CN103813632B - Circuit board package structure and manufacture method thereof - Google Patents
Circuit board package structure and manufacture method thereof Download PDFInfo
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- CN103813632B CN103813632B CN201210457584.6A CN201210457584A CN103813632B CN 103813632 B CN103813632 B CN 103813632B CN 201210457584 A CN201210457584 A CN 201210457584A CN 103813632 B CN103813632 B CN 103813632B
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Abstract
The open a kind of circuit board package structure of the present invention and manufacture method thereof.Circuit board package structure comprises and has the substrate on relatively first and second surface, annular magnetic element, adhesion coating, multiple conductive part and multiple conductive channels.First surface and second surface are respectively provided with multiple first metal portion and multiple second metal portions.One annular groove is formed at the position that first surface is not covered by the first metal portion.Annular magnetic element is arranged in annular groove.Adhesion coating is positioned on first surface and covers the first metal portion and annular magnetic element.Conductive part is formed on adhesion coating and relative with the second metal portion respectively.Conductive channel runs through conductive part, adhesion coating and substrate, and in the inwall of annular groove with outer wall outside.Each conductive channel has conducting film, electrical connection two relative conductive parts and the second metal portion.
Description
Technical field
The present invention relates to a kind of circuit board package structure and manufacture method thereof.
Background technology
It is said that in general, in the manufacturing process of circuit board, specific element need to be inserted in the storage tank that circuit board is preset,
The copper billet of such as heat transmission, iron core etc..Wherein iron core is because having magnetic, can be applicable to transformator (transformer) or chokes
The structure of device (power choke).Magnetic element counter stress is very sensitive, and the electrical characteristic of magnetic element can cause because of environment
Stress influence even causes damaging, and existing processing technology and encapsulating structure itself all can produce and affect the stress of inductance value.
Available circuit plate is the encapsulating structure of four layers, and is respectively provided with copper clad laminate (the Copper Clad of copper with tow sides
Laminate；CCL) it is substrate.When making the circuit board of four layers of encapsulating structure, need the copper in first patterned substrate front, then at
Forming machine is utilized to form storage tank in substrate front side.Then the copper that substrate back is whole is removed in etching, is placed into iron core in accommodating
In groove.Viscose glue is inserted afterwards in storage tank, and respectively at the tow sides pressing Copper Foil of substrate.Wherein between Copper Foil and substrate with
Glass fibre (FR4) or polypropylene (PP) are as adhesive layer.Then via boring, copper facing in hole wall, insert asphalt mixtures modified by epoxy resin
The processing technology such as fat (epoxy), form the passage (via) that can turn on substrate tow sides Copper Foil.Afterwards, patterning tow sides
Copper Foil, and in substrate tow sides with the Copper Foil of epoxy resin overlay pattern and adhesive-layer.
But, at pressing Copper Foil before the back side of substrate, need to first etch and remove the copper that the copper clad laminate back side is whole, and make
Become material and processing technology waste of time, and the thickness of Copper Foil is less than the copper of substrate back, therefore can reduce four-layer circuit board
The intensity of structure, produces the stress affecting inductance value.
Additionally, subsequent conditioning circuit plate is fitted processing technology (Surface Mount Technology through surface；SMT), time, hold
Put the gas in groove to be prone to infrared ray reflow oven (IR Reflow) and expanded by high temperature, make adhesive layer and the epoxy of covering substrate
Resin damages, unless be just avoided that said circumstances with the viscose glue of high-quality, but cost can be caused to increase.On the other hand, the plate of substrate
Material is glass fibre, and existing when making conductive channel, the position easily ignoring adjacency channel is likely located at the glass of parallel substrate
The position of fiber orientation.Consequently, it is possible to the distance along glass fibre is beeline between adjacency channel, adjacency channel bores at substrate
The slight crack produced during hole easily connects along glass fibre, makes the copper of adjacency channel wall may be turned on by slight crack, causes short
Road.
Summary of the invention
The one technology aspect of the present invention is a kind of circuit board package structure.
According to an embodiment of the present invention, a kind of circuit board package structure comprise substrate, annular magnetic element, adhesion coating,
Multiple conductive parts and multiple conductive channels.Substrate has first and second relative surface.First surface is with second surface respectively
There are multiple first metal portion and multiple second metal portions.One annular groove is formed at first surface and is not covered by the first metal portion
Position.Annular magnetic element is arranged in annular groove.Adhesion coating is positioned on first surface, and covers the first metal portion and ring
Shape magnetic element.Conductive part is formed on adhesion coating, and relative with the second metal portion respectively.Conductive channel runs through conductive part, glues
Layer and substrate, and in the inwall of annular groove with outer wall outside.Each conductive channel has conducting film, electrically connects biphase
To conductive part and the second metal portion.
In an embodiment of the present invention, aforesaid substrate has at least two gas passages.It is recessed that gas passage is formed at annular
The outer wall of groove or inwall, make gas passage be communicated in annular groove.
In an embodiment of the present invention, above-mentioned adhesion coating forms at least two releases of pressure in the second protective layer on adhesion coating
Perforation.Release of pressure perforation is alignd respectively and connects gas passage.
In an embodiment of the present invention, above-mentioned conductive channel next-door neighbour's annular groove inwall is proximate annular arrangement, and base
Plate comprises multiple longitudinal fiber and multiple transverse fibers.Transverse fiber is respectively perpendicular to longitudinal fiber.Wherein conductive channel radius
For r, the center of circle distance of wantonly two adjacent conductive channels is L, and the center of circle of the wantonly two adjacent conductive channels in ring groove inwall is even
Line and the angle of longitudinal fiber and the angle with transverse fiber are all higher than or equal to 1/2 (Sin-1(2r/L))。
The manufacture method that another technology aspect is a kind of circuit board package structure of the present invention.
