CN103889161B - Prevent the method and printed circuit board that the ring-shaped inductors on printed circuit board fall off - Google Patents
Prevent the method and printed circuit board that the ring-shaped inductors on printed circuit board fall off Download PDFInfo
- Publication number
- CN103889161B CN103889161B CN201210566938.0A CN201210566938A CN103889161B CN 103889161 B CN103889161 B CN 103889161B CN 201210566938 A CN201210566938 A CN 201210566938A CN 103889161 B CN103889161 B CN 103889161B
- Authority
- CN
- China
- Prior art keywords
- ring
- shaped inductors
- circuit board
- printed circuit
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 29
- 230000035939 shock Effects 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Abstract
The present invention discloses a kind of method that the ring-shaped inductors prevented on printed circuit board fall off, and includes the following steps：The ring-shaped inductors are positioned close to the position of the device being fixedly secured on printed circuit board, side is hit and is located at offside of the ring-shaped inductors relative to the device.A kind of printed circuit board is also disclosed, includes ring-shaped inductors and electrolytic capacitor on plate body, the ring-shaped inductors are positioned close to the position of the electrolytic capacitor, and the shock side of printed circuit board is located at offside of the ring-shaped inductors relative to the device.The above method and printed circuit board, since ring-shaped inductors being positioned close to be fixedly secured the position of device on a printed circuit, when circuit board is hit, the device being fixedly secured can stop that ring-shaped inductors substantially deviate original position, so as to prevent from falling off because of pin breakage.
Description
Technical field
The present invention relates to printed-board technologies, fall off more particularly to a kind of ring-shaped inductors prevented on printed circuit board
Method and a kind of printed circuit board.
Background technology
On the various circuit devices based on printed circuit board, such as computer main board, display card etc., thereon in addition to being welded with
Outside various integrated chips, it is also welded with the peripheral components such as capacitance, inductance.Ring-shaped inductors are a kind of forms of inductance, also frequent
For printed circuit board.
Fig. 1 a are a kind of positive structure schematics of ring-shaped inductors, and Fig. 1 b are the side schematic views of the ring-shaped inductors.Annular
Inductance is generally made of magnet ring and the coil being wrapped on magnet ring, and the initiating terminal and end of pin and coil are separately connected extraction simultaneously
It is fixed.To protect ring-shaped inductors, also increase protective shell in entire coil outer sometimes.Its coil generally uses enameled wire, and
Pin is usually exactly to be formed after the end of a thread directly by enameled wire removes the peel wicking.
It can be seen that this structure based on ring-shaped inductors, due to the weight of inductance entirety（Weight including magnet ring and coil
Amount）It is bigger, and the intensity of pin is inadequate simultaneously, this is easy for causing printed circuit board by slightly larger shock disturbance
When, ring-shaped inductors fall off from printed circuit board.When carrying out drop test to complete machine, the pin of ring-shaped inductors is easy for breaking
It splits, ring-shaped inductors is caused to fall off.
Invention content
Based on this, it is necessary to which providing a kind of prevents from causing the ring-shaped inductors on printed circuit board to fall off due to the shocks such as falling
Method.
A method of it prevents the ring-shaped inductors on printed circuit board from falling off, includes the following steps：By the ring-shaped inductors
It is positioned close to the position of the device being fixedly secured on printed circuit board, the shock side of printed circuit board is located at the annular electro
Feel the offside relative to the device being fixedly secured.
The technical front of the ring-shaped inductors is in face of the device being fixedly secured in one of the embodiments,.
The ring-shaped inductors are placed between the device being fixedly secured described at least two in one of the embodiments,.
The ring-shaped inductors and the distance between the device being fixedly secured are less than 5 millimeters in one of the embodiments,.
In one of the embodiments, bolster is additionally provided between the ring-shaped inductors and the device being fixedly secured.
The bolster is white glue in one of the embodiments,.
The device being fixedly secured is electrolytic capacitor in one of the embodiments,.
A kind of printed circuit board, includes ring-shaped inductors and electrolytic capacitor on plate body, and the ring-shaped inductors setting exists
Close to the position of the electrolytic capacitor, the shock side of printed circuit board is located at pair of the ring-shaped inductors relative to the device
Side.
