CN103817433A - Method and special device for controlling laser processing light spots - Google Patents

Method and special device for controlling laser processing light spots Download PDF

Info

Publication number
CN103817433A
CN103817433A CN201410030553.1A CN201410030553A CN103817433A CN 103817433 A CN103817433 A CN 103817433A CN 201410030553 A CN201410030553 A CN 201410030553A CN 103817433 A CN103817433 A CN 103817433A
Authority
CN
China
Prior art keywords
signal transmitter
galvanometer
controller
motor
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410030553.1A
Other languages
Chinese (zh)
Other versions
CN103817433B (en
Inventor
胡晓冬
姚建华
徐元飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang University of Technology ZJUT
Original Assignee
Zhejiang University of Technology ZJUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang University of Technology ZJUT filed Critical Zhejiang University of Technology ZJUT
Priority to CN201410030553.1A priority Critical patent/CN103817433B/en
Publication of CN103817433A publication Critical patent/CN103817433A/en
Application granted granted Critical
Publication of CN103817433B publication Critical patent/CN103817433B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0738Shaping the laser spot into a linear shape

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a method and a special device for controlling laser processing light spots. The method includes steps of placing a to-be-processed workpiece on a movable workbench; starting a controller, enabling a motor, a first signal transmitter and a second signal transmitter to transmit instructions under the control of the controller to drive the corresponding moveable workbench, a galvanometer and a laser device to correspondingly change, and forming a linear light spot with the width of L by laser beams. The linear light spot is used as reflected light to be projected on the surface of the to-be-processed workpiece. The special device manufactured according to the method for controlling the laser processing light spots comprises the controller, a motor actuator, the motor, the first signal transmitter, the second signal transmitter, the movable workbench, the laser device and the galvanometer. The method and the special device have the advantages that the size, the shape and energy density distribution of the light spot can be dynamically adjusted according to requirements of processing technologies, and the special device is simple in structure and convenient to use.

