CN103855509A - Connector - Google Patents
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- CN103855509A CN103855509A CN201310620843.7A CN201310620843A CN103855509A CN 103855509 A CN103855509 A CN 103855509A CN 201310620843 A CN201310620843 A CN 201310620843A CN 103855509 A CN103855509 A CN 103855509A
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- base material
- connector
- scolding tin
- plating coating
- next door
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- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The invention relates to a connector. Specifically, the connector is capable of merely heating a solder joint portion between the connector and a partition wall to further carry out welding operation on the solder joint portion on the condition that an integral body of the connector including the partition wall is not heated and is used for electrically connecting the inside and outside of an air-tight chamber comparted by the partition wall. The connector (1) is provided with a flat-plate-shaped base material (10) provided with a blocked opening portion (44) formed on the partition wall (43) and used for communicating the interior and the exterior of the air-tight chamber (C). A solder joint portion (15) extending along the periphery of the base material (10) and being welded on the partition wall (43)is formed on an inner surface (10a)of the base material (10).Multiple plating through holes(18)are discontinuously formed in the base material (10)along the solder joint portion (15)and communicated between the solder joint portion (15)of the inner surface (10a)and an outer surface (10b).
Description
Technical field
The present invention relates to for the inner side in the airtight chamber by next door zoning and outside are electrically interconnected, stop up and be formed at next door, connect the inside in airtight chamber and the connector of outside peristome.
Background technology
All the time, require the inner side in the airtight chamber by next door zoning and outside electrically to interconnect.For example, in the semiconductor core blade technolgy that has carried integrated circuit, use can be by inner pressure relief to the vacuum chamber of state that approaches vacuum, by the inside of this vacuum chamber and outside electrical connection.In addition, also make the gas of molecular weight less as He gas be full of inside, airtight chamber with next door zoning with decompression.The inside in airtight chamber of having adjusted pressure at this kind during with outside electrical connection, in the bubble-tight while of holding chamber inside, requires the inside in chamber and outside reliable electrical connectivity.
As existing for connecting the inside in this chamber and outside connector, for example, the connector that the patent documentation 1 shown in known Figure 15 is recorded.Figure 15 be conventional example by with next door zoning, adjusted private side and the electrically sectional view of interconnective connector of outer side in the airtight chamber of pressure.
At this, at adapter 120, form two not shown through holes, connect and be inserted with each post 122 for power supply at these two through holes.Around the inside and power supply use post 122 of each through hole, with the airtight filling of glass.At each power supply post 122, be connected with connector for power supply (not shown) from inside A side and the outside B side both sides in chamber.Electric power is supplied to inner A side from the outside B side in chamber via power supply post 122.Adapter 120 is fixed on sheet dish 110 by welding with airtight conditions.
And in ceramic substrate 130, at its lower surface place, circumference is brazing area 131, its inner side is electrical connection region 132.At the middle body of ceramic substrate 130, be formed with and make to be electrically connected the pass through openings 121 that region 132 exposes.And in ceramic substrate 130, its brazing area 131 is the part around the pass through openings 121 of adapter 120 with airtight conditions soldering.
In addition,, at inner surface and the outer surface in the electrical connection region 132 of ceramic substrate 130, dispose multiple conductive welding disks (not shown).The conductive welding disk of inner surface and the conductive welding disk of outer surface interconnect by the path (via) (not shown) of having filled electric conductor in the inside of through hole.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2004-349073 communique.
Summary of the invention
The problem that invention will solve
But, in the connector 101 of recording at the patent documentation 1 shown in this Figure 15, there is following problem points.
,, the connector 101 of recording at the patent documentation 1 shown in Figure 15, as previously mentioned, in ceramic substrate 130, its brazing area 131 is the part around the pass through openings 121 of adapter 120 with airtight conditions soldering.
At this, for welding ceramics substrate 130 well, need to put into reflow ovens heating in interior connector 101 entirety by comprising next door 102, carry out reflow soldering.If connector 101 put into together with next door 102 to reflow ovens and be heated to scolding tin melt temperature, have the partial melting having welded in connector 101, or other parts on next door 102, connector 101 are because of the deteriorated risk of backflow heat.In addition, if next door 102 becomes large, exist heating self to become difficulty, allow to heating, the cooling needed time is also elongated, and its productivity ratio becomes the problem of extreme difference.
Therefore, the present invention completes in view of these problem points, its object is to provide can be in the case of not heating including the connector entirety next door, only the scolding tin bonding part in heated connector and next door to be to weld, for by the inner side in the airtight chamber with next door zoning and electrically interconnective connector of outside.
For the scheme of dealing with problems
In order to reach above-mentioned purpose, in the present invention, the related connector of certain mode is for the inner side in the airtight chamber with next door zoning and outside are electrically interconnected, obstruction is formed at next door, connect the inside in airtight chamber and the connector of outside peristome, described connector has the flat base material that stops up described peristome, it is characterized in that: at the inner surface of described base material, formation is extended along the periphery of described base material, be welded in the scolding tin junction surface in described next door, at described base material, the multiple plating coating ventilating holes between scolding tin junction surface and the described outer surface that is communicated with described inner surface have been formed intermittently along described scolding tin junction surface.
At this, " plating coating ventilating hole " refers to that the inner peripheral surface of the through hole between inner surface and the outer surface to connecting base material is applied to the conductive coating extending between described inner surface and outer surface and the part forming.
In addition, in this connector, preferably, at the outer surface of described base material, be formed with heat transfer layer, described heat transfer layer extends along the periphery of described base material, is connected in described multiple plating coating ventilating hole.
In addition, in this connector, can also heat transfer part be set at the lateral surface of described base material, described heat transfer part is connected the described scolding tin junction surface of the inner surface that is positioned at described base material with the described heat transfer layer of the outer surface that is positioned at described base material.
