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Method for recycling wafer cutting waste mortar

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CN103921363A
CN103921363A CN 201410176832 CN201410176832A CN103921363A CN 103921363 A CN103921363 A CN 103921363A CN 201410176832 CN201410176832 CN 201410176832 CN 201410176832 A CN201410176832 A CN 201410176832A CN 103921363 A CN103921363 A CN 103921363A
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mortar
cutting
waste
wafer
method
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CN103921363B (en )
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刘洋
赵朋占
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南通综艺新材料有限公司
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Abstract

The invention discloses a method for recycling wafer cutting waste mortar. The method includes the following steps that the waste mortar used in wafer cutting is taken and filtered through a filter bag; the waste mortar is mixed and stirred again after adjustment, and mortar density testing is carried out through a density tester in the mixing process to achieve a mortar density capable of meeting use requirements of squaring; a stainless steel filter screen is additionally arranged on a mortar circulation port of a squarer cutting chamber, and a mortar tank double-layer filter screen is replaced by a single-layer filter screen; the groove gap of a home roll used in square forming is designed to be 157.0 mm; equipment technological parameters are adjusted, and segmented cutting is adopted; the whole machining process is monitored, and the size of produced polycrystal square ingots is controlled. According to the method, the wafer cutting waste mortar is recycled for squaring linear cutting of ingots, the defect that traditional cutting technologies relay on new sand and new liquid is overcome mainly through technology research and development and technology update, the wafer cutting waste mortar is applied to polycrystal ingot squaring, and therefore the consumption of auxiliary materials of an enterprise is reduced and enterprise benefits are improved.

Description

一种切片废旧砂浆二次循环利用方法 One kind of the secondary sections mortar waste recycling methods

技术领域 FIELD

[0001] 本发明具体涉及一种切片废旧砂浆二次循环利用方法。 [0001] The present invention particularly relates to a slicing method of recycling secondary waste mortar.

背景技术 Background technique

[0002] 太阳能硅片需求主要来自于太阳能电池制造,目前我国太阳能电池产量位居全球各国之首,因此我国硅片企业主要为国内企业提供原料,部分产品向欧洲及北美洲地区出口。 [0002] The main demand for solar wafers from solar cell manufacturers, is currently ranked first in China's solar cell production in the countries of the world, so our silicon business mainly for domestic enterprises to provide raw materials, some products exported to Europe and North America. 太阳能光伏市场应用将呈现宽领域、多样化的趋势适应各种需求的光伏产品将不断问世除了大型并网光伏电站、分布式发电、与建筑相结合的光伏发电系统、小型光伏系统、离网光伏系统也将快速兴起。 Solar PV market will show a wide field of applications, the trend of diversification to adapt to the various needs of PV products will continue to come in addition to large-scale grid-connected photovoltaic power plants, distributed generation, photovoltaic power generation system combined with the construction of small-scale PV systems, off-grid PV the system will rapidly rise.

[0003] 2013年随着国家对光伏行业政策调整和扶持,太阳能光伏装机需求量将迅猛发展,这将带动我国硅片行业需求的增长。 [0003] 2013 as the country and support the PV industry policy adjustment, installed capacity of solar PV demand will be rapid development, which will drive the growth of our industry needs silicon. 但是太阳能硅片切割依然成本较高,从而制约了企业发展和经济效益,硅片产品质量、技术水平与世界先进水平还存在一定的差距,主要体现在研发创新能力较低、制造技术水平层次不齐,降低硅片成本仍将是光伏行业的发展主题, But still high cost of solar wafer cutting, thereby constraining the development of enterprises and economic benefits, silicon product quality, technical level with the world advanced level there is still a gap, mainly reflected in lower R & D innovation, manufacturing technology level is not Qi, reduce the cost of silicon will remain the theme of development of photovoltaic industry,

开方线切割技术是光伏硅片切割行业重要组成部分,传统开方切割目前国内外光伏行业所用的砂浆基本为新液新砂按照一定的比例配置(如国内1: 1.1),具有辅料消耗较大、效益低等缺陷,由于新材料技术的发展,对于降低辅材消耗的要求越来越高。 Prescribing wire cutting technology is an important part of the PV wafering industry, the traditional cutting prescribing the photovoltaic industry at home and abroad substantially mortar used for the new new sand was arranged according to a certain ratio (such as domestic 1: 1.1) having a greater consumption of materials , low efficiency defects, due to the development of new materials technology, to reduce the consumption of auxiliary increasingly demanding. 同时也是光伏硅片行业不断向高效率,低成本的方向发展。 Silicon photovoltaic industry but also to the development of high-efficiency, low-cost direction. 提高核心竞争力实现从规模增长型向质量效益型的转变。 Improve the core competitiveness to achieve the transition from growth to quality and efficiency of scale type.