According to an embodiment of the present invention, the manufacture method of a kind of circuit board package structure comprises the steps of
A () provides the first metal layer on substrate, and the first surface of patterned substrate, to form multiple first metal
Portion；
B () forms the position that annular groove is not covered by the first metal portion in first surface, and arrange annular magnetic element
In annular groove；
C () attaching adhesion coating is on first surface, and pressing conductive layer is on adhesion coating；
D () bores multiple perforation in conductive layer, adhesion coating and substrate, and form multiple conducting film, with shape in perforation
Become multiple conductive channel；
E () forms multiple first protective layer in the gap of conductive channel；
(f) patterned conductive layer and the second metal level on the second surface of substrate；And
(g) formed 2 second protective layers respectively at adhesion coating, conductive channel and patterning conductive layer on, and patterning
On the second surface of the second metal level, conductive channel and substrate.
In an embodiment of the present invention, the manufacture method of foregoing circuit plate encapsulating structure further includes formation at least two gases
Passage, in the outer wall of annular groove or inwall, makes gas passage be communicated in annular groove.
In an embodiment of the present invention, the manufacture method of foregoing circuit plate encapsulating structure further includes formation at least two releases of pressure
Bore a hole the second protective layer on adhesion coating and adhesion coating.Release of pressure perforation is alignd respectively and connects gas passage.
In an embodiment of the present invention, the manufacture method of foregoing circuit plate encapsulating structure further include calculating conductive channel in
The suitable angle that substrate bore position must rotate through broadwise relative to glass fibre, makes the conducting film of adjacent conductive passage be difficult to along boring
The slight crack that hole produces connects and turns on.
In the above-mentioned embodiment of the present invention, circuit board package structure is three layers of encapsulating structure.On the second surface of substrate
The second metal level can form multiple second metal portions via patterning, and it is relative to electrically connect two by the conducting film of conductive channel
Conductive part and the second metal portion.Comparing with existing four layers of encapsulating structure, the second surface of this substrate is not required to etching and removes all
The second metal level, and second surface is also not required to the conductive layer that pressing again is extra, but utilizes the second metal level of patterning (i.e.
Second metal portion) electrically connect with conductive channel.Owing to the second metal level is had by substrate (copper clad laminate) itself, therefore electricity
Road plate encapsulating structure can be saved existing etching and remove whole second metal levels with pressing additional conductive layer in the making of second surface
Process time and material cost.Additionally, magnetic element counter stress is very sensitive, the electrical characteristic of magnetic element can be because of processing technology
The stress influence caused with encapsulating structure itself even causes damaging, and three layers of encapsulating structure can make the thickness of the second metal level be more than
The existing conductive layer being pressed on second surface, therefore can improve the support strength of circuit board package structure, reduces and affects inductance value
Stress.
Circuit board package structure also can by be positioned at annular groove outer wall or inwall gas passage and be positioned at adhesion coating with
Release of pressure perforation in second protective layer thereon comes release of pressure and heat extraction, can omit the viscose glue material in annular groove to reduce cost,
And improve inductance value because reducing the stress of processing technology and encapsulating structure itself generation, and can avoid gas in annular groove in
Infrared ray reflow oven is expanded by high temperature, makes the adhesion coating of covering substrate damage with the second protective layer on adhesion coating.
Conductive channel can by rotate a suitable angle make adjacent relative to glass fibre through broadwise in the bore position of substrate
The conducting film of conductive channel is difficult to connect along the slight crack that boring produces and turn on, it is to avoid short circuit.
Accompanying drawing explanation
Figure 1A is the top view of the circuit board package structure of an embodiment of the present invention；
Figure 1B is the schematic diagram of the equivalent circuit of Figure 1A；
Fig. 2 is the Figure 1A sectional view along line segment 2-2；
Fig. 3 A to Fig. 4 D is the sectional view during circuit board package structure making of Fig. 2；
Fig. 5 is the flow chart of the manufacture method of the circuit board package structure of an embodiment of the present invention；
Fig. 6 is the top view of the circuit board package structure of an embodiment of the present invention；
Fig. 7 is the Fig. 6 sectional view along line segment 7-7；
Fig. 8 A is annular groove and sectional view during gas passage making of an embodiment of the present invention；
Fig. 8 B is the sectional view during release of pressure perforation making of an embodiment of the present invention；
Fig. 9 A is the top view of the circuit board package structure of an embodiment of the present invention；
Fig. 9 B is the schematic diagram of the equivalent circuit of Fig. 9 A；
Figure 10 A be Fig. 9 A annular groove inwall in the signal of longitudinally, laterally fiber of two adjacent conductive channels and substrate
Figure；
Figure 10 B-1, Figure 10 B-2 be Fig. 9 A annular groove inwall in conductive channel along substrate longitudinally, laterally fiber revolve
Turn the schematic diagram of an angle；
Figure 11 is the top view of the circuit board package structure of an embodiment of the present invention；
Figure 12 is the sectional view of the circuit board package structure of an embodiment of the present invention.
