CN103857956B - LED changes the method for rising angle by encapsulating - Google Patents
LED changes the method for rising angle by encapsulating Download PDFInfo
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- CN103857956B CN103857956B CN201280003927.XA CN201280003927A CN103857956B CN 103857956 B CN103857956 B CN 103857956B CN 201280003927 A CN201280003927 A CN 201280003927A CN 103857956 B CN103857956 B CN 103857956B
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- Prior art keywords
- encapsulating
- mould
- light bar
- led
- rising angle
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A kind of method being changed LED (2) rising angle by encapsulating, is comprised the following steps: A. light bar (2) lighting test; B. at light bar (2) back side pasting protective film and double faced adhesive tape; C. light bar (2) is pasted on the operational platform; D. mould (1) is installed in the light bar (2) posted; E. machine encapsulating; F. mould (1) is removed; G. lighting test; H. aging; I. pack.The end surface shape at the encapsulating position of mould (1) is inverted trapezoidal or parallelogram.Glue is poured in mould (1) by machine, and glue is shaping by mould (1), and its environment temperature is 23 ° ~ 27 ° C, and encapsulating thickness is 5mm ~ 10mm, and the encapsulating time is 2 minutes ~ 10 minutes.Encapsulating sequentially performed mould (1) of dismantling after 8 hours, and lighting test and Aging Step, encapsulating was packed LED (2) product after 24 hours.By said method, can produce the various LED of angular (2), luminous intensity changes with the change of rising angle, thus reaches the object of directional lighting.
Description
Technical field
The present invention relates to technical field of lamps, particularly relate to LED changes rising angle method by encapsulating.
Background technology
Conventional light source can be divided into spot light and line source two type, tengsten lamp and Electricity-saving lamp bulb belong to spot light, and fluorescent tube then belongs to line source, during above two kinds of light source luminescents, all that light is outwards launched with radial fashion, therefore cannot via adjustment light source light projector angle.And be applied to the light emitting diode (LED of lighting in recent years gradually, LightEmittingDiode) planar light source (or claiming directive property light source) is then belonged to, although light emitting diode has the little advantage of volume, but many shortcomings are had: 1, light projector focal power is limited when being so applied to light fixture, therefore be not suitable for conventional lamp, the cover body adopting reflective or straight-down negative structure must be coordinated luminous.2, the brightness of single light emitting diode there is no method and meets light fixture demand, the lumination of light emitting diode of many fixing light projector angles must be adopted to provide enough brightness, cause the problems such as the straight-down negative light fixture of fixing light projector angle produces uneven, the dazzle of light and light emitting region is limited, cause that beholder's is uncomfortable.3, LED source light projector angle is fixed, and refraction or the reflection type lamp of therefore fixing light projector angle are difficult to, for different light rays or demand, adjust different rising angle and light type, use more not elasticity.4, in conventional light emitting diodes light fixture, because light emitting diode fixes on circuit boards, if need change or keep in repair single LED source, or when changing light emitting diode configuration categories, must together with circuit board in the lump disassembling, assembling and replacing, its maintenance mode is quite difficult, and ordinary consumer is difficult to self-changeable or maintenance.If 5 when having single or part light emitting diode to damage, namely can be observed immediately.The double-legged formula light emitting diode of tradition limit because of structure, and therefore having light projector angle cannot adjust at random, and single light emitting diode fault is difficult to the problems such as single maintenance.There is no method at present based on the shortcoming that light emitting diode light projector angle is limited effectively to improve, for control light-emitting diode (LED) illuminating lamp rising angle, go out optical range and outgoing light homogeneity, straight-down negative LED lamp can only through the arrangement of change light emitting diode, or on LED source, install lens additional improve, and refraction or reflection type light-emitting diode lamp normally through design refraction reflector or change reflector mode with reach control light fixture rising angle, go out the object such as optical range and outgoing light homogeneity.With regard to straight-down negative light fixture, although good light extraction efficiency can be obtained, but light emitting diode light projector angle cannot be adjusted, cause user cannot for environmental demand, adjust the light uniformity of optimal lamp luminescence angle, bright dipping light type and light-emitting zone, incident luminous environment comfort level also just reduces.In daily life, in order to be applicable to the needs of various illumination, the lighting angle for light fixture has various different demand.Its beam angle of polytype light fixture of prior art is all generally fixing, when user needs light fixture can meet the variant place of bright dipping requirement, just needs the light fixture using rising angle different, thus causes the increase of customer using cost.