发明内容 SUMMARY

[0004] 发明目的:本发明提供一种切片废旧砂浆二次循环利用方法。 [0004] Object of the invention: The present invention provides a slicing method of recycling secondary waste mortar.

[0005] 技术方案:一种切片废旧砂浆二次循环利用方法,包括如下步骤: [0005] The technical solutions: A slicing method of recycling secondary waste mortar, comprising the steps of:

(I)选取硅片切割使用过的废旧砂浆,每缸砂浆使用量约为320L-330L,抽取废旧砂浆时使用过滤袋进行过滤;过滤主要作用为将切片切割过程中产生的杂质进行去除,防止开方作业时断线。 (I) selected wafering waste mortar used, each cylinder of mortar using approximately 320L-330L, was filtered using filter bags when extracting waste mortar; filter main role is to cut a slice of impurities generated during removal, to prevent disconnection job prescribing.

[0006] (2)由于切片使用过的废旧砂浆密度为1.625-1.63Kg\ Hl2不符合开方砂浆切割使用要求:开方使用砂浆密度为1.667-1.669Kg\ m%要对切片废旧砂浆进行重新配制调整,通过在砂浆搅拌缸里面添加50 Kg-60 Kg(1200#)的新的砂进行调配,搅拌,调配过程中使用密度测试仪进行砂浆密度测试,达到开方使用要求的砂浆密度1.667-1.669Kg\ in2即可; [0006] (2) Since the used waste slice mortar density 1.625-1.63Kg \ Hl2 dicing does not meet the requirements prescribe mortar: prescribing the use of mortar density \ m% waste to re-slice the mortar 1.667-1.669Kg formulated adjustment, it is formulated by the addition of new sand 50 Kg-60 Kg (1200 #) in which the mortar mixing tank, stirring, used during the deployment density tester density test mortar, to prescribing requirements mortar density 1.667- 1.669Kg \ in2 can;

(3)将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网;防止因开方过程中产生杂质造成断线导致尺寸偏小。 (3) adding a stainless steel mortar squarer circulation port at the cutting chamber filter, a double filter mortar cylinders were 80 mesh and 150 mesh to 800 single filter object; prevent generation of impurities due to the evolution process caused small size lead to breakage.

[0007] (4)对开方使用的主辊由原来槽距为156.8mm改为157.0mm槽距;加大的主要原因为防止废旧砂浆切割力不够导致晶体边宽尺寸开小。 [0007] (4) used for prescribing the original main roll groove pitch of 156.8mm to 157.0mm slot pitch; mainly due to increase of the mortar to prevent cutting waste is not enough to open resulting in crystal size smaller edge width.

[0008] (5)对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切割,杂质层主要分布在多晶硅锭头部约为20— 25mm、尾部约为30—40 mm,详细切割工艺变更为: [0008] (5) for the device to adjust the process parameters, the main technical parameters of the cutting from the original tension 75N to 80N, the flow rate increased from 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting Laid taken segmented cutting process, the impurity layer is mainly distributed in the polycrystalline silicon ingot head of about 20- 25mm, the tail is about 30-40 mm, a cutting process is changed as detailed:

Figure CN103921363AD00041

(6)对整个加工过程进行监控,生产的多晶方锭尺寸控制在156.3±0.3。 (6) to monitor the whole process, the production of polycrystalline ingots square size control 156.3 ± 0.3.

[0009] 作为优化:所述步骤一中过滤袋为150-180目。 [0009] As optimization: in said step a 150 to 180 mesh filter bag.

[0010] 作为优化:所述步骤二中废旧砂浆的密度为1.625-1.63Kg\ m2。 [0010] As optimization: the density of the waste mortar in two steps 1.625-1.63Kg \ m2.

[0011] 作为优化:所述步骤二中搅拌时间为3.5—4小时。 [0011] As optimization: the stirring time in step II 3.5-4 hours.

[0012] 有益效果:本发明对切片废旧砂浆二次利用于铸锭开方线切割,主要通过技术研发、工艺更新克服传统切割技术依赖新砂新液,使其切片废旧砂浆用于多晶铸锭开方,从而降低企业辅料消耗,提高企业效益。 [0012] Advantageous Effects: The present invention for use in the secondary slice ingot scrap mortar prescribing wire cutting, mainly through technical development, process updates overcome conventional cutting liquid new techniques rely on new sand, mortar for the waste so that the slice polycrystalline ingot prescribing, resulting in lower consumption of materials and improve enterprise efficiency. 可以达到并超过国内外同领域同类水平,有效解决铸锭开方线切割对新砂新液的依赖,并可以向光伏行业推广。 You can meet and exceed the same level in the same field at home and abroad, prescribing an effective solution ingot cutting dependence on new sand the new solution, and can be extended to the photovoltaic industry.

