CN103857956A - Method of changing light emitting angle of LED light strip by glue injection - Google Patents
Method of changing light emitting angle of LED light strip by glue injection Download PDFInfo
- Publication number
- CN103857956A CN103857956A CN201280003927.XA CN201280003927A CN103857956A CN 103857956 A CN103857956 A CN 103857956A CN 201280003927 A CN201280003927 A CN 201280003927A CN 103857956 A CN103857956 A CN 103857956A
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- China
- Prior art keywords
- encapsulating
- mould
- light
- led
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A method of changing light emitting angle of a LED light strip (2) by glue injection is disclosed. The method comprises the following steps: A. lighting test for the light strip (2); B. pasting the protective film and double side adhesive to the back of the light strip (2); C. pasting the light strip (2) on the operation platform; D. covering a mold (1) on the pasted light strip (2); E. injecting glue by a machine; F. removing the mold (1); G. lighting test; H. aging; and I. packaging. The end face of the injection part of the mold (1) has a reversed trapezium or a parallelogram contour shape. Glue is injected into the mold (1) by the machine and formed by molding, during the environment temperature is 23 DEG C-27 DEG C, the thickness of the glue injected is 5mm-10 mm, and the injection time is 2 minutes-30 minutes. 8 hours later after injections, following steps are successively conducted: removing the mold (1), lighting test and aging. 24 hours later after injections, the LED light strip (2) is packaged. LED light strips (2) with a variety of light emitting angles can be produced by the method. As the light emitting angle is changed, light intensity of the light strip (2) is changed, hence directional lighting is realized.
Description
Specification
LED changes the method and technology field of rising angle by encapsulating
The present invention relates to technical field of lamps, more particularly to LED changes the method for rising angle by encapsulating.
Background technology
Conventional light source can be divided into spot light and line source two types, tengsten lamp belongs to spot light with Electricity-saving lamp bulb, and fluorescent tube then belongs to line source, during both the above light source luminescent, all it is outwards to launch light with radial fashion, therefore can not be via adjustment light source light projector angle.And the light emitting diode of illuminator is gradually applied in recent years（LED, Light Emitting Diode) then belong to planar light source（Or directive property light source）Although light emitting diode has the advantages that small volume, being so applied to light fixture inch has many shortcomings：1st, light projector focal power is limited, therefore is not suitable for conventional lamp, it is necessary to coordinates and is lighted using reflective or straight-down negative structure cover body.2nd, the brightness of single light emitting diode there is no method to meet light fixture demand, the lumination of light emitting diode of many fixed light projector angles must be used to provide enough brightness, cause the problems such as straight-down negative light fixture for fixing light projector angle produces light inequality hook, dazzle and limited light emitting region, cause beholder's uncomfortable.3rd, LED source light projector angle is fixed, therefore the refraction of fixed light projector angle or reflection type lamp are difficult to be directed to different light or demand, adjust different rising angles and light type, using upper less elastic.4th, in conventional light emitting diodes light fixture, because light emitting diode is integrally fixed on circuit board, change or repair if desired single LED source, or during change light emitting diode configuration categories, must be together with circuit board in the lump disassembling, assembling and replacing, its maintenance mode is extremely difficult, and ordinary consumer is difficult to self-changeable or maintenance.If the 5th, have single or the damage of part light emitting diode, i.e., it can be observed immediately.Traditional both feet formula light emitting diode is limited because of structure, therefore be there are light projector angle and can not be adjusted at random, and single light emitting diode failure is the problems such as be difficult to single and repair.Method there is no to be effectively improved at present based on the limited shortcoming of light emitting diode light projector angle, to control the rising angle of light-emitting diode (LED) illuminating lamp, going out optical range and light extraction degree of hook, straight-down negative LED lamp can only be arranged through light emitting diode is changed, or improve in installing lens on LED source additional, and reflect or reflection type light-emitting diode lamp is typically through design refraction or reflector or changes the mode of reflector to reach the rising angle of control light fixture, go out the purposes such as optical range and light extraction degree of hook.For straight-down negative light fixture, although good light extraction efficiency can be obtained, but light emitting diode light projector angle can not be adjusted, cause user can not be directed to environmental demand, the light uniformity of optimal lamp luminescence angle, light extraction light type and light-emitting zone is adjusted, incident luminous environment comfort level is also just reduced.In daily life, the need in order to be adapted to various illuminations, there are a variety of demands for the lighting angle of light fixture.Polytype light fixture of prior art its go out
Specification
Optic angle is typically all fixed, when user needs light fixture to meet the place that light extraction requires variant, it is necessary to using the different light fixture of rising angle, so as to cause the increase of customer using cost.
In the prior art, all directions of LED lamp bead during encapsulating are upward, and encapsulating is all direct encapsulation type.Its rising angle is single, it is impossible to meet the demand of user.Therefore, the method that a kind of highly desirable LED light bar of people changes rising angle by encapsulating comes out.
The content of the invention
The technical problems to be solved by the invention are：Overcoming the LED of prior art, lighting rising angle is single, can not meet the defect of user's request after encapsulating solidification, a kind of method that LED changes rising angle by encapsulating is provided, the method that this LED changes rising angle by encapsulating can require to produce or customization LED product according to user to the different of rising angle, so as to meet the demand of user.
The technical solution adopted for the present invention to solve the technical problems is：LED by encapsulating change rising angle method, Bao include Ru Xia Walk it is rapid：
A, light bar lighting test；
B, light bar back side pasting protective film and double faced adhesive tape；
C, by light bar patch on the operational platform；
D, mould is enclosed on above the light bar posted；
E, machine encapsulating（Spontaneous curing）；
F, mould of dismantling；
G, lighting test；
H, aging：
I, packaging；
In step D, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal or parallelogram；In the rapid E of Walk, glue is poured into mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 °C 27 °C, and it was 30 minutes 2 minutes 5 10 encapsulating operating times that encapsulating thickness, which is,.
In the above-mentioned technical solutions, encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, and encapsulating is packed after 24 hours to LED product.
Further, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal, and size is：Following a width of 911 a height of 5mm 10mm, a width of 12mn 20mm in top
Further, the end surface shape parallelogram at the encapsulating position of the mould, the medial surface at the encapsulating position and the angle of mould bottom surface are 45 ° 63 °
The beneficial effects of the invention are as follows：1st, production stage of the invention is few, and LED good product quality makes
Use long lifespan.2nd, the present invention is not in waste water, waste gas and waste residue in each production stage, meets environmental requirement.3rd, present invention less energy consumption in implementation process, meets power conservation requirement.4th, in step E, glue is poured into mould by machine, and glue is by mould molding, and the end surface shape at the encapsulating position of the mould is in inverted trapezoidal or parallelogram, and when the end surface shape at encapsulating position is in inverted trapezoidal, the size of the inverted trapezoidal is：Following a width of 9 11 a height of 5ram 10mm, top a width of 12 20 is when the end surface shape parallelogram at encapsulating position, the medial surface at encapsulating position and the angle of mould bottom surface are 45 ° 63 °, as can be seen here, the shape at encapsulating position can be varied, LED product its rising angle produced by the present invention also have it is varied, so as to solve the technical problems to be solved by the invention.5th, a variety of changes can occur for LED product its rising angle produced by the present invention, so as to meet demand of the user to the LED product of different rising angles.6th, after the rising angle of LED product changes, it, which goes out luminous intensity, can also change, i.e., a certain range lighting joint storytelling is very bright, so as to reach the purpose of directional lighting.The change of 7 encapsulating thickness also can correspondingly change the rising angle of LED product and go out luminous intensity.8th, it is low by present invention production its cost of raw material of LED product and production cost.9th, the present invention is practical, with wide market prospects.
Brief description of the drawings
Fig. 1 is the die profile in encapsulating in first embodiment of the invention；
Fig. 2 is the die profile in encapsulating in second embodiment of the invention；
Fig. 3 is the top view of LED in the present invention；
Fig. 4 is the front view of LED in the present invention.