Description

A kind of Laser Processing hot spot control method and special device thereof
Technical field
The present invention relates to a kind of Laser Processing hot spot control method and special device thereof.
Background technology
In field of laser processing, normally adopt the optical mirror slip of a series of static state to carry out optical transform acquisition for the laser facula of the processing such as LASER HEAT TREATMENT, laser melting coating, laser alloying, the light spot shape obtaining has circle, rectangle, linear etc., but this light beam obtaining through a series of optical mirror slip shaping generally has following characteristics: 1, be not easy to adjust light spot shape: a set of optical mirror slip can only shaping go out a kind of hot spot of shape, if need difform hot spot need to change shaping light path; 2, be not easy to adjust the light distribution characteristic in hot spot: different laser processing technologies needs dissimilar light distribution characteristic, some laser processing technologies need that central energy density is high, the low density Gaussian shaped profile of edge energy, and some laser processing technologies need the uniform optical characteristics of Energy distribution; But the hot spot obtaining through static optical mirror slip shaping, the characteristic of its internal energy Density Distribution is fixed, and can not change with the requirement of operating mode.
Summary of the invention
Can only shaping go out in order to solve current laser facula a kind of shape hot spot, cannot regulate the light distribution characteristic adjusted in hot spot and the problem of light spot shape, the present invention proposes and a kind ofly can carry out Laser Processing hot spot control method and the special device thereof dynamically adjusted according to the requirement of processing technology to spot size, shape and energy density distribution.
A kind of Laser Processing hot spot control method, comprises the following steps:
1) workpiece to be processed is placed on motion workbench;
2) opening controller, the driver module of controller sends motion control instruction to motor driver, and the motor driver that receives motion control instruction drives and drives the workpiece being placed on motion workbench to be synchronized with the movement by motor movement; The swing control module of controller is sent swing instruction to first signal transmitter, controls the galvanometer being connected with first signal transmitter and makes corresponding swing; The power conditioning module of controller is to the instruction of secondary signal transmitter transmission power control, and the laser instrument that control is connected with secondary signal transmitter sends the laser of corresponding power;
3) laser beam of the point-like that laser instrument sends irradiates on galvanometer as incident light, forms by the laser beam of the vibration mirror reflected that swings back and forth the linear beam spot that width is L, and described linear beam spot projects surface of the work to be processed as reverberation; Wherein, the energy density p at the every bit place in formed hot spot and the laser output power f of this some place, scan rate of vibrating mirror v b, working table movement speed v tconstituting-functions relation, its function expression is:
p ( x , y ) = f ( x , y ) v ( x , y ) - - - ( 1 )
In formula (1), p (x, y) is in hot spot, certain puts desired energy density; F (x, y) is the power output at this some place laser instrument 3; V (x, y) is the movement velocity with respect to workpiece at this some place light beam projecting, and its v (x, y) size is scan rate of vibrating mirror v bwith working table movement speed v tvector, that is:
v ( x , y ) = v b → + v t → - - - ( 2 ) ;
Meeting under the prerequisite of desired functional relation in formula (1), for the spot energy distribution stability of characteristics that dynamic scan is obtained, the time that galvanometer completes the track while scan in 1 cycle is less than or equal to 0.02 second.
The special device building according to Laser Processing hot spot control method of the present invention, it is characterized in that: comprise controller, motor driver, motor, first signal transmitter, secondary signal transmitter, motion workbench, laser instrument and galvanometer, the driver module of described controller is connected with the signal input part of motor driver, the signal output part of described motor driver is connected with motor, and the output shaft of described motor and described motion workbench are fixed; The swing control module of described controller is connected with the signal input part of first signal transmitter, and the signal output part of described first signal transmitter is connected with galvanometer; The power conditioning module of described controller is connected with the signal input part of described secondary signal transmitter, and the signal output part of described secondary signal transmitter is connected with described laser instrument.
Described controller is PLC, computer, digital signal processor or single-chip microcomputer.
Described secondary signal transmitter adopts the transmitter of transmitter, parallel communication digital interface or the serial communication digital interface of curtage analog signals interface.
Described galvanometer is 1 dimension scanning galvanometer, 2 dimension scanning galvanometers or the scanning galvanometer device with auto-focus function.
Described motor adopts AC servo motor or stepper motor.
