flat-plate heat pipes of platen surface passing through self, and the water pipe of the opposite position that described each flat-plate heat pipe is laid is overall water pipe or the multiple water pipes being connected by joint。
It should be pointed out that, that the above detailed description of the invention can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation。Therefore; although the invention is had been carried out describing in detail by this specification with reference to drawings and Examples; but; skilled artisan would appreciate that; still the invention can be modified or equivalent replacement; in a word, all are without departing from the technical scheme of the spirit and scope of the invention and improvement thereof, and it all should be encompassed in the middle of the protection domain of the invention patent。
Claims (10)
1. thermal tube radiation top board heating/refrigeration system, for indoor heating or refrigeration, it is characterized in that, including heat-conducting substrate, one or more flat-plate heat pipe being arranged side by side and one or more water pipe, described flat-plate heat pipe is laid on above heat-conducting substrate, described water pipe is laid on above flat-plate heat pipe, described water pipe is arranged in a crossed manner with flat-plate heat pipe, water pipe in described heating system connects thermal source by liquid media, described water pipe is arranged at the evaporator section of described flat-plate heat pipe, the condensation segment of described flat-plate heat pipe and heat-conducting substrate heat exchange；Water pipe in described refrigeration system connects low-temperature receiver by liquid media, and described water pipe is arranged at the condensation segment of described flat-plate heat pipe, the evaporator section of described flat-plate heat pipe and heat-conducting substrate heat exchange。
2. thermal tube radiation top board heating/refrigeration system according to claim 1, it is characterized in that, described flat-plate heat pipe is uniformly distributed more than two on heat-conducting substrate, described flat-plate heat pipe be metal material through extruding or stamping forming, there are two and micro heat pipe array structure that two or more is arranged side by side in it, the tube side wall interconnection of described micro heat pipe, described micro heat pipe inwall has capillary slot or micro-fin, and the equivalent diameter of described micro heat pipe is 0.3mm～4.5mm。
3. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, it is characterised in that described water pipe and flat-plate heat pipe are vertically arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction。
4. thermal tube radiation top board heating/refrigeration system according to claim 1, it is characterised in that the metallic plate that described heat-conducting substrate is one of the forming；Or for multiple heat-conducting substrates be grating type arrange total substrate, the flat-plate heat pipe of the opposite position laid on the heat-conducting substrate of described each grating type arrangement is Integral flat-plate heat pipe or the interconnective multiple flat-plate heat pipes of platen surface passing through self, and the water pipe of the opposite position that described each flat-plate heat pipe is laid is overall water pipe or the multiple water pipes being connected by joint。
5. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, it is characterized in that, described flat-plate heat pipe and water pipe are directly or indirectly laminating, when described flat-plate heat pipe and water pipe are directly fitted, the water pipe tube wall of described water pipe and flat-plate heat pipe joint place is band-tube type heat exchange structure, or described water pipe is flat water tubes and is directly fitted with flat-plate heat pipe by its flat horizontal surface；When described flat-plate heat pipe and water pipe are fitted indirectly, described flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating。
6. thermal tube radiation top board heating/refrigeration system according to claim 1 and 2, it is characterised in that described heat-conducting substrate is aluminium sheet；
And/or, heat-conducting substrate is provided with the punching that punching technology is made, or is provided with the embossing that embossed technology is made, or be provided with the fin of augmentation of heat transfer function；
And/or, scribble functional coat on flat-plate heat pipe surface or heat-conducting substrate surface；
And/or, at least side of described heat-conducting substrate is provided with gutter。