[0013] 本发明对切片废旧砂浆进行重新配制调整,将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网,防止因开方过程中产生杂质造成断线导致尺寸偏小。 [0013] The present invention mortar waste slice adjustment reconstitution, add stainless steel filter squarer circulation port at the cutting chamber mortar, mortar cylinders were double filters 80 mesh to 150 mesh and 800-mesh filter monolayer network, to prevent generation of impurities cause breakage during evolution led to small dimension.

[0014] 对开方使用的主辊由原来槽距为156.8mm改为157.0mm槽距;加大的主要原因为防止废旧砂浆切割力不够导致晶体边宽尺寸开小。 [0014] prescribing the use of the original main roll groove pitch of 156.8mm to 157.0mm slot pitch; mainly due to increase of the mortar to prevent cutting waste is not enough to open resulting in crystal size smaller edge width.

[0015] 对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切割。 [0015] The apparatus for adjusting the process parameters, the main technical parameters of the cutting from the original tension 75N to 80N, the flow rate increased from 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting process to take sub Laid segment cutting.

具体实施方式[0016] 下面结合具体实施例对本发明进行详细阐述。 DETAILED DESCRIPTION [0016] The present invention will be described in detail with reference to specific embodiments.

[0017] 具体实施例1: [0017] DETAILED DESCRIPTION Example 1:

一种切片废旧砂浆二次循环利用方法,包括如下步骤: One kind of the secondary sections mortar waste recycling method, comprising the steps of:

(1)选取硅片切割使用过的废旧砂浆,每缸砂浆使用量约为320L,抽取废旧砂浆时使用过滤袋进行过滤,其中过滤袋为150目; (1) Select the wafer cutting waste mortar used, each cylinder of mortar using approximately 320L, filtered using filter bags when extracting waste mortar, which is a 150 mesh filter bag;

(2)对切片废旧砂浆进行重新配制调整,废旧砂浆的密度为1.625Kg\m2,通过在砂浆搅拌缸里面添加50 Kg (1200#)的新的砂进行调配,搅拌,搅拌时间为3.5小时,调配过程中使用密度测试仪进行砂浆密度测试,达到开方使用要求的砂浆密度1.667Kg\ m2即可; (2) waste slice adjustment reconstitution mortar, mortar density waste 1.625Kg \ m2, was added 50 Kg (1200 #) new sand mortar formulations inside the cylinder by stirring, stirring, stirred 3.5 hours, during the formulation of density tester density test mortar, to prescribing requirements mortar density 1.667Kg \ m2 can;

(3)将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网; (3) adding a stainless steel mortar squarer circulation port at the cutting chamber filter, a double filter mortar cylinders were 80 mesh and 150 mesh to 800 single filter object;

(4)对开方使用的主棍由原来槽距为156.8mm改为157.0mm槽距; (4) main grooves stick to the original pitch of prescribing use of 156.8mm to 157.0mm slot pitch;

(5)对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切害1J,杂质层主要分布在多晶娃锭头部约为20mm、尾部约为30mm ; (5) adjust the process parameters of the device, the main technical parameters of the cutting from the original tension 75N to 80N, the flow rate increased from 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting process to take sub Laid stage cut damage 1J, mainly in the impurity layer of polycrystalline ingots doll head of about 20mm, about 30mm tail;

(6)对整个加工过程进行监控,生产的多晶方锭尺寸控制在156。 (6) to monitor the whole process, the production of polycrystalline ingot size control 156 side.

[0018] 具体实施例2: [0018] Specific Example 2:

一种切片废旧砂浆二次循环利用方法,包括如下步骤: One kind of the secondary sections mortar waste recycling method, comprising the steps of:

(1)选取硅片切割使用过的废旧砂浆,每缸砂浆使用量约为330L,抽取废旧砂浆时使用过滤袋进行过滤,其中过滤袋为180目; (1) Select the wafer cutting waste mortar used, each cylinder of mortar using approximately 330L, filtered using filter bags when extracting waste mortar, which is a 180 mesh filter bag;