In prior art, LED lamp pearl in encapsulating process be all direction upwards, encapsulating is all direct encapsulation type.Its rising angle is single, can not meet the demand of user.Therefore, people urgently wish that a kind of method that LED changes rising angle by encapsulating is come out.
Summary of the invention
Technical problem to be solved by this invention is: the LED overcoming prior art solidifies at encapsulating the defect that rear lighting rising angle is single, can not meet consumers' demand, a kind of LED is provided to change the method for rising angle by encapsulating, the method that this LED changes rising angle by encapsulating can require to produce or customization LED product to the difference of rising angle according to user, thus meets the demand of user.
The technical solution adopted for the present invention to solve the technical problems is: LED changes the method for rising angle by encapsulating, comprises the steps:
A, light bar lighting test;
B, light bar back side pasting protective film and double faced adhesive tape;
C, by light bar paste on the operational platform;
D, mould is enclosed within above the light bar that posts;
E, machine encapsulating (spontaneous curing);
F, mould of dismantling;
G, lighting test;
H, aging;
I, packaging;
In step D, the end surface shape at the encapsulating position of described mould is inverted trapezoidal or parallelogram; In step e, glue is poured in mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 5mm ~ 10mm, and the encapsulating operating time is 2 minutes ~ 30 minutes.
In technique scheme, encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.
Further, the end surface shape at the encapsulating position of described mould is inverted trapezoidal, is of a size of: lower hem width is 9mm ~ 11mm, and height is 5mm ~ 10mm, and upper hem width is 12mm ~ 20mm.
Further, the end surface shape parallelogram at the encapsulating position of described mould, the medial surface at described encapsulating position and the angle of mould bottom surface are 45 ° ~ 63 °.
The invention has the beneficial effects as follows: 1, production stage of the present invention is few, LED good product quality, long service life.2, the present invention there will not be waste water, waste gas and waste residue in each production stage, meets environmental requirement.3, the present invention's less energy consumption in implementation process, meets power conservation requirement.4, in step e, glue is poured in mould by machine, glue passes through mould molding, the end surface shape at the encapsulating position of described mould is inverted trapezoidal or parallelogram, when the end surface shape at encapsulating position is inverted trapezoidal, described inverted trapezoidal is of a size of: lower hem width is 9mm ~ 11mm, and height is 5mm ~ 10mm, and upper hem width is 12mm ~ 20mm; When the end surface shape parallelogram at encapsulating position, the medial surface at encapsulating position and the angle of mould bottom surface are 45 ° ~ 63 °, as can be seen here, the shape at encapsulating position can be varied, its rising angle of LED product produced by the present invention also has varied, thus solves technical problem to be solved by this invention.Can be there is multiple change in its rising angle of LED product 5, produced by the present invention, thus meet the demand of user to the LED product of different rising angle.6, after the rising angle of LED product changes, it goes out luminous intensity and also can change, and namely a certain range lighting can be very bright, thus reach the object of directional lighting.7, the change of encapsulating thickness also can correspondingly change the rising angle of LED product and go out luminous intensity.8, by its cost of raw material of production LED product of the present invention and production cost low.9, the present invention is practical, has wide market prospects.
Accompanying drawing explanation
Fig. 1 is the die profile in first embodiment of the invention when encapsulating;
Fig. 2 is the die profile in second embodiment of the invention when encapsulating;
Fig. 3 is the top view of LED in the present invention;
Fig. 4 is the front view of LED in the present invention.