Described first signal transmitter adopts curtage analog quantity signal transducer, parallel communication digital interface or serial communication digital interface transmitter.
What preferably, controller of the present invention adopted is the controller that uses digital signal processor exploitation; What secondary signal transmitter adopted is voltage analog signal transmitting device; What galvanometer adopted is 1 dimension scanning galvanometer; Motor adopts stepper motor; What first signal transmitter adopted is voltage analog signal transmitting device.
Element functional description in legend is as follows: controller: the movement velocity of the power output of control laser instrument, the corner of galvanometer and speed, workbench;
Secondary signal transmitter: accept the control instruction of controller, and control instruction is converted to the receptible signal of telecommunication of laser instrument, regulate the laser output power of laser instrument;
Laser instrument: export the laser beam of corresponding power according to the driving signal of secondary signal transmitter, and laser beam is projected on the eyeglass of galvanometer;
Galvanometer: the reciprocally swinging by eyeglass by the point-like dot projection of laser instrument output to workpiece, the linear beam spot that to form width be L;
Broadband hot spot: the dynamic beam projection that the width forming on workpiece because laser beam swings is L;
Motion workbench: carrying workpiece, and move under the driving of motor;
Workpiece: the processed object that is subject to broadband hot spot heat effect;
Motor: the signal of telecommunication of accepting motor driver drives and moves, and drives working table movement;
Motor driver: the signal of telecommunication that the movement instruction of controller is converted to drive motors 8;
First signal transmitter: be the signal of telecommunication that drives galvanometer motion by the swing instruction transformation of controller.
The invention has the beneficial effects as follows: spot size, shape and energy density distribution can dynamically be adjusted and simple in structure, practical and convenient according to the requirement of processing technology.
Accompanying drawing explanation
Fig. 1 is fundamental diagram of the present invention (wherein, the arrow at A place represents the direction of motion of motion workbench, and the arrow at B place represents the swaying direction of galvanometer, remaining arrow representation signal transmission direction).
Fig. 2 is hot spot broadband cross section Energy distribution.
The specific embodiment
Further illustrate the present invention below in conjunction with accompanying drawing
With reference to accompanying drawing:
1 one kinds of Laser Processing hot spot control methods of embodiment, comprise the following steps:
1) workpiece to be processed 9 is placed on motion workbench;
2) opening controller, the driver module of controller sends motion control instruction to motor driver, and the motor driver that receives motion control instruction drives and drives the workpiece being placed on motion workbench to be synchronized with the movement by motor movement; The swing control module of controller is sent swing instruction to first signal transmitter, controls the galvanometer being connected with first signal transmitter and makes corresponding swing; The power conditioning module of controller is to the instruction of secondary signal transmitter transmission power control, and the laser instrument that control is connected with secondary signal transmitter sends the laser of corresponding power;
3) laser beam of the point-like that laser instrument sends irradiates on galvanometer as incident light, forms by the laser beam of the vibration mirror reflected that swings back and forth the linear beam spot 10 that width is L, and described linear beam spot projects surface of the work to be processed as reverberation; Wherein, the energy density p at the every bit place in formed hot spot and the laser output power f of this some place, scan rate of vibrating mirror v b, working table movement speed v tconstituting-functions relation, its function expression is:
p ( x , y ) = f ( x , y ) v ( x , y ) - - - ( 1 )
In formula (1), p (x, y) is in hot spot, certain puts desired energy density; F (x, y) is the power output at this some place laser instrument 3; V (x, y) is the movement velocity with respect to workpiece at this some place light beam projecting, and its v (x, y) size is scan rate of vibrating mirror v bwith working table movement speed v tvector, that is:
v ( x , y ) = v b → + v t → - - - ( 2 ) ;
Meeting under the prerequisite of desired functional relation in formula (1), for the spot energy distribution stability of characteristics that dynamic scan is obtained, the time that galvanometer completes the track while scan in 1 cycle is less than or equal to 0.02 second.
The special device that embodiment 2 builds according to the Laser Processing hot spot control method described in embodiment 1, comprise controller 1, motor driver 2, motor 3, first signal transmitter 4, secondary signal transmitter 5, motion workbench 6, laser instrument 7 and galvanometer 8, the driver module of described controller 1 is connected with the signal input part of motor driver 2, the signal output part of described motor driver 2 is connected with motor 3, and the output shaft of described motor 3 and described motion workbench 6 are fixing; The swing control module of described controller 1 is connected with the signal input part of first signal transmitter 4, and the signal output part of described first signal transmitter 4 is connected with galvanometer 8; The power conditioning module of described controller 1 is connected with the signal input part of described secondary signal transmitter 5, and the signal output part of described secondary signal transmitter 5 is connected with described laser instrument 7.
