CN103851386A

CN103851386A - LED (light-emitting diode) lighting module

Info

Publication number: CN103851386A
Application number: CN201310076929.8A
Authority: CN
Inventors: 王儒光
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-11-28
Filing date: 2013-03-11
Publication date: 2014-06-11
Anticipated expiration: 2033-03-11
Also published as: CN102937249A; CN103851386B

Abstract

The invention provides an LED (light-emitting diode) lighting module which is capable of increasing the luminous efficiency, improving light output, realizing long service life and remarkably lowering the cost; furthermore, the LED light utilization rate is increased, and the LED finished product lamp lighting angle is enlarged. The lighting module comprises an LED lamp body and a light guide body, wherein the LED lamp body consists of a support seat, an LED wafer and a circuit; the LED wafer and the circuit are electrically insulated from the support seat and are arranged on the support seat; an electric loop is formed by connecting the LED wafer and the circuit; the circuit is provided with an electrode connected with an external power supply; the light guide body is arranged on the peripheral surface of a lighting taking surface of the LED lamp body; the light guide body contains fluorescent powder. According to the LED lighting module, the color-changing fluorescent powder is arranged at the far end, thus being taken as of a lighting device or a display light source a handheld device. The support seat of the lighting module can be transparent.

Description

A kind of LED lighting module

Technical field

The present invention relates to use the lighting field of light emitting diode (LED:light-emitting diode).

Background technology

In recent years, light emitting diode (hereinafter referred to as LED light-emitting device) is as receiving publicity for the light source of various lighting apparatus, and compared with conventional illuminating lamp such as incandescent lamp, LED light-emitting device has and working life longer advantageous effects lower such as caloric value.LED light-emitting device is used in various fields in recent years, not only as the light source of display, also as the illuminating lamp of general illumination equipment or as the headlight of installing on vehicle etc.Because each LED light-emitting device has lower luminous intensity, therefore, in order to realize high luminous intensity, a large amount of LED light-emitting devices is assembled in a lamp body.

As this lighting device, provided the LED illuminating lamp of the bullet cut LED light-emitting device shown in Fig. 1 in the past.Wherein, have use the light supply apparatus of single light emitting diode and by multiple dot matrix LEDs shapes be configured in the light supply apparatus using on insulation board.

General LED illuminating lamp industrial chain Shang Yousanzhong manufacturer, is first the LED wafer manufacturer of upstream, is then LED lamp pearl (being the LED luminescence unit shown in Fig. 1) manufacturer, is finally only LED illuminating lamp manufacturer.Structure and the forming process of bullet cut LED illuminating lamp are described below in conjunction with Fig. 1 and Fig. 2.

LED Deng Zhu manufacturer is from upstream manufacturer buys LED wafer, first make luminescence unit 1, stick with glue agent by heat sink 3, insulation board 4 and circuit board 8 and join one (being also bearing 5) to, with chips welding cream 7 such as silver slurries, 2 silver of LED wafer are starched to (being thermal coupling) to electrical insulating board 4 again, then drive circuit (not shown in figure 1) is set on circuit board 8, then will between drive circuit and the electrode of LED wafer 2, be electrically connected with the sealing wire 9 that the metal fines such as gold form.In order to obtain white light, will mix sealing resin 10 sealing LED wafers 2, sealing wire 9 and the partial circuit plate 8 of fluorescent material 11, this is the sealing shown in Fig. 2.The LED luminescence unit of making like this becomes qualified LED lamp pearl through a series ofly solidifying, after check, light splitting, encapsulation.After the LED lamp pearl of LED illuminating lamp manufacturer buying bout lattice, then on lamp pearl, install optical material and lamp holder, just made finished product LED lighting device.

LED illuminating lamp as noted above, LED wafer 2 is outer is covered with sealing resin and fluorescent material, and because the thermal conductivity factor of sealing resin is low, therefore, the heat dissipation path of general LED wafer 2 only has one, by heat sink 3, heat is passed.