7. thermal tube radiation top board heating/refrigerating method, for indoor heating or refrigeration, it is characterized in that, the thermal source within the utilization of one or more water pipe or low-temperature receiver and one or more flat-plate heat pipe is adopted to carry out heat exchange, described water pipe is laid on above flat-plate heat pipe, described water pipe and flat-plate heat pipe intersect laying, when carrying out heating, by liquid media, water pipe are connected thermal source, utilize the evaporator section of thermal source within water pipe and flat-plate heat pipe to carry out heat exchange；When freezing, water pipe is connected low-temperature receiver by liquid media, the condensation segment utilizing the low-temperature receiver within water pipe and flat-plate heat pipe carries out heat exchange, utilize evaporation endothermic and the condensation heat release of flat-plate heat pipe, make flat-plate heat pipe carry out heat exchange with the heat-conducting substrate laid below, reach the purpose of heating or refrigeration。
8. thermal tube radiation top board heating/refrigerating method according to claim 7, it is characterized in that, when carrying out heat pipe radiant heating, described cross current thermal source, described water pipe face direct or indirect with the evaporator section of flat-plate heat pipe contacts, and the condensation segment of flat-plate heat pipe contacts with heat-conducting substrate face, and the evaporator section of flat-plate heat pipe absorbs the heat within water pipe, again through condensation segment heat release and through heat-conducting substrate, heat is distributed to indoor, reach the purpose of indoor heating；When carrying out heat pipe radiation refrigeration, described cross current low-temperature receiver, described water pipe face direct or indirect with the condensation segment of flat-plate heat pipe contacts, the evaporator section of flat-plate heat pipe contacts with heat-conducting substrate face, heat exchange is carried out with the low-temperature receiver in water pipe by the condensation segment of flat-plate heat pipe, simultaneously indoor heat is absorbed by the evaporator section of flat-plate heat pipe through heat-conducting substrate, reaches the purpose of indoor refrigeration。
9. thermal tube radiation top board heating/refrigerating method according to claim 8, it is characterized in that, when described flat-plate heat pipe is two or more, each flat-plate heat pipe is arranged side by side, described water pipe and each flat-plate heat pipe are vertically arranged, and described water pipe is uniformly distributed more than two along flat-plate heat pipe length direction；
And/or, described flat-plate heat pipe and water pipe are directly or indirectly laminating, during described direct laminating, water pipe is set to band-tube type heat exchange structure at the tube wall with flat-plate heat pipe joint place, or the water pipe adopted is flat water tubes and is directly fitted with flat-plate heat pipe by its flat horizontal surface；During described indirect laminating, flat-plate heat pipe is by band-tube type heat exchanger and water pipe laminating。
10. according to the thermal tube radiation top board heating/refrigerating method one of claim 7 to 9 Suo Shu, it is characterized in that, heat-conducting substrate is arranged at indoor roof, flat-plate heat pipe level is laid on the top of heat-conducting substrate, described water pipe level is laid on the top of flat-plate heat pipe, and on heat-conducting substrate, make punching by punching technology, or on heat-conducting substrate, make embossing by embossed technology, or the fin of augmentation of heat transfer function has been set on heat-conducting substrate；Or scribble functional coat on flat-plate heat pipe surface or heat-conducting substrate surface；Or at least side of heat-conducting substrate is provided with gutter；
And/or, the metallic plate that described heat-conducting substrate is one of the forming；Or for multiple heat-conducting substrates be grating type arrange total substrate, the flat-plate heat pipe of the opposite position laid on the heat-conducting substrate of described each grating type arrangement is Integral flat-plate heat pipe or the interconnective multiple flat-plate heat pipes of platen surface passing through self, and the water pipe of the opposite position that described each flat-plate heat pipe is laid is overall water pipe or the multiple water pipes being connected by joint。
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| CN105526722A (en) * | 2014-10-27 | 2016-04-27 | 陆永达 | Heat storage device and heat storage system |
| CN104613536A (en) * | 2015-02-10 | 2015-05-13 | 季弘 | Heat pipe type floor heating system |
| CN104764128A (en) * | 2015-04-24 | 2015-07-08 | 清华大学 | Indoor sunshading and cooling device with internal cooling water pipes |
| CN104790572A (en) * | 2015-04-24 | 2015-07-22 | 清华大学 | Double-glass enclosure system with cooling and shading functions |
| CN104964374A (en) * | 2015-07-28 | 2015-10-07 | 珠海格力电器股份有限公司 | Radiation heat exchange plate assembly |
| CN116182295B (en) * | 2023-04-26 | 2023-07-21 | 湖南大学 | Radiation air conditioner refrigerating system |
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| CN203824159U (en) * | 2014-05-09 | 2014-09-10 | 赵耀华 | Heat pipe radiation type top plate heating/refrigerating system |
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| CN101220972A (en) * | 2008-01-08 | 2008-07-16 | 何政林 | Box type water medium radiation cold roof plate and cooling and warming floor system |
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