And, in this connector, preferably, solder flux rising is set in described plating coating ventilating hole and prevents material.
In addition, in this connector, described solder flux rises and prevents that material from can be the conductive paste being filled in described plating coating ventilating hole.
In addition, in this connector, described solder flux rises and prevents that material from can also be the resin being filled in described plating coating ventilating hole.
In addition, in this connector, the multiple plating coating ventilating holes that form intermittently along described scolding tin junction surface can also be formed as two row.
In addition, in the present invention, the related connector of other modes is for the inner side in the airtight chamber with next door zoning and outside are electrically interconnected, obstruction is formed at next door, connect the inside in airtight chamber and the connector of outside peristome, it is characterized in that: possess the multilager base plate that stops up described peristome, this multilager base plate possesses flat the first base material, be disposed at the inner surface side of this first base material and stop up the second base material of described peristome, with flat the 3rd base material of outer surface side that is disposed at described the first base material, at the inner surface of described the second base material, formation is extended along the periphery of described the second base material, be welded in the scolding tin junction surface in described next door, at described the second base material, form intermittently the multiple plating coating ventilating holes between the scolding tin junction surface of inner surface and the outer surface of described the second base material that is communicated with described the second base material along described scolding tin junction surface, at described the first base material, form interconnective multiple path electrically between the inner surface of this first base material and outer surface, described multiple path is connected in the described plating coating ventilating hole of being located at described the second base material, at described the 3rd base material, form intermittently the multiple plating coating ventilating holes between multiple paths of described the first base material and the outer surface of described the 3rd base material at inner surface place that is communicated with described the 3rd base material along the periphery of described the 3rd base material.
In this connector, the inner peripheral surface that described the first base material has the through hole between inner surface and the outer surface to connecting this first base material is applied to the first conductive coating extending between described inner surface and outer surface and the first through hole forming, and possesses the inner surface of being located at described the first base material, be connected in the first conductive layer of the inner surface side of described the first conductive coating, with the outer surface of being located at described the first base material, be connected in the second conductive layer of the outer surface side of described the first conductive coating, the inner peripheral surface that described the second base material has the through hole between inner surface and the outer surface to connecting this second base material is applied to the second conductive coating extending between described inner surface and outer surface and the second through hole forming, and possesses the inner surface of being located at described the second base material, be connected in the 3rd conductive layer of the inner surface side of described the second conductive coating, the inner peripheral surface that described the 3rd base material has the through hole between inner surface and the outer surface to connecting the 3rd base material is applied to the 3rd conductive coating extending between described inner surface and outer surface and the third through-hole forming, and possesses the outer surface of being located at described the 3rd base material, be connected in the 4th conductive layer of the outer surface side of described the 3rd conductive coating, the outer surface that configures described the second base material in the mode of joining with the inner surface of described the first base material is to stop up the inner surface side of described the first through hole by described the second base material, and connect the outer surface side of described the first conductive layer and described the second conductive coating, the inner surface that configures described the 3rd base material in the mode of joining with the outer surface of described the first base material is to stop up the outer surface side of described the first through hole by described the 3rd base material, and connect the inner surface side of described the second conductive layer and described the 3rd conductive coating.
Invention effect
According to connector involved in the present invention, at base material, be formed with intermittently multiple plating coating ventilating holes along scolding tin junction surface, the plurality of plating coating ventilating hole is communicated with between the scolding tin junction surface and outer surface of inner surface.And, in the time that scolding tin junction surface is welded in to next door, conduct heat to the scolding tin junction surface of base material inner surface side via multiple plating coating ventilating holes from the outer surface side of base material by heater, scolding tin is heated to scolding tin melt temperature.Therefore, can heat packs not containing next door in the case of interior connector entirety, only the scolding tin junction surface in heated connector and next door assigns to weld.Thus, the partial melting having welded in connector, or other parts on next door, base material are eliminated because of the deteriorated risk of backflow heat.In addition, even in the larger situation of next door, it self is also easy heating, and can shorten heating and cooling required time.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that has used the electric connection construction of the first execution mode of connector involved in the present invention.
Fig. 2 is having used in the electric connection construction of the connector shown in Fig. 1, be shown specifically the sectional view of connector periphery.
Fig. 3 is the vertical view of the connector shown in Fig. 1.
Fig. 4 is the sectional view along the 4-4 line in Fig. 3.
Fig. 5 is the vertical view of the base material that uses of the connector shown in Fig. 1.
Fig. 6 is the sectional view along the 6-6 line in Fig. 5.
Fig. 7 is the vertical view of the base material that uses of the second execution mode of connector involved in the present invention.
Fig. 8 is the vertical view of the base material that uses of the 3rd execution mode of connector involved in the present invention.
Fig. 9 is the sectional view along the 9-9 line in Fig. 8.
Figure 10 is in the 3rd execution mode electric connection construction that has used connector involved in the present invention, is shown specifically the sectional view of connector periphery.
Figure 11 is the sectional view of the base material that uses of the 4th execution mode of connector involved in the present invention.
Figure 12 is the sectional view of the base material that uses of the 5th execution mode of connector involved in the present invention.
Figure 13 is the vertical view of the multilager base plate that uses of the 6th execution mode of connector involved in the present invention.
Figure 14 is the sectional view along the 14-14 line in Figure 13.
Figure 15 be conventional example by with next door zoning, adjusted private side and the electrically sectional view of interconnective connector of outer side in the airtight chamber of pressure.
Embodiment
Below, with reference to the accompanying drawings of the execution mode of connector involved in the present invention.Fig. 1 is the schematic diagram that has used the electric connection construction of the first execution mode of connector involved in the present invention.
