CN103904204B - Light-emitting diode light bar - Google Patents
Light-emitting diode light bar Download PDFInfo
- Publication number
- CN103904204B CN103904204B CN201210573187.5A CN201210573187A CN103904204B CN 103904204 B CN103904204 B CN 103904204B CN 201210573187 A CN201210573187 A CN 201210573187A CN 103904204 B CN103904204 B CN 103904204B
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- circuit board
- backlight unit
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
A kind of light-emitting diode light bar, circuit board including being internally provided with metallic circuit, the light-emitting diode light bar further include setting on the board and with several light-emitting diode chip for backlight unit of the circuit board electrical connection and sealing several light-emitting diode chip for backlight unit packaging body, the circuit board has upper surface and the lower surface opposite with the upper surface, and be recessed inwardly in the middle part of the upper surface and to form a groove, which is arranged in the groove.
Description
Technical field
The present invention relates to a kind of light-emitting diode light bar more particularly to a kind of lower-cost light-emitting diode light bars.
Background technology
Compared to traditional light emitting source, light emitting diode（Light Emitting Diode, LED）With light-weight, body
The advantages that product is small, pollution is low, long lifespan, as a kind of novel light emitting source, is applied to each field more and more
In the middle.However, for the backlight module of LCD TV, it usually needs be packaged light emitting diode, then coordinate secondary
Optical lens is attached in lamp bar again later, so that the cost increase of the light-emitting diode light bar, price is more high
It is expensive.
Invention content
In view of this, the present invention is intended to provide a kind of lower-cost light-emitting diode light bar.
A kind of light-emitting diode light bar, including it is internally provided with the circuit board of metallic circuit, the light-emitting diode light bar is also
Including be arranged on the board and with several light-emitting diode chip for backlight unit of the circuit board electrical connection and seal this several luminous two
The packaging body of pole pipe chip, the circuit board have upper surface and the lower surface opposite with the upper surface, and the middle part of the upper surface
It is recessed inwardly to form a groove, which is arranged in the groove.
The present invention by the light-emitting diode light bar directly use un-encapsulated light-emitting diode chip for backlight unit, in this way,
Reduce the packaging cost of light-emitting diode chip for backlight unit so that light-emitting diode light bar cost is relatively low.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram for the light-emitting diode light bar that a preferred embodiment of the present invention provides.
Fig. 2 is the stereoscopic schematic diagram that light-emitting diode light bar removes packaging body in Fig. 1.
Fig. 3 is light-emitting diode light bar in Fig. 1 along the diagrammatic cross-section of III-III lines.
Main element symbol description
| Light-emitting diode light bar | 1 |
| Circuit board | 10 |
| Upper surface | 11 |
| Lower surface | 12 |
| Groove | 13 |
| Bottom surface | 14 |
| Side | 15 |
| Reflective layer | 16 |
| Light-emitting diode chip for backlight unit | 20 |
| Conducting wire | 30 |
| Packaging body | 40 |
| Top surface | 41 |
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
As depicted in figs. 1 and 2, the light-emitting diode light bar 1 that first embodiment of the invention provides a comprising strip
Circuit board 10, several light-emitting diode chip for backlight unit 20 being arranged in circuit board 10 and seal several light-emitting diode chip for backlight unit 20
One packaging body 40.
Circuit board 10 has a upper surface 11 and a lower surface 12 opposite with upper surface 11.The upper surface 11 of circuit board 10
Middle part be recessed inwardly to form the groove 13 of a strip, and groove 13 is vertical upwards by a bottom surface 14 and along the edge of bottom surface 14
The side 15 of extension is surrounded.Please refer to Fig. 3, a reflective layer 16 is equipped on bottom surface 14 and side 15, reflective layer 16 makes
It is incident to the opening that light thereon is reflected to groove 13.Circuit board 10 is internally provided with metallic circuit.
