CN103852104B - Temperature and pressure compound sensor based on anode linkage - Google Patents
Temperature and pressure compound sensor based on anode linkage Download PDFInfo
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- CN103852104B CN103852104B CN201210509953.1A CN201210509953A CN103852104B CN 103852104 B CN103852104 B CN 103852104B CN 201210509953 A CN201210509953 A CN 201210509953A CN 103852104 B CN103852104 B CN 103852104B
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Abstract
The present invention provides a kind of temperature and pressure compound sensor based on anode linkage, including electrical apparatus interface, signal conditioning circuit, sensor base housing, pinboard, glass ring, sensor core seat shell body, first/second seal, partition, silicon resistance sensing element of pressure, retaining ring, spun gold, first/second signal wire, sealed insulation component and temperature sensor；Wherein, sealed insulation component is fixedly mounted in sensor core seat shell body, for seal temperature sensor, while the signal of temperature sensor is transferred into signal conditioning circuit；Temperature sensor is connected to the lower end of sealed insulation component, and secondary signal line one end is connected to the upper end of sealed insulation component, and the other end is connected on signal conditioning circuit, then is connected to by electrical apparatus interface the control section of automobile.The present invention can improve the sealing property between temperature sensor and sensor core seat shell body, it is to avoid the various defects that coating fluid sealant is brought, and be suitable for mass production.
Description
Technical field
The present invention relates to pressure sensor technique field, in particular it relates to a kind of temperature based on anode linkage
Spend pressure compound sensor.
Background technology
Fig. 1 is a kind of cross-sectional view of temperature and pressure compound sensor of the prior art.As shown in figure 1, should
Temperature and pressure compound sensor can include electrical apparatus interface 1, signal conditioning circuit 2, sensor base housing 3, pinboard 4, glass
Glass ring 5, sensor core seat shell body 6, first seal 7, partition 8, silicon resistance sensing element of pressure 9, retaining ring 10, second seal
11st, the element such as spun gold 20, signal wire 21 and temperature sensor 31.Above-mentioned existing temperature and pressure compound sensor is general in temperature
Sealed between degree sensor 31 and sensor core seat shell body 6 by way of fluid sealant, this sealing means there are following a few point defects：
1. due to the sealing means using glue, and requiring that gluing wants highly uniform and considerably less, product is caused to add
The uniformity of work process is difficult to ensure, is not suitable for producing in batches；
If 2. using the sealing means of glue, due to the lead, sensor core seat shell body 6 and fluid sealant of temperature sensor 31
Coefficient of thermal expansion and contraction it is different, cause the performances such as the high/low temperature of product not to be well positioned to meet.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of temperature and pressure compound sensor based on anode linkage, energy
Enough improve the sealing property between temperature sensor and sensor core seat shell body, it is to avoid what coating fluid sealant was brought above-mentioned lacks
Fall into, be suitable for batch production.
In order to solve the above technical problems, the present invention provides a kind of temperature and pressure compound sensor based on anode linkage, bag
Include electrical apparatus interface, signal conditioning circuit, sensor base housing, pinboard, glass ring, sensor core seat shell body, the first sealing
Part, partition, silicon resistance sensing element of pressure, retaining ring, second seal, spun gold, the first signal wire, secondary signal line, sealed insulation
Component and temperature sensor；Wherein
The silicon resistance sensing element of pressure and the glass ring pass through silicon glass bonding technology formation silicon piezoresistance sensitivity core body；
Partition and the retaining ring are installed on the sensor described in the silicon piezoresistance sensitivity core body, the first seal
In core print seat housing, sealed between the glass ring and the sensor core seat shell body by the first seal；
The sealed insulation component is fixedly mounted in the sensor core seat shell body, for sealing the TEMP
Device, while the signal of the temperature sensor is transferred into the signal conditioning circuit；
The temperature sensor is connected to the lower end of the sealed insulation component, and described secondary signal line one end is connected to institute
The upper end of sealed insulation component is stated, the other end is connected on the signal conditioning circuit, then is connected to by the electrical apparatus interface
The control section of automobile；
The sensor core seat shell body, the signal conditioning circuit and the electrical apparatus interface are installed on the sensor base
In housing, the second seal is located between the sensor base housing and the sensor core seat shell body；
One end of the spun gold is connected with silicon resistance sensing element of pressure binding, and the other end is connected with the pinboard；
And
One end of the signal conditioning circuit is connected by first signal wire with the pinboard, and the other end passes through
The electrical apparatus interface is connected to the control section of automobile.