Main element symbol description
100a: circuit board package structure 100b: circuit board package structure
100c: circuit board package structure 100d: circuit board package structure
100e: circuit board package structure 105: circuit
110: substrate 111: first surface
112: annular groove 113: second surface
114: the first metal portions 115: the first metal layer
116: the second metal portion 117: the second metal levels
119: gas passage 120: annular magnetic element
122: inwall 124: outer wall
130: adhesion coating 140: conductive part
141: conductive layer 150: conductive channel
151: perforation 152: conducting film
154: the first protective layer 162: the second protective layers
164: the second protective layers 170: viscose glue material
181: release of pressure perforation 182: milling cutter
184: drill bit 186: drill bit
192: longitudinal fiber 194: transverse fiber
196: electrode 2-2: line segment
7-7: line segment d1: aperture
D2: aperture D1: the degree of depth
D2: degree of depth D3: diameter
D4: diameter I1: electric current
I2: electric current I3: electric current
I4: electric current L1: distance
L2: distance L3: distance
S1: step S2: step
S3: step S4: step
S5: step S6: step
S7: step V1: conductive channel
V2: conductive channel V3: conductive channel
V4: conductive channel V5: conductive channel
V6: conductive channel θ: angle
θ 1: angle theta 2: angle
Detailed description of the invention
Multiple embodiments of the present invention, as clearly stated, the details in many practices will be disclosed below with accompanying drawing
Will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.The most just
Being to say, in some embodiments of the present invention, the details in these practices is non-essential.Additionally, for the sake of simplifying accompanying drawing, one
A little existing usual structures and element will illustrate it in the accompanying drawings in the way of simple signal.
Figure 1A illustrates the top view of circuit board package structure 100a according to an embodiment of the present invention.Figure 1B illustrates Figure 1A
The schematic diagram of equivalent circuit.Simultaneously refering to Figure 1A and Figure 1B, circuit board package structure 100a have multiple conductive channel 150 with
Multiple circuit 105, wherein the configuration mode of circuit 105 can be depending on designer's demand, and circuit 105 solid line in Figure 1A is upper strata
Circuit, dotted line is lower circuit, vice versa.In the present embodiment, circuit board package structure 100a is choke (power
Choke) pattern, is available for electric current I1 and passes through with electric current I2.In the following description, by the electricity of explanation circuit board package structure 100a
The structure that road 105 is connected.
Fig. 2 illustrates the Figure 1A sectional view along line segment 2-2.Comprise refering to Figure 1A and Fig. 2, circuit board package structure 100a simultaneously
Substrate 110, annular magnetic element 120, adhesion coating 130, multiple conductive part 140 and multiple conductive channels 150.Wherein, substrate 110
There is relative first surface 111 and second surface 113, and first surface 111 have multiple para-position the first metal portion 114,
Second surface 113 has multiple second metal portion 116.Annular groove 112 is formed at first surface 111 not by the first metal portion
114 cover positions, and annular magnetic element 120 be arranged in annular groove 112.Adhesion coating 130 is positioned at first surface 111
On, and cover the first metal portion 114 and annular magnetic element 120.
Additionally, conductive part 140 is formed on adhesion coating 130 and the most relative with the second metal portion 116 respectively.Conduction is logical
Road 150 runs through conductive part 140, adhesion coating 130 and substrate 110, and is close to inwall 122 and the outer wall of annular groove 112 respectively
124.Each conductive channel 150 has conducting film 152, can electrically connect two relative conductive part 140 and the second metal portions 116.
Circuit board package structure 100a also can comprise multiple first protective layer 154 and 2 second protective layers 162,164.First
Protective layer 154 is respectively formed in the gap of conductive channel 150, namely conducting film 152 around space.Second protective layer
162 be formed at adhesion coating 130, conductive channel 150 with on conductive part 140, the second protective layer 164 be formed at the second metal portion 116,
On the second surface 113 of conductive channel 150 and substrate 110.In present embodiment, circuit board package structure 100a also can comprise viscous
Glue material 170.Viscose glue material 170 is positioned in annular groove 112, can be used to stationary annular magnetic element 120.
Additionally, on reality is applied, the circuit 105 in Figure 1A can be formed at the second protective layer 162,164 nexine, and selects
Property ground electrical connection conductive part 140 be close to the inwall 122 of annular groove 112 and outer wall 124 wherein both, or electrical connection the second gold medal
Genus portion 116 be close to the inwall 122 of annular groove 112 and outer wall 124 wherein both, make the electricity on the second protective layer 162,164
Road 105 can be turned on by conductive channel 150, and reaches to spongy the effect of annular magnetic element 120.
In the present embodiment, substrate 110 can be copper clad laminate (the Copper Clad comprising glass fibre (FR4)
Laminate；CCL).First metal portion 114, conductive part the 140, second metal portion 116 can comprise with the material of conducting film 152
Copper.The material of adhesion coating 130 can comprise glass fibre (FR4) or polypropylene (PP).First protective layer 154 and 2 second protections
The material of layer 162,164 can comprise epoxy resin (epoxy), but above-mentioned material is not to limit the present invention, can be according to design
Person's demand and convert.
In the following description, by the manufacturing process of explanation circuit board package structure 100a.
Fig. 3 A to Fig. 4 D illustrates the sectional view during circuit board package structure 100a making of Fig. 2.In Fig. 3 A, copper clad laminate
The first surface 111 of 110 is respectively provided with the first metal layer 115 and the second metal level 117 with second surface 113.Then pattern
The first metal layer 115, the para-position forming Fig. 3 B can comprise exposure with the first metal portion 114, the patterning herein referred to, develops or lose
The steps such as quarter, but be not limited.The milling cutter (route bit) that may utilize forming machine afterwards forms Fig. 3 C in first surface 111
Annular groove 112.Referring next to Fig. 3 D, place annular magnetic element 120 in annular groove 112, and in annular groove 112
Middle filling viscose glue material 170.In Figure 4 A, attaching adhesion coating 130 is on first surface 111, and pressing conductive layer 141 is in adhesion coating
On 130.Then hole with substrate 110 in conductive layer 141, adhesion coating 130, form the perforation 151 of Fig. 4 B.
In figure 4 c, in perforation 151, conducting film 152 is plated, to form conductive channel 150, and in conductive channel 150
Gap is formed the first protective layer 154.Patterned conductive layer 141 and the second metal level 117, just can get the multiple of Fig. 4 D afterwards
Conductive part 140 and the second metal portion 116.Finally form the second protection in adhesion coating 130, conductive channel 150 on conductive part 140
Layer 162 (see Fig. 2), and form the second guarantor on the second metal portion 116, the conductive channel 150 second surface 113 with substrate 110
Sheath 164 (see Fig. 2).
The circuit board package structure 100a of Fig. 2 is three layers of encapsulating structure, compares with existing four-layer circuit board encapsulating structure, electricity
Road plate encapsulating structure 100a can save existing etching and remove whole second metal level 117 with pressing additional conductive layer in second surface
The processing technology time of 113 and material cost.Additionally, the thickness of the second metal level 117 is pressed on second surface 113 more than existing
Conductive layer, therefore can improve the support strength of circuit board package structure 100a, reduce the stress affecting inductance value.
Fig. 5 illustrates the flow chart of the manufacture method of circuit board package structure according to an embodiment of the present invention.First exist
In step S1, it is provided that the first metal layer on substrate, and the first surface of patterned substrate, to form multiple para-position the first gold medal
Genus portion.The most in step s 2, form the position that annular groove is not covered by the first metal portion in first surface, and annular is set
Magnetic element is in annular groove.The most in step s3, attaching adhesion coating is on first surface, and pressing conductive layer is in adhesion
On layer.The most in step s 4, bore multiple perforation in conductive layer, adhesion coating and substrate, and form multiple leading in perforation
Electrolemma, to form multiple conductive channel, conducting film generation type can be electro-coppering.The most in step s 5, multiple is formed
One protective layer is in the gap of conductive channel.The most in step s 6, the on the second surface of patterned conductive layer and substrate
Two metal levels.The most in the step s 7,2 second protective layers conductive layer respectively at adhesion coating, conductive channel and patterning is formed
On, and on the second surface of the second metal level of patterning, conductive channel and substrate.
Fig. 6 illustrates the top view of circuit board package structure 100b according to an embodiment of the present invention.Fig. 7 illustrates Fig. 6 edge
The sectional view of line segment 7-7.Comprise substrate 110, annular magnetic element refering to Fig. 6 and Fig. 7, circuit board package structure 100b simultaneously
120, adhesion coating 130, multiple conductive part 140 and multiple conductive channels 150.The place different from the embodiment of Figure 1A, Fig. 2 exists
Not having viscose glue material 170 (see Fig. 2) in circuit board package structure 100b, substrate 110 has at least two gas passages 119, and adhesion
Layer 130 and the second protective layer 162 thereon form at least two release of pressure perforation 181.Wherein, gas passage 119 is formed at annular recessed
The outer wall 124 of groove 112 without circuit 105 covering at, make gas passage 119 can be communicated in annular groove 112, but other embodiment party
In formula, gas passage 119 also can be formed at the inwall 122 of annular groove 112.Additionally, release of pressure perforation 181 is alignd respectively and connects
Gas passage 119.
In the present embodiment, the shape of gas passage 119 can be semicircle, circular or along annular groove 112
Outer wall 124 or inwall 122 are easily with the shape of milling cutter molding, but not to limit the present invention.The aperture d1 of gas passage 119 more than or
Equal to the aperture d2 of release of pressure perforation 181, and degree of depth D1 of gas passage 119 is less than or equal to degree of depth D2 of annular groove 112.
When circuit board package structure 100b fits processing technology (Surface Mount Technology through surface；SMT)
Time, circuit board package structure 100b can by the gas passage 119 of the outer wall 124 or inwall 122 that are positioned at annular groove 112 and
It is positioned at adhesion coating 130 and comes release of pressure and heat extraction with the release of pressure perforation 181 in the second protective layer 162 thereon, annular groove can be omitted
Viscose glue material 170 (see Fig. 2) in 112 is to reduce cost, and because reducing the stress of processing technology and encapsulating structure itself generation
Improve the inductance value of about 30%, and the gas in annular groove 112 can be avoided by high temperature in infrared ray reflow oven (IR reflow)
(such as 270 DEG C) and expand, make the adhesion coating 130 of covering substrate 110 damage with the second protective layer 162.
Fig. 8 A illustrates sectional view when annular groove 112 according to an embodiment of the present invention makes with gas passage 119.
Annular groove 112 may utilize the milling cutter 182 of forming machine and contacts the first surface 111 of substrate 110 and formed, and gas passage 119
Available drill bit 184 penetrates the first surface 111 of next-door neighbour's annular groove 112 and is formed, but not to limit the present invention.Citing comes
Saying, milling cutter 182 also can be contacted inwall 122 or outer when the milling cutter 182 of forming machine forms annular groove 112 by gas passage 119
Wall 124, makes gas passage 119 formation Tong Bu with annular groove 112.In the present embodiment, the diameter D3 of milling cutter 182 is more than boring
The diameter D4 of 184.