The distance between the ring-shaped inductors and electrolytic capacitor are less than 5 millimeters in one of the embodiments,.
In one of the embodiments, bolster is additionally provided between the ring-shaped inductors and electrolytic capacitor.
The above method and printed circuit board, due to being positioned close to be fixedly secured in printed circuit board by ring-shaped inductors
On device position, when circuit board is hit, the device being fixedly secured can stop that ring-shaped inductors substantially deviate originally
Position, so as to prevent from falling off because of pin breakage.
Description of the drawings
Fig. 1 a are a kind of positive structure schematics of ring-shaped inductors；
Fig. 1 b are the side schematic views of ring-shaped inductors shown in Fig. 1 a；
Fig. 2 is a kind of printing circuit board element schematic layout pattern.
Specific implementation mode
As shown in Fig. 2, being a kind of printing circuit board element schematic layout pattern.The printed circuit board 10 is equipped with ring-shaped inductors
100, electrolytic capacitor 200 and chip 300 etc..The side that the ring-shaped inductors of one embodiment prevented on printed circuit board fall off is provided
Ring-shaped inductors 100 are positioned close to the position of the electrolytic capacitor 200 on printed circuit board 10, and ring-shaped inductors by method, this method
100 are located at the offside of the shock side of electrolytic capacitor 200.In this way, when because hitting so that ring-shaped inductors 100 deviate original position
When, electrolytic capacitor 200 can stop ring-shaped inductors 100, prevent it from leading to pin breakage because hitting the offset generated.
Preferably, the technical front of ring-shaped inductors 100 faces electrolytic capacitor 200.Front, that is, coil of ring-shaped inductors 100 is whole
The annular surface of body can see conducting wire from the front of ring-shaped inductors 100 and radially be arranged outward from hub of a spool.Correspondingly
Be ring-shaped inductors 100 side.The front of ring-shaped inductors 100 can enable electrolytic capacitor 200 in face of electrolytic capacitor 200
Preferably stop ring-shaped inductors 100.
Preferably, ring-shaped inductors 100 are placed between at least two electrolytic capacitors 200.Electrolytic capacitor 200 in this way
Stop ring-shaped inductors 100 from least two directions, prevents it from leading to pin breakage because hitting the offset generated.
Preferably, the distance between ring-shaped inductors 100 and electrolytic capacitor 200 are less than 5 millimeters.5 millimeters of distances below can
To ensure that electrolytic capacitor 200 can preferably stop ring-shaped inductors 100.When distance be more than 5 millimeters when, ring-shaped inductors 100 due to
May have enough spaces to tilt, it is also possible that leading to pin breakage and falling off.
Preferably, bolster 400 is additionally provided between ring-shaped inductors 100 and electrolytic capacitor 200.Bolster 400 can buffer
Interaction force between ring-shaped inductors 100 and electrolytic capacitor 200 can avoid the shock being likely to occur from damaging.In a reality
It applies in example, which is white glue.White glue has certain viscosity and insulation, can be after making printed circuit board
Phase adds between ring-shaped inductors 100 and electrolytic capacitor 200.
In above-described embodiment, ring-shaped inductors 100 are proximate to the setting of electrolytic capacitor 200.It is appreciated that in other embodiment
In, electrolytic capacitor 200, which can also replace with other, can be fixedly secured device on the printed circuit board 10.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of method that the ring-shaped inductors prevented on printed circuit board fall off, includes the following steps：
The ring-shaped inductors are positioned close to the position of the device being fixedly secured on printed circuit board, the ring-shaped inductors position
Offside in the shock side of the device being fixedly secured；
The ring-shaped inductors and the distance between the device being fixedly secured are less than 5 millimeters.
2. the method that the ring-shaped inductors according to claim 1 prevented on printed circuit board fall off, which is characterized in that described
The technical front of ring-shaped inductors is in face of the device being fixedly secured.
3. the method that the ring-shaped inductors according to claim 1 prevented on printed circuit board fall off, which is characterized in that described
Ring-shaped inductors are placed between the device being fixedly secured described at least two.
