CN103818871B - Heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor - Google Patents
Heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor Download PDFInfo
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- CN103818871B CN103818871B CN201410058567.4A CN201410058567A CN103818871B CN 103818871 B CN103818871 B CN 103818871B CN 201410058567 A CN201410058567 A CN 201410058567A CN 103818871 B CN103818871 B CN 103818871B
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- radio
- frequency receiving
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- energy
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Abstract
The invention discloses the heat in a kind of Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor, by at antenna and MEMS thermoelectric pile, be aided with rectification circuit, bulky capacitor and mu balanced circuit again, form utilize radio frequency sending set to dissipate heat energy and radio-frequency receiving-transmitting thermomechanical components around stray wave electromagnetic energy formed self-powered microsensor.Compared with existing radio-frequency receiving-transmitting assembly, the radio-frequency receiving-transmitting assembly applying heat of the present invention and electromagnetism self-powered microsensor effectively improves the heat dissipation problem of radio-frequency receiving-transmitting assembly, stray wave interference problem and energy loss, and provides galvanic current potential source for circuit; And this structural manufacturing process is comparatively simple, mutually compatible with GaAsMMIC technique, be convenient to integrated; The present invention is the self-powered microsensor of a kind of collection two kinds of energy, and the collection efficiency of energy is higher, can improve the performance of radio-frequency receiving-transmitting assembly.
Description
Technical field
The present invention proposes the heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor, belong to the technical field of microelectromechanical systems.
Background technology
Internet of Things is by information sensing equipment such as RF identification, infrared inductor, global positioning system, laser scanners, by the agreement of agreement, any article are connected with internet, carry out information exchange and communicate, to realize a kind of network of Weigh sensor, location, tracking, monitor and managment.Radio-frequency receiving-transmitting assembly is also the important component part in Internet of Things, and the heat dissipation problem in radio-frequency receiving-transmitting assembly and power consumption issues are absolutely necessary in any microwave study.Modal radio frequency sending set is the emitter based on superhet, and in this system, microwave power amplifier consumes large energy, is dissipated by form of heat, makes the temperature of whole system increase, makes reliability step-down.Modal radio-frequency transmitter is the receiver based on superhet, and the low-noise amplifier in its formation needs DC voltage bias.Along with MEMS technology development, on the one hand, utilize the Seebeck effect of MEMS thermoelectric pile, the converting heat dissipated of emitter is made to be DC voltage by thermoelectric pile, this DC voltage is carried out charging energy-storing to bulky capacitor, and then export DC voltage through mu balanced circuit, provide DC offset voltage to the low-noise amplifier of receiver; On the other hand, utilize antenna to gather the electromagnetic energy of the stray wave around radio-frequency receiving-transmitting assembly, by rectification circuit and mu balanced circuit, the low-noise amplifier to receiver provides direct current biasing.Thus solve the heat dissipation problem of the microwave power amplifier of transmitter system, stray wave for the self-powered problem of the interference problem of radio-frequency receiving-transmitting assembly and the low-noise amplifier of receiver, make the realization of the heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor become possibility.
Summary of the invention
Technical problem: the object of this invention is to provide the heat in a kind of Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor, the burning voltage obtained by self-powered microsensor exports and is supplied to low-noise amplifier and does DC offset voltage, thus solves the heat dissipation problem of the microwave power amplifier of transmitter system, stray wave for the self-powered problem of the interference problem of radio-frequency receiving-transmitting assembly and the low-noise amplifier of receiver.
Technical scheme: its structure is mainly by forming by four assemblies be separated of square four limits distributions of vertically placing at microwave power amplifier heat sink outer surface, wherein these four assemblies take GaAs substrate, and its positive and negative structure is antenna and MEMS thermoelectric pile respectively.Wherein antenna is placed at the four sides in square outside, MEMS thermoelectric pile is placed at the four sides of square inner side, the hot junction of MEMS thermoelectric pile is near heat sink outer surface, cold junction is near heat sink, be aided with rectification circuit, bulky capacitor and mu balanced circuit again, form utilize radio frequency sending set to dissipate heat energy and radio-frequency receiving-transmitting thermomechanical components around stray wave electromagnetic energy formed self-powered microsensor.
Heat in Internet of Things radio-frequency receiving-transmitting assembly of the present invention and electromagnetic energy self-powered microsensor are made up of MEMS thermoelectric pile and antenna, are aided with rectification circuit, bulky capacitor and mu balanced circuit in periphery:
What this microsensor was vertically placed by the heat sink outer surface of microwave power amplifier is formed by four microsensor body be separated of square four limits distributions, wherein heat and electromagnetic energy self-powered microsensor body take gallium arsenide substrate as substrate, the positive and negative structure of microsensor body is antenna and by MEMS thermoelectric pile metal thermocouple arm respectively, semiconductor thermocouple arm interlock be connected form thermoelectric pile, antenna is placed at the four sides in wherein said square outside, antenna accesses peripheral rectification circuit by the coplanar waveguide transmission line be made up of the ground wire of holding wire and both sides thereof, and be connected with mu balanced circuit with bulky capacitor formation electromagnetic energy collection structure, and the four sides of described square inner side is respectively placed one group by MEMS thermoelectric pile metal thermocouple arm, semiconductor thermocouple arm and to be interlocked the thermoelectric pile that forms of being connected, its hot junction leans against heat sink outer surface, cold junction, near heat sink, forms thermal energy collecting structure by four groups of end to end thermoelectric piles and collection electric capacity,
This self-powered microsensor achieves the function for heat energy and these two kinds of collection of energy of electromagnetic wave energy simultaneously.Collect by MEMS thermoelectric pile the heat energy that in radio-frequency receiving-transmitting assembly, microwave power amplifier dissipates, improve the heat dispersion of radio frequency sending set; And antenna have collected the stray wave energy in radio-frequency receiving-transmitting assembly, improve the Electro Magnetic Compatibility of radio-frequency receiving-transmitting assembly.
The microwave power amplifier of radio frequency sending set heat sink outer surface design with preparation by square four limits distribute four be separated assembly, these four assemblies take GaAs substrate, antenna is placed at the four sides in square outside, MEMS thermoelectric pile is placed at the four sides of inner side, wherein the hot junction of MEMS thermoelectric pile is near heat sink outer surface, and dispels the heat heat sink the helping of the outside of four groups of thermoelectric pile cold junctions placement with stabilized operating temperature.
In the course of work of the microwave power amplifier of radio frequency sending set, have a large amount of thermal dissipations, produce thermograde in heat sink heat sink direction, form the temperature difference.Four the component substrate inner surfaces vertically placed at the heat sink outer surface of microwave power amplifier place MEMS thermoelectric pile, wherein MEMS thermoelectric pile is made up of metal thermocouple arm and semiconductor thermocouple arm, by four groups of thermoelectric pile series connection, DC voltage will be produced at head and the tail two ends based on Seebeck effect.This DC voltage is added on bulky capacitor, the storage of heat energy can be realized.The DC voltage stored is passed through mu balanced circuit, to obtain galvanic current pressure.
In the course of work of radio-frequency receiving-transmitting assembly, have a large amount of spurious electromagnetic waves energy dissipations, ubiquitous in the environment of radio-frequency receiving-transmitting assembly, in order to self-powered microsensor is integrated into a device, the electromagnetic energy of self-powered microsensor collection part and MEMS thermoelectric pile can be integrated.At the outer surface placement antenna of four component substrate that the heat sink outer surface of microwave power amplifier is vertically placed, the electromagnetic energy that four antennas receive is accessed rectification circuit respectively, the DC voltage produced is accessed four bulky capacitor respectively, the storage of electromagnetic energy can be realized.The DC voltage stored is passed through mu balanced circuit, to obtain galvanic current pressure.
When radio-frequency transmitter works, the galvanic current pressure obtained is supplied to low-noise amplifier as direct current biasing, thus achieves the basic function of this self-powered microsensor by above heat energy and electromagnetic energy.Therefore, by the recycling of heat energy and electromagnetic energy, effectively improve the energy ezpenditure of radio-frequency receiving-transmitting assembly, not only can improve the heat dispersion of emitter, the interference of stray wave for radio-frequency receiving-transmitting assembly can also be improved, improve the Electro Magnetic Compatibility of radio-frequency receiving-transmitting assembly.
Beneficial effect: the heat in Internet of Things radio-frequency receiving-transmitting assembly of the present invention and electromagnetic energy self-powered microsensor not only achieve the collection for heat energy and these two kinds of energy of spurious electromagnetic waves energy simultaneously, solve the self-powered problem of low-noise amplifier in radio-frequency receiving-transmitting assembly, and effectively improve the heat dispersion of radio frequency sending set, improve the Electro Magnetic Compatibility of radio-frequency receiving-transmitting assembly, reduce energy loss.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor.
Fig. 2 is the plane structure chart that heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor are outwards seen inside A-A' face.
Fig. 3 is the plane structure chart that heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor are seen in lateral, A-A' face.
Figure comprises: heat sink 1, and heat sink 2, microsensor body 3, gallium arsenide substrate 4, MEMS thermoelectric pile metal thermocouple arm 5, MEMS thermoelectric pile semiconductor thermocouple arm 6, antenna 7, coplanar waveguide transmission line holding wire 8, ground wire 9, collects electric capacity 10, bulky capacitor 11,12,13,14, rectification circuit 15,16,17,18, mu balanced circuit 19, low-noise amplifier 20.
Detailed description of the invention
Heat in Internet of Things radio-frequency receiving-transmitting assembly of the present invention and the specific embodiments of electromagnetic energy self-powered microsensor as follows:
This heat and electromagnetism self-powered microsensor 3 utilize MEMS thermoelectric pile and antenna to form, and are aided with bulky capacitor, rectification circuit, mu balanced circuit in periphery:
The microwave power amplifier of radio frequency sending set heat sink 1 outer surface design with preparation by square four limits distribute four be separated assembly 3, these four assemblies 3 take GaAs substrate 4, antenna 7 is placed at the four sides in square outside, MEMS thermoelectric pile is placed at the four sides of inner side, wherein the hot junction of MEMS thermoelectric pile is near heat sink outer surface, and helps heat radiation with stabilized operating temperature in the outside of four groups of thermoelectric pile cold junctions placement heat sink 2.
In the course of work of the microwave power amplifier of radio frequency sending set, have a large amount of thermal dissipations, produce thermograde in heat sink 1 heat sink 2 direction, form the temperature difference.At the inner surface placement MEMS thermoelectric pile of four assembly 3 substrates 4 that the heat sink outer surface of microwave power amplifier is vertically placed, wherein MEMS thermoelectric pile is made up of metal thermocouple arm 5 and semiconductor thermocouple arm 6, by four groups of thermoelectric pile series connection, DC voltage will be produced at head and the tail two ends based on Seebeck effect.This DC voltage is added on bulky capacitor 10, the storage of heat energy can be realized.The DC voltage stored is passed through mu balanced circuit 19, to obtain galvanic current pressure.
In the course of work of radio-frequency receiving-transmitting assembly, have a large amount of spurious electromagnetic waves energy dissipations.At the outer surface placement antenna 7 of four assembly 3 substrates 4 that heat sink 1 outer surface of microwave power amplifier is vertically placed, the electromagnetic energy received by four groups of antennas 7 spreads out of rear access rectification circuit 15 by the holding wire 8 of coplanar waveguide transmission line, ground wire 9,16,17,18, the DC voltage produced is accessed four bulky capacitor 11 respectively, 12,13,14, the storage of electromagnetic energy can be realized.The DC voltage stored is passed through mu balanced circuit 19, to obtain galvanic current pressure.
When radio-frequency transmitter works, the galvanic current pressure obtained is supplied to low-noise amplifier 20 as direct current biasing, thus achieves the function of this self-powered microsensor by above heat energy and electromagnetic energy.
The preparation method of the heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor:
1) gallium arsenide substrate 3 is prepared: the semi-insulating GaAs substrate selecting extension, wherein extension N
+the doping content of GaAs is 10
18cm
-3, its square resistance is 100 ~ 130 Ω/;
2) at an Epitaxial growth N of gallium arsenide substrate
+gaAs.GaAs, as thermoelectric pile GaAs arm, forms figure and the ohmic contact regions of the semiconductor thermocouple arm 6 of thermoelectric pile;
3) N is anti-carved
+gaAs, forming its doping content is 10
17cm
-3the semiconductor thermocouple arm 6 of thermoelectric pile;
4) photoetching: remove and will retain the local photoresist of gold germanium nickel/gold;
5) sputter gold germanium nickel/gold, as thermoelectric pile metal arm 5, the thickness of gold germanium nickel/gold is
, wherein gold germanium nickel and GaAs form Ohmic contact;
6) peel off, form the metal thermocouple arm 5 of thermoelectric pile;
7) in the another side photoetching of gallium arsenide substrate: remove the photoresist that will retain the place of ground floor gold;
8) evaporate ground floor gold, its thickness is 0.3 μm;
9) peel off, form holding wire 8 and the ground wire 9 of antenna 7 and coplanar waveguide transmission line;
10) evaporate titanium/gold/titanium, its thickness is 500/1500/
: evaporate the down payment for electroplating;
11) photoetching: remove and will electroplate local photoresist;
12) electrogilding, its thickness is 2 μm;
13) photoresist is removed: remove and do not need to electroplate local photoresist;
14) anti-carve titanium/gold/titanium, corrosion down payment, form holding wire 8 and the ground wire 9 of antenna 7 and coplanar waveguide transmission line.
Whether distinguish is that the standard of this structure is as follows:
Heat in Internet of Things radio-frequency receiving-transmitting assembly of the present invention and electromagnetic energy self-powered microsensor positive and negative structure are antenna and MEMS thermoelectric pile respectively.This self-powered microsensor achieves the function for heat energy and these two kinds of collection of energy of electromagnetic wave energy simultaneously.Collect by MEMS thermoelectric pile the heat energy that in radio-frequency receiving-transmitting assembly, microwave power amplifier dissipates, improve the heat dispersion of radio frequency sending set; And antenna have collected the stray wave energy in radio-frequency receiving-transmitting assembly, improve the Electro Magnetic Compatibility of radio-frequency receiving-transmitting assembly.
Namely the structure meeting above condition is considered as heat in Internet of Things radio-frequency receiving-transmitting assembly of the present invention and electromagnetic energy self-powered microsensor.
Claims (1)
1. the heat in an Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor, it is characterized in that the microsensor body (3) of four separation by square four limits distributions that this microsensor is vertically placed by heat sink (1) outer surface of microwave power amplifier are formed, wherein heat and electromagnetic energy self-powered microsensor body (3) with gallium arsenide substrate (4) for substrate, the positive and negative structure of microsensor body (3) is antenna (7) and by MEMS thermoelectric pile metal thermocouple arm (5) respectively, the staggered thermoelectric pile formed that is connected of semiconductor thermocouple arm (6), antenna (7) is placed at the four sides in wherein said square outside, antenna (7) accesses peripheral rectification circuit (15 by the coplanar waveguide transmission line be made up of the ground wire (9) of holding wire (8) and both sides thereof, 16, 17, 18), and and bulky capacitor (11, 12, 13, 14) form electromagnetic energy collection structure to be connected with mu balanced circuit (19), and the four sides of described square inner side respectively places one group by MEMS thermoelectric pile metal thermocouple arm (5), the staggered thermoelectric pile formed that is connected of semiconductor thermocouple arm (6), its hot junction leans against heat sink (1) outer surface, cold junction is near heat sink (2), and the thermoelectric pile be connected by four groups of series connection and collection electric capacity (10) form thermal energy collecting structure,
This self-powered microsensor achieves the function for heat energy and these two kinds of collection of energy of electromagnetic wave energy simultaneously, collects the heat energy that in radio-frequency receiving-transmitting assembly, microwave power amplifier dissipates, improve the heat dispersion of radio frequency sending set by MEMS thermoelectric pile; And antenna have collected the stray wave energy in radio-frequency receiving-transmitting assembly, improve the Electro Magnetic Compatibility of radio-frequency receiving-transmitting assembly.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058567.4A CN103818871B (en) | 2014-02-20 | 2014-02-20 | Heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor |
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|---|---|---|---|
| CN201410058567.4A CN103818871B (en) | 2014-02-20 | 2014-02-20 | Heat in Internet of Things radio-frequency receiving-transmitting assembly and electromagnetic energy self-powered microsensor |
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| CN103818871A CN103818871A (en) | 2014-05-28 |
| CN103818871B true CN103818871B (en) | 2015-09-16 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890821A (en) * | 2003-12-02 | 2007-01-03 | 巴特尔纪念研究所 | Thermoelectric devices and applications for the same |
| US7564267B1 (en) * | 2008-02-15 | 2009-07-21 | Sharp Laboratories Of America, Inc. | Thermal electric logic circuit |
| CN102650718A (en) * | 2011-02-28 | 2012-08-29 | 深圳新飞通光电子技术有限公司 | Refrigeration-type coaxial packaging light-emitting tube core |
| CN103105531A (en) * | 2013-01-18 | 2013-05-15 | 东南大学 | Micro electro-mechanical online microwave frequency detector and detecting method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010232113A (en) * | 2009-03-30 | 2010-10-14 | Otax Co Ltd | Rf-mems switch, manufacturing method of rf-mems switch, antenna changeover device, cellphone, portable information terminal equipment and equipment for ic test |
| US9325052B2 (en) * | 2012-06-01 | 2016-04-26 | Purdue Research Foundation Regents of the University of California | Tunable cavity resonator having a post and variable capacitive coupling |
-
2014
- 2014-02-20 CN CN201410058567.4A patent/CN103818871B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1890821A (en) * | 2003-12-02 | 2007-01-03 | 巴特尔纪念研究所 | Thermoelectric devices and applications for the same |
| US7564267B1 (en) * | 2008-02-15 | 2009-07-21 | Sharp Laboratories Of America, Inc. | Thermal electric logic circuit |
| CN102650718A (en) * | 2011-02-28 | 2012-08-29 | 深圳新飞通光电子技术有限公司 | Refrigeration-type coaxial packaging light-emitting tube core |
| CN103105531A (en) * | 2013-01-18 | 2013-05-15 | 东南大学 | Micro electro-mechanical online microwave frequency detector and detecting method thereof |
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