CN103846574A - Inorganic flux - Google Patents

Inorganic flux Download PDF

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Publication number
CN103846574A
CN103846574A CN201410096774.9A CN201410096774A CN103846574A CN 103846574 A CN103846574 A CN 103846574A CN 201410096774 A CN201410096774 A CN 201410096774A CN 103846574 A CN103846574 A CN 103846574A
Authority
CN
China
Prior art keywords
inorganic
inorganic flux
flux
chloride
hydrochloric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410096774.9A
Other languages
Chinese (zh)
Inventor
杨伟帅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lotte Chemical Technology Co Ltd
Original Assignee
Suzhou Lotte Chemical Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Lotte Chemical Technology Co Ltd filed Critical Suzhou Lotte Chemical Technology Co Ltd
Priority to CN201410096774.9A priority Critical patent/CN103846574A/en
Publication of CN103846574A publication Critical patent/CN103846574A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The invention discloses an inorganic flux. The flux comprises the following components in percentage by mass: 35% to 55% of hydrochloric acid, 20% to 30% of hydrofluoric acid, 15% to 20% of zinc chloride, and 5% to 15% of stannic chloride. By adopting the method, the inorganic flux has the advantages that the welding assisting capability is good, the water dissolving effect is realized, the cleaning is easy, the corrosiveness is high, the oxide films on the ferrous and non-ferrous metal surfaces can be effectively removed, the efficiency is high, and the like; the broad market prospect is obtained in the popularizing of the inorganic flux.

Description

A kind of inorganic flux
Technical field
The present invention relates to chemical field, particularly relate to a kind of inorganic flux.
Background technology
Chemical industry, full name chemical industry, very close with the mankind's productive life relation, in the modern life, almost all be unable to do without chemical products whenever and wherever possible, chemical products are permeated in industry-by-industry and fields such as household, agricultural, industry, wherein scaling powder is widely used in industrial welding, existing scaling powder can be divided into inorganic flux, organic scaling powder and rosin scaling powder, wherein inorganic flux is used in the oxidation film layer on clean metal surface more, and existing inorganic flux formula components inequality, easily causes the problems such as partial failure.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of inorganic flux, make inorganic flux by the even proportioning that adopts inorganic acid and inorganic salts, uniformity and the stability of scaling powder are increased, help that weldering ability is good, water-soluble, easy cleaning, highly corrosive, can effectively remove iron and nonferrous metal surface oxidation film layer, efficiency high, on inorganic flux universal, have market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of inorganic flux, the mass percent of formula comprises:
Hydrochloric acid 35 ~ 55%,
Hydrofluoric acid 20 ~ 30%,
Zinc chloride 15 ~ 20%,
Stannic chloride 5 ~ 15%.
In a preferred embodiment of the present invention, the mass percent of the formula of described inorganic flux comprises potassium chloride 5%.
In a preferred embodiment of the present invention, the mass percent of the formula of described inorganic flux comprises sodium chloride 5%.
In a preferred embodiment of the present invention, the concentration of described hydrochloric acid is less than 10%.
The invention has the beneficial effects as follows: inorganic flux of the present invention have help that weldering ability is good, water-soluble, easy cleaning, highly corrosive, the oxidation film layer that can effectively remove iron and nonferrous metal surface, efficiency advantages of higher, on inorganic flux universal, have market prospects widely.
The specific embodiment
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of inorganic flux, the mass percent of formula comprises:
Hydrochloric acid 35 ~ 55%,
Hydrofluoric acid 20 ~ 30%,
Zinc chloride 15 ~ 20%,
Stannic chloride 5 ~ 15%, adopt inorganic acid to mix and make to be used as scaling powder with inorganic salts, entirety solution water soluble, therefore belong to water-soluble flux, easy to use, easy to clean, it is acid that overall solution is, because of its highly corrosive having, therefore can remove the oxidation film layer of iron and nonferrous metal surface, or be used in the welding of stainless steel, teleoseal, copper or tin, but can not use electronic product.
Preferably, the mass percent of the formula of described inorganic flux comprises potassium chloride 5%, and potassium chloride source is wide, increases overall mobility and abundant contact by increasing the large inorganic salts of mobility, has effectively overcome the problems such as scaling powder partial failure in the past.
Preferably, the mass percent of the formula of described inorganic flux comprises sodium chloride 5%, and sodium chloride is the substitute of potassium chloride, can adopt the mixture of potassium chloride, sodium chloride or potassium chloride and sodium chloride in the time of formula, and compatibility is wide, applicability is strong.
Preferably, the concentration of described hydrochloric acid is less than 10%, belongs to watery hydrochloric acid, active strong, stable chemical nature.
The beneficial effect of inorganic flux of the present invention is:
One, by adopting inorganic acid to mix and make to be used as scaling powder with inorganic salts, entirety solution water soluble, belong to water-soluble flux, easy to use, easy to clean, entirety solution is acid, because of its highly corrosive having, thus can remove the oxidation film layer of iron and nonferrous metal surface, or be used in the welding of stainless steel, teleoseal, copper or tin;
Two, by adopting the mixture of potassium chloride, sodium chloride or potassium chloride and sodium chloride to increase overall mobility and abundant contact, effectively overcome the problems such as scaling powder partial failure in the past, compatibility is wide, applicability is strong;
Three, with respect to general inorganic flux, the concentration of the hydrochloric acid of the inorganic flux is here less than 10%, belongs to watery hydrochloric acid, active strong, stable chemical nature.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. an inorganic flux, is characterized in that, the mass percent of formula comprises:
Hydrochloric acid 35 ~ 55%,
Hydrofluoric acid 20 ~ 30%,
Zinc chloride 15 ~ 20%,
Stannic chloride 5 ~ 15%.
2. inorganic flux according to claim 1, is characterized in that, the mass percent of the formula of described inorganic flux comprises potassium chloride 5%.
3. inorganic flux according to claim 1, is characterized in that, the mass percent of the formula of described inorganic flux comprises sodium chloride 5%.
4. inorganic flux according to claim 1, is characterized in that, the concentration of described hydrochloric acid is less than 10%.
CN201410096774.9A 2014-03-17 2014-03-17 Inorganic flux Pending CN103846574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410096774.9A CN103846574A (en) 2014-03-17 2014-03-17 Inorganic flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410096774.9A CN103846574A (en) 2014-03-17 2014-03-17 Inorganic flux