In the electric connection construction shown in Fig. 1, use connector 1 will be with next door 43 zonings, and inner side and outside that inside remains airtight airtight chamber C electrically interconnect.The inside of airtight chamber C can be the state that approaches vacuum, and the gas that also can use the such molecular weight less of He gas is full of and is decompressed to the state of the pressure lower than outer air pressure.In addition, the inside of airtight chamber C can be also the state of the pressure higher than outer air pressure.
At this, as shown in Figure 1, next door 43 is formed with peristome 44, and peristome 44 connects the outside of airtight chamber C with inner.In addition, next door 43, is formed with peristome 45 for gas inject, gas inject with peristome 45 for by the airtight chamber C in gas inject next door 43.This next door 43 is metal system.
And as shown in Figure 1 and Figure 2, the peristome 44 in next door 43 is stopped up by connector 1.
As shown in Figure 2, connector 1 possesses the flat base material 10 of occlusion of openings portion 44.As shown in Figure 5, base material 10 is flat-shaped parts of the essentially rectangular shape of broad ways (left and right directions in Fig. 5) and length direction (above-below direction in Fig. 5) extension.As shown in Figures 2 to 6, base material 10 has the inner surface 10a of the private side that is positioned at airtight chamber C and the outer surface 10b that is opposition side with inner surface 10a.In addition, base material 10 has Width right flank 10c, Width left surface 10d, length direction front end face 10e and length direction rear end face 10f.Base material 10 is for example the epoxy resin system containing glass.
In addition, as shown in Fig. 5 and Fig. 6, at the base material 10 of connector 1, be formed with multiple paths 13, multiple paths 13 will electrically interconnect between the inner surface 10a of base material 10 and outer surface 10b.Multiple paths 13 are formed as two row shapes on the Width of base material 10.The path 13 of each row forms with both determining deviations along fore-and-aft direction.Each path 13 is included in the conductive coating portion 11 of the inner peripheral surface setting that connects the inner surface 10a of base material 10 and the through hole of outer surface 10b and is filled in the packing material 12 in this conductive coating portion 11.As shown in Fig. 5 and Fig. 6, conductive coating portion 11 extends between the inner surface 10a of base material 10 and outer surface 10b, and forms at the inner surface 10a of base material 10 and outer surface 10b place the conductive welding disk 14 applying rectangular-shapedly.This conductive coating portion 11 is for example by zinc-plated or gold-plated formation.In addition, packing material 12 is preferably electric conductor, but also can be resin.
In addition, as shown in Figures 2 to 6, at the inner surface 10a of base material 10, be formed with the scolding tin junction surface 15 that is welded in next door 43.Scolding tin junction surface 15 along the seamless shape of periphery of base material 10 extend.Scolding tin junction surface 15 is formed as stratiform, for example, by zinc-plated or gold-plated formation.As shown in Figure 5, scolding tin junction surface 15 is formed as the path 13 of two row shapes and the mode of conductive welding disk 14 and path 13 and conductive welding disk 14 and forms discretely to surround.
And, as shown in Fig. 5 and Fig. 6, at base material 10, being formed with intermittently multiple plating coating ventilating holes 18 along scolding tin junction surface 15, multiple plating coating ventilating holes 18 are communicated with between the scolding tin junction surface 15 and outer surface 10b of inner surface 10a., be formed with multiple plating coating ventilating holes 18 along scolding tin junction surface 15 with roughly equal spacing.As shown in Figure 6, the inner peripheral surface of the through hole 16 between inner surface 10a and the outer surface 10b of perforation base material 10 is applied conductive coating 17 and forms each plating coating ventilating hole 18.Conductive coating 17 extends between inner surface 10a and outer surface 10b.Conductive coating 17 is for example by zinc-plated or gold-plated formation.The conductive coating 17 of each plating coating ventilating hole 18 is connected in scolding tin junction surface 15 at the inner surface 10a place of base material 10.
In addition, at the outer surface 10b of base material 10, be formed with heat transfer layer 19, heat transfer layer 19 is connected in the conductive coating 17 of multiple plating coating ventilating holes 18.Heat transfer layer 19 along the seamless shape of periphery of base material 10 extend.Heat transfer layer 19 is formed as the path 13 of two row shapes and the mode of conductive welding disk 14 and path 13 and conductive welding disk 14 and forms discretely to surround.Heat transfer layer 19 is for example by zinc-plated or gold-plated formation.
In addition, as shown in Fig. 2 and Fig. 4, connector 1 possesses the first connector 20 of the inner surface 10a side that is disposed at base material 10 and is disposed at the second connector 30 of the outer surface 10b side of base material 10.
At this, as shown in Figure 4, the first connector 20 possesses the outer cover 21 of insulating properties and is contained in multiple electric contact pieces 22 of outer cover 21.Multiple electric contact pieces 22 are configured to two row shapes accordingly with the path 13 that is formed at base material 10 on the Width of outer cover 21.The electric contact piece 22 of each row forms with both determining deviations along fore-and-aft direction.Each electric contact piece 22 is welded in the conductive welding disk 14 that is formed at base material 10.
In addition, the second connector 30 has the formation identical with the first connector 20, possesses the outer cover 31 of insulating properties and is contained in multiple electric contact pieces 32 of outer cover 31.Multiple electric contact pieces 32 are configured to two row shapes accordingly with the path 13 that is formed at base material 10 on the Width of outer cover 31.The electric contact piece 32 of each row forms with both determining deviations along fore-and-aft direction.Each electric contact piece 32 is welded in the conductive welding disk 14 that is formed at base material 10.
Then, illustrate and use connector 1 by the inner side of airtight chamber C and electrically interconnective method of outside.
