CN103934593A - Clean-free scaling powder for welding stainless steel - Google Patents
Clean-free scaling powder for welding stainless steel Download PDFInfo
- Publication number
- CN103934593A CN103934593A CN201410096872.2A CN201410096872A CN103934593A CN 103934593 A CN103934593 A CN 103934593A CN 201410096872 A CN201410096872 A CN 201410096872A CN 103934593 A CN103934593 A CN 103934593A
- Authority
- CN
- China
- Prior art keywords
- scaling powder
- stainless steel
- free scaling
- welding
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
Abstract
The invention discloses a clean-free scaling powder for welding stainless steel. The clean-free scaling powder comprises the following chemical components, by weight, 5-8.5% of o-hydroxybenzoic acid, 10-15% of phosphoric acid, 15-20% of zinc chloride, 1.5-3% of organic solvents, 1-2.5% of anticorrosive agents, 1.8-2.6% of co-solvent and 3-4.5% of film-forming agents, and the balance deionized water. Due to the way, the clean-free scaling powder for welding the stainless steel can carry out tin welding on copper and iron materials and can also be used for carrying out welding or chromium plating welding on the stainless steel; meanwhile, by the adoption of the clean-free scaling powder, the weldability is good, poison, environmental pollution and corrosiveness can be avoided, work hours are saved, and the production efficiency is improved.
Description
Technical field
The present invention relates to scaling powder, particularly relate to a kind of cleaning-free scaling powder for soldering stainless steel.
Background technology
Scaling powder, for helping and promote welding process in welding procedure, has the chemical substance of protective effect, prevention oxidation reaction simultaneously.Scaling powder has by Function Classification: hand immersed solder scaling powder, wave-soldering scaling powder and stainless steel flux; Both are users institute familiar with understanding above, here explain stainless steel flux, it is a kind of chemical agent welding for stainless steel specially, general welding can only complete the welding to copper or tin surfaces, but stainless steel flux can complete the welding to copper, iron, galvanized sheet, nickel plating, all kinds of stainless steels etc.
On market for the scaling powder of stainless steel welding also already in application, but for general stainless steel flux, after welding, also exist sweep, the various operations such as cleaning, reduced welding job efficiency, increased workman's welding labour intensity.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of cleaning-free scaling powder for soldering stainless steel, soldering that can not only soldering copper iron material, more can be applied to stainless welding or chromium plating welding, adopt cleaning-free scaling powder simultaneously, solderability is good, nontoxic, free from environmental pollution, non-corrosiveness, has saved and has improved production efficiency man-hour.For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of cleaning-free scaling powder for soldering stainless steel is provided, it is characterized in that, comprise following various chemical composition: septichen, phosphoric acid, zinc chloride, organic solvent, anticorrosive, cosolvent and film forming agent, described each composition proportion is by weight percentage: septichen 5%～8.5%, phosphatase 11 0%～15%, zinc chloride 15%～20%, organic solvent 1.5%～3%, anticorrosive 1%～2.5%, cosolvent 1.8%～2.6%, film forming agent 3%～4.5%, all the other are deionized water.
In a preferred embodiment of the present invention, described organic solvent is perchloroethylene or trichloro-ethylene.
In a preferred embodiment of the present invention, the oxidized paraffin wax salt that described anticorrosive is octadecylamine.
In a preferred embodiment of the present invention, described cosolvent is nicotinic acid amide or the acetamide in amides compound.
In a preferred embodiment of the present invention, described film forming agent is acrylate modified butadiene resin.
In a preferred embodiment of the present invention, the PH of described deionized water is 3～4.
The invention has the beneficial effects as follows: the invention provides a kind of cleaning-free scaling powder for soldering stainless steel, soldering that can not only soldering copper iron material, more can be applied to stainless welding or chromium plating welding, adopt cleaning-free scaling powder simultaneously, solderability is good, nontoxic, free from environmental pollution, non-corrosiveness, saved man-hour, has improved production efficiency.
Detailed description of the invention
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of cleaning-free scaling powder for soldering stainless steel, it is characterized in that, comprise following various chemical composition: septichen, phosphoric acid, zinc chloride, organic solvent, anticorrosive, cosolvent and film forming agent, described each composition proportion is by weight percentage: septichen 5%～8.5%, phosphatase 11 0%～15%, zinc chloride 15%～20%, organic solvent 1.5%～3%, anticorrosive 1%～2.5%, cosolvent 1.8%～2.6%, film forming agent 3%～4.5%, all the other are deionized water.