(2)对切片废旧砂浆进行重新配制调整,废旧砂浆的密度为1.63Kg\m2,通过在砂浆搅拌缸里面添加60 Kg (1200#)的新的砂进行调配,搅拌,搅拌时间为4小时,调配过程中使用密度测试仪进行砂浆密度测试,达到开方使用要求的砂浆密度1.669Kg\ m2即可; (2) waste slice adjustment reconstitution mortar, mortar density of 1.63 kg of waste \ M2, was added 60 Kg (1200 #) new sand mortar formulations inside the cylinder by stirring, agitation, stirring time was 4 hours, during the formulation of density tester density test mortar, to prescribing requirements mortar density 1.669Kg \ m2 can;

(3)将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网; (3) adding a stainless steel mortar squarer circulation port at the cutting chamber filter, a double filter mortar cylinders were 80 mesh and 150 mesh to 800 single filter object;

(4)对开方使用的主棍由原来槽距为156.8mm改为157.0mm槽距; (4) main grooves stick to the original pitch of prescribing use of 156.8mm to 157.0mm slot pitch;

(5)对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切害1J,杂质层主要分布在多晶娃锭头部约为25mm、尾部约为40 mm ; (5) adjust the process parameters of the device, the main technical parameters of the cutting from the original tension 75N to 80N, the flow rate increased from 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting process to take sub Laid stage cut damage 1J, mainly in the impurity layer of polycrystalline ingots doll head of about 25mm, the tail about 40 mm;

(6)对整个加工过程进行监控,生产的多晶方锭尺寸控制在156.6。 (6) to monitor the whole process, the production of polycrystalline 156.6 square ingot size control.

[0019] 具体实施例3: [0019] DETAILED Example 3:

一种切片废旧砂浆二次循环利用方法,包括如下步骤: One kind of the secondary sections mortar waste recycling method, comprising the steps of:

(1)选取硅片切割使用过的废旧砂浆,每缸砂浆使用量约为325L,抽取废旧砂浆时使用过滤袋进行过滤,其中过滤袋为170目; (1) Select the wafer cutting waste mortar used, each cylinder of mortar using approximately 325L, filtered using filter bags when extracting waste mortar, which is a 170 mesh filter bag;

(2)对切片废旧砂浆进行重新配制调整,废旧砂浆的密度为1.628Kg\ m2,通过在砂浆搅拌缸里面添加55Kg(1200#)的新的砂进行调配,搅拌,搅拌时间为3.8小时,调配过程中使用密度测试仪进行砂浆密度测试,达到开方使用要求的砂浆密度1.668Kg\ m2即可; (2) The sections of waste mortar reconstitution adjusted waste mortar density 1.628Kg \ m2, add new sand 55Kg (1200 #) is formulated by stirring in the mortar inside the cylinder, with stirring, stirring time of 3.8 hours, the formulation during a density tester density test mortar, to prescribing requirements mortar density 1.668Kg \ m2 can;

(3)将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网; (3) adding a stainless steel mortar squarer circulation port at the cutting chamber filter, a double filter mortar cylinders were 80 mesh and 150 mesh to 800 single filter object;

(4)对开方使用的主棍由原来槽距为156.8mm改为157.0mm槽距; (5)对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切害I],杂质层王要分布在多晶娃徒头部约为23mm、尾部约为37mm; (4) main grooves stick to the original pitch of prescribing use of 156.8mm to 157.0mm slot pitch; (5) the device for adjusting the process parameters, the main technical parameters of the cutting from the original tension 75N to 80N, the flow rate from the original the 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting process will take Laid segmented cutting damage the I], Wang distributed in the impurity layer of polycrystalline doll head only about 23mm, about the tail 37mm;

(6)对整个加工过程进行监控,生产的多晶方锭尺寸控制在156.3。 (6) to monitor the whole process, the production of polycrystalline 156.3 square ingot size control.

Claims (4)