Description of reference numerals in Fig. 1 to Fig. 4:
1---mould; 2---light bar; 3---LED illuminator; 4---electrode.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation, is not practical range of the present invention is confined to this.
Embodiment 1, as shown in Figure 1, Figure 3 and Figure 4, the LED described in the present embodiment changes the method for rising angle by encapsulating, comprises the steps:
A, light bar 2 lighting test;
B, light bar 2 back side pasting protective film and double faced adhesive tape;
C, light bar 2 is pasted on the operational platform;
D, mould 1 is enclosed within above the light bar 2 that posts;
E, machine encapsulating (spontaneous curing);
F, mould of dismantling;
G, lighting test;
H, aging;
I, packaging;
In step D, the end surface shape parallelogram at the encapsulating position of described mould 1, the medial surface at described encapsulating position and the angle of mould 1 bottom surface are 45 °; In step e, glue is poured in mould 1 by machine, and glue is shaping by mould 1, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 7mm ~ 8mm, and the encapsulating operating time is 10 minutes ~ 15 minutes.Encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.In FIG, a medial surface at described encapsulating position and the angle of mould 1 bottom surface are 45 °, and the angle of its another medial surface and mould 1 bottom surface is 135 °, as shown by the arrows in Figure 1; Light bar 2 is positioned at the encapsulating position of described mould 1.As shown in Figure 3 and Figure 4, light bar 2 is provided with multiple LED illuminator 3, is respectively arranged with electrode 4 at light bar 2 two ends.
Embodiment 2, as shown in Figure 2, Figure 3 and Figure 4, the method that LED described in the present embodiment changes rising angle by encapsulating is identical with embodiment 1, difference is: in step D, the end surface shape parallelogram at the encapsulating position of described mould 1, the medial surface at described encapsulating position and the angle of mould 1 bottom surface are 63 °; In step e, glue is poured in mould 1 by machine, and glue is shaping by mould 1, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 5mm ~ 7mm, and the encapsulating operating time is 2 minutes ~ 9 minutes.Encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.In fig. 2, a medial surface at described encapsulating position and the angle of mould 1 bottom surface are 63 °, and the angle of its another medial surface and mould 1 bottom surface is 117 °, as shown by the arrows in Figure 2; Light bar 2 is positioned at the encapsulating position of described mould 1.As shown in Figure 3 and Figure 4, light bar 2 is provided with multiple LED illuminator 3, is respectively arranged with electrode 4 at light bar 2 two ends.
Embodiment 3, the method that LED described in the present embodiment changes rising angle by encapsulating is identical with embodiment 1, difference is: in step D, the end surface shape at the encapsulating position of described mould is inverted trapezoidal, the face size at the encapsulating position of described mould is: lower hem width is 9mm, height is 5mm, and upper hem width is 12mm.In step e, glue is poured in mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 5mm, and the encapsulating operating time is 2 minutes ~ 9 minutes.Encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.
Embodiment 4, the method that LED described in the present embodiment changes rising angle by encapsulating is identical with embodiment 1, difference is: in step D, the end surface shape at the encapsulating position of described mould is inverted trapezoidal, the face size at the encapsulating position of described mould is: lower hem width is 10mm, height is 8mm, and upper hem width is 15mm.In step e, glue is poured in mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 8mm, and the encapsulating operating time is 2 minutes ~ 9 minutes.Encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.
Embodiment 5, the method that LED described in the present embodiment changes rising angle by encapsulating is identical with embodiment 1, difference is: in step D, the end surface shape at the encapsulating position of described mould is inverted trapezoidal, the face size at the encapsulating position of described mould is: lower hem width is 11mm, height is 10mm, and upper hem width is 20mm.In step e, glue is poured in mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 10mm, and the encapsulating operating time is 2 minutes ~ 9 minutes.Encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.
