CN103928381B - A kind of aid for measuring wafer contacts angle - Google Patents
A kind of aid for measuring wafer contacts angle Download PDFInfo
- Publication number
- CN103928381B CN103928381B CN201310013337.1A CN201310013337A CN103928381B CN 103928381 B CN103928381 B CN 103928381B CN 201310013337 A CN201310013337 A CN 201310013337A CN 103928381 B CN103928381 B CN 103928381B
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- CN
- China
- Prior art keywords
- aid
- scale
- cun
- measured
- wafer
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
Abstract
A kind of aid for measuring wafer contacts angle, the aid includes upper surface and side, also comprising the measured hole and scale for being arranged on upper surface.The present invention is directly used in existing Contact-angle measurement equipment, can be accurately positioned in measurement, is forbidden the engineer caused to judge by accident so as to avoid wafer positioning.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of aid for measuring wafer contacts angle.
Background technology
, it is necessary to judge same wafer or contrast different wafer interfacial surface tensions in the gold-tinted processing procedure of semiconductor manufacturing
Difference, according to being exactly the size for measuring contact angle.
The scheme at measurement wafer contacts angle is that wafer is placed on platform now, not fixed or coordinate setting, by note
Emitter roughly drips water on wafer, and the contact angle of water droplet and crystal column surface is then detected with optical instrument, and we define
For spot measurement.But actual demand is, it would be desirable to accurately know the position of measurement, such as the tension force of center, from side
The tension force that 2 centimetres of edge, or the same position of two wafers, the tension force in such as 1 centimetre from center of region, but utilize existing
Measuring method, due to no measurer, so accurate position can not be known.
Current measuring instrument is adapted to spot measurement, but for the different zones of same wafer, or different wafers
Same area, it is impossible to accomplish to be accurately positioned.
It is obvious with the center of wafer and edge thickness and CD differences due to being rotary coating for lithographic process, such as
Fruit will measure the different zones of same wafer, or the same area of different wafers contact angle, just with greater need for being accurately positioned.
The content of the invention
A kind of aid at measurement wafer contacts angle that the present invention is provided, can provide accurate fixed for the measurement of contact angle
Position, it is to avoid erroneous judgement.
In order to achieve the above object, the present invention provides a kind of aid for measuring wafer contacts angle, the aid bag
Containing upper surface and side, also comprising the measured hole and scale for being arranged on upper surface.
Described aid is cylindric.
The internal diameter of described upper surface is matched with the external diameter of tested wafer.
The height of described side and the matched of tested wafer.
The position in the position setting measurement hole measured as needed.
Described scale is set to donut.
Described scale is arranged on scale film, and scale film is covered in upper surface.
Described scale is accurate to millimeter.
Described aid uses transparent material.
Described aid uses acryl material.
The present invention is directly used in existing Contact-angle measurement equipment, can be accurately positioned in measurement, so as to avoid
Wafer positioning is forbidden the engineer caused to judge by accident.
Brief description of the drawings
Fig. 1 is the use schematic diagram of the aid of the present invention；
Fig. 2 is the top view of the aid of the present invention.
Embodiment
Below according to Fig. 1 and Fig. 2, presently preferred embodiments of the present invention is illustrated.
As depicted in figs. 1 and 2, the present invention provides a kind of aid for measuring wafer contacts angle, and the aid is circle
Column, the aid includes upper surface 101 and side 102, also comprising the measured hole 103 and scale for being arranged on upper surface 101
104；
Described aid uses transparent material, and observing to become apparent from；
The internal diameter of described upper surface 101 is matched with the external diameter of tested wafer, convenient positioning；
Play support and positioning crystal round fringes in the height of described side 102 and the matched of tested wafer, side 102
Effect；
Described measured hole 103, which is divided equally, to be set, the two side positions setting conventional according to work, can be opened up according to actual needs
Exhibition；
Described scale 104 is set to donut, and scale is accurate to millimeter；
In the present embodiment, the aid is applied to 8 cun of circular wafers, the upper surface 101 of the aid and side
Face 102 all matches with 8 cun of circular wafers, and the aid uses acryl material, and the position measured as needed will be surveyed
Metering-orifice 103 is arranged on the centre bit of upper surface 101, and ring-type is arranged on 1/8 radius position and 1/4 radius position, and scale 104 is set
On scale film, scale film is covered in upper surface 101；Using acryl material and scale film, manufacturing cost is saved；
In contact angle of the aid at measurement wafer contacts angle provided using the present invention to measure wafer, with measurement
Exemplified by 8 cun of wafers, using following steps：
Step 1, wafer is placed on the measuring table of measuring instrument, and the aid that size and wafer are matched
It is placed on wafer（As shown in Figure 1）；
Step 2, the position that needs to carry out Contact-angle measurement is determined using the scale on aid, such as：Center
Tension force, the tension force of 2 centimetres of isolated edge, or from center 1 centimetre region tension force；
Step 3, according to defined location in step 2, pass through the measured hole being arranged on aid relevant position, utilize
Syringe drips to water droplet on wafer（As shown in Figure 1）；
Step 4, the contact angle for detecting using optical measurement water droplet and crystal column surface.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for the present invention's
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (4)
1. a kind of aid for measuring 8 cun of circular wafers contact angles, it is characterised in that the aid to be cylindric, comprising
Upper surface（101）And side（102）, also comprising being arranged on upper surface（101）Measured hole（103）And scale（104）, backman
Tool uses transparent material, upper surface（101）Internal diameter be tested 8 cun of circular wafers external diameter match, sideways（102）Height
Matched with being tested 8 cun of circular wafers, measured hole（103）Respectively set, scale（104）Donut is set to, is carved
Degree（104）It is accurate to millimeter.
2. the aid of 8 cun of circular wafers contact angles is measured as claimed in claim 1, it is characterised in that surveyed as needed
The position setting measurement hole of amount（103）Position.
3. the aid of 8 cun of circular wafers contact angles is measured as claimed in claim 1, it is characterised in that described scale
（104）It is arranged on scale film, scale film is covered in upper surface（101）.
4. the aid of 8 cun of circular wafers contact angles is measured as claimed in claim 1, it is characterised in that described auxiliary
Instrument uses acryl material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310013337.1A CN103928381B (en) | 2013-01-15 | 2013-01-15 | A kind of aid for measuring wafer contacts angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310013337.1A CN103928381B (en) | 2013-01-15 | 2013-01-15 | A kind of aid for measuring wafer contacts angle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103928381A CN103928381A (en) | 2014-07-16 |
| CN103928381B true CN103928381B (en) | 2017-09-05 |
Family
ID=51146560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310013337.1A Active CN103928381B (en) | 2013-01-15 | 2013-01-15 | A kind of aid for measuring wafer contacts angle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103928381B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106092828B (en) * | 2016-06-08 | 2018-10-02 | 清华大学 | The contact angle measuring method focused based on microscope |
| CN108120409B (en) * | 2017-12-25 | 2020-05-19 | 武汉华星光电技术有限公司 | Film thickness measuring apparatus and film thickness measuring method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101089680A (en) * | 2007-08-20 | 2007-12-19 | 友达光电（苏州）有限公司 | Device for measuring contact corner |
| CN102135490A (en) * | 2010-12-13 | 2011-07-27 | 海南大学 | Measuring device for measuring contact angle and surface energy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120008438U (en) * | 2011-05-31 | 2012-12-10 | 주식회사 에스이오 | Contact measuring device using laser |
-
2013
- 2013-01-15 CN CN201310013337.1A patent/CN103928381B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101089680A (en) * | 2007-08-20 | 2007-12-19 | 友达光电（苏州）有限公司 | Device for measuring contact corner |
| CN102135490A (en) * | 2010-12-13 | 2011-07-27 | 海南大学 | Measuring device for measuring contact angle and surface energy |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103928381A (en) | 2014-07-16 |
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