First, as shown in Figure 1, the first circuit substrate 41 is disposed in airtight chamber C.
Then, as shown in Figure 2, the inner surface 10a that makes connector 1 is next door 60 sides towards peristome 44 sides, by connector 1 occlusion of openings portion 44.Now, the scolding tin junction surface 15 by scolding tin S, the inner surface 10a of the base material at connector 1 10 being formed is connected in the lateral surface in next door 43.In the time of this welding, first, scolding tin S is positioned on the lateral surface in next door 43, then the scolding tin junction surface 15 of connector 1 is loaded on scolding tin S.Then, the heaters such as flatiron (not shown) are pushed against to the heat transfer layer 19 forming in the outer surface 10b at base material 10, to heat heat transfer layer 19.Now, heat be communicated to via the outer surface 10b from base material 10 inner surface 10a multiple plating coating ventilating holes 18 conductive coating 17 and be passed to scolding tin junction surface 15.The heating of heater is carried out until the scolding tin S joining with scolding tin junction surface 15 becomes scolding tin melt temperature and melting.Afterwards, cooling scolding tin S.Thus, the scolding tin junction surface 15 forming at the inner surface 10a of the base material 10 of connector 1 is welded in the lateral surface in next door 43.
So, according to connector 1 of the present invention, at base material 10, be formed with intermittently multiple plating coating ventilating holes 18 along scolding tin junction surface 15, multiple plating coating ventilating holes 18 are communicated with between the scolding tin junction surface 15 and outer surface 10b of inner surface 10a.And, in the time that scolding tin junction surface 15 is welded in to next door 43, conduct heat to the scolding tin junction surface 15 of the inner surface 10a side of base material 10, so that scolding tin S is heated to scolding tin melt temperature via multiple plating coating ventilating holes 18 from the outer surface 10b side of base material 10 by heater.Therefore, can heat packs not containing next door 43 in the case of interior connector 1 entirety, only heated connector 1 assigns to weld with the scolding tin junction surface in next door 43.Thus, in the time that putting into reflow ovens and heat, interior connector 1 entirety becoming the following risk elimination of problem by comprising next door 43 in the past,, the partial melting having welded in connector 1, or other parts (for example, the first and second connector 20,30) on next door, base material because of backflow heat deteriorated.In addition, even in the larger situation of next door 43, it self is also easy heating, and can shorten heating and cooling required time.
In addition, in the connector 1 of present embodiment, at the outer surface 10b of base material 10, be formed with the heat transfer layer 19 that is connected in multiple plating coating ventilating holes 18.Therefore, in the time conducting heat to scolding tin junction surface 15 from the outer surface 10b side of base material 10 via multiple plating coating ventilating holes 18 by heater, if by heater push against in heat transfer layer 19 with heating heat transfer layer 19, can heat multiple plating coating ventilating holes 18.Therefore, do not need to heat independently each plating coating ventilating hole 18, can realize heater simply to form.
And in the time having stopped up the peristome 44 in next door 43 by connector 1, the electric contact piece 22 of the first connector 20 contacts the first circuit substrate 41.
Then, as shown in Figure 1, make second circuit substrate 42 contact the electric contact piece 32 of the second connector 30.Thus, the first circuit substrate 41 and second circuit substrate 42 electrically interconnect via connector 1.
Then, with reference to Fig. 7, the base material that the second execution mode of connector involved in the present invention uses is described.In Fig. 7, the parts identical with Fig. 1 to Fig. 6 are accompanied by same-sign, the description thereof will be omitted sometimes.
,, in the base material 10 shown in Fig. 7, the multiple plating coating ventilating holes 18 that form intermittently along scolding tin junction surface 15 are formed as two row., multiple plating coating ventilating holes 18 are formed as two row with roughly equal spacing in base material 10.
So, in the situation that multiple plating coating ventilating holes 18 are formed as to two row, compared with plating coating ventilating hole being formed as to the situation of row, in the time conducting heat scolding tin junction surface 15 to the inner surface 10a side of base material 10 by heater via multiple plating coating ventilating holes 18 from the outer surface 10b side of base material 10, can improve heat-transfer effect.
Then, with reference to Fig. 8 to Figure 10, the base material that the 3rd execution mode of connector involved in the present invention uses is described.In Fig. 8 to Figure 10, the parts identical with Fig. 1 to Fig. 6 are accompanied by same-sign, the description thereof will be omitted sometimes.
,, at the inner surface 10a of the base material 10 shown in Fig. 8 to Figure 10, be formed with the breach 10g of the set width extending continuously along the periphery of base material 10 seamless shape.And, scolding tin junction surface 15 on the medial surface 10h of the inner surface 10a of base material 10, breach 10 and bottom surface 10i along the seamless shape of periphery of base material 10 extend.
And, according to the connector 1 of present embodiment, in the time that scolding tin junction surface 15 is welded in to next door 43, also conduct heat to the scolding tin junction surface 15 of the inner surface 10a side of base material 10, so that scolding tin S is heated to scolding tin melt temperature via multiple plating coating ventilating holes 18 from the outer surface 10b side of base material 10 by heater.Therefore, can heat packs not containing next door 43 in the case of interior connector 1 entirety, only heated connector 1 assigns to weld with the scolding tin junction surface in next door 43.
Then, with reference to Figure 11, the base material that the 4th execution mode of connector involved in the present invention uses is described.In Figure 11, the parts identical with Fig. 1 to Fig. 6 are accompanied by same-sign, the description thereof will be omitted sometimes.
; at the lateral surface of the base material 10 shown in Figure 11; be Width right flank 10c, Width left surface 10d, length direction front end face 10e (with reference to Fig. 3) and length direction rear end face 10f (with reference to Fig. 3), be provided with heat transfer part 23.Heat transfer part 23 connects the scolding tin junction surface 15 of the inner surface 10a that is positioned at base material 10 and is positioned at the heat transfer layer 19 of the outer surface 10b of base material 10.
And, according to the connector 1 of present embodiment, in the time that scolding tin junction surface 15 is welded in to next door 43 (with reference to Fig. 2), conduct heat to the scolding tin junction surface 15 of the inner surface 10a side of base material 10 via multiple plating coating ventilating holes 18 and heat transfer part 23 from the heat transfer layer 19 of the outer surface 10b of base material 10 by heater.And, scolding tin S is heated to scolding tin melt temperature.Therefore, with only undertaken compared with the situation of the heat transfer from heat transfer layer 19 to scolding tin junction surface 15, can improving heat-transfer effect by plating coating ventilating hole 18.
Then, with reference to Figure 12, the base material that the 5th execution mode of connector involved in the present invention uses is described.In Figure 12, the parts identical with Fig. 1 to Fig. 6 are accompanied by same-sign, the description thereof will be omitted sometimes.
,, in the base material 10 shown in Figure 12, in each plating coating ventilating hole 18, be provided with solder flux rising and prevent material (the upper Ga り of Off ラ ッ Network ス prevents material) 24.
In the time that the scolding tin junction surface 15 of base material 10 inner surface 10a that is formed at connector 1 is welded in the lateral surface in next door 43 (with reference to Fig. 2), sometimes be supplied to the solder flux of scolding tin S (with reference to Fig. 2) in the interior rising of each plating coating ventilating hole 18, arrive heat transfer layer 19.If solder flux arrives heat transfer layer 19, be sometimes attached to the surface of heat transfer layer 19 due to solder flux, push against in the heater of heat transfer layer 19 dirty.The solder flux that is attached to heat transfer layer 19 reduces the heat transfer efficiency from heater to heat transfer layer 19.Therefore, by rising and prevent material 24 at the interior solder flux that arranges of each plating coating ventilating hole 18, can prevent that solder flux from rising, stop solder flux to be attached to the surface of heat transfer layer 19.
At this, solder flux rises and prevents that material 24, for conductive paste, is filled to outer surface 10b from inner surface 10a in plating coating ventilating hole 18.Prevent material 24 if rise conductive paste as solder flux and be filled in plating coating ventilating hole 18, thermal conductivity is high.Therefore,, when the outer surface 10b side from base material 10 is conducted heat scolding tin junction surface 15 to the inner surface 10a side of base material 10 via multiple plating coating ventilating holes 18, can further improve heat-transfer effect.
In addition, can also use resin to rise and prevent material 24 as solder flux, be filled in plating coating ventilating hole 18.In this case, also can in the time of heating, prevent that solder flux from rising.
Finally, with reference to Figure 13 and Figure 14, the multilager base plate that the 6th execution mode of connector involved in the present invention uses is described.
, the multilager base plate 50 shown in Figure 13 and Figure 14 possesses flat second base material 70 of flat the first base material 60, the inner surface 60a side that is disposed at the first base material 60 occlusion of openings portion 44 and is disposed at flat the 3rd base material 80 of the outer surface 60b side of the first base material 60.
At this, as shown in figure 13, the first base material 60 is flat-shaped parts of the essentially rectangular shape of broad ways (left and right directions in Figure 13) and length direction (above-below direction in Figure 13) extension.The first base material 60 has the inner surface 60a and the outer surface 60b that are positioned at airtight chamber C (with reference to Fig. 1) private side.The first base material 60 is for example the epoxy resin system containing glass.
In addition, as shown in figure 14, at the first base material 60, be formed with multiple the first through holes 63, multiple the first through holes 63 will electrically interconnect between the inner surface 60a of the first base material 60 and outer surface 60b.Multiple the first through holes 63 are formed as two row shapes on the Width of the first base material 60.Though not shown, the first through hole 63 of each row forms with both determining deviations along fore-and-aft direction.And, the inner peripheral surface that connects the through hole 61 between inner surface 60a and the outer surface 60b of the first base material 60 is applied the first conductive coating 62 of ring-type and forms each the first through hole 63.The first conductive coating 62 extends between the inner surface 60a of the first base material 60 and outer surface 60b.The first conductive coating 62 is for example by zinc-plated or gold-plated formation.In addition, there is electric conductor at the space-filling of the first conductive coating 62 central authorities of ring-type.In addition, this electric conductor also can be set.And, at the inner surface 60a of the first base material 60, be provided with multiple the first conductive layers 64 that are connected in the first conductive coating 62 inner surface 60a sides.Each the first conductive layer 64 surrounds part around of the first conductive coating 62 and forms from the mode that this part extends to the part in Width outside to comprise.In addition, at the outer surface 60b of the first base material 60, be provided with multiple the second conductive layers 65 that are connected in the first conductive coating 62 outer surface 60b sides.Each the second conductive layer 65 also surrounds part around of the first conductive coating 62 and forms from the mode that this part extends to the part in Width outside to comprise.
And as shown in figure 13, the second base material 70 is flat-shaped parts of the essentially rectangular shape of broad ways (left and right directions in Figure 13) and length direction (above-below direction in Figure 13) extension.The second base material 70 has width and the length identical with the inner surface 60a of the first base material 60.And the second base material 70 has the inner surface 70a of the airtight chamber C private side being positioned at shown in Fig. 1 and the outer surface 70b that is opposition side with this inner surface 70a.The second base material 70 is for example the epoxy resin system containing glass.