4. the method that the ring-shaped inductors according to claim 1 prevented on printed circuit board fall off, which is characterized in that described
It is additionally provided with bolster between ring-shaped inductors and the device being fixedly secured.
5. the method that the ring-shaped inductors according to claim 4 prevented on printed circuit board fall off, which is characterized in that described
Bolster is white glue.
6. preventing the method that the ring-shaped inductors on printed circuit board fall off, feature according to Claims 1 to 5 any one of them
It is, the device being fixedly secured is electrolytic capacitor.
7. a kind of printed circuit board includes ring-shaped inductors and electrolytic capacitor on plate body, which is characterized in that the annular electro
Sense is positioned close to the position of the electrolytic capacitor, and the ring-shaped inductors are located at the offside of the shock side of the electrolytic capacitor；Institute
It states the distance between ring-shaped inductors and electrolytic capacitor and is less than 5 millimeters.
8. printed circuit board according to claim 7, which is characterized in that also set between the ring-shaped inductors and electrolytic capacitor
There is bolster.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210566938.0A CN103889161B (en) | 2012-12-24 | 2012-12-24 | Prevent the method and printed circuit board that the ring-shaped inductors on printed circuit board fall off |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210566938.0A CN103889161B (en) | 2012-12-24 | 2012-12-24 | Prevent the method and printed circuit board that the ring-shaped inductors on printed circuit board fall off |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103889161A CN103889161A (en) | 2014-06-25 |
| CN103889161B true CN103889161B (en) | 2018-10-19 |
Family
ID=50957819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210566938.0A Expired - Fee Related CN103889161B (en) | 2012-12-24 | 2012-12-24 | Prevent the method and printed circuit board that the ring-shaped inductors on printed circuit board fall off |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103889161B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104504211B (en) * | 2014-12-31 | 2017-07-11 | 北京经纬恒润科技有限公司 | A kind of method and device for optimizing capacity arrangement |
| CN107438330A (en) * | 2017-08-23 | 2017-12-05 | 西安易朴通讯技术有限公司 | A kind of device architecture |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1253605A2 (en) * | 1997-02-18 | 2002-10-30 | Canon Kabushiki Kaisha | Power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit |
| CN201532830U (en) * | 2009-11-16 | 2010-07-21 | 深圳市海光电子有限公司 | Improvement structure of single-winding panel inductor |
| CN101959364A (en) * | 2010-06-02 | 2011-01-26 | 苏州工业园区胜欣电子有限公司 | Fixing device |
| CN102035914A (en) * | 2010-10-15 | 2011-04-27 | 络派模切（北京）有限公司 | Method for manufacturing decorating part of phone speaker |
| TW201243168A (en) * | 2011-04-22 | 2012-11-01 | Wistron Corp | Locking mechanism and an electronic device having the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0897090A (en) * | 1994-09-27 | 1996-04-12 | Matsushita Electric Ind Co Ltd | Electrolytic capacitor |
| JP2005295752A (en) * | 2004-04-02 | 2005-10-20 | Namiki Precision Jewel Co Ltd | Surface mounting type vibration motor and portable communication apparatus carrying the same |
| US7518238B2 (en) * | 2005-12-02 | 2009-04-14 | Intel Corporation | Mounting flexible circuits onto integrated circuit substrates |
-
2012
- 2012-12-24 CN CN201210566938.0A patent/CN103889161B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1253605A2 (en) * | 1997-02-18 | 2002-10-30 | Canon Kabushiki Kaisha | Power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit |
| CN201532830U (en) * | 2009-11-16 | 2010-07-21 | 深圳市海光电子有限公司 | Improvement structure of single-winding panel inductor |
| CN101959364A (en) * | 2010-06-02 | 2011-01-26 | 苏州工业园区胜欣电子有限公司 | Fixing device |
| CN102035914A (en) * | 2010-10-15 | 2011-04-27 | 络派模切（北京）有限公司 | Method for manufacturing decorating part of phone speaker |
| TW201243168A (en) * | 2011-04-22 | 2012-11-01 | Wistron Corp | Locking mechanism and an electronic device having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103889161A (en) | 2014-06-25 |
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Granted publication date: 20181019 |