Further, described organic solvent is perchloroethylene or trichloro-ethylene.
Further, the oxidized paraffin wax salt that described anticorrosive is octadecylamine.
Further, described cosolvent is nicotinic acid amide or the acetamide in amides compound.
Further, described film forming agent is acrylate modified butadiene resin.
Further, the PH of described deionized water is 3～4.
The invention has the beneficial effects as follows: the invention provides a kind of cleaning-free scaling powder for soldering stainless steel, soldering that can not only soldering copper iron material, more can be applied to stainless welding or chromium plating welding, adopt cleaning-free scaling powder simultaneously, solderability is good, nontoxic, free from environmental pollution, non-corrosiveness, has saved and has improved production efficiency man-hour.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. the cleaning-free scaling powder for soldering stainless steel, it is characterized in that, comprise following various chemical composition: septichen, phosphoric acid, zinc chloride, organic solvent, anticorrosive, cosolvent and film forming agent, described each composition proportion is by weight percentage: septichen 5%～8.5%, phosphatase 11 0%～15%, zinc chloride 15%～20%, organic solvent 1.5%～3%, anticorrosive 1%～2.5%, cosolvent 1.8%～2.6%, film forming agent 3%～4.5%, all the other are deionized water.
2. the cleaning-free scaling powder for soldering stainless steel according to claim 1, is characterized in that, described organic solvent is perchloroethylene or trichloro-ethylene.
3. the cleaning-free scaling powder for soldering stainless steel according to claim 1, is characterized in that, the oxidized paraffin wax salt that described anticorrosive is octadecylamine.
4. the cleaning-free scaling powder for soldering stainless steel according to claim 1, is characterized in that, described cosolvent is nicotinic acid amide or the acetamide in amides compound.
5. the cleaning-free scaling powder for soldering stainless steel according to claim 1, is characterized in that, described film forming agent is acrylate modified butadiene resin.
6. the cleaning-free scaling powder for soldering stainless steel according to claim 1, is characterized in that, the PH of described deionized water is 3～4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096872.2A CN103934593A (en) | 2014-03-17 | 2014-03-17 | Clean-free scaling powder for welding stainless steel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410096872.2A CN103934593A (en) | 2014-03-17 | 2014-03-17 | Clean-free scaling powder for welding stainless steel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103934593A true CN103934593A (en) | 2014-07-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410096872.2A Pending CN103934593A (en) | 2014-03-17 | 2014-03-17 | Clean-free scaling powder for welding stainless steel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103934593A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526754A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of high cleaning intensity scaling powder |
| CN108620770A (en) * | 2018-05-08 | 2018-10-09 | 丹凤县荣毅电子有限公司 | A kind of cleaning-free scaling powder and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030597A (en) * | 1983-07-29 | 1985-02-16 | Kawasaki Steel Corp | Coated electrode |
| CN1449886A (en) * | 2003-04-22 | 2003-10-22 | 虞选勇 | Stainless steel soldering flux |
| CN101200026A (en) * | 2006-12-15 | 2008-06-18 | 李汀 | Stainless steel flux |
| CN101269448A (en) * | 2008-04-22 | 2008-09-24 | 太仓市首创锡业有限公司 | Cleaning-free lead-free solder soldering fluid |
| CN101412166A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free scaling powder |
| CN103056560A (en) * | 2012-12-28 | 2013-04-24 | 深圳市美克科技有限公司 | Scaling flux for soldering |
-
2014
- 2014-03-17 CN CN201410096872.2A patent/CN103934593A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030597A (en) * | 1983-07-29 | 1985-02-16 | Kawasaki Steel Corp | Coated electrode |
| CN1449886A (en) * | 2003-04-22 | 2003-10-22 | 虞选勇 | Stainless steel soldering flux |
| CN101200026A (en) * | 2006-12-15 | 2008-06-18 | 李汀 | Stainless steel flux |
| CN101269448A (en) * | 2008-04-22 | 2008-09-24 | 太仓市首创锡业有限公司 | Cleaning-free lead-free solder soldering fluid |
| CN101412166A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free scaling powder |
| CN103056560A (en) * | 2012-12-28 | 2013-04-24 | 深圳市美克科技有限公司 | Scaling flux for soldering |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526754A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of high cleaning intensity scaling powder |
| CN108620770A (en) * | 2018-05-08 | 2018-10-09 | 丹凤县荣毅电子有限公司 | A kind of cleaning-free scaling powder and preparation method thereof |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140723 |