Alternatively, the quantity of the sealed insulation component is 2 sets.
Alternatively, the silicon resistance sensing element of pressure is arranged at and the body concentric position of sensor base shell, Huo Zheshe
It is placed in and the sensor base housing eccentric position.
Alternatively, the sealed insulation component includes：
Signal transmission pole, through the sensor core seat shell body, one end is connected with the temperature sensor, the other end
It is connected with the secondary signal line；
Sealed insulation external member, is set in signal transmission pole middle part outside and is closely pasted with the sensor core seat shell body
Close.
Alternatively, the sealed insulation external member is fixedly connected by way of welding with the sensor core seat shell body, institute
Signal transmission pole is stated also by the mode of welding respectively with the temperature sensor and the secondary signal line to be connected.
Alternatively, the sealed insulation component includes：
Sealing plate；
Sealing ring, positioned at the lower section of the sealing plate；
Partition is sealed, positioned at the lower section of the sealing ring；And
Temperature retaining ring, positioned at the lower section of the sealing partition.
Alternatively, the sealed insulation component includes：
Signal transmission pole, through the sensor core seat shell body, one end is connected with the temperature sensor, the other end
It is connected with the secondary signal line；
Agglomerated material, is coated on signal transmission pole middle part outside and is brought into close contact with the sensor core seat shell body,
Ring-type insulating space is left between the upper surface of the agglomerated material and the sensor core seat shell body；And
Insulate colloid, is poured into the ring-type insulating space, the upper surface flush with the sensor core seat shell body.
Alternatively, the agglomerated material is glass or ceramics.
Alternatively, the sealed insulation component includes：
Guide rod, through the sensor core seat shell body, one end is connected with the temperature sensor, the other end with it is described
Secondary signal line is connected；
On the outside of upper sealing and insulator, the end that the guide rod is sheathed on from the upper surface of the sensor core seat shell body；
Sealing ring, positioned at the upper sealing and the lower section of insulator；And
On the outside of lower sealing and insulator, the end that the guide rod is sheathed on from the lower surface of the sensor core seat shell body.
Alternatively, the silicon resistance sensing element of pressure is provided with resistance bridge, and the resistance bridge includes strain resistor,
The strain resistor is connected with one end binding of the spun gold.
Compared with prior art, the present invention has advantages below：
First, the present invention in sensor core seat shell body by, through sealed insulation component is set, both ensure that temperature was passed
Signal transmission between sensor and signal conditioning circuit, improves the sealing between temperature sensor and sensor core seat shell body again
Performance.
Secondly as not using fluid sealant as sealing means, temperature and pressure compound sensor processing one of the invention
Cause property is good, is suitable for batch production.
Furthermore, because fluid sealant is not used as sealing means, even if the lead of temperature sensor, sensor core seat shell
Body is different with the coefficient of thermal expansion and contraction of sealed insulation component, will not have a significant impact to performances such as the high/low temperatures of product.
Brief description of the drawings
The above and other features of the present invention, property and advantage will pass through retouching with reference to the accompanying drawings and examples
State and become readily apparent from, wherein：
Fig. 1 is a kind of cross-sectional view of temperature and pressure compound sensor of the prior art；
Fig. 2 illustrates for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of one embodiment of the invention
Figure；
Fig. 3 shows for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of another embodiment of the present invention
It is intended to；
Fig. 4 shows for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of further embodiment of the present invention
It is intended to；
Fig. 5 is that the cross-section structure of the temperature and pressure compound sensor based on anode linkage of another embodiment of the invention shows
It is intended to；
Fig. 6 shows for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of a still further embodiment of the present invention
It is intended to.
Embodiment
With reference to specific embodiments and the drawings, the invention will be further described, elaborates in the following description more
Details to facilitate a thorough understanding of the present invention, still the present invention obviously can come real with a variety of other manners different from this description
Apply, those skilled in the art can in the case of without prejudice to intension of the present invention according to practical situations make it is similar promote, drill
Unravel silk, therefore should not be limited the scope of the invention with the content of this specific embodiment.