Several light-emitting diode chip for backlight unit 20 are arranged in the groove 13 of circuit board 10 and on bottom surfaces 14, and luminous two
Pole pipe chip 20 is electrically connected by two conducting wires 30 with the metallic circuit formation inside circuit board 10, to which the circuit board 10 is luminous
Diode chip for backlight unit 20 provides electric energy.In this present embodiment, the opposite sides of two conducting wires, the 30 spontaneous luminous diode chip 20 is drawn,
And side 15 is extended to from bottom surface 14, and be finally electrically connected from side 15 with the metallic circuit inside circuit board 10.
Packaging body 40 is provide with and seals several light-emitting diode chip for backlight unit 20, and packaging body 40 fills entire groove 13, from
And several light-emitting diode chip for backlight unit 20 can be protected.It is to be appreciated that the separate circuit board lower surface 12 of packaging body 40
41 shape of top surface can be planar or arc-shaped.In the present embodiment, packaging body 40 protrudes the outside of its circuit board 10,
41 shape of top surface is planar, and cross section is substantially t-shaped.Packaging body 40 is completed using gluing process, first in groove 13
Using packaging plastic on dispenser point, so that packaging plastic is covered several light-emitting diode chip for backlight unit 20 and fill up groove 13 surrounded it is whole
Then a region squeezes the top surface 41 for making the upper end of packaging body 40 form required shape with mold.In this present embodiment, may be used
When preparing packaging plastic directly in packaging plastic internal mix fluorescent powder, or after packaging is accomplished, in the top surface of packaging body 40 41
One layer of fluorescence coating is coated, goes out light color with what acquisition was wanted.
When light-emitting diode light bar 1 shines, the light sent out is incident to after the inside of packaging body 40, a part of light
The surface of line directive light-emitting diode chip for backlight unit 20, another part light directive light-emitting diode chip for backlight unit 20 it is lateral.Directive is sent out
Light right over luminous diode chip 20 is refracted when projecting packaging body 40 into the air of surrounding；Directive light-emitting diodes tube core
The lateral light of piece 20 is incident on after passing through packaging body 40 on the reflective layer 16 on side 15 and bottom surface 14, in the anti-of reflective layer 16
It penetrates under effect, which is reflected to 40 region of packaging body of 1 top of light-emitting diode light bar, then from light emitting diode
40 region of the packaging body outgoing of the top of lamp bar 1, some light sent out so as to avoid light-emitting diode chip for backlight unit 20 is by circuit board
10 side 15, bottom surface 14 absorb, and light-emitting diodes are increased under conditions of being not required to the secondary optics elements such as arranging extra lens
The luminous intensity of the surface of spot item 1.
The present invention on the light-emitting diode light bar 1 by directly using un-encapsulated light-emitting diode chip for backlight unit 20, such as
This, the packaging cost of light-emitting diode chip for backlight unit 20 is reduced without secondary optical lens so that light-emitting diode light bar 1
Cost it is relatively low；In addition, by being arranged light-emitting diode chip for backlight unit 20 in the groove 13 of circuit board 10, then it is right with packaging body 40
The light-emitting diode chip for backlight unit 20 is sealed, so that light-emitting diode light bar 1 is more frivolous.
The technology contents and technical characterstic of the present invention are disclosed above, however those skilled in the art are still potentially based on this hair
Bright teaching and announcement and make various replacements and modification without departing substantially from spirit of that invention.Therefore, protection scope of the present invention is answered
It is not limited to the revealed content of embodiment, and should include various replacements and modification without departing substantially from the present invention, and is appended right
It is required that being covered.