The above is only five preferred embodiments of the present invention, therefore all equivalences done according to structure, feature and the principle described in patent claim of the present invention change or modify, and such as, the end surface shape at the encapsulating position of described mould is inverted trapezoidal or parallelogram; When the end surface shape at encapsulating position is inverted trapezoidal, described inverted trapezoidal is of a size of: lower hem width is 9mm ~ 11mm, and height is 5mm ~ 10mm, and upper hem width is 12mm ~ 20mm; When the end surface shape parallelogram at encapsulating position, the medial surface at encapsulating position and the angle of mould bottom surface are 45 ° ~ 63 °, and these features are also contained in the protection domain of patent application of the present invention.
Claims (2)
1.LED light bar changes the method for rising angle by encapsulating, it is characterized in that, comprises the steps:
A, light bar lighting test;
B, light bar back side pasting protective film and double faced adhesive tape;
C, by light bar paste on the operational platform;
D, mould is enclosed within above the light bar that posts;
E, machine encapsulating;
F, mould of dismantling;
G, lighting test;
H, aging;
I, packaging;
In step D, the end surface shape parallelogram at the encapsulating position of described mould; In step e, glue is poured in mould by machine, and glue is by mould molding, and the environment temperature of machine encapsulating is 23 DEG C ~ 27 DEG C, and encapsulating thickness is 5mm ~ 10mm, and the encapsulating operating time is 2 minutes ~ 30 minutes;
The medial surface at described encapsulating position and the angle of mould bottom surface are 45 ° ~ 63 °.
2. LED according to claim 1 changes the method for rising angle by encapsulating, it is characterized in that: encapsulating sequentially carries out after 8 hours dismantling the operation of mould, lighting test and Aging Step, and encapsulating was packed LED product after 24 hours.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2012/076400 WO2013177796A1 (en) | 2012-06-01 | 2012-06-01 | Method of changing light emitting angle of led light strip by glue injection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103857956A CN103857956A (en) | 2014-06-11 |
| CN103857956B true CN103857956B (en) | 2016-03-30 |
Family
ID=49672319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280003927.XA Active CN103857956B (en) | 2012-06-01 | 2012-06-01 | LED changes the method for rising angle by encapsulating |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103857956B (en) |
| WO (1) | WO2013177796A1 (en) |
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| JP3834991B2 (en) * | 1998-03-12 | 2006-10-18 | 富士通株式会社 | Solder ball forming plate manufacturing method, semiconductor device manufacturing method, and semiconductor device |
| JP3142971U (en) * | 2008-01-29 | 2008-07-03 | 今臺電子股▲ふん▼有限公司 | Light emitting diode light source |
| JP2010027756A (en) * | 2008-07-17 | 2010-02-04 | Panasonic Corp | Light emitting device |
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2012
- 2012-06-01 WO PCT/CN2012/076400 patent/WO2013177796A1/en active Application Filing
- 2012-06-01 CN CN201280003927.XA patent/CN103857956B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101230959A (en) * | 2008-02-04 | 2008-07-30 | 林万炯 | Flexible water-proof LED lamp belt and embedding technique thereof |
| CN101587923A (en) * | 2008-05-19 | 2009-11-25 | 玉晶光电股份有限公司 | Method for using screen plate for packaging and molding light emitting diode (LED) |
| CN101393955A (en) * | 2008-10-28 | 2009-03-25 | 福建省苍乐电子企业有限公司 | Fabrication of fluorescent power layer of large power white light LED and fabricating tool |
| CN101793352A (en) * | 2009-02-02 | 2010-08-04 | 林柏廷 | Manufacturing method for integral LED light source module |
| CN101707230A (en) * | 2009-10-13 | 2010-05-12 | 中外合资江苏稳润光电有限公司 | Method for manufacturing high-power white light LED |
| CN102208518A (en) * | 2010-04-20 | 2011-10-05 | 蒋伟东 | Integrated patch unit |
| CN201731346U (en) * | 2010-07-29 | 2011-02-02 | 北京尚明时代光电科技有限公司 | Annular LED light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103857956A (en) | 2014-06-11 |
| WO2013177796A1 (en) | 2013-12-05 |
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