In addition, as shown in figure 14, at the second base material 70, be formed with multiple the second through holes 73, multiple the second through holes 73 will electrically interconnect between the inner surface 70a of the second base material 70 and outer surface 70b.Multiple the second through holes 73 are formed as two row shapes in the position in outside compared with the first through hole 63 on the Width of the second base material 70.The second through hole 73 of each row forms with both determining deviations along fore-and-aft direction.And, the inner peripheral surface that connects the through hole 71 between inner surface 70a and the outer surface 70b of the second base material 70 is applied the second conductive coating 72 and forms each the second through hole 73.The second conductive coating 72 extends between the inner surface 70a of the second base material 70 and outer surface 70b.As shown in figure 14, the second conductive coating 72 forms so that most mode is all buried in the inside of through hole 71.The second conductive coating 72 is for example by zinc-plated or gold-plated formation.And, at the inner surface 70a of the second base material 70, be provided with multiple the 3rd conductive layers 74 that are connected in the second conductive coating 72 inner surface side.As shown in Figure 13 and Figure 14, each the 3rd conductive layer 74 covers the inner surface side end of the second conductive coating 72 and is formed as the oblong-shaped extending to Width inner side.
And the 3rd base material 80 is flat-shaped parts of the essentially rectangular shape of broad ways (left and right directions in Figure 13) and length direction (above-below direction in Figure 13) extension.The 3rd base material 80 has width and the length identical with the outer surface 60b of the first base material 60.And the 3rd base material 80 has the inner surface 80a of the airtight chamber C private side being positioned at shown in Fig. 1 and the outer surface 80b that is opposition side with this inner surface 80a.The 3rd base material 80 is for example the epoxy resin system containing glass.
In addition, as shown in figure 14, at the 3rd base material 80, be formed with multiple third through-holes 83, multiple third through-holes 83 will electrically interconnect between the inner surface 80a of the 3rd base material 80 and outer surface 80b.Multiple third through-holes 83 are formed as two row shapes in the position in outside compared with the first through hole 63 on the Width of the 3rd base material 80.The third through-hole 83 of each row forms with both determining deviations along fore-and-aft direction.And, the inner peripheral surface that connects the through hole 81 between inner surface 80a and the outer surface 80b of the 3rd base material 80 is applied the 3rd conductive coating 82 and forms each third through-hole 83.The 3rd conductive coating 82 extends between the inner surface 80a of the 3rd base material 80 and outer surface 80b.As shown in figure 14, the 3rd conductive coating 82 forms so that most mode is all buried in the inside of through hole 81.The 3rd conductive coating 82 is for example by zinc-plated or gold-plated formation.And, at the outer surface 80b of the 3rd base material 80, be provided with multiple the 4th conductive layers 84 that are connected in the 3rd conductive coating 82 outer surface sides.Each the 4th conductive layer 84 covers the outer surface side end of the 3rd conductive coating 82 and is formed as the oblong-shaped extending to Width inner side.
And as shown in figure 14, the outer surface 70b of the second base material 70 configures in the mode of joining with the inner surface 60a of the first base material 60, stopped up the inner surface side of the first through hole 63 that is formed at the first base material 60 by the second base material 70.In addition, the first conductive layer 64 is connected with the outer surface side of the second conductive coating 72.
And the inner surface 80a of the 3rd base material 80 configures in the mode of joining with the outer surface 60b of the first base material 60, stopped up the outer surface side of the first through hole 63 that is formed at the first base material 60 by the 3rd base material 80.In addition, the second conductive layer 65 is connected with the inner surface side of the 3rd conductive coating 82.
In this multilager base plate 50, from the stacked direction of the second base material 70, the first base material 60 and the 3rd base material 80 of inner surface side outward surface side, dispose the 3rd conductive layer 74, the first conductive layer 64, the second conductive layer 65 and the 4th conductive layer 84 these four conductive layers.Therefore, multilager base plate 50 forms four laminar substrates.
At this, as shown in Figure 13 and Figure 14, at the inner surface 70a of the second base material 70, be formed with the scolding tin junction surface 75 that is welded in next door 43 (with reference to Fig. 2).Scolding tin junction surface 75 along the seamless shape of periphery of the second base material 70 extend.Scolding tin junction surface 75 is formed as stratiform, for example, by zinc-plated or gold-plated formation.As shown in figure 13, scolding tin junction surface 75 forms discretely with the mode and the 3rd conductive layer 74 that surround the 3rd conductive layer 74 that is formed as two row shapes.
And, as shown in Figure 13 and Figure 14, at the second base material 70, being formed with intermittently multiple plating coating ventilating holes 78 along scolding tin junction surface 75, multiple plating coating ventilating holes 78 are communicated with between the scolding tin junction surface 75 and outer surface 70b of inner surface 70a., be formed with multiple plating coating ventilating holes 78 along scolding tin junction surface 75 with roughly equal spacing.As shown in figure 14, the inner peripheral surface that connects the through hole 76 between inner surface 70a and the outer surface 70b of the second base material 70 is applied conductive coating 77 and forms each plating coating ventilating hole 78.Conductive coating 77 extends between inner surface 70a and outer surface 70b.Conductive coating 77 is for example by zinc-plated or gold-plated formation.The conductive coating 77 of each plating coating ventilating hole 78 is connected in scolding tin junction surface 75 at the inner surface 70a of the second base material 70.
In addition, at the first base material 60, be formed with multiple paths 68, multiple paths 68 will electrically interconnect between the inner surface 60a of the first base material 60 and outer surface 60b.These multiple paths 68 form along the periphery of the first base material 60 intermittently in the mode that is connected in multiple plating coating ventilating holes 78 of being located at the second base material 70.And each path 68 is included in the conductive coating portion 66 of the inner peripheral surface setting that connects the inner surface 60a of the first base material 60 and the through hole of outer surface 60b and is filled in the packing material 67 in conductive coating portion 66.Conductive coating portion 66 extends between the inner surface 60a of the first base material 60 and outer surface 60b, is connected in the conductive coating 77 of plating coating ventilating hole 78 in inner surface 60a side.Conductive coating portion 66 is for example by zinc-plated or gold-plated formation.In addition, packing material 67 is preferably electric conductor, but also can be resin, or also can there is no packing material 67.