Claims (8)
1. a kind of light-emitting diode light bar, including it is internally provided with the circuit board of metallic circuit, it is characterised in that：The light-emitting diodes
It is somebody's turn to do on the board and with several light-emitting diode chip for backlight unit of the circuit board electrical connection and sealing if spot item further includes setting
The packaging body of dry light-emitting diode chip for backlight unit, the circuit board have upper surface and the lower surface opposite with the upper surface, and the upper table
It is recessed inwardly to form a groove in the middle part of face, which is arranged in the groove, and the groove is by a bottom surface
The side upwardly extended with the edge along the bottom surface is equipped with a reflective layer, Mei Yifa around being formed on the bottom surface and the side
Luminous diode chip is electrically connected with the circuit board by two conducting wires, which is sticked the reflective layer, and two conducting wire was from should
The opposite sides of light-emitting diode chip for backlight unit is drawn, and extends to the side from the groove floor, finally along vertical with the side
Direction be electrically connected with the metallic circuit inside the circuit board through the reflective layer.
2. light-emitting diode light bar as described in claim 1, it is characterised in that：Several light-emitting diode chip for backlight unit are arranged at this
On bottom surface.
3. light-emitting diode light bar as described in claim 1, it is characterised in that：Each light-emitting diode chip for backlight unit passes through two conducting wires
It is electrically connected with the metallic circuit formation inside the circuit board.
4. light-emitting diode light bar as described in claim 1, it is characterised in that：The full entire groove of packaging body filling.
5. light-emitting diode light bar as claimed in claim 4, it is characterised in that：The top surface shape of the packaging body be it is planar or
Arc-shaped.
6. light-emitting diode light bar as claimed in claim 5, it is characterised in that：The top surface shape of the packaging body be it is planar,
And its cross section is T-shaped.
7. light-emitting diode light bar as described in claim 1, it is characterised in that：Fluorescent powder is equipped in the packaging body.
8. light-emitting diode light bar as described in claim 1, it is characterised in that：Several light-emitting diode chip for backlight unit pass through one
Packaging body seals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210573187.5A CN103904204B (en) | 2012-12-26 | 2012-12-26 | Light-emitting diode light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210573187.5A CN103904204B (en) | 2012-12-26 | 2012-12-26 | Light-emitting diode light bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103904204A CN103904204A (en) | 2014-07-02 |
| CN103904204B true CN103904204B (en) | 2018-07-31 |
Family
ID=50995438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210573187.5A Expired - Fee Related CN103904204B (en) | 2012-12-26 | 2012-12-26 | Light-emitting diode light bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103904204B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106382609B (en) * | 2016-10-18 | 2023-05-30 | 南昌大学 | LED filament strip |
| TWI699907B (en) * | 2018-01-25 | 2020-07-21 | 致伸科技股份有限公司 | Light source module |
| CN208687433U (en) * | 2018-07-13 | 2019-04-02 | 深圳市宇辰星光电有限公司 | A kind of bent flexible light band cut |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365907A (en) * | 2006-03-31 | 2009-02-11 | 香港应用科技研究院有限公司 | Illumination system and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI356486B (en) * | 2007-09-07 | 2012-01-11 | Young Lighting Technology | Led light source module and manufacturing method t |
| US8132935B2 (en) * | 2008-09-01 | 2012-03-13 | Samsung Led Co., Ltd. | Light emitting module |
-
2012
- 2012-12-26 CN CN201210573187.5A patent/CN103904204B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101365907A (en) * | 2006-03-31 | 2009-02-11 | 香港应用科技研究院有限公司 | Illumination system and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103904204A (en) | 2014-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170927 Address after: Guangdong province Shenzhen city Longhua District Dalang street community of Longsheng gold dragon road e-commerce incubator exhibition Tao Commercial Plaza E block 706 Applicant after: Shenzhen Meliao Technology Transfer Center Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180613 Address after: 318056 Shang Yun Village, Heng Jie Town, Luqiao District, Taizhou, Zhejiang Applicant after: Taizhou Liansheng Electric Appliance Co.,Ltd. Address before: 518000 Guangdong Shenzhen Longhua New District big wave street Longsheng community Tenglong road gold rush e-commerce incubation base exhibition hall E commercial block 706 Applicant before: Shenzhen Meliao Technology Transfer Center Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180731 Termination date: 20211226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |