CN103843366B - Ultrasonic sensor and manufacture method thereof - Google Patents
Ultrasonic sensor and manufacture method thereof Download PDFInfo
- Publication number
- CN103843366B CN103843366B CN201280048808.6A CN201280048808A CN103843366B CN 103843366 B CN103843366 B CN 103843366B CN 201280048808 A CN201280048808 A CN 201280048808A CN 103843366 B CN103843366 B CN 103843366B
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- shell
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- ultrasonic sensor
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- damping member
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- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000013016 damping Methods 0.000 claims abstract description 49
- 102000045246 noggin Human genes 0.000 claims abstract description 26
- 108700007229 noggin Proteins 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 238000007493 shaping process Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 230000002787 reinforcement Effects 0.000 claims description 9
- 238000002604 ultrasonography Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 229920003225 polyurethane elastomer Polymers 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 102100032884 Neutral amino acid transporter A Human genes 0.000 description 1
- 101710160582 Neutral amino acid transporter A Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
- G01S15/88—Sonar systems specially adapted for specific applications
- G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
- G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
Abstract
Ultrasonic sensor (101) possesses: have the shell (31) having bottom tube-like of bottom (31b) and side of sidewall portion (31a)；It is located at the piezoelectric element (32) of the inner bottom surface of shell (31)；Electrically connect and the terminal (43) prominent to the outside of shell (31) with piezoelectric element (32) via conductive member in shell (31)；The terminal keeping terminal (43) keeps component (41)；Terminal is kept the buffer component (33) that component (41) is maintained in shell (31)；The damping member (39) arranged along the inner peripheral surface of the side of sidewall portion (31a) of shell (31)；It is filled in the noggin piece (36) on the top of in shell (31), damping member (39) and buffer component (33), between damping member (39) and buffer component (33), is provided with gap (40).According to this structure, prevent the leakage of vibration to terminal, thus improve the reverberation characteristic caused by leakage of vibration.
Description
Technical field
The present invention relates to ultrasonic sensor and manufacture method thereof, especially relate to have piezoelectric element and
The input and output terminal that electrically connects with this piezoelectric element, such as at turning sonar, the reversing sound of motor vehicles
The ultrasonic sensor used in receiving etc. and manufacture method thereof.
Background technology
Ultrasonic sensor is to send out by indirectly sending ultrasonic pulse signal receiving
Ultrasonic pulse signal arrive the reflected signal of back reflection of object and detect the device of object.At machine
When the reversing sonar of motor-car, turning sonar and then detection parallel parking with the barrier such as sidewall away from
From parking spot sensor etc. in use ultrasonic sensor.This ultrasonic sensor is at patent literary composition
Offer and in 1～3, have disclosure.
Fig. 9 is the partial cutoff front view of the ultrasonic sensor of patent documentation 1.This supersonic sensing
Device possesses ultrasonic oscillator 1, buffer component 2, shielding line 5, sound-absorbing part 6 and housing 3.Buffering structure
Part 2 has ultrasound wave and sends the opening received and around ultrasonic oscillator 1.Housing 3 is profiled member,
Ultrasonic oscillator 1 and buffer component 2 are received.The one end of shielding line 5 is in housing 3
Portion is connected with ultrasonic oscillator 1, and the other end is drawn to outside from housing 3.Further, at buffering structure
The inside of part 2 and the part corresponding with the side of ultrasonic oscillator 1, to surround ultrasonic oscillator 1
Mode is formed with air layer 4.
The structure of ultrasonic sensor as described below is had, i.e. this is ultrasonic disclosed in patent documentation 2
Wave sensor possesses: ultrasonic oscillator；Have and be stained with ultrasonic oscillator and form ultrasonic wave radiation wall
The interior side box body of bottom surface sections and cylindrical sidewall；Having the cylindrical sidewall with interior side box body is that coaxial is joined
The outer side box body of the cylindrical sidewall put, outer side box body is in multiple supporting portions pair of ultrasonic wave radiation wall side
Interior side box body supports, and locates, beyond multiple supporting portions outside the cylindrical sidewall of interior side box body
It is formed with gap between the outer wall of the cylindrical sidewall of wall and outer side box body.
The structure of ultrasonic sensor as described below is had, i.e. this is ultrasonic disclosed in patent documentation 3
Wave sensor possesses: ultrasonic oscillator；There is ultrasound wave send the opening received and surround ultrasound wave
The holding component of oscillator；For profiled member and to ultrasonic oscillator and the housing keeping component to receive,
By being provided with protuberance in the inner side keeping component, thus the generation gap, position beyond protuberance.
Citation
Patent documentation
Patent documentation 1: 4 No. 238497 publications of Japanese Unexamined Patent Publication
Patent documentation 2: 2003 No. 315443 publications of Japanese Unexamined Patent Publication
Patent documentation 3: 5 No. 207594 publications of Japanese Unexamined Patent Publication
Summary of the invention
Invent problem to be solved
In the existing ultrasonic sensor shown in patent documentation 1～3, above-mentioned air layer and
Under the effect of gap, the vibration of ultrasonic oscillator is difficult to transmit to shell (housing, casing).Therefore,
There is the shortening effect of reverberation time.
But, the component in the input and output carrying out the signal of telecommunication does not sets for lead-in wire (or shielding line)
In the case of pin terminal, the vibration of shell is propagated to pin terminal, produces this vibration and makes to be provided with ultrasonic
The problem of the external circuit substrate vibration of wave sensor is (hereinafter referred to as " leakage of vibration ".).Due to
This leakage of vibration and make the reverberation time elongated (reverberation characteristic deterioration).Further, if the reverberation time drags
If length, then when detection is positioned at in-plant object, due to based on the ultrasonic pulse sent out
Receive reflected signal in the persistent period of the reverberation of signal, therefore cannot realize being positioned at in-plant object
Detection.
It is an object of the invention to, it is provided that a kind of preventing is let out by vibration to the leakage of vibration of terminal, improvement
The ultrasonic sensor of the reverberation characteristic that leakage causes.
For solving the mode of problem
(1) ultrasonic sensor of the present invention is characterised by possessing:
Having the shell of bottom tube-like, it has bottom and side of sidewall portion；
Piezoelectric element, it is located at the inner bottom surface of described shell；
Terminal, it electrically connects with described piezoelectric element via conductive member in described shell, and to institute
The outside stating shell highlights；
Terminal keeps component, and described terminal is kept by it；
Buffer component, described terminal is kept component to keep in described shell by it；
Damping member, it is arranged along the inner peripheral surface of the side of sidewall portion of described shell；
Noggin piece, it is filled in damping member in described shell, described and described buffer component
Top,
Gap (air layer) it is provided with between described damping member and described buffer component.
According to this structure, the damped component of vibration, buffer component and the gap come from shell transmission are (empty
Gas-bearing formation) decay (blocking), it is virtually impossible to keep component to propagate to terminal by terminal, accordingly, it is capable to
The leakage of vibration produced when the circuit substrate that terminal is installed on outside is enough greatly reduced.
(2) preferably, damping member described in the modular ratio of described noggin piece is little.According to
This structure, it is possible to reduction is directly transmitted to terminal from the noggin piece that modular ratio damping member is little
Leakage of vibration.It addition, damping member becomes the structure directly not connected with terminal, the bullet of damping member
Property modulus is difficult to affect leakage of vibration characteristic, therefore the range of choice of damping member broadens.
(3) interface (air to described gap Yu described noggin piece preferably, it is also equipped with
The peristome of layer) carry out inaccessible obstruction component (inserting mortar resin).According to this structure, it is possible to make to delay
Rush simplifying the structure of component.
(4) preferably, the side of sidewall portion of described shell possesses thinner wall section and at bottom side in open side
Possess heavy section,
Heavy section is provided with the reinforcement that acoustic impedance is higher than shell.According to this structure, the bottom surface of shell
The rigidity of surrounding uprise, the vibration of enclosure bottom is suppressed to the propagation of enclosure side wall sections, and
Sensitivity as sensor is improved.
(5) preferably, between described piezoelectric element and described buffer component, it is provided with Sound-absorbing member.
According to this structure, sound-absorbing part is utilized to absorb useless sound wave, it is possible to more efficiency makes well from piezoelectricity
Element is to the useless SATT of shell internal delivery.
(6) manufacture method of the ultrasonic sensor of the present invention is (1)～(5) either side
The manufacture method of ultrasonic sensor, it is characterised in that including:
The work that circular shaping mould bigger than described buffer component for external diameter is inserted into described shell
Sequence；
The week of the elastic resin that described damping member is formed described shaping mould in described shell
Enclose the operation of filling；
Described shaping mould is removed from described shell and in described shell, carries described buffer component
Operation.
Invention effect
According to the present invention, the damped component of vibration, buffer component and the gap come from shell transmission are (empty
Gas-bearing formation) decay (blocking), keep component to propagate to terminal substantially without by terminal, accordingly, it is capable to
Leakage of vibration is enough greatly reduced.Therefore, it is possible to prevent the evil of the reverberation characteristic caused by leakage of vibration
Change such that it is able to realize being positioned at the detection of more in-plant object.
Accompanying drawing explanation
Fig. 1 is the sectional view of the ultrasonic sensor 101 involved by the first embodiment.
Fig. 2 is the exploded perspective view removing local of ultrasonic sensor 101.
In Fig. 3, Fig. 3 (A) is to represent the ultrasonic sensor 101 involved by the first embodiment
The figure of reverberation characteristic, Fig. 3 (B) is the reverberation characteristic of the ultrasonic sensor being denoted as comparative example
Figure.
When Fig. 4 is to represent the gap 40 between damping member 39 and buffer component 33 and leakage of vibration
Between the figure of relation.
Fig. 5 is the figure representing the operation forming damping member 39 and gap 40.
Fig. 6 is the sectional view of the ultrasonic sensor 102 involved by the second embodiment.
Fig. 7 is the sectional view of the ultrasonic sensor 103 involved by the 3rd embodiment.
Fig. 8 is the sectional view of the ultrasonic sensor 104 involved by the 4th embodiment.
Fig. 9 is the partial cutoff front view of the ultrasonic sensor of patent documentation 1.
Detailed description of the invention
" the first embodiment "
Fig. 1 is the sectional view of the ultrasonic sensor 101 involved by the first embodiment.Fig. 2 is super
The exploded perspective view removing local of sonic sensor 101.
Ultrasonic sensor 101 includes: have the side of sidewall portion 31a of discoideus bottom 31b and tubular
The having the shell 31 of bottom tube-like, be attached at the piezoelectric element 32 of the inner bottom surface of shell 31, add of aluminum
Strong part (spindle) 37, terminal 43, the terminal of holding terminal 43 keep component 41 etc..Terminal 43
Electrically connect by Fig. 1 unshowned distribution part (conductive member) with piezoelectric element 32.Distribution part (is led
Logical component) for example, lead-in wire, flexible base board etc..Piezoelectric element 32, in tabular, drives when being applied in
Vibrate along Directional Extension in face during galvanic electricity pressure.Piezoelectric element 32 engages with the bottom 31b of shell 31.
Piezoelectric element 32 is such as made up of piezoelectric ceramics, has the piezoelectric substrate of circular plate shape and is respectively arranged on
Electrode on the mutually opposing interarea of piezoelectric substrate.
As in figure 2 it is shown, shell 31 is 31b side, bottom obturation, the opposition side opening of 31b side, bottom
Have bottom tube-like, the opening of shell 31 is rounded under top view.The side of sidewall portion 31a of shell 31
Possess thinner wall section 31t in open side and at bottom side, there is heavy section 31h.Side of sidewall portion at shell 31
31a is formed with stage portion 31ST.
Reinforcement (spindle) 37 is the annular component in central authorities with opening 37h, is arranged in shell
On the heavy section 31h of 31 and be arranged in what the inner peripheral surface with thinner wall section 31t of side of sidewall portion 31a did not connected
Position.Reinforcement 37 for acoustic impedance is higher as the component of spindle function.Therefore,
Reinforcement 37 can be by the material identical with shell 31, i.e. by aluminum by adjustment thickness equidimension
Constitute component, but preferably by as rustless steel, zinc compared with the material constituting shell 31 close
The material that degree is high and rigidity is high is constituted.
As in figure 2 it is shown, in the 31b of bottom by stage portion 31ST around region be main vibration
Region.The main vibration area of shell 31 is rectangle under top view, y-axis direction length therefore y
Direction of principal axis is major axis, and Duan GuxZhou direction, x-axis direction is short axle.So, main vibration area tool
There is anisotropic shape, therefore the directivity of ultrasound wave produces anisotropy.That is, described long axis direction
The sensing angle in (y-axis direction) is narrow, the sensing angular width of described short-axis direction (x-axis direction).
Flat sound-absorbing part 38 it is provided with on piezoelectric element 32.Sound-absorbing part 38 is arranged in shell
The inside of 31 by stage portion 31ST around space in.Sound-absorbing part 38 is by such as polyester felt, many
Hole matter silicone etc. are constituted, to useless ultrasonic to the release of the open side of shell 31 from piezoelectric element 32
Ripple absorbs.It is provided with by silicon between reinforcement 37 and sound-absorbing part 38 and terminal holding component 41
The buffer component 33 that the elastomers such as ketone rubber, polyurethane rubber are constituted.Buffer component 33 is at shell 31
Interior holding terminal keeps component 41.It is provided with by gathering along the inner peripheral surface of side of sidewall portion 31a of shell 31
Elastomer composition and the resistances as the cylindrical member in central authorities with opening such as urethane rubber, silicone rubber
Buddhist nun's component 39.Further, between damping member 39 and buffer component 33, gap (air layer) it is formed with
40.Specifically, buffer component 33 has flange shape (the chimb shape) contacted with damping member 39
Part, by the part of this flange shape (chimb shape) at damping member 39 and buffer component 33
Between form gap (air layer) 40.
In the inside of shell 31, in the space on damping member 39 and the top of buffer component 33
It is filled with the noggin piece 36 being made up of the elastomer such as silicone rubber, polyurethane rubber.Noggin piece
36 and damping member 39 can use identical material.
Shell 31 can be formed by such as forging.Bolster 33 is the component of cup-shaped, including tool
There are bottom and the side of sidewall portion of tubular of the holding section 33e that the opening 37h with reinforcement 37 engages.Logical
Cross and bolster 33 is set, it is possible to the vibration in the bottom 31b of suppression shell 31 is to terminal hold down 41
The situation of transmission.
Terminal keeps component 41 to be made up of, to two resins such as polybutylene terephthalate (PBT)s (PBT)
The pin-shaped terminal 43 of root keeps.Terminal keeps component 41 to have and the tubular of buffer component 33
Side of sidewall portion inner surface engaging flange shape holding section (hereinafter referred to as " flange part ".)41f.
Terminal keeps the upper surface 41s of the flange part 41f of component 41 to be covered by noggin piece 36.
So, owing to being provided with the damping member 39 that the inner peripheral surface of the side of sidewall portion 31a with shell 31 connects,
Therefore the damped component of vibration 39 of the side of sidewall portion 31a of shell 31 is decayed.Further, by damping structure
Gap (air layer) 40 it is formed with, the side of sidewall portion 31a of shell 31 between part 39 and buffer component 33
Vibration be difficult to propagate to buffer component 33 via damping member 39.I.e., hardly according to slow
Rush component 33 → terminal and keep the propagated vibration of component 41 → terminal 43, can effectively press down vibration damping
Dynamic leakage.It addition, the vibration propagated from shell 31 via the part beyond gap (air layer) 40
Decay among noggin piece 36, keep component 41 to propagate to terminal 43 via terminal hardly.
According to above-mentioned effect, it is possible to ultrasonic sensor 101 is installed on outside circuit is greatly reduced
Produced leakage of vibration during substrate.
It addition, kept the upper surface 41s of the flange part 41f of component 41 by noggin piece by terminal
36 cover, it is possible to prevent terminal from keeping the situation that component 41 departs from from shell 31.
Buffer component 33 is the structure being difficult to propagate vibration, and damping member 39 and noggin piece 36 are
The structure of the vibration of the side of sidewall portion 31a of suppression (vibration damping) shell 31.I.e. damping member 39 and filling
The preferred modular ratio buffer component 33 of component 36 is high.More specifically, elastic modelling quantity includes energy storage
The loss springform of elastic modelling quantity and loss elastic modulus, preferably damping member 39 and noggin piece 36
Amount is big and the store elastic modulus of buffer component 33 is little.
Fig. 3 (A) is to represent that the reverberation of the ultrasonic sensor 101 involved by the first embodiment is special
The figure of property, Fig. 3 (B) is the figure of the reverberation characteristic of the ultrasonic sensor being denoted as comparative example.
The ultrasonic sensor of this comparative example does not has the gap 40 shown in Fig. 1, to be expanded with buffering in the portion
Component 33, except do not have gap 40 this on the one hand in addition to for the first embodiment involved by surpass
The structure that sonic sensor 101 is identical.In Fig. 3 (A) and Fig. 3 (B), by μ s/div
Represent transverse axis 500, represented the longitudinal axis by 1V/div.It addition, be all to utilize soldering to be fixed by terminal 43
On outside circuit substrate, according to sending time 0.13ms and send the train of pulse ripple of eight ripples, to
The voltage waveform manifested in piezoelectric element is amplified being observed.Although being from transmission for reality
The decay of amplitude is started after just terminating, but owing to temporarily exceeding the dynamic range of amplifying circuit, therefore its
The waveform of time is saturated.
Can be clear from from Fig. 3 (A) and Fig. 3 (B) are contrasted, involved by the first embodiment
Ultrasonic sensor 101 in, amplitude relatively early convergence, leakage of vibration is inhibited and the reverberation time is short.
When Fig. 4 is to represent the gap 40 between damping member 39 and buffer component 33 and leakage of vibration
Between the figure of relation.Here, " leakage of vibration time " is as utilizing soldering to fix terminal 43
Common reverberation time under state on outside circuit substrate and utilizing the folders such as silicone rubber
Hold to the vibration of terminal 43 leakage to the reverberation time under the state suppressing leakage of vibration, reverberation
The time that amount of change is defined.In the case of being not provided with gap 40, i.e. in the feelings of comparative example
Under condition, the deviation of leakage of vibration time is relatively big, and by arranging gap 40, the leakage of vibration time becomes very
Little, and deviation also diminishes.According to its result, by being provided with more than the gap of 0mm, vibration
Leak time be suppressed to as the grade that can use, less than 0.1ms.
It should be noted that according to the first embodiment, owing to the peristome of shell 31 is protected by terminal
Hold component 41 airtight with noggin piece 36, therefore, in the inside of shell 31, do not have water to be immersed in
Inside causes sensitivity decrease or the problem producing corrosion between dissimilar metal.
About the manufacture method for arranging gap 40 in ultrasonic sensor 101 illustrated above
Illustrate with reference to Fig. 5.
Fig. 5 is the figure representing the operation forming damping member 39 and gap 40.First, such as Fig. 5 (A)
Shown in, in shell 31, engage piezoelectric element 32, reinforcement 37 is installed, Sound-absorbing member 38 is joined
Put on piezoelectric element 32, be assembled into pattern 51.Shaping mould 51 is with the sidewall at itself and shell 31
Exist between portion 31a and there is the mode with the gap of damping member 39 same shape configure.Then,
As shown in Fig. 5 (B), inserting mortar resin 39P is coated on the side of sidewall portion of shaping mould 51 and shell 31
In the local in the gap between 31a and be allowed to harden.Inserting mortar resin 39P is by identical with damping member 39
Material is constituted, and becomes a part for damping member 39 afterwards.Then, as shown in Fig. 5 (C), will
Resin-coated (filling) of damping member 39 is at the side of sidewall portion 31a of shaping mould 51 with shell 31
Between gap in and be allowed to harden.Afterwards, as shown in Fig. 5 (D), remove shaping mould 51, such as figure
5 (E) assemble buffer component 33 like that.
According to above operation, between damping member 39 and buffer component 33, it is provided with gap 40.
" the second embodiment "
Fig. 6 is the sectional view of the ultrasonic sensor 102 involved by the second embodiment.Ultrasound wave passes
The structure of sensor 102 is identical with the ultrasonic sensor 101 shown in the first embodiment.But, fill out
Fill component 36 to be made up of the material different from damping member 39.Ultrasound wave at the second embodiment passes
In sensor 102, the elastic modelling quantity of the modular ratio damping member 39 of noggin piece 36 is little.
Such as damping member 39 is made up of polyurethane rubber, and noggin piece 36 is made up of silicone rubber.
As long as it addition, make the elastic modelling quantity of noggin piece 36 different from the elastic modelling quantity of damping member 39, two
Person is alternatively polyurethane rubber.Damping member 39 is damping relative to the side of sidewall portion 31a of shell 31
High elastic component, noggin piece 36 is to be difficult to terminal, the vibration of side of sidewall portion 31a is kept component 41
The elastic component propagated.
" the 3rd embodiment "
Fig. 7 is the sectional view of the ultrasonic sensor 103 involved by the 3rd embodiment.At ultrasound wave
Sensor 103 possesses the interface to gap 40 with noggin piece 36 and carries out the obstruction component of obturation
34.Other structure is identical with the ultrasonic sensor 101 shown in the first embodiment.
Obstruction component 34 up to can will not be immersed in gap 40 by utilizing allotter coating thixotropy
The resin of interior degree is arranged.
So, by utilizing obstruction component 34 (empty with the interface of noggin piece 36 to gap 40
The peristome of gas-bearing formation) carry out obturation (inserting mortar), it is therefore prevented that tree is filled when the filling of noggin piece 36
The inflow to gap 40 of fat.
It addition, by so using obstruction component 34, it is not necessary to formed and damping structure at buffer component 33
The part of flange shape (the chimb shape) of part 39 contact, therefore, it is possible to make the shape of buffer component 33
Simplify.
" the 4th embodiment "
Fig. 8 is the sectional view of the ultrasonic sensor 104 involved by the 4th embodiment.At ultrasound wave
In sensor 104, utilize noggin piece 36 between damping member 39 and buffer component 33
The opening of gap 40 carries out obturation.Other structure and the ultrasonic sensor shown in the first embodiment
101 is identical.
Use thixotropy to be up to the resin when it is filled in noggin piece 36 and may not flow into gap 40
The resin material of interior degree.
Reference numeral explanation
31 ... shell
31a ... side of sidewall portion
31b ... bottom
31h ... heavy section
31ST ... stage portion
31t ... thinner wall section
32 ... piezoelectric element
33 ... buffer component
33e ... holding section
34 ... obstruction component
36 ... noggin piece
37 ... reinforcement
37h ... opening
38 ... Sound-absorbing member
39 ... damping member
40 ... gap
41 ... terminal keeps component
41f ... flange part
41s ... upper surface
43 ... terminal
51 ... shaping mould
101～104 ... ultrasonic sensor
Claims (6)
1. a ultrasonic sensor, it is characterised in that possess:
Having the shell of bottom tube-like, it has bottom and side of sidewall portion；
Piezoelectric element, it is located at the inner bottom surface of described shell；
Terminal, it electrically connects with described piezoelectric element via conductive member in described shell, and to institute
The outside stating shell highlights；
Terminal keeps component, and described terminal is kept by it；
Buffer component, described terminal is kept component to keep in described shell by it；
Damping member, it is arranged along the inner peripheral surface of the side of sidewall portion of described shell；
Noggin piece, it is filled in damping member in described shell, described and described buffer component
Top,
It is provided with gap between described damping member and described buffer component,
The elastic modelling quantity of buffer component described in the modular ratio of described damping member is high.
2. ultrasonic sensor as claimed in claim 1, it is characterised in that
Damping member described in the modular ratio of described noggin piece is little.
3. ultrasonic sensor as claimed in claim 1 or 2, it is characterised in that
Being also equipped with obstruction component, it carries out obturation to the interface in described gap Yu described noggin piece.
4. ultrasonic sensor as claimed in claim 1 or 2, it is characterised in that
The side of sidewall portion of described shell possesses thinner wall section in open side and possesses heavy section at described bottom side,
Described heavy section is provided with the reinforcement that acoustic impedance is higher than described shell.
5. ultrasonic sensor as claimed in claim 1 or 2, it is characterised in that
It is provided with Sound-absorbing member between described piezoelectric element and described buffer component.