1.一种切片废旧砂浆二次循环利用方法,其特征在于:包括如下步骤: (1)选取硅片切割使用过的废旧砂浆,每缸砂浆使用量约为320L-330L,抽取废旧砂浆时使用过滤袋进行过滤; (2)对切片废旧砂浆进行重新配制调整,通过在砂浆搅拌缸里面添加50 Kg-60Kg(1200#)的新的砂进行调配,搅拌,调配过程中使用密度测试仪进行砂浆密度测试,达到开方使用要求的砂衆密度1.667-1.669Kg\ m2即可; (3)将开方机切割室砂浆循环口处添加不锈钢过滤网、将砂浆缸双层过滤网分别为80目和150目改为单层800目的过滤网; (4)对开方使用的主棍由原来槽距为156.8mm改为157.0mm槽距; (5)对设备工艺参数进行调整,主要技术参数将切割张力由原来75N改为80N,流量由原来的140 L\min改为145L\min,由于多晶硅锭存在杂质层,特将切割工艺采取分段式切害I],杂质层主要分布在多晶硅锭头部约为20— 2 A slicing method of recycling secondary waste mortar, characterized by: comprising the steps of: (1) Select the wafer cutting waste mortar used, each cylinder of mortar using approximately 320L-330L, used when extracting waste mortar filter bag filter; (2) the sections of waste mortar reconstitution adjustment, be formulated by the addition of new sand 50 Kg-60Kg (1200 #) in the mortar mixing tank inside, with stirring, the formulation process of density tester mortar density test, to prescribing requirements all sand density 1.667-1.669Kg \ m2 can; (3) adding a stainless steel filter squarer circulation port at the cutting chamber mortar, mortar cylinders were double filters 80 mesh 800 to 150 mesh and a single layer filter object; (4) of the main groove stick prescribing use original pitch of 156.8mm to 157.0mm slot pitch; (5) the device for adjusting the process parameters, the main technical parameters 75N to 80N tension cut from the original, the original flow rate of 140 L \ min to 145L \ min, due to the presence of the impurity layer polycrystalline silicon ingot, the cutting process will take Laid segmented cutting damage the I], the impurity layer is mainly in the polycrystalline silicon ingot head of about 20-2 5mm、尾部约为30—40 mm ; (6)对整个加工过程进行监控,生产的多晶方锭尺寸控制在156.3±0.3。 5mm, the tail is about 30-40 mm; (6) to monitor the whole process, the production of polycrystalline ingots square size control 156.3 ± 0.3.
2.如权利要求1所述的切片废旧砂浆二次循环利用方法,其特征在于:所述步骤一中过滤袋为150-180目。 2. Slice waste mortar according to claim 1 using the method of the second cycle, characterized in that: in said step a 150 to 180 mesh filter bag.
3.如权利要求1所述的切片废旧砂浆二次循环利用方法,其特征在于:所述步骤二中废旧砂浆的密度为1.625-1.63Kg\ m2。 1 slice of waste mortar according to claim secondary recycling method characterized in that: said waste mortar density in two steps 1.625-1.63Kg \ m2.
4.如权利要求1所述的切片废旧砂浆二次循环利用方法,其特征在于:所述步骤二中搅拌时间为3.5— 4小时。 4. The waste slice mortar according to claim 1 secondary recycling method, wherein: said step II is stirred for 3.5 to 4 hours time.
CN 201410176832 2014-04-29 One kind of the secondary sections mortar waste recycling methods CN103921363B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105522657A (en) * 2015-12-04 2016-04-27 湖南红太阳光电科技有限公司 Secondary recycling method of silicon rod slicing waste mortar

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0990498A1 (en) * 1998-09-10 2000-04-05 Wacker-Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Method and device for cutting wafers from a hard brittle ingot
US6113473A (en) * 1997-04-25 2000-09-05 G.T. Equipment Technologies Inc. Method and apparatus for improved wire saw slurry
CN201998337U (en) * 2010-10-26 2011-10-05 深圳市拓日新能源科技股份有限公司 System for recovering cutting fluid and silicon carbide in waste mortar of siliconchip cutting
CN202826099U (en) * 2012-08-09 2013-03-27 海润光伏科技股份有限公司 Double-way cutting system for solar silicon wafer
JP2013166193A (en) * 2012-02-15 2013-08-29 Nippon Steel & Sumitomo Metal Corp Method for cutting hard brittle ingot
CN103522431A (en) * 2013-10-21 2014-01-22 山西潞安太阳能科技有限责任公司 Silicon wafer cutting technology

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6113473A (en) * 1997-04-25 2000-09-05 G.T. Equipment Technologies Inc. Method and apparatus for improved wire saw slurry
EP0990498A1 (en) * 1998-09-10 2000-04-05 Wacker-Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Method and device for cutting wafers from a hard brittle ingot
CN201998337U (en) * 2010-10-26 2011-10-05 深圳市拓日新能源科技股份有限公司 System for recovering cutting fluid and silicon carbide in waste mortar of siliconchip cutting
JP2013166193A (en) * 2012-02-15 2013-08-29 Nippon Steel & Sumitomo Metal Corp Method for cutting hard brittle ingot
CN202826099U (en) * 2012-08-09 2013-03-27 海润光伏科技股份有限公司 Double-way cutting system for solar silicon wafer
CN103522431A (en) * 2013-10-21 2014-01-22 山西潞安太阳能科技有限责任公司 Silicon wafer cutting technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105522657A (en) * 2015-12-04 2016-04-27 湖南红太阳光电科技有限公司 Secondary recycling method of silicon rod slicing waste mortar

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