Fig. 2 illustrates for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of one embodiment of the invention
Figure.It should be noted that this and follow-up other accompanying drawings are only as an example, it is painted according to the condition of equal proportion
System, and should not be construed as limiting in this, as the protection domain to actual requirement of the present invention.
Adjusted as shown in Fig. 2 being somebody's turn to do the temperature and pressure compound sensor based on anode linkage and mainly including electrical apparatus interface 1, signal
Manage circuit 2, sensor base housing 3, pinboard 4, glass ring 5, sensor core seat shell body 6, first seal 7, partition 8, silicon
Resistance sensing element of pressure 9, retaining ring 10, second seal 11, spun gold 20, the first signal wire 21, secondary signal line 22,2 sets of sealings
Insulation assembly 30 and the grade part of temperature sensor 31.Wherein, silicon resistance sensing element of pressure 9 and glass ring 5 are bonded work by silicon glass
Skill formation silicon piezoresistance sensitivity core body.Silicon piezoresistance sensitivity core body, the partition 8 of first seal 7 and retaining ring 10 are installed on sensor core
In seat shell body 6, sealed between glass ring 5 and sensor core seat shell body 6 by first seal 7.Sealed insulation component 30 is fixed
In sensor core seat shell body 6, for seal temperature sensor 31, while the signal of temperature sensor 31 is transferred into letter
Number modulate circuit 2.Temperature sensor 31 is connected to the lower end of sealed insulation component 30, and the one end of secondary signal line 22 is connected to sealing
The upper end of insulation assembly 30, the other end is connected on signal conditioning circuit 2, and the control of automobile is connected to eventually through electrical apparatus interface 1
Part processed.Sensor core seat shell body 6, signal conditioning circuit 2 and electrical apparatus interface 1 are installed in sensor base housing 3, and second is close
Sealing 11 is located between sensor base housing 3 and sensor core seat shell body 6.One end of spun gold 20 and silicon resistance sensing element of pressure 9
Binding connection, the other end is connected with pinboard 4.One end of signal conditioning circuit 2 passes through the first signal wire 21 and the phase of pinboard 4
Connection, the other end is connected to the control section of automobile by electrical apparatus interface 1.
In the present embodiment, silicon resistance sensing element of pressure 9 is provided with resistance bridge (not shown), and the resistance bridge includes
Strain resistor, strain resistor is connected with one end binding of spun gold 20 and signal is drawn, and this signal finally enters signal condition electricity
Road 2, the signal after conditioning is input to the control section of automobile eventually through electrical apparatus interface 1.
As shown in Fig. 2 the silicon resistance sensing element of pressure 9 in the present embodiment can be arranged at it is concentric with sensor base housing 3
Position.In addition, section knots of the Fig. 3 for the temperature and pressure compound sensor based on anode linkage of another embodiment of the present invention
Structure schematic diagram.As shown in figure 3, the silicon resistance sensing element of pressure 9 may also be disposed on and the eccentric position of sensor base housing 3.Can
See, the diverse location of silicon resistance sensing element of pressure 9 can make the position of sealed insulation component 30 different, another set of sealed insulation in Fig. 3
Component 30 is not shown.
In the embodiment shown in Fig. 2 and Fig. 3, the sealed insulation component 30 can include signal transmission pole 32 and sealing is exhausted
The two parts of edge external member 33.Wherein, signal transmission pole 32 is through sensor core seat shell body 6, and one end is connected with temperature sensor 31
Connect, the other end is connected with secondary signal line 22.Sealed insulation external member 33 be set in the middle part of signal transmission pole 32 outside and with biography
Sensor core print seat housing 6 is brought into close contact.
In addition, in the above-described embodiments, the sealed insulation external member 33 can by way of welding with sensor core seat shell
Body 6 is fixedly connected, and signal transmission pole 32 can also by way of welding respectively with temperature sensor 31 and secondary signal line
22 are connected.
The function of above-mentioned each building block can be briefly described as follows in the present invention：
Electrical apparatus interface 1 is used for：1) pinboard 4 is provided to install；2) signal output；3) closing in sealing is provided for internal structure.