And, at the 3rd base material 80, being formed with intermittently multiple plating coating ventilating holes 88 along the periphery of the 3rd base material 80, multiple plating coating ventilating holes 88 are communicated with between the path 68 and outer surface 80b of the first base material 60 of inner surface 80a., be formed with multiple plating coating ventilating holes 88 along the periphery of the 3rd base material 80 with roughly equal spacing.As shown in figure 14, the inner peripheral surface that connects the through hole 86 between inner surface 80a and the outer surface 80b of the 3rd base material 80 is applied conductive coating 87 and forms each plating coating ventilating hole 88.Conductive coating 87 extends between the inner surface 80a of the 3rd base material 80 and outer surface 80b, is connected in the conductive coating portion 66 of the path 68 of the first base material 60 in inner surface 80a side.Conductive coating 87 is for example by zinc-plated or gold-plated formation.In addition, at the outer surface 80b of the 3rd base material 80, be formed with along the seamless shape of periphery of the 3rd base material 80 the heat transfer layer 85 that extends.Heat transfer layer 85 is connected in the conductive coating 87 of multiple plating coating ventilating holes 88.This heat transfer layer 85 forms discretely with the mode and the third through-hole 83 that surround the third through-hole 83 that is formed as two row shapes.Heat transfer layer 85 is for example by zinc-plated or gold-plated formation.
And, in the time that the scolding tin junction surface 75 forming at the inner surface 70a of the second base material 70 is welded in to the lateral surface in next door 43, the heaters such as flatiron (not shown) are pushed against to the heat transfer layer 85 forming in the outer surface 80b at the 3rd base material 80, to heat heat transfer layer 85.Thus, heat is passed to scolding tin junction surface 75 via conductive coating 87, the conductive coating portion 66 of path 68 of the first base material 60 and the conductive coating 77 of multiple plating coating ventilating holes 78 of the second base material 70 of multiple plating coating ventilating holes 88 of the 3rd base material 80.The heating of heater is carried out until the scolding tin joining with scolding tin junction surface 75 becomes scolding tin melt temperature and melting.Afterwards, cooling scolding tin.Thus, scolding tin junction surface 75 is welded in the lateral surface in next door 43.
So, according to the use of present embodiment the connector 1 of multilager base plate 50, at the second base material 70, be formed with intermittently multiple plating coating ventilating holes 78 along scolding tin junction surface 75, multiple plating coating ventilating holes 78 are communicated with between the scolding tin junction surface 75 of inner surface 70a and the outer surface 70b of the second base material 70 of the second base material 70.In addition, at the first base material 60, be formed with multiple paths 68, multiple paths 68 will electrically interconnect between the inner surface 60a of the first base material 60 and outer surface 60b.Each path 68 is connected in each plating coating ventilating hole 78 of the second base material 70.And, at the 3rd base material 80, being formed with intermittently multiple plating coating ventilating holes 88 along the periphery of the 3rd base material 80, multiple plating coating ventilating holes 88 are communicated with between multiple paths 68 of the first base material 60 and the outer surface 80b of the 3rd base material 80 at the inner surface 80a place of the 3rd base material 80.And, in the time that scolding tin junction surface 75 is welded in to next door 43, conduct heat to scolding tin junction surface 75 via multiple plating coating ventilating holes 88, the path 68 of the first base material 60 and multiple plating coating ventilating holes 78 of the second base material 70 of the 3rd base material 80 by heater, scolding tin is heated to scolding tin melt temperature.Therefore, can heat packs not containing next door 43 in the case of interior connector 1 entirety, only heated connector 1 assigns to weld with the scolding tin junction surface in next door 43.
In addition, in the related connector 1 of present embodiment, in multilager base plate 50, by the second base material 70 configuring in the mode that the inner surface 60a of the outer surface 70b of the second base material 70 and the first base material 60 is joined, stop up the first through hole 63 inner surface side that are formed at the first base material 60.In addition, by the 3rd base material 80 configuring in the mode that the outer surface 60b of the inner surface 80a of the 3rd base material 80 and the first base material 60 is joined, stop up the outer surface side of the first through hole 63.Therefore, by forming the second base material 70 and the 3rd base material 80 of multilager base plate 50, can stop up inner surface side and the outer surface side of the first through hole 63 of first substrate 60, air-tightness that can holding chamber C inside.
Above, embodiments of the present invention are illustrated, but the present invention is not limited thereto, can carries out various changes, improvement.
For example, if extend along the periphery of base material 10 or the second base material 70 at scolding tin junction surface 15,75, be welded in next door 43, be connected with multiple plating coating ventilating holes 18,78, not necessarily need seamless shape and form.
In addition, not necessarily needing to arrange heat transfer layer 19,85, heat transfer part 23 and solder flux rises and prevents material 24.
And the multiple plating coating ventilating holes 18 that form intermittently along scolding tin junction surface 15 are not limited to row, two row, more than can also forming three row.
In addition, plating coating ventilating hole 78,88 and path 68 in multilager base plate 50 are not limited to row, more than can also forming two row.
Although will electrically interconnect between the inner surface 10a of base material 10 and outer surface 10b by path 13, also can interconnect by the scheme beyond path again.