Description of reference numerals of the Fig. 1 into Fig. 4：
1 --- mould；2 --- light bar；3 --- LED illuminator；4 --- electrode.
Embodiment
The present invention is further detailed explanation with specific embodiment below in conjunction with the accompanying drawings, is not that the practical range of the present invention is confined to this.
Embodiment 1, shown as shown in Figure 1, Figure 3 and Figure 4, the method that the LED described in the present embodiment changes rising angle by encapsulating, comprises the following steps：
A, the lighting test of light bar 2；
B, the back side pasting protective film of light bar 2 and double faced adhesive tape；
C, light bar 2 pasted on the operational platform；
D, mould 1 is enclosed on above the light bar 2 posted；
E, machine encapsulating（Spontaneous curing）；
Specification
F, mould of dismantling；
G, lighting test；
H, aging；
I, packaging；
In step D, the end surface shape parallelogram at the encapsulating position of the mould 1, the medial surface at the encapsulating position and the angle of the bottom surface of mould 1 are 45 °；In step E, glue is poured into mould 1 by machine, and glue is molded by mould 1, and the environment temperature of machine encapsulating is 23 °C of 27O, and encapsulating thickness is 7mm 8mm, and the encapsulating operating time is 15 minutes 10 minutes.Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED product.In Fig. 1, the angle of a medial surface at the encapsulating position and the bottom surface of mould 1 is 45 °, and its another medial surface and the angle of the bottom surface of mould 1 are 135 °, as shown by the arrows in Figure 1：Light bar 2 is located at the encapsulating position of the mould 1.As shown in Figure 3 and Figure 4, multiple LED illuminators 3 are provided with light bar 2, electrode 4 is respectively arranged with the two ends of light bar 2
Embodiment 2, as shown in Figure 2, Figure 3 and Figure 4, the method that the LED described in the present embodiment changes rising angle by encapsulating are same as Example 1, and difference is：In step D, the end surface shape parallelogram at the encapsulating position of the mould 1, the medial surface at the encapsulating position and the angle of the bottom surface of mould 1 are 63 °；In step E, glue is poured into mould 1 by machine, and glue is molded by mould 1, and the environment temperature of machine encapsulating is 23 °C ~ 27 °C, and encapsulating thickness is 5mn 7mm, and the encapsulating operating time is 9 minutes 2 minutes.Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED product.In fig. 2, the angle of a medial surface at the encapsulating position and the bottom surface of mould 1 is 63 °, and its another medial surface and the angle of the bottom surface of mould 1 are 117 °, as shown in arrow in Fig. 2；Light bar 2 is located at the encapsulating position of the mould 1.As shown in Figure 3 and Figure 4, multiple LED illuminators 3 are provided with light bar 2, electrode 4 is respectively arranged with the two ends of light bar 2
Embodiment 3, the method that the LED described in the present embodiment changes rising angle by encapsulating is same as Example 1, and difference is：In step D, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal, and the face size at the encapsulating position of the mould is：Following a width of 9, a height of 5 top a width of 12 is in step E, and glue is poured into mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 °C 27 °C, and encapsulating thickness is 5mm, and the encapsulating operating time is 9 minutes 2 minutes.Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED product.
Embodiment 4, the LED described in the present embodiment changes the method and embodiment of rising angle by encapsulating
Specification
1 is identical, and difference is：In step D, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal, and the face size at the encapsulating position of the mould is：Following a width of 10mm, a height of 8mm, a width of 15mm in top.In the rapid E of Walk, glue is poured into mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 °C 27 °C, and encapsulating thickness is 8 gangsters, and the encapsulating operating time is 9 minutes 2 minutes.Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED light bar products.
Embodiment 5, the method that the LED described in the present embodiment changes rising angle by encapsulating is same as Example 1, and difference is：In step D, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal, and the face size at the encapsulating position of the mould is：Following a width of 11 Chant, a height of 10 leg, a width of 20mm in top.In the rapid E of Walk, glue is poured into mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 27 °C of 23 X, and encapsulating thickness is 10mm, and the encapsulating operating time is 9 minutes 2 minutes.Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED light bar products.
Described above is only five preferred embodiments of the present invention, therefore the equivalent change or modification that all construction, feature and principles according to described in present patent application scope are done, for example, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal or parallelogram；When the end surface shape at encapsulating position is in inverted trapezoidal, the size of the inverted trapezoidal is：Following a width of 9mm l lmm, a height of 5mn！10mm, a width of 12 Chant 20mm in top;When the end surface shape parallelogram at encapsulating position, the medial surface at encapsulating position and the angle of mould bottom surface are 45
63 °, these features are also contained in the protection domain of present patent application.
Claims (1)
- Claims1st, LED changes the method for rising angle by encapsulating, it is characterised in that comprise the following steps：A, light bar lighting test；B, light bar back side pasting protective film and double faced adhesive tape；C, by light bar patch on the operational platform；D, mould is enclosed on above the light bar posted；E, machine encapsulating；F, mould of dismantling；G, lighting test；H, aging；I, packaging；In step D, the end surface shape at the encapsulating position of the mould is in inverted trapezoidal or parallelogram：In the rapid E of Walk, glue is poured into mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 °C 27 °C, and encapsulating thickness is the Hidden of 5 Hidden 10, and the encapsulating operating time is 30 minutes 2 minutes.2nd, LED according to claim 1 changes the method for rising angle by encapsulating, it is characterised in that：Encapsulating sequentially carries out the operation of mould, lighting test and Aging Step of dismantling after 8 hours, encapsulating is packed after 24 hours to LED product.3rd, LED according to claim 1 changes the method for rising angle by encapsulating, it is characterised in that：The end surface shape at the encapsulating position of the mould is in inverted trapezoidal, and size is：Following a width of 9mm ~ l lmm, a height of 5mn！10mm, a width of 12mm 20inm in top.4th, LED according to claim 1 changes the method for rising angle by encapsulating, it is characterised in that：The end surface shape parallelogram at the encapsulating position of the mould, the medial surface at the encapsulating position and the angle of mould bottom surface are 45 ° 63 °.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/076400 WO2013177796A1 (en) | 2012-06-01 | 2012-06-01 | Method of changing light emitting angle of led light strip by glue injection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103857956A true CN103857956A (en) | 2014-06-11 |
| CN103857956B CN103857956B (en) | 2016-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280003927.XA Active CN103857956B (en) | 2012-06-01 | 2012-06-01 | LED changes the method for rising angle by encapsulating |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103857956B (en) |
| WO (1) | WO2013177796A1 (en) |
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| CN201731346U (en) * | 2010-07-29 | 2011-02-02 | 北京尚明时代光电科技有限公司 | Annular LED light source |
| CN102208518A (en) * | 2010-04-20 | 2011-10-05 | 蒋伟东 | Integrated patch unit |
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- 2012-06-01 CN CN201280003927.XA patent/CN103857956B/en active Active
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| JPH11260766A (en) * | 1998-03-12 | 1999-09-24 | Fujitsu Ltd | Method of manufacturing plate for forming solder ball method of manufacturing semiconductor device, and the semiconductor device |
| US20090189165A1 (en) * | 2008-01-29 | 2009-07-30 | Kingbright Electronic Co., Ltd. | Light-emitting diode light source |
| CN101230959A (en) * | 2008-02-04 | 2008-07-30 | 林万炯 | Flexible water-proof LED lamp belt and embedding technique thereof |
| CN101587923A (en) * | 2008-05-19 | 2009-11-25 | 玉晶光电股份有限公司 | Method for using screen plate for packaging and molding light emitting diode (LED) |
| JP2010027756A (en) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | Light emitting device |
| CN101393955A (en) * | 2008-10-28 | 2009-03-25 | 福建省苍乐电子企业有限公司 | Fabrication of fluorescent power layer of large power white light LED and fabricating tool |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103857956B (en) | 2016-03-30 |
| WO2013177796A1 (en) | 2013-12-05 |
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