Signal conditioning circuit 2 is used to nurse one's health sensor signal.Sensor base housing 3 provides structural support for sensor.Turn
Fishplate bar 4 is used for transfer chip signal.Glass ring 5 is used as the quiet envelope pedestal of chip, chip carrier.Sensor core seat shell body 6 is sensing
Device encapsulation provides a sealed cavity.First seal 7 provides sealing for pressure-sensitive storehouse, prevents glass ring 5 and sensor core print seat
Gas leakage between housing 6.When partition 8 is used to prevent that retaining ring 10 from rotating, having distorted first seal 7 causes glass ring 5 and sensing
Gas leakage between device core print seat housing 6.Silicon resistance sensing element of pressure 9 is used to sense ambient pressure, and the pressure signal sensed is converted into
Electric signal.Retaining ring 10 compresses first seal 7 while fixed glass ring 5, it is ensured that sealing.Second seal 11 is shell
Body provides sealing, prevents gas leakage between sensor base housing 3 and sensor core seat shell body 6.Spun gold 20 is responsible for silicon pressure drag is quick
The electric signal that sensing unit 9 is sensed is input to pinboard 4.First signal wire 21 is responsible for silicon resistance sensing element of pressure 9 to be transferred to and turned
The electric signal of fishplate bar 4 finally enters signal conditioning circuit 2.The responsible signal temperature sensor 31 of secondary signal line 22 is final
It is input to signal conditioning circuit 2.Sealed insulation component 30 is responsible for seal temperature sensor 31, while by the letter of temperature sensor 31
Number signal conditioning circuit 2 is transferred to by secondary signal line 22.Temperature sensor 31 is used for the environment temperature for sensing the external world, sense
The temperature signal that should be arrived is converted into electric signal.
Fig. 4 shows for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of further embodiment of the present invention
It is intended to.As shown in figure 4, in the present embodiment, temperature sensor 31 is carried out sealed sealed insulation component 30 can include it is close
Shrouding 40, sealing ring 41, sealing partition 42 and temperature retaining ring 43.Wherein sealing ring 41 is located at the lower section of sealing plate 40；Sealing
Partition 42 is located at the lower section of sealing ring 41；Temperature retaining ring 43 is located at the lower section of sealing partition 42.
Fig. 5 is that the cross-section structure of the temperature and pressure compound sensor based on anode linkage of another embodiment of the invention shows
It is intended to.As shown in figure 5, in the present embodiment, sealed sealed insulation component 30 (not indicating) is carried out to temperature sensor 31 can
With including insulation colloid 50, signal transmission pole 51 and agglomerated material 52.Wherein, signal transmission pole 51 is through sensor core seat shell
Body 6, one end is connected with temperature sensor 31, and the other end is connected with secondary signal line 22.Agglomerated material 52 (for example glass or
Person's ceramics) it is coated on the middle part of signal transmission pole 51 outside and is brought into close contact with sensor core seat shell body 6, agglomerated material 52 and sensing
Ring-type insulating space is left between the upper surface of device core print seat housing 6.Insulation colloid 50 is poured into ring-type insulating space, with sensing
The upper surface flush of device core print seat housing 6.
Fig. 6 shows for the cross-section structure of the temperature and pressure compound sensor based on anode linkage of a still further embodiment of the present invention
It is intended to.As shown in fig. 6, in the present embodiment, sealed sealed insulation component 30 (not indicating) is carried out to temperature sensor 31 can
With including guide rod 60, upper sealing and insulator 61, lower sealing and insulator 62 and sealing ring 63.Wherein, guide rod 60 is through biography
Sensor core print seat housing 6, one end is connected with temperature sensor 31, and the other end is connected with secondary signal line 22.It is upper to seal and exhausted
The upper surface of edge body 61 from sensor core seat shell body 6 is sheathed on the outside of the end of guide rod 60.Sealing ring 63 is located at upper sealing and exhausted
The lower section of edge body 61.The lower surface of lower sealing and insulator 62 from sensor core seat shell body 6 is sheathed on the outside of the end of guide rod 60.
Compared with prior art, the present invention has advantages below：
First, the present invention in sensor core seat shell body by, through sealed insulation component is set, both ensure that temperature was passed
Signal transmission between sensor and signal conditioning circuit, improves the sealing between temperature sensor and sensor core seat shell body again
Performance.
Secondly as not using fluid sealant as sealing means, temperature and pressure compound sensor processing one of the invention
Cause property is good, is suitable for batch production.
Furthermore, because fluid sealant is not used as sealing means, even if the lead of temperature sensor, sensor core seat shell
Body is different with the coefficient of thermal expansion and contraction of sealed insulation component, will not have a significant impact to performances such as the high/low temperatures of product.
Although the present invention is disclosed as above with preferred embodiment, it is not for limiting the present invention, any this area skill
Art personnel without departing from the spirit and scope of the present invention, can make possible variation and modification.Therefore, it is every without departing from
The content of technical solution of the present invention, any modification made according to technical spirit of the invention to above example, equivalent variations
And modification, each fall within the protection domain that the claims in the present invention are defined.
Claims (10)
1. a kind of temperature and pressure compound sensor based on anode linkage, including electrical apparatus interface (1), signal conditioning circuit (2), biography
Sensor base housing (3), pinboard (4), glass ring (5), sensor core seat shell body (6), first seal (7), partition (8),
Silicon resistance sensing element of pressure (9), retaining ring (10), second seal (11), spun gold (20), the first signal wire (21), secondary signal
Line (22), sealed insulation component (30) and temperature sensor (31)；Wherein
The silicon resistance sensing element of pressure (9) and the glass ring (5) pass through silicon glass bonding technology formation silicon piezoresistance sensitivity core body；
The silicon piezoresistance sensitivity core body, the first seal (7) described partition (8) and the retaining ring (10) are installed on described
In sensor core seat shell body (6), sealed between the glass ring (5) and the sensor core seat shell body (6) by described first
Part (7) is sealed；
The sealed insulation component (30) is fixedly mounted in the sensor core seat shell body (6), is passed for sealing the temperature
Sensor (31), while the signal of the temperature sensor (31) is transferred into the signal conditioning circuit (2)；
The temperature sensor (31) is connected to the lower end of the sealed insulation component (30), described secondary signal line (22) one end
The upper end of the sealed insulation component (30) is connected to, the other end is connected on the signal conditioning circuit (2), then by described
Electrical apparatus interface (1) is connected to the control section of automobile；
The sensor core seat shell body (6), the signal conditioning circuit (2) and the electrical apparatus interface (1) are installed on the sensing
In device base housing (3), the second seal (11) is located at the sensor base housing (3) and the sensor core seat shell
Between body (6)；
One end of the spun gold (20) is connected with the silicon resistance sensing element of pressure (9) binding, the other end and the pinboard (4) phase
Connection；And
One end of the signal conditioning circuit (2) is connected by first signal wire (21) with the pinboard (4), another
End is connected to the control section of automobile by the electrical apparatus interface (1).
2. temperature and pressure compound sensor according to claim 1, it is characterised in that the sealed insulation component (30)
Quantity is 2 sets.
3. temperature and pressure compound sensor according to claim 1, it is characterised in that the silicon resistance sensing element of pressure (9)
The position concentric with the sensor base housing (3) is arranged at, or is arranged at eccentric with the sensor base housing (3)
Position.
4. temperature and pressure compound sensor according to any one of claim 1 to 3, it is characterised in that the sealing is exhausted
Edge component (30) includes：
Signal transmission pole (32), through the sensor core seat shell body (6), one end is connected with the temperature sensor (31)
Connect, the other end is connected with the secondary signal line (22)；
Sealed insulation external member (33), be set in the middle part of the signal transmission pole (32) outside and with the sensor core seat shell body
(6) it is brought into close contact.
5. temperature and pressure compound sensor according to claim 4, it is characterised in that the sealed insulation external member (33) is led to
Cross welding mode be fixedly connected with the sensor core seat shell body (6), the signal transmission pole (32) also by welding side
Formula is connected with the temperature sensor (31) and the secondary signal line (22) respectively.
6. temperature and pressure compound sensor according to claim 1 or 2, it is characterised in that the sealed insulation component
(30) include：
Sealing plate (40)；
Sealing ring (41), the lower section positioned at the sealing plate (40)；
Seal partition (42), the lower section positioned at the sealing ring (41)；And
Temperature retaining ring (43), positioned at the lower section of the sealing partition (42).
7. temperature and pressure compound sensor according to claim 1 or 2, it is characterised in that the sealed insulation component
(30) include：
Signal transmission pole (51), through the sensor core seat shell body (6), one end is connected with the temperature sensor (31)
Connect, the other end is connected with the secondary signal line (22)；
Agglomerated material (52), is coated on signal transmission pole (51) middle part outside and tight with the sensor core seat shell body (6)
It is closely connected to close, leave ring-type insulating space between the agglomerated material (52) and the upper surface of the sensor core seat shell body (6)；With
And
Insulate colloid (50), is poured into the ring-type insulating space, the upper surface with the sensor core seat shell body (6) is neat
It is flat.
8. temperature and pressure compound sensor according to claim 7, it is characterised in that the agglomerated material (52) is glass
Or ceramics.
9. temperature and pressure compound sensor according to claim 1 or 2, it is characterised in that the sealed insulation component
(30) include：
Guide rod (60), through the sensor core seat shell body (6), one end is connected with the temperature sensor (31), another
End is connected with the secondary signal line (22)；
Upper sealing and insulator (61), the end of the guide rod (60) is sheathed on from the upper surface of the sensor core seat shell body (6)
On the outside of portion；
Sealing ring (63), positioned at the upper sealing and the lower section of insulator (61)；And
Lower sealing and insulator (62), the end of the guide rod (60) is sheathed on from the lower surface of the sensor core seat shell body (6)
On the outside of portion.
10. temperature and pressure compound sensor according to claim 1, it is characterised in that the silicon resistance sensing element of pressure (9)
Resistance bridge is provided with, the resistance bridge includes strain resistor, one end of the strain resistor and the spun gold (20)
Binding connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210509953.1A CN103852104B (en) | 2012-12-03 | 2012-12-03 | Temperature and pressure compound sensor based on anode linkage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210509953.1A CN103852104B (en) | 2012-12-03 | 2012-12-03 | Temperature and pressure compound sensor based on anode linkage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103852104A CN103852104A (en) | 2014-06-11 |
| CN103852104B true CN103852104B (en) | 2017-08-25 |
Family
ID=50860040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210509953.1A Active CN103852104B (en) | 2012-12-03 | 2012-12-03 | Temperature and pressure compound sensor based on anode linkage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103852104B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5974893A (en) * | 1997-07-24 | 1999-11-02 | Texas Instruments Incorporated | Combined pressure responsive transducer and temperature sensor apparatus |
| DE10109095A1 (en) * | 2001-02-24 | 2002-09-05 | Bayerische Motoren Werke Ag | Combination sensor, especially pressure and temperature sensor, for use in motor sport or aerospace applications has a compact design and is easily mounted |
| CN201138215Y (en) * | 2008-01-07 | 2008-10-22 | 南京高华科技有限公司 | Pressure and temperature synthesized sensing construction |
| CN201149497Y (en) * | 2008-01-22 | 2008-11-12 | 南京高华科技有限公司 | Sensor for detecting temperature, humidness atmos surroundings |
| CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
-
2012
- 2012-12-03 CN CN201210509953.1A patent/CN103852104B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5974893A (en) * | 1997-07-24 | 1999-11-02 | Texas Instruments Incorporated | Combined pressure responsive transducer and temperature sensor apparatus |
| DE10109095A1 (en) * | 2001-02-24 | 2002-09-05 | Bayerische Motoren Werke Ag | Combination sensor, especially pressure and temperature sensor, for use in motor sport or aerospace applications has a compact design and is easily mounted |
| CN201138215Y (en) * | 2008-01-07 | 2008-10-22 | 南京高华科技有限公司 | Pressure and temperature synthesized sensing construction |
| CN201149497Y (en) * | 2008-01-22 | 2008-11-12 | 南京高华科技有限公司 | Sensor for detecting temperature, humidness atmos surroundings |
| CN102023066A (en) * | 2010-05-31 | 2011-04-20 | 昆山双桥传感器测控技术有限公司 | Universal pressure sensor of automobile |
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| Publication number | Publication date |
|---|---|
| CN103852104A (en) | 2014-06-11 |
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