Symbol description
1 connector; 10 base materials; 10a inner surface; 10b outer surface; 13 paths; 15 scolding tin junction surfaces; 18 plating coating ventilating holes; 19 heat transfer layers; 23 heat transfer parts; 24 solder flux rise and prevent material; 43 next doors; 44 peristomes; 50 multilager base plates; 60 first base materials; 60a inner surface; 60b outer surface; 61 through holes; 62 first conductive coatings; 63 first through holes; 64 first conductive layers; 65 second conductive layers; 68 paths; 70 second base materials; 70a inner surface; 70b outer surface; 71 through holes; 72 second conductive coatings; 73 second through holes; 74 the 3rd conductive layers; 75 scolding tin junction surfaces; 78 plating coating ventilating holes; 80 the 3rd base materials; 80a inner surface; 80b outer surface; 81 through holes; 82 the 3rd conductive coatings; 83 third through-holes; 84 the 4th conductive layers; 88 plating coating ventilating holes; The airtight chamber of C.
Claims (8)
1. a connector, for the inner side in the airtight chamber with next door zoning and outside are electrically interconnected, stop up and to be formed at next door, connect the inside in airtight chamber and outside peristome, described connector has the flat base material that stops up described peristome, it is characterized in that:
At the inner surface of described base material, form along the periphery of described base material and extend, be welded in the scolding tin junction surface in described next door, at described base material, formed intermittently the multiple plating coating ventilating holes between scolding tin junction surface and the described outer surface that is communicated with described inner surface along described scolding tin junction surface.
2. connector according to claim 1, is characterized in that, is formed with heat transfer layer at the outer surface of described base material, and described heat transfer layer extends along the periphery of described base material, is connected in described multiple plating coating ventilating hole.
3. connector according to claim 2, is characterized in that, is provided with heat transfer part at the lateral surface of described base material, and described heat transfer part is connected the described scolding tin junction surface of the inner surface that is positioned at described base material with the described heat transfer layer of the outer surface that is positioned at described base material.
4. according to the connector described in any one in claims 1 to 3, it is characterized in that, in described plating coating ventilating hole, be provided with solder flux rising and prevent material.
5. connector according to claim 4, is characterized in that, described solder flux rises and prevents that material from being the conductive paste being filled in described plating coating ventilating hole.
6. connector according to claim 4, is characterized in that, described solder flux rises and prevents that material from being the resin being filled in described plating coating ventilating hole.
7. according to the connector described in any one in claim 1 to 6, it is characterized in that, the multiple plating coating ventilating holes that form intermittently along described scolding tin junction surface are formed as two row.
8. a connector, for the inner side in the airtight chamber with next door zoning and outside are electrically interconnected, stops up and is formed at next door, connects the inside in airtight chamber and outside peristome, it is characterized in that:
Possesses the multilager base plate that stops up described peristome, this multilager base plate possesses flat the first base material, is disposed at the inner surface side of this first base material and stops up the second base material of described peristome and be disposed at flat the 3rd base material of the outer surface side of described the first base material
At the inner surface of described the second base material, form along the periphery of described the second base material and extend, be welded in the scolding tin junction surface in described next door, at described the second base material, form intermittently the multiple plating coating ventilating holes between the scolding tin junction surface of inner surface and the outer surface of described the second base material that is communicated with described the second base material along described scolding tin junction surface
At described the first base material, form interconnective multiple path electrically between the inner surface of this first base material and outer surface, described multiple paths are connected in the described plating coating ventilating hole of being located at described the second base material,
At described the 3rd base material, form intermittently the multiple plating coating ventilating holes between multiple paths of described the first base material and the outer surface of described the 3rd base material at inner surface place that is communicated with described the 3rd base material along the periphery of described the 3rd base material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012263312A JP5977159B2 (en) | 2012-11-30 | 2012-11-30 | connector |
| JP2012-263312 | 2012-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103855509A true CN103855509A (en) | 2014-06-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310620843.7A Pending CN103855509A (en) | 2012-11-30 | 2013-11-29 | Connector |
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| Country | Link |
|---|---|
| JP (1) | JP5977159B2 (en) |
| CN (1) | CN103855509A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505385A (en) * | 2014-12-18 | 2015-04-08 | 西安华芯半导体有限公司 | Trough hole/contact hole for semiconductor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231165A (en) * | 1994-02-15 | 1995-08-29 | Hitachi Cable Ltd | Multilayer wiring board and its manufacture |
| JPH1075022A (en) * | 1996-08-31 | 1998-03-17 | Taiyo Yuden Co Ltd | Circuit board |
| JP4214068B2 (en) * | 2004-03-09 | 2009-01-28 | パナソニック株式会社 | Multilayer glass substrate manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2012144326A1 (en) * | 2011-04-20 | 2014-07-28 | タイコエレクトロニクスジャパン合同会社 | Connector and connector manufacturing method |
-
2012
- 2012-11-30 JP JP2012263312A patent/JP5977159B2/en active Active
-
2013
- 2013-11-29 CN CN201310620843.7A patent/CN103855509A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07231165A (en) * | 1994-02-15 | 1995-08-29 | Hitachi Cable Ltd | Multilayer wiring board and its manufacture |
| JPH1075022A (en) * | 1996-08-31 | 1998-03-17 | Taiyo Yuden Co Ltd | Circuit board |
| JP4214068B2 (en) * | 2004-03-09 | 2009-01-28 | パナソニック株式会社 | Multilayer glass substrate manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505385A (en) * | 2014-12-18 | 2015-04-08 | 西安华芯半导体有限公司 | Trough hole/contact hole for semiconductor |
| CN104505385B (en) * | 2014-12-18 | 2018-01-19 | 西安紫光国芯半导体有限公司 | A kind of semiconductor through hole/contact hole |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5977159B2 (en) | 2016-08-24 |
| JP2014110123A (en) | 2014-06-12 |
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