Publications (1)

Publication Number Publication Date
CN103846574A true CN103846574A (en) 2014-06-11

Family

ID=50854952

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410096774.9A Pending CN103846574A (en) 2014-03-17 2014-03-17 Inorganic flux

Country Status (1)

Country Link
CN (1) CN103846574A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104551448A (en) * 2015-01-19 2015-04-29 九龙坡区辉腾机械加工厂 Novel soldering flux and preparation method thereof
CN111331281A (en) * 2018-12-19 2020-06-26 吕延成 Tin brazing method for stainless steel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1337294A (en) * 2000-08-08 2002-02-27 中国华晶电子集团公司 Flux for hot dip coating of tin into lead of transistor
CN1449886A (en) * 2003-04-22 2003-10-22 虞选勇 Stainless steel soldering flux

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1337294A (en) * 2000-08-08 2002-02-27 中国华晶电子集团公司 Flux for hot dip coating of tin into lead of transistor
CN1449886A (en) * 2003-04-22 2003-10-22 虞选勇 Stainless steel soldering flux

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
葛文君: "无铅药芯焊锡丝用无卤素助焊剂的研究", 《中国优秀硕士学位论文全文数据库(电子期刊) 工程科技I辑》 *
高四: "助焊剂的组成及研究进展", 《印制电路信息》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104551448A (en) * 2015-01-19 2015-04-29 九龙坡区辉腾机械加工厂 Novel soldering flux and preparation method thereof
CN111331281A (en) * 2018-12-19 2020-06-26 吕延成 Tin brazing method for stainless steel

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Application publication date: 20140611