Within the scope of the common serviceability temperature as lighting device, the luminous efficiency of LED lighting device is determined by the luminous efficiency of LED wafer 2, and the luminous efficiency of LED wafer 2 be inversely proportional to himself temperature height, be that the lower luminous efficiency of chip temperature is higher, the higher luminous efficiency of chip temperature is lower.This is because the vibration of lattice increases along with temperature rise, and the radiationless combination in electronics and hole is increased.Using in the light supply apparatus of light emitting diode, as the major part of heating, be LED wafer 2.Therefore, the heat how LED wafer 2 being produced promptly distributes, and LED chip temperature is declined, and just becomes extremely important.

Secondly, if improve the temperature rise that suppresses LED wafer 2 self from LED wafer 2 to outside heat radiation, the larger forward current that can circulate in LED wafer 2, thus the light that can increase LED wafer 2 is exported.

Again, in the life-span that the heat dissipation characteristics of raising LED wafer 2 can improve LED wafer 2, reduce light decay.The heating of LED wafer self can be accelerated the deteriorated of LED wafer, makes the LED lost of life.There is chromogenic reaction because of the utilizing emitted light of LED wafer 2 in sealing resin 10, this chromogenic reaction is photochemical reaction, can make sealing resin deteriorated and present color, is therefore transmitted into outside light from sealing resin 10 and also can significantly declines.If the temperature of sealing resin 10 raises, the reaction speed of this chromogenic reaction can be accelerated.Therefore, improve LED wafer and can effectively reduce the temperature of LED wafer and resin to outside heat radiation, thereby weaken the photochemical reaction speed because of the luminous resin causing of LED wafer, improve the life-span of LED wafer.

In addition, the fluorescent material of prior art is the outer type that covers, and it is with after fluorescent material and mixed with resin, covers one by one on LED wafer, and operation is loaded down with trivial details, no matter be machinery coating or manually to apply operating efficiency all lower.And this technique is difficult to guarantee the fluorescent material even thickness on each LED wafer, and the amount of fluorescent material has influence on the final color of lamp pearl, therefore the lamp pearl of this structure finally can be because aberration be compared with having to carry out greatly another operation-light splitting, be about to present the separately use of LED lamp pearl of different colours light, and the LED lamp pearl that presents white light only accounts for a wherein part, thereby cause finished product LED lamp cost higher.

Therefore, it is higher that the LED lamp of this kind of structure causes LED lamp operating temperature because fluorescent material and resin cover outward, and fluorescent material light conversion efficiency under hot conditions is lower, thereby the fluorescent material of the quality of having relatively high expectations, thereby also cause LED lamp cost higher.

Finally, the bearing 5 of this kind of structure is normally opaque, and LED wafer 2 be six luminous, this just causes the luminous efficacy of LED wafer 2 not make full use of, and has also caused the more conventional incandescent lamp of lighting angle of LED lamp of this structure little.

In sum, improve from LED wafer 2 to outside heat dissipation characteristics, can improve LED wafer luminous efficiency, improve the LED wafer life-span, reduce quality requirement to fluorescent material, improve the light angle of LED lamp, namely improve simultaneously LED lighting device luminous efficiency, increase light output, improve the LED lighting device life-span and reduce costs.The coating position of fluorescent material and improved process can improve the yield rate of LED lamp pearl, thus the cost of LED lighting device reduced.

Summary of the invention

In view of the above problems, the object of this invention is to provide a kind of LED lighting module, can improve luminous efficiency, the increase light of LED lighting device and export, realize the long-life, can reduce costs again simultaneously.

Another object of the present invention is the irradiating angle that improves the luminous utilization rate of LED lighting module and increase light.

Shoot out the lighting module from the LED of LED wafer according to of the present invention, comprise LED lamp body and light conductor, described LED lamp body is by bearing, LED wafer and the electric circuit constitute, described LED wafer and circuit are arranged on the bearing of electric insulation with it, described LED wafer and circuit connect into electric loop, are provided with the electrode that connects external power on described circuit;

Described light conductor is arranged on described LED lamp body gets the outer peripheral face of light face, described light conductor contain fluorescent material and and described LED lamp body between gapped or be close to.

Thus, LED wafer of the present invention does not directly apply fluorescent material outward, do not apply encapsulant, effectively improved the heat dissipation characteristics of LED wafer yet, thus effectively improved LED lighting device luminous efficiency, increase light output, improved the LED lighting device life-span.