Described controller 1 is PLC, computer, digital signal processor or single-chip microcomputer.
Described secondary signal transmitter 5 adopts the transmitter of transmitter, parallel communication digital interface or the serial communication digital interface of curtage analog signals interface.
Described galvanometer 8 is 1 dimension scanning galvanometer, 2 dimension scanning galvanometers or the scanning galvanometer device with auto-focus function.
Described motor 3 adopts AC servo motor or stepper motor.
Described first signal transmitter 4 adopts curtage analog quantity signal transducer, parallel communication digital interface or serial communication digital interface transmitter.
What preferably, controller of the present invention adopted is the controller that uses digital signal processor exploitation; What secondary signal transmitter adopted is voltage analog signal transmitting device; What galvanometer adopted is 1 dimension scanning galvanometer; Motor adopts stepper motor; What first signal transmitter adopted is voltage analog signal transmitting device.
Element functional description in legend is as follows: controller: the movement velocity of the power output of control laser instrument, the corner of galvanometer and speed, workbench;
Secondary signal transmitter: accept the control instruction of controller, and control instruction is converted to the receptible signal of telecommunication of laser instrument, regulate the laser output power of laser instrument;
Laser instrument: export the laser beam of corresponding power according to the driving signal of secondary signal transmitter, and laser beam is projected on the eyeglass of galvanometer;
Galvanometer: the reciprocally swinging by eyeglass by the point-like dot projection of laser instrument output to workpiece, the linear beam spot that to form width be L;
Broadband hot spot: the dynamic beam projection that the width forming on workpiece because laser beam swings is L;
Motion workbench: carrying workpiece, and move under the driving of motor;
Workpiece: the processed object that is subject to broadband hot spot heat effect;
Motor: the signal of telecommunication of accepting motor driver drives and moves, and drives working table movement;
Motor driver: the signal of telecommunication that the movement instruction of controller is converted to drive motors 8;
First signal transmitter: be the signal of telecommunication that drives galvanometer motion by the swing instruction transformation of controller.
Embodiment 3, take medium carbon steel as example, utilizes method and apparatus centering steel surface laser broadband transformation hardening layer depth the Uniform Control application of the present invention
In the time that centering steel surface carries out laser transformation hardening processing, wish that the case depth obtaining after processing is evenly distributed, traditional processing method is that the uniform broadband of the energy density distribution hot spot that adopts static optical shaping system to obtain is heat-treated, but owing to being subject to heated work pieces, at the different parts radiating condition of broadband hot spot, inconsistent (hot spot middle heat conduction of velocity is slow, and hot spot edge heat conduction velocity is fast), tend to cause hot spot middle part higher than the temperature at edge, it is large that middle heat is processed the degree of depth, and the little problem of the edge heat treatment degree of depth.
For adapting to the different condition of hot spot different parts heat conduction velocity, obtain the uniform heat treatment degree of depth, it be that middle part energy density is smaller that the beam energy adopting distributes, and edge energy density is bigger, and the energy-distributing feature of required broad band laser is as shown in Figure 2.
Control program is: adopt 1 dimension galvanometer to carry out the linear scan that width is L, and by discrete 1 scan period T be several time points (t 1, t 2, t 3t n), calculate the galvanometer rotating speed (v on each time point corresponding with energy distribution curve in Fig. 2 according to formula 1 1, v 2, v 3v n) and laser output power (p 1, p 2, p 3p n), form galvanometer rotating speed, laser power and time map relation in 1 scan period, as shown in table 1.Work in-process, according to the control sequential relationship in table 1, exports corresponding galvanometer rotating speed, laser power in the different time points of scan period, obtains the hot spot of required Energy distribution characteristic, realizes the Uniform Control to laser broadband transformation hardening layer depth.
Table 1 galvanometer rotating speed, laser power and the output relation of time
Time t 1 t 2 t 3 …… t n-2 t n-1 t n
Galvanometer rotating speed v 1 v 2 v 3 …… v n-2 v n-1 v n
Laser power p 1 p 2 p 3 …… p n-2 p n-1 p n
Content described in this description embodiment is only enumerating of way of realization to inventive concept; protection scope of the present invention should not be regarded as only limiting to the concrete form that embodiment states, protection scope of the present invention also comprises that those skilled in the art conceive the equivalent technologies means that can expect according to the present invention.

Claims (8)

1. a Laser Processing hot spot control method, comprises the following steps:
1) workpiece to be processed is placed on motion workbench;
2) opening controller, the driver module of controller sends motion control instruction to motor driver, and the motor driver that receives motion control instruction drives and drives the workpiece being placed on motion workbench to be synchronized with the movement by motor movement; The swing control module of controller is sent swing instruction to first signal transmitter, controls the galvanometer being connected with first signal transmitter and makes corresponding swing; The power conditioning module of controller is to the instruction of secondary signal transmitter transmission power control, and the laser instrument that control is connected with secondary signal transmitter sends the laser of corresponding power;
3) laser beam of the point-like that laser instrument sends irradiates on galvanometer as incident light, forms by the laser beam of the vibration mirror reflected that swings back and forth the linear beam spot that width is L, and described linear beam spot projects surface of the work to be processed as reverberation; Wherein, the energy density p at the every bit place in formed hot spot and the laser output power f of this some place, scan rate of vibrating mirror v b, working table movement speed v tconstituting-functions relation, its function expression is:
p ( x , y ) = f ( x , y ) v ( x , y ) - - - ( 1 )
In formula (1), p (x, y) is in hot spot, certain puts desired energy density; F (x, y) is the power output at this some place laser instrument; V (x, y) is the movement velocity with respect to workpiece at this some place light beam projecting, and its v (x, y) size is scan rate of vibrating mirror v bwith working table movement speed v tvector, that is:
v ( x , y ) = v b → + v t → - - - ( 2 ) ;
Meeting under the prerequisite of desired functional relation in formula (1), the time that galvanometer completes the track while scan in 1 cycle is less than or equal to 0.02 second.
2. the special device building according to Laser Processing hot spot control method claimed in claim 1, it is characterized in that: comprise controller, motor driver, motor, first signal transmitter, secondary signal transmitter, motion workbench, laser instrument and galvanometer, the driver module of described controller is connected with the signal input part of motor driver, the signal output part of described motor driver is connected with motor, and the output shaft of described motor and described motion workbench are fixed; The swing control module of described controller is connected with the signal input part of first signal transmitter, and the signal output part of described first signal transmitter is connected with galvanometer; The power conditioning module of described controller is connected with the signal input part of described secondary signal transmitter, and the signal output part of described secondary signal transmitter is connected with described laser instrument.
3. special device as claimed in claim 2, is characterized in that: described controller is PLC, computer, digital signal processor or single-chip microcomputer.
4. special device as claimed in claim 2, is characterized in that: described secondary signal transmitter adopts the transmitter of transmitter, parallel communication digital interface or the serial communication digital interface of curtage analog signals interface.
5. special device as claimed in claim 2, is characterized in that: described galvanometer is 1 dimension scanning galvanometer, 2 dimension scanning galvanometers or the scanning galvanometer device with auto-focus function.
6. special device as claimed in claim 2, is characterized in that: described motor adopts AC servo motor or stepper motor.
7. special device as claimed in claim 2, is characterized in that: described first signal transmitter adopts curtage analog quantity signal transducer, parallel communication digital interface or serial communication digital interface transmitter.
8. the special device as described in claim 1~7 any one claim, is characterized in that: what described controller adopted is the controller that uses digital signal processor exploitation; What secondary signal transmitter adopted is voltage analog signal transmitting device; What galvanometer adopted is 1 dimension scanning galvanometer; Motor adopts stepper motor; What first signal transmitter adopted is voltage analog signal transmitting device.
CN201410030553.1A 2014-01-23 2014-01-23 A kind of Laser Processing hot spot control method and special device thereof Active CN103817433B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410030553.1A CN103817433B (en) 2014-01-23 2014-01-23 A kind of Laser Processing hot spot control method and special device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410030553.1A CN103817433B (en) 2014-01-23 2014-01-23 A kind of Laser Processing hot spot control method and special device thereof

Publications (2)

Publication Number Publication Date
CN103817433A true CN103817433A (en) 2014-05-28
CN103817433B CN103817433B (en) 2016-04-13

Family

ID=50752877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410030553.1A Active CN103817433B (en) 2014-01-23 2014-01-23 A kind of Laser Processing hot spot control method and special device thereof

Country Status (1)

Country Link
CN (1) CN103817433B (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106881525A (en) * 2015-12-15 2017-06-23 新代科技股份有限公司 Laser Processing control system and its control method
CN109088302A (en) * 2018-08-22 2018-12-25 深圳市深视智能科技有限公司 The control method and device of laser output energy
CN109822575A (en) * 2019-03-25 2019-05-31 华中科技大学 A kind of robot system and method carrying out mobile processing using projection properties image
CN110153417A (en) * 2019-04-30 2019-08-23 大族激光科技产业集团股份有限公司 A kind of laser formation equipment
CN110293310A (en) * 2018-03-22 2019-10-01 孟晋科技股份有限公司 Aluminium molecule is avoided to penetrate into the processing method for silicon high-tensile steel welding bead of aluminizing
CN110681992A (en) * 2019-10-31 2020-01-14 华中科技大学 Adjustable broadband laser processing optical system and processing method
CN110814522A (en) * 2018-08-08 2020-02-21 松下知识产权经营株式会社 Laser processing method and laser processing apparatus
CN110909478A (en) * 2019-11-28 2020-03-24 上海航天精密机械研究所 Light spot power density field measurement modeling method during laser defocusing processing
CN112145176A (en) * 2020-08-13 2020-12-29 中国地质大学(武汉) Square wave type cutting process method for enlarging kerf width by laser cutting rock soil
CN113330377A (en) * 2018-12-20 2021-08-31 Etxe-Tar有限公司 Method and system for operating a machine in a manufacturing process
CN113977078A (en) * 2021-10-25 2022-01-28 常州特尔玛科技股份有限公司 Handheld laser welding equipment and method for cooperatively controlling laser position and power
CN114277217A (en) * 2021-12-24 2022-04-05 中国科学院长春光学精密机械与物理研究所 Laser quenching light source and laser quenching system
CN115869062A (en) * 2022-12-19 2023-03-31 广州信筑医疗技术有限公司 Dot matrix laser output method and control system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225183A (en) * 2000-02-14 2001-08-21 Nec Corp Optical device for laser beam machining
JP2002348146A (en) * 2001-05-30 2002-12-04 Central Glass Co Ltd Method for removing thin film from sheet glass with thin film
CN1441467A (en) * 2001-11-09 2003-09-10 株式会社半导体能源研究所 Laser radiator, laser radiation method and method for producing semiconductor device
US20040006543A1 (en) * 2002-04-02 2004-01-08 Soluble Technologies Llc System and method for facilitating transactions between two or more parties
WO2006017510A2 (en) * 2004-08-02 2006-02-16 J.P. Sercel Associates, Inc. System and method for laser machining
WO2007072744A1 (en) * 2005-12-20 2007-06-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method and method for manufacturing semiconductor device
CN101044597A (en) * 2004-10-20 2007-09-26 株式会社半导体能源研究所 Laser irradiation method, laser irradiation apparatus, and manufacturing method of semiconductor device
CN101331592A (en) * 2005-12-16 2008-12-24 株式会社半导体能源研究所 Laser irradiation apparatus, laser irradiation method and manufacturing method of semiconductor device
CN101870039A (en) * 2010-06-12 2010-10-27 中国电子科技集团公司第四十五研究所 Double-workbench drive laser processing machine and processing method thereof
JP2011062726A (en) * 2009-09-17 2011-03-31 Toshiba Corp Laser irradiation apparatus, laser beam machining apparatus and method of manufacturing flat panel display

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225183A (en) * 2000-02-14 2001-08-21 Nec Corp Optical device for laser beam machining
JP2002348146A (en) * 2001-05-30 2002-12-04 Central Glass Co Ltd Method for removing thin film from sheet glass with thin film
CN1441467A (en) * 2001-11-09 2003-09-10 株式会社半导体能源研究所 Laser radiator, laser radiation method and method for producing semiconductor device
US20040006543A1 (en) * 2002-04-02 2004-01-08 Soluble Technologies Llc System and method for facilitating transactions between two or more parties
WO2006017510A2 (en) * 2004-08-02 2006-02-16 J.P. Sercel Associates, Inc. System and method for laser machining
CN101044597A (en) * 2004-10-20 2007-09-26 株式会社半导体能源研究所 Laser irradiation method, laser irradiation apparatus, and manufacturing method of semiconductor device
CN101331592A (en) * 2005-12-16 2008-12-24 株式会社半导体能源研究所 Laser irradiation apparatus, laser irradiation method and manufacturing method of semiconductor device
WO2007072744A1 (en) * 2005-12-20 2007-06-28 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method and method for manufacturing semiconductor device
JP2011062726A (en) * 2009-09-17 2011-03-31 Toshiba Corp Laser irradiation apparatus, laser beam machining apparatus and method of manufacturing flat panel display
CN101870039A (en) * 2010-06-12 2010-10-27 中国电子科技集团公司第四十五研究所 Double-workbench drive laser processing machine and processing method thereof