Fig. 8 B illustrates sectional view during release of pressure perforation 181 making according to an embodiment of the present invention.When gas passage 119
After covering adhesion coating 130 and the second protective layer 162, and circuit board package structure 100b carries out surface and fits before processing technology,
Only need to run through the adhesion coating 130 above gas passage 119 and the second protective layer 162 by drill bit 186, just can form release of pressure perforation
181 in adhesion coating 130 and the second protective layer 162, and release of pressure perforation 181 can align and connect gas passage 119.
Repeat it will be understood that the structure described the most in the above-described embodiment will not be repeated again with material, close and first chat
Bright.
Fig. 9 A illustrates the top view of circuit board package structure 100c according to an embodiment of the present invention.Fig. 9 B illustrates Fig. 9 A
The schematic diagram of equivalent circuit.Simultaneously refering to Fig. 9 A and Fig. 9 B, circuit board package structure 100c have multiple conductive channel 150 with
Multiple circuit 105.In the present embodiment, circuit board package structure 100c is the pattern of transformator (transformer), is available for
Electric current I3 passes through with electric current I4.
Circuit board package structure 100c is three layers of encapsulating structure, and its cross-section structure see the circuit board package structure of Fig. 2
100a.Comprise substrate 110, annular magnetic element 120, adhesion coating refering to Fig. 2 Yu Fig. 9 A, circuit board package structure 100c simultaneously
130, multiple conductive parts 140, multiple conductive channel 150.In the present embodiment, circuit board package structure 100c comprises and is positioned at ring
Viscose glue material 170 in connected in star 112.
Additionally, on reality is applied, the circuit 105 in Fig. 9 A can be formed at the second protective layer 162,164 nexine, and selects
Property ground electrical connection conductive part 140 be close to the inwall 122 of annular groove 112 and outer wall 124 wherein both, or electrical connection the second gold medal
Genus portion 116 be close to the inwall 122 of annular groove 112 and outer wall 124 wherein both, make the second protective layer 162,164 nexine
Circuit 105 can be turned on by conductive channel 150, and reaches to spongy the effect of annular magnetic element 120.Figure 10 A illustrates figure
Two adjacent conductive channels 150 in the annular groove inwall 122 of 9A and the signal of the longitudinally, laterally fiber 192,194 of substrate 110
Figure.Figure 10 B-1, Figure 10 B-2 illustrate longitudinal, horizontal along substrate 110 of the conductive channel 150 in the annular groove inwall 122 of Fig. 9 A
The schematic diagram of an angle is rotated to fiber 192,194.Simultaneously refering to Fig. 9 A and Figure 10 A, Figure 10 B-1, Figure 10 B-2, annular groove
Conductive channel 150 in inwall 122 is in approximating average annular arrangement, and such as Fig. 9 A is with slash mark annular groove inwall 122
Conductive channel 150.Substrate 110 is glass fibre basal plate, comprises multiple longitudinal fiber 192 and multiple transverse fibers 194, and horizontal
It is respectively perpendicular to longitudinal fiber 192 to fiber 194.Longitudinal fiber 192 leads to the conduction of transverse fiber 194, proximate annular arrangement
Road 150 in substrate 110 bore position relative fiber through broadwise be a suitable angle.In the present embodiment, led by calculating
The suitable angle that electric channel 150 must rotate through broadwise relative to glass fibre in substrate 110 bore position, makes adjacent conductive passage
The conducting film 152 (see Fig. 2) of 150 is difficult to connect along the slight crack that boring produces and turn on.Will be described below that " bore position is the most fine
Tie up through broadwise be a suitable angle " connotation and effect.
In the present embodiment, with the conductive channel 150 of slash mark annular groove inwall 122 and average annular arrangement
Quantity is 6, and radius is r.In Figure 10 B-1, the two of (the most left figure) adjacent conductive channel V1 Yu V2 are respectively positioned on parallel transverse fiber 194
Position, transversely the distance of fiber 194 is L1, and the center of circle distance of conductive channel V1 Yu V2 is L3.In Figure 10 B-2 (the rightest figure)
For conductive channel 150 after bore position clockwise anglec of rotation θ (pattern twist angle) of substrate 110, transversely
The distance of fiber 194 is that L2, L2 are more than L1, and a transverse fiber 194 is tangential on its circumference with conductive channel V1 Yu V2.θ=
Sin-1(2r/L3).It is to say, the angle theta 1 of the orientation of conductive channel 150 and longitudinal fiber 192 in Figure 10 A, and conduction
The orientation of passage 150 is all θ with the angle theta 2 of transverse fiber 194.
Rotate an angle at conductive channel 150 in the bore position of substrate 110 and have a transverse fiber 194 connection conduction logical
In all embodiments of the circumference of road V1 Yu V2, present embodiment is tangent with conductive channel V1 with V2 because of a transverse fiber 194
In circumference, L2 is the maximum range value that transverse fiber 194 connects conductive channel V1 Yu V2.And as θ ＞ Sin-1(2r/L3) time, because of
A transverse fiber 194 cannot be found to connect adjacent conductive passage V1 and V2, and conducting film 152 (see Fig. 2) needs the most transversely fiber 194
The slight crack conducting that could produce along boring along longitudinal fiber 192 again.