Meanwhile, because fluorescent material far-end is arranged in light conductor, can reduce the quality requirement of LED lamp to fluorescent material, as the present invention can select domestic fluorescent material, can significantly reduce the cost of this lighting module.Because being coated in larger area light conductor compared with fluorescent material, fluorescent material is coated in one by one on LED wafer simultaneously, technique is simpler and apply more even, therefore can guarantee that the final colour developing of finished product LED lighting module is identical, and only need change light conductor and just can change the color of module, thereby can significantly reduce the production cost of LED lamp.

This lighting module can be made block or spherical, thereby can increase lighting angle scope from 0 to 350 degree of lamp.

The present invention, in above-mentioned improved invention, also comprises, the space between described LED lamp body and light conductor is vacuum, or is filled with inert gas in space between described LED lamp body and light conductor.These two kinds of structures contribute to the protection against the tide, anti-oxidation, dustproof of LED wafer, thereby improve service life and the scope of application of LED lamp.

The present invention also can be coated with encapsulant on described LED wafer.The LED lamp fluorescent material of this structure is coated in light conductor, can reduce LED module cost.And on LED wafer, be coated with encapsulant, and can effectively improve LED wafer and chip electrode intensity, also can play the protection against the tide to LED wafer, anti-oxidation, dustproof effect simultaneously.

The present invention also comprises, described bearing is transparent.As glass etc.The use of this transparent bearing, takes full advantage of each face issued light of LED wafer, thereby has improved the luminous utilization rate of LED finished product lamp, has also improved the irradiating angle of LED finished product lamp.Especially just can meet the occasion of illumination intensity for lamp pearl of that use, without assembling multiple lamp pearls for reaching light angle solid, and its size also can be made with ordinary incandescent lamp suitable, therefore can save in a large number volume and cost, there is the penetration and promotion that utilizes LED lamp.

Further, for improving the heat dissipation characteristics of LED wafer, described bearing forms with heat-dissipating aluminium plate.Bearing preferably also comprises heat sink and insulation board, and described insulation board is configured at least one face of described heat sink.Certainly also can comprise circuit board, described circuit is arranged on circuit board.

Accompanying drawing explanation

In order to be illustrated more clearly in the present invention or technical scheme of the prior art, will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below.Obviously, the accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, is not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the structural representation of existing bullet cut LED luminescence unit;

Fig. 2 is existing LED lighting device work flow schematic diagram;

Fig. 3 is embodiment of the present invention 1LED lighting module structure schematic diagram;

Fig. 4 is embodiment of the present invention 4LED lighting module structure schematic diagram.

The specific embodiment

Below, with reference to accompanying drawing, embodiments of the invention are described.

(embodiment 1)

Below with reference to Fig. 3, embodiments of the invention 1 are described.

First make LED luminescence unit 1, as shown in Figure 3.Use silver slurry to wait wafer soldering paste 7 that LED wafer 2 is welded on respectively on bearing 5, make LED wafer 2 and bearing 5 thermal couplings, on bearing 5, lay again circuit 6, then with the sealing wire 9 of the formations such as metal wire, the electrode of LED wafer 2 and circuit are welded into circuit, on circuit 6, reserve two electrode (not shown)s that are used for connecting external power.Bearing 5 need with circuit 6 and LED wafer 2 electric insulations.

By as implied above single or organize LED luminescence unit 1 more and consist of as required difform LED lamp body 13, as can be planely or cylindric, the light-emitting area of its LED wafer 2 all arranges outwardly.

The following several modes of light conductor 18 use obtain.A: fluorescent material 11 is mixed and is applied on optical material or is directly formed to allochroic light-conducting body with silica type glue; B: in airtight transparent utensil, be filled with that inert gas and fluorescent material 11 synthesize primary mixture and transparent utensil becomes light conductor 18; C: the allochroic light-conducting body 18 that direct spraying after fluorescent material 11 and mixed with resin is become to the modes such as light conductor 18 and is processed on optical material required form.

By light conductor 18 use engagings or adhesive is bonding etc. that mode is fixed on LED lamp body 13 peripheries, space between lamp body 13 and light conductor 18 is evacuated, use again the interface of the means good seal light conductors 18 such as waxing and lamp body 13, to play 2 protection against the tide of LED wafer, anti-oxidation, dustproof effect.Certainly, two electrodes for connecting external power on lamp body 13 can not cover.Subsequent production person only need add that heat abstractor and lamp holder can be made into finished product illuminating lamp to this kind of LED lighting module.

(embodiment 2)

In the space between lamp body 13 and light conductor 18, inert gas injecting, other is all with embodiment 1.

(embodiment 3)

On LED wafer 2, apply encapsulant 10; LED lamp body 13 does not need sealing with the interface of light conductor 18 simultaneously; and the space between lamp body 13 and light conductor 18 does not need to be evacuated or inert gas injecting yet, equally can play the protection against the tide of LED wafer, anti-oxidation, dustproof protective effect.Other is all same with embodiment 1.

(embodiment 4)

As shown in Figure 4, LED luminescence unit 1 is made up of LED wafer 2 and the circuit 6 of transparent bearing 5 and setting thereon, form LED lamp body 13 with one or more such LED luminescence units 1, then be socketed with the light conductor 18 that contains fluorescent material 11 thereon, just formed LED lighting module.

The transparent bearing 5 of the present embodiment can be glass, due to the light transmission of glass etc., LED wafer 2 and the luminous of bearing 5 abutted surfaces also can be utilized.Thereby improve the luminous efficiency of LED finished product lamp, also improved the lighting angle of LED finished product lamp simultaneously.Due to the use of transparent bearing, make to utilize the finished product LED lamp that single led luminescence unit 1 is made to become possibility, reduce the production cost of LED finished product lamp.

The bearing 5 of above-mentioned embodiment also can be used heat sink, to strengthen the radiating effect of wafer, simultaneously heat sink need with circuit 6 and LED wafer 2 electric insulations.Certainly also can be combined into bearing with heat sink and insulation board, LED wafer 2 is arranged on insulation board.

On bearing, also can be provided with circuit board, circuit 6 is arranged on circuit board.Circuit 6 also can be used on printed wiring mode on circuit board and obtains.

The present invention can be used as illumination, also can be used as the display light source of the display devices such as mobile phone.

Embodiments of the invention are not limited to above statement, and all have the embodiment of similar functions all within protection scope of the present invention with above-described embodiment.

Claims

1. a LED lighting module, comprises LED lamp body (13) and light conductor (18), it is characterized in that:

Described LED lamp body (13) is made up of bearing (5), LED wafer (2) and circuit (6), described LED wafer (2) and circuit (6) are arranged on it on the bearing of electric insulation (5), described LED wafer (2) and circuit (6) connect into circuit, are provided with the electrode that connects external power on described circuit (6);

Described light conductor (18) is arranged on described LED lamp body (13) gets the outer peripheral face of light face, and described light conductor (18) contains fluorescent material (11).

2. LED lighting module as claimed in claim 1, is characterized in that, gapped between described light conductor (18) and described LED lamp body (13).

3. LED lighting module as claimed in claim 1, is characterized in that, between described light conductor (18) and described LED lamp body (13), is close to.

4. as the LED lighting module as described in arbitrary in claim 1,2,3, it is characterized in that, the space between described LED lamp body (13) and light conductor (18) is vacuum.

5. the LED lighting module as described in claim 1,2,3, is characterized in that, in the space between described LED lamp body (13) and light conductor (18), is filled with inert gas.

6. LED lighting module as claimed in claim 1, is characterized in that, is coated with encapsulant (10) on described LED wafer (2).

7. as the LED lighting module as described in any in claim 1,2,3, it is characterized in that, described bearing (5) is transparent.

8. LED lighting module as claimed in claim 7, is characterized in that, described bearing (5) is for to be made up of heat sink.

9. LED lighting module as claimed in claim 7, is characterized in that, described bearing (5) is made up of heat sink and insulation board combination.

10. LED lighting module as claimed in claim 7, is characterized in that, described bearing is also provided with circuit board on (5), and described circuit (6) is arranged on circuit board.