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106881525A (en) * 2015-12-15 2017-06-23 新代科技股份有限公司 Laser Processing control system and its control method
CN110293310A (en) * 2018-03-22 2019-10-01 孟晋科技股份有限公司 Aluminium molecule is avoided to penetrate into the processing method for silicon high-tensile steel welding bead of aluminizing
CN110814522A (en) * 2018-08-08 2020-02-21 松下知识产权经营株式会社 Laser processing method and laser processing apparatus
CN110814522B (en) * 2018-08-08 2021-07-09 松下知识产权经营株式会社 Laser processing method and laser processing apparatus
CN109088302A (en) * 2018-08-22 2018-12-25 深圳市深视智能科技有限公司 The control method and device of laser output energy
CN109088302B (en) * 2018-08-22 2021-01-22 深圳市深视智能科技有限公司 Laser output energy control method and device
CN113330377A (en) * 2018-12-20 2021-08-31 Etxe-Tar有限公司 Method and system for operating a machine in a manufacturing process
CN109822575B (en) * 2019-03-25 2020-12-08 华中科技大学 Robot system and method for performing mobile processing by using projection characteristic image
CN109822575A (en) * 2019-03-25 2019-05-31 华中科技大学 A kind of robot system and method carrying out mobile processing using projection properties image
CN110153417A (en) * 2019-04-30 2019-08-23 大族激光科技产业集团股份有限公司 A kind of laser formation equipment
CN110681992A (en) * 2019-10-31 2020-01-14 华中科技大学 Adjustable broadband laser processing optical system and processing method
CN110681992B (en) * 2019-10-31 2024-02-02 华中科技大学 Adjustable broadband laser processing optical system and processing method
CN110909478A (en) * 2019-11-28 2020-03-24 上海航天精密机械研究所 Light spot power density field measurement modeling method during laser defocusing processing
CN112145176A (en) * 2020-08-13 2020-12-29 中国地质大学(武汉) Square wave type cutting process method for enlarging kerf width by laser cutting rock soil
CN112145176B (en) * 2020-08-13 2022-03-11 中国地质大学(武汉) Square wave type cutting process method for enlarging kerf width by laser cutting rock soil
CN113977078A (en) * 2021-10-25 2022-01-28 常州特尔玛科技股份有限公司 Handheld laser welding equipment and method for cooperatively controlling laser position and power
CN113977078B (en) * 2021-10-25 2023-09-12 常州特尔玛科技股份有限公司 Handheld laser welding device and method for cooperatively controlling laser position and power
CN114277217A (en) * 2021-12-24 2022-04-05 中国科学院长春光学精密机械与物理研究所 Laser quenching light source and laser quenching system
CN115869062A (en) * 2022-12-19 2023-03-31 广州信筑医疗技术有限公司 Dot matrix laser output method and control system

Also Published As

Publication number Publication date
CN103817433B (en) 2016-04-13

Similar Documents

Publication Publication Date Title
CN103817433B (en) A kind of Laser Processing hot spot control method and special device thereof
CN104979748B (en) Femtosecond laser scan power regulation device and method, femtosecond laser system of processing
CN101499755B (en) PID control method for DC motor speed
CN110314980B (en) Linear light spot laser bending forming method for metal sheet
CN205147577U (en) Linear friction weld equipment of high -frequency
CN110142407B (en) Additive manufacturing control method, device and system and storage medium
CN102601687A (en) Phased-array ultrasound focused fluid vibration polishing device
CN101342636A (en) Laser processing system
CN110125551B (en) 3D laser marking device and method for large-radian deep inner wall annular marking
CN103869757A (en) Dynamics control method of five-axis numerical control machining cutter-axis vectors of complex curved surfaces
CN103296957B (en) A kind of permagnetic synchronous motor position scan control method and system
CN104775010A (en) Laser quenching equipment and use method
CN204589228U (en) A kind of axial workpiece fast quenching appts
US9720225B2 (en) Processing system with galvano scanner capable of high speed laser scanning
CN108025362B (en) Control device and method for controlling deflection of laser beam
CN104793490A (en) Dynamic feedforward compensation based improved generalized predication self-adaptive control method and application thereof
MX162230A (en) IMPROVED SERVOMOTOR CONTROL SYSTEM
CN103898282A (en) Curved surface laser beam heat treatment device and method for controlling position of laser spot
CN104714483A (en) Method and system for controlling laser processing
CN209021429U (en) A kind of online high-rate laser welding system of dynamic battery box dynamic
CN105033464A (en) Vehicle-mounted laser engraving machine suitable for field application
CN204589227U (en) A kind of laser quenching equipment
CN103869751A (en) X-C direct driven grinding profile error non-linear coupling control system and method
CN100512575C (en) Time domain and space domain controllable electronic bundle heating method
CN103847243A (en) Laser marking method and laser marking device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant