CN103826385A - High-voltage-resistant structure of mutual induction coil printed circuit board - Google Patents
High-voltage-resistant structure of mutual induction coil printed circuit board Download PDFInfo
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- CN103826385A CN103826385A CN201410087952.1A CN201410087952A CN103826385A CN 103826385 A CN103826385 A CN 103826385A CN 201410087952 A CN201410087952 A CN 201410087952A CN 103826385 A CN103826385 A CN 103826385A
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- film type
- wet film
- ink layer
- printed board
- copper base
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Abstract
The invention discloses a high-voltage-resistant structure of a mutual induction coil printed circuit board. A wet film type solder-resistant ink layer with the thickness of 0.035mm-0.01mm covers the surface of a circuit on the outmost layer of the mutual induction coil printed circuit board; a copper-free baseplate with the thickness of 0.05mm-0.15mm is fixedly attached onto the surface of the wet film type solder-resistant ink layer; the wet film type solder-resistant ink layer and the copper-free baseplate are respectively provided with a windowing part and a grooving part corresponding to plug-in holes of the circuit on the outmost layer, and the plug-in holes are exposed out of the windowing parts and the grooving parts. Due to the adoption of the structure, the voltage resistance of the mutual induction coil printed circuit board is enhanced, and the requirement of a high-voltage insulation test under the conditions of DC1500V, 60sec and 2mA can be met.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, be specifically related to a kind of structure of the high voltage withstanding property that can strengthen mutual inductor printed board.
Background technology
Traditional mutual inductor printed board structure can be good at meeting effect and the demand of route protection, but proof voltage is not good enough, can only meet the international electronics industry of basic I PC(and connect association): DC500V, the voltage-withstand test condition of 30sec.But along with scientific and technological progress, the upgrading of electronic product and update, science and technology progress is more and more higher to the requirement of printed board, high voltage withstanding property to mutual inductor printed board also increases, and is industry technical problem urgently to be resolved hurrily so how to significantly improve the high voltage withstanding property of mutual inductor printed board in the situation that significantly not increasing cost.
Summary of the invention
In order to address the above problem, the invention provides the high voltage withstanding structure of a kind of mutual inductor printed board, the high voltage withstanding structural reinforcing of this mutual inductor printed board proof voltage, can meet test condition: DC1500V, 60sec, 2mA, and simple in structure, easy to implement.
The present invention for the technical scheme that solves its technical problem and adopt is:
The high voltage withstanding structure of a kind of mutual inductor printed board, the outermost wire road surfaces of described mutual inductor printed board is coated with wet film type anti-solder ink layer, the outermost layer circuit of described mutual inductor printed board has insert hole, described wet film type anti-solder ink layer has the window portion corresponding with described insert hole position, the insert hole of described outermost layer circuit is outside the place of the portion of windowing of described wet film type anti-solder ink layer is exposed to, described wet film type anti-solder ink layer surface is fixedly pasted with without copper base, described without copper base have with described insert hole and described in the corresponding fluting portion of portion of windowing, described insert hole is outside place of the described fluting portion without copper base is exposed to, the thickness of described wet film type anti-solder ink layer is 0.035mm～0.01mm, the described thickness without copper base is 0.05～0.15mm.
Preferably, described is glass mat without copper base.
Preferably, the described thickness without copper base is 0.1mm.
The invention has the beneficial effects as follows: the high voltage withstanding structure of mutual inductor printed board of the present invention is first to cover at the outermost wire road surfaces of mutual inductor printed board the wet film type anti-solder ink layer that a layer thickness is 0.035mm～0.01mm, it is fixing on described wet film type anti-solder ink layer surface again that to attach a layer thickness be 0.05～0.15mm without copper base, wet film type anti-solder ink layer and there is respectively the window portion corresponding with the insert hole of outermost layer circuit and fluting portion without copper base, insert hole is outside described portion and the fluting portion place of windowing is exposed to, said structure has strengthened the proof voltage of mutual inductor printed board, can meet test condition is DC1500V, 60sec, the High-Voltage Insulation test of 2mA.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Below, by specific instantiation explanation the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
Embodiment: the high voltage withstanding structure of a kind of mutual inductor printed board, the outermost wire road surfaces of described mutual inductor printed board 1 is coated with wet film type anti-solder ink layer 2(by synthetic resin, light initiator, colorant, interface activating agent, filler and solvent are made), the outermost layer circuit of described mutual inductor printed board has insert hole 11, described wet film type anti-solder ink layer has the window portion 21 corresponding with described insert hole position, the insert hole of described outermost layer circuit is outside the place of the portion of windowing of described wet film type anti-solder ink layer is exposed to, described wet film type anti-solder ink layer surface is fixedly pasted with without copper base 3, described without copper base have with described insert hole and described in the corresponding fluting portion 31 of portion of windowing, described insert hole is outside place of the described fluting portion without copper base is exposed to, the thickness of described wet film type anti-solder ink layer is 0.035mm～0.01mm, the described thickness without copper base is 0.05～0.15mm.
The described material without copper base is glass mat (being made up of epoxy resin and glass fibre) preferably.
Described thickness the best without copper base is 0.1mm.
Claims (3)
1. the high voltage withstanding structure of mutual inductor printed board, it is characterized in that: the outermost wire road surfaces of described mutual inductor printed board (1) is coated with wet film type anti-solder ink layer (2), the outermost layer circuit of described mutual inductor printed board has insert hole (11), described wet film type anti-solder ink layer has the window portion (21) corresponding with described insert hole position, the insert hole of described outermost layer circuit is outside the place of the portion of windowing of described wet film type anti-solder ink layer is exposed to, described wet film type anti-solder ink layer surface is fixedly pasted with without copper base (3), described without copper base have with described insert hole and described in the corresponding fluting portion (31) of portion of windowing, described insert hole is outside place of the described fluting portion without copper base is exposed to, the thickness of described wet film type anti-solder ink layer is 0.035mm～0.01mm, the described thickness without copper base is 0.05～0.15mm.
2. the high voltage withstanding structure of mutual inductor printed board as claimed in claim 1, is characterized in that: described is glass mat without copper base.
3. the high voltage withstanding structure of mutual inductor printed board as claimed in claim 1, is characterized in that: the described thickness without copper base is 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410087952.1A CN103826385A (en) | 2014-03-11 | 2014-03-11 | High-voltage-resistant structure of mutual induction coil printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410087952.1A CN103826385A (en) | 2014-03-11 | 2014-03-11 | High-voltage-resistant structure of mutual induction coil printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103826385A true CN103826385A (en) | 2014-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410087952.1A Pending CN103826385A (en) | 2014-03-11 | 2014-03-11 | High-voltage-resistant structure of mutual induction coil printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103826385A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113168167A (en) * | 2018-12-11 | 2021-07-23 | 西门子股份公司 | Method and apparatus for manufacturing a product and computer program product |
-
2014
- 2014-03-11 CN CN201410087952.1A patent/CN103826385A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113168167A (en) * | 2018-12-11 | 2021-07-23 | 西门子股份公司 | Method and apparatus for manufacturing a product and computer program product |
| US11480951B2 (en) * | 2018-12-11 | 2022-10-25 | Siemens Aktiengesellschaft | Method and device for producing a product and computer program product |
| CN113168167B (en) * | 2018-12-11 | 2023-09-26 | 西门子股份公司 | Method and apparatus for manufacturing product, and computer-readable storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140528 |