6. a manufacture method for ultrasonic sensor, the method is any one of Claims 1 to 5
The manufacture method of described ultrasonic sensor, it is characterised in that including:
The work that circular shaping mould bigger than described buffer component for external diameter is inserted into described shell
Sequence；
The described shaping mould that the elastic resin that described damping member is formed is filled in described shell
The operation of surrounding；
Described shaping mould is removed from described shell and in described shell, carries described buffer component
Operation.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011220325 | 2011-10-04 | ||
| JP2011-220325 | 2011-10-04 | ||
| PCT/JP2012/075446 WO2013051524A1 (en) | 2011-10-04 | 2012-10-02 | Ultrasonic sensor and manufacturing method therefor |
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| CN103843366A CN103843366A (en) | 2014-06-04 |
| CN103843366B true CN103843366B (en) | 2016-11-02 |
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| JP (1) | JP5522311B2 (en) |
| KR (1) | KR101491509B1 (en) |
| CN (1) | CN103843366B (en) |
| WO (1) | WO2013051524A1 (en) |
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|---|---|---|---|---|
| WO2016171003A1 (en) * | 2015-04-20 | 2016-10-27 | 株式会社村田製作所 | Ultrasonic sensor |
| CN106017529B (en) * | 2016-07-15 | 2018-08-07 | 广东奥迪威传感科技股份有限公司 | A kind of open-type sensor |
| KR20180065580A (en) * | 2016-12-08 | 2018-06-18 | 아이에스테크놀로지 주식회사 | wire alignment jig for ultrasonic transducer of vehicle |
| JP6631549B2 (en) * | 2017-02-01 | 2020-01-15 | 株式会社デンソー | Ultrasonic output device |
| JP7393881B2 (en) * | 2019-06-17 | 2023-12-07 | 株式会社アイシン | sonar unit |
| JP7294223B2 (en) * | 2020-04-21 | 2023-06-20 | 株式会社デンソー | Ultrasonic sensors and vibration absorbers |
| JP2022059286A (en) * | 2020-10-01 | 2022-04-13 | Tdk株式会社 | Ultrasonic transducer |
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| JPH04238496A (en) * | 1991-01-23 | 1992-08-26 | Matsushita Electric Works Ltd | Ultrasonic sensor |
| CN1734285A (en) * | 2004-08-11 | 2006-02-15 | 株式会社电装 | Ultrasonic sensor |
| WO2007019506A2 (en) * | 2005-08-05 | 2007-02-15 | Kellogg Company | Peeled infused dried buoyant cranberries and method for making same |
| WO2011090201A1 (en) * | 2010-01-25 | 2011-07-28 | 株式会社村田製作所 | Ultrasonic vibration device |
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| JPH09138224A (en) | 1995-11-14 | 1997-05-27 | Mitsubishi Electric Corp | Array probe |
| CN101258772B (en) * | 2005-09-09 | 2012-04-25 | 株式会社村田制作所 | Ultrasonic sensor |
| JP5423295B2 (en) * | 2009-09-30 | 2014-02-19 | 株式会社村田製作所 | Ultrasonic transducer |
| KR101422819B1 (en) * | 2009-12-25 | 2014-07-23 | 가부시키가이샤 무라타 세이사쿠쇼 | Ultrasonic vibration device |
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2012
- 2012-10-02 WO PCT/JP2012/075446 patent/WO2013051524A1/en active Application Filing
- 2012-10-02 KR KR1020147008772A patent/KR101491509B1/en active IP Right Grant
- 2012-10-02 JP JP2013519904A patent/JP5522311B2/en active Active
- 2012-10-02 CN CN201280048808.6A patent/CN103843366B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04238496A (en) * | 1991-01-23 | 1992-08-26 | Matsushita Electric Works Ltd | Ultrasonic sensor |
| CN1734285A (en) * | 2004-08-11 | 2006-02-15 | 株式会社电装 | Ultrasonic sensor |
| WO2007019506A2 (en) * | 2005-08-05 | 2007-02-15 | Kellogg Company | Peeled infused dried buoyant cranberries and method for making same |
| WO2011090201A1 (en) * | 2010-01-25 | 2011-07-28 | 株式会社村田製作所 | Ultrasonic vibration device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103843366A (en) | 2014-06-04 |
| KR101491509B1 (en) | 2015-02-09 |
| KR20140053405A (en) | 2014-05-07 |
| JPWO2013051524A1 (en) | 2015-03-30 |
| WO2013051524A1 (en) | 2013-04-11 |
| JP5522311B2 (en) | 2014-06-18 |
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