Additionally, in the present embodiment, by chance L3 is four times of r, therefore θ=30 °.Connect although L2 is transverse fiber 194
Connect the maximum range value of conductive channel V1 Yu V2, other adjacent conductive passage V2 and V3, or V5 and V6, the most equal position
In the position of parallel longitudinal direction fiber 192, shorten conductive channel V2 Yu V3 along the distance of longitudinal fiber 192 to L1.It is to say, it is former
This is that the slight crack transversely fiber 194 avoiding the conducting film 152 (see Fig. 2) of adjacent conductive passage V1 with V2 to produce because of boring is connected
And turn on, bore position rotation (pattern twist) therefore make the distance growth of transversely fiber 194 avoid short for L2
Road, cause other conductive channels V2 Yu V3 is L1 along the Distance Shortened of longitudinal fiber 192 the most simultaneously.
Therefore, in other embodiments, because conductive channel 150 mostly is being symmetric arrays through broadwise, anglec of rotation θ is subtracted
Half to 1/2 (Sin-1(2r/L3)), the distance of transversely fiber 194 or longitudinal fiber 192 can be made to increase, and other adjacent conductive
Passage is unlikely to shorten too much along the distance that longitudinal fiber 192 or transverse fiber 194 are bigger through broadwise at another originally.Reality should
Using, annular magnetic element 120 radius internal diameter is about 0.5mm～10mm, and the diameter of annular groove inwall 122 is slightly less than ring-like magnetic
The diameter of power element 120, conductive channel 150 radius r is about 0.075mm～2.75mm, the conductive channel of annular groove inwall 122
The quantity of 150 is more than or equal to 6, and transformator must proof voltage be 500V～4000V, the distance of center circle of wantonly two adjacent conductive channels 150
Need not be identical from the center of circle distance for L and each two adjacent conductive channels 150, if the circle center line connecting of wantonly two adjacent conductive channels 150
Angle with the angle of longitudinal fiber 192 and with transverse fiber 194 is all higher than or equal to 1/2 (Sin-1(2r/L3)), can make
The conducting film 152 of two adjacent conductive channels 150 is difficult to connect along the slight crack that boring produces and turn on, can be under the demand of proof voltage
Avoid short circuit.Additionally, the quantity of conductive channel 150 is the most, under conditions of ring groove inwall 122 diameter is constant, for increasing
Adjacent conductive passage 150 must reduce along the distance of fiber, conductive channel 150 radius r, the center of circle distance of adjacent conductive passage 150
L3 also can reduce because of conductive channel increasing number, for increasing the adjacent conductive passage 150 distance along fiber, conductive channel 150
Being not limited to annular arrangement, can stagger arbitrary arrangement.
Conductive channel 150 outside annular groove outer wall 124 is because being not only restricted in ring groove inner space, relatively annular groove
Conductive channel 150 in wall 122 has more spatial arrangements, therefore can the neighbor distance of wantonly two conductive channels 150 be widened, its edge
The distance of fiber i.e. increases.Or by its adjacent conductive passage 150 along the distance and annular groove inwall 122 of fiber along fiber
Distance compare, if less than the adjacent conductive passage 150 in annular groove inwall 122 along the distance of fiber, also must be to fiber warp
Broadwise rotates and causes apart from the slight crack conducting enough making conducting film be difficult under proof voltage demand along boring produces along fiber to it
Short circuit.
Specifically, when conductive channel 150 radius is r, or when the radius difference of two adjacent conductive channels 150, its
Middle one tool small radii be r, and the center of circle distance of two adjacent conductive channels 150 for L time, in ring groove inwall 122
Circle center line connecting and the angle of longitudinal fiber 192 of two adjacent conductive channels 150 and equal with the angle of transverse fiber 194
More than or equal to 1/2 (Sin-1(2r/L)).Additionally, the edge of the wantonly two adjacent conductive channels 150 outside ring groove outer wall 124
Fiber distance is all higher than or is equal to the shortest along fiber distance of the wantonly two adjacent conductive channels 150 in ring groove inwall 122
Value.
When designing conductive channel 150, conductive channel 150 can be calculated in substrate 110 bore position relative fiber through broadwise
The suitable angle that must rotate, the center of circle distance making wantonly two adjacent conductive channels 150 is L, appointing in ring groove inwall 122
The circle center line connecting of two adjacent conductive channels 150 and the angle of longitudinal fiber 192 and the biggest with the angle of transverse fiber 194
In or equal to 1/2 (Sin-1(2r/L)).Additionally, and calculate wantonly two adjacent conductive channels 150 in ring groove inwall 122
Along fiber distance, take short value and the wantonly two adjacent conductive channels 150 outside ring groove outer wall 124 along fiber distance than
Relatively, if less than above-mentioned short value, by conductive channel 150 adjacent for two outside ring groove outer wall 124 apart from elongation, or in base
Plate 110 bore position relative fiber rotates to it along fiber distance more than or equal to above-mentioned short value through broadwise, makes conducting film exist
It is difficult to the slight crack conducting along boring produces under proof voltage demand and causes short circuit.
When making conductive channel 150, it is considered as following factor:
(1) magnetic element radius, conductive channel quantity, conductive channel radius and conductive channel are in substrate and glass fibers
Dimension all can affect the adjacent conductive passage beeline along glass fibre through the relative position of broadwise.The demand of proof voltage is the biggest,
Required beeline is the biggest, causes short to avoid the conducting film of adjacent conductive passage to turn on because slight crack that boring produces connects
Road.
(2) in actual application, under the demand of proof voltage, for increasing above-mentioned beeline, bore position must be rotated one
Angle.
(3) the suitable anglec of rotation can make adjacent conductive passage originally elongate along the distance that glass fibre is too short, although away from
From the longest more be difficult to short circuit, the excessive anglec of rotation by make other adjacent conductive passages another through broadwise along glass fibre away from
Short circuit is caused from shortening.
(4) weaving manner of glass fibre and density also can affect above-mentioned beeline and the suitable anglec of rotation.Glass
Fiber also has square, rectangle or the weaving manner of different overlap mode.The weaving manner of glass fibre can affect adjacent leading
Whether the conducting film of electric channel can turn on (as laterally turned longitudinally or longitudinally turning horizontal stroke along being positioned at the different glass fibre slight crack through broadwise
To).
(5) conductive channel can annular arrangement, for increasing adjacent conductive passage along the distance of fiber, it is possible to arbitrary arrangement.
Figure 11 illustrates the top view of circuit board package structure 100d according to an embodiment of the present invention.Circuit board package is tied
Structure 100d is three layers of encapsulating structure, and its cross-section structure see the circuit board package structure 100b of Fig. 7.Simultaneously refering to Fig. 7 and figure
11, circuit board package structure 100d comprise substrate 110, annular magnetic element 120, adhesion coating 130, multiple conductive part 140, multiple
Conductive channel 150.The place different from the embodiment of Figure 10 A be circuit board package structure 100d do not have viscose glue material 170 (see
Fig. 2), substrate 110 has three gas passages 119, and one of which is formed at the inwall 122 of annular groove 112 and covers without circuit 105
At lid, another both be formed at the outer wall 124 of annular groove 112 without circuit 105 covering at.Adhesion coating 130 is protected with thereon second
Sheath 162 forms at least two release of pressure perforation 181.Additionally, release of pressure perforation 181 is alignd respectively and connects gas passage 119.
Simultaneously refering to Figure 10 A and Figure 11, in the present embodiment, circuit board package structure 100d has such as Figure 10 A substrate
Between conductive channel 150 in the longitudinal fiber 192 of 110 and transverse fiber 194, annular groove inwall 122 through broadwise angle
Design, namely the circle center line connecting of two adjacent conductive channels 150 and the angle of longitudinal fiber 192 and with transverse fiber 194
Angle be all higher than or equal to 1/2 (Sin-1(2r/L3))。
Figure 12 illustrates the sectional view of circuit board package structure 100e according to an embodiment of the present invention.Circuit board package is tied
Structure 100e is the pattern of coulant meter (power meter), is three layers of encapsulating structure.It is to say, circuit board package structure 100e
Also substrate 110, annular magnetic element 120, adhesion coating 130, multiple conductive part 140, multiple conductive channel 150 are comprised.
In the present embodiment, circuit board package structure 100e does not have viscose glue material 170 (see Fig. 2).Substrate 110 has gas
Passage 119.Adhesion coating 130 and the second protective layer 162 thereon form release of pressure perforation 181, and release of pressure perforation 181 is alignd and connection
Gas passage 119.Additionally, circuit board package structure 100e has the longitudinal fiber 192 such as Figure 10 A substrate 110 and transverse fiber
194, the design through broadwise angle between the partially electronically conductive passage 150 of annular arrangement.Additionally, circuit board package structure 100e is also
Can have and be positioned at the electrode 196 above conductive part 140 to connect other elements.
The above-mentioned embodiment of the present invention compared with prior art, has the advantage that
(1) circuit board package structure can be saved existing etching and remove whole second metal levels and pressing additional conductive layer in the
The processing technology time on two surfaces and material cost.Additionally, magnetic element counter stress is very sensitive, the electrical characteristic of magnetic element
Even can cause damaging because of the stress influence that processing technology and encapsulating structure cause itself, three layers of encapsulating structure can make the second metal
The thickness of layer, more than the existing conductive layer being pressed on second surface, therefore can improve the support strength of circuit board package structure, subtract
Affect the stress of inductance value less.
(2) circuit board package structure is when the laminating processing technology of surface, and circuit board package structure can be recessed by being positioned at annular
Groove outer wall or the gas passage of inwall and be positioned at adhesion coating and come release of pressure and row with the release of pressure perforation in the second protective layer thereon
Heat, can omit the viscose glue material in annular groove to reduce cost, and because of answering of reducing that processing technology and encapsulating structure itself produce
Power and improve inductance value, and the gas in annular groove can be avoided to be expanded by high temperature in infrared ray reflow oven, make covering substrate
Adhesion coating damages with the second protective layer on adhesion coating.
(3) the conductive channel radius in ring groove inwall is r, and the center of circle distance of wantonly two adjacent conductive channels is L, appoints
The circle center line connecting of two adjacent conductive channels and the angle of longitudinal fiber and the angle with transverse fiber is all higher than or equal to 1/2
(Sin-1(2r/L)), the conducting film of adjacent conductive passage is made to be difficult to connect along the slight crack that boring produces and turn on, can be at proof voltage
Demand under avoid short circuit.
Although disclosing the present invention in conjunction with embodiment of above, but it is not limited to the present invention, any is familiar with this
Operator, without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations, therefore protection scope of the present invention
Should be with being as the criterion that the claim enclosed is defined.
Claims (13)
1. a circuit board package structure, comprises:
Substrate, has first and second relative surface, and wherein this first surface and this second surface are respectively provided with multiple first
Metal portion and multiple second metal portions, an annular groove is formed at the position that this first surface is not covered by those the first metal portions
Put；
Annular magnetic element, is arranged in this annular groove；
Adhesion coating, is positioned on this first surface, and covers those the first metal portions and this annular magnetic element；
Multiple conductive parts, are formed on this adhesion coating, and relative with those the second metal portions respectively；
Multiple conductive channels, run through those conductive parts, this adhesion coating and this substrate, and in the inwall of this annular groove with
Outside outer wall, this conductive channel of each of which has conducting film, electrical connection two these relative conductive parts and this second metal portion；
Multiple first protective layers, are respectively formed in the gap of those conductive channels；And
2 second protective layers, one of which is formed on this adhesion coating, those conductive channels and those conductive parts, and another one is formed
On those the second metal portions, those conductive channels this second surface with this substrate,
Wherein this substrate has at least two gas passages, is formed at outer wall or the inwall of this annular groove, makes this two gas passage
It is communicated in this annular groove.
2. circuit board package structure as claimed in claim 1, this gas passage of each of which be shaped as semicircle, circle,
Or along annular groove outer wall or inwall easily with the shape of milling cutter molding.
3. circuit board package structure as claimed in claim 1, wherein this adhesion coating and this second protective layer on this adhesion coating
Middle formation at least two release of pressure is bored a hole, and the perforation of this two release of pressure is alignd respectively and connects this two gas passage.
4. circuit board package structure as claimed in claim 3, and the aperture of this two gas passage is all higher than or two releases equal to this
The aperture of pressure perforation.
5. circuit board package structure as claimed in claim 1, wherein the degree of depth of this two gas passage is respectively less than or equal to this ring
The degree of depth of connected in star.
6. circuit board package structure as claimed in claim 1, and this substrate comprises:
Multiple longitudinal fibers；And
Multiple transverse fibers, are respectively perpendicular to those longitudinal fibers；
Wherein those conductive channel radiuses are r, and the center of circle distance of wantonly two those adjacent conductive channels is L, in this ring groove
The circle center line connecting of wantonly two those the adjacent conductive channels in inwall and the angle of those longitudinal fibers and the most fine with those
The angle of dimension is all higher than or equal to 1/2 (Sin-1(2r/L) wantonly two those the adjacent conductions), and outside this ring groove outer wall
Passage be all higher than along fiber distance or equal to wantonly two those the adjacent conductive channels in this ring groove inwall along fiber
Distance short value.
7. circuit board package structure as claimed in claim 1, and this substrate comprises:
Multiple longitudinal fibers；And
Multiple transverse fibers, are respectively perpendicular to those longitudinal fibers；
Wherein when the radius difference of two those adjacent conductive channels, one of which tool small radii is r, this two adjacent leading
The center of circle distance of electric channel is L, and the circle center line connecting of this two adjacent conductive channel in this ring groove inwall is with those longitudinally
The angle of fiber and the angle with those transverse fibers are all higher than or equal to 1/2 (Sin-1(2r/L)), and at this ring groove
Being all higher than or equal to wantonly two in this ring groove inwall along fiber distance of wantonly two those adjacent conductive channels outside outer wall
Those adjacent conductive channels along fiber distance short value.
8. circuit board package structure as claimed in claim 1, also comprises:
Multiple circuit, optionally electrically connect those conductive parts wherein both or those the second metal portions wherein both.
9. a manufacture method for circuit board package structure, comprises the steps of
A () provides a substrate, and pattern the first metal layer on the first surface of this substrate, to form multiple first metal
Portion, this substrate comprises multiple longitudinal fiber；And multiple transverse fiber, it is respectively perpendicular to those longitudinal fibers；
B () forms the position that an annular groove is not covered by those the first metal portions in this first surface, and arrange an annular magnetic
Power element is in this annular groove；
C () attaches an adhesion coating on this first surface, and pressing one conductive layer is on this adhesion coating；
D () bores multiple perforation in this conductive layer, this adhesion coating and this substrate, and form multiple conduction in those are bored a hole
Film, to form multiple conductive channel；
E () forms multiple first protective layer in the gap of those conductive channels；
F () patterns this conductive layer and the second metal level on the second surface of this substrate；And
G () forms 2 second protective layers, one of which is formed on this adhesion coating, those conductive channels and those conductive parts, separately
One is formed on this second surface of this second metal portion of patterning, those conductive channels and this substrate.
10. the manufacture method of circuit board package structure as claimed in claim 9, also comprises:
Form at least two gas passages in the outer wall of this annular groove or inwall, make this two gas passage be communicated in this annular recessed
Groove.
The manufacture method of 11. circuit board package structures as claimed in claim 10, also comprises:
Form at least two releases of pressure to bore a hole this second protective layer on this adhesion coating and this adhesion coating, and the perforation of this two release of pressure is respectively
Align and connect this two gas passage.
The manufacture method of the circuit board package structure described in 12. claim 9, also comprises:
Calculating the suitable angle that those conductive channels must rotate through broadwise in this substrate bore position relative fiber, wherein those are led
Electric channel radius is r, and the center of circle distance of wantonly two those adjacent conductive channels is L, and appointing in this ring groove inwall is biphase
The adjacent circle center line connecting of those conductive channels angle with the angle of those longitudinal fibers and with those transverse fibers is all higher than
Or equal to 1/2 (Sin-1(2r/L))；And
Calculate those wantonly two adjacent conductive channels in this ring groove inwall along fiber distance, take short value with in this ring
Comparing along fiber distance of wantonly two those adjacent conductive channels outside type groove outer wall, if being less than this short value, will be in this ring
Two those adjacent conductive channel distances outside type groove outer wall are elongated, or revolve through broadwise in this substrate bore position relative fiber
Go to it along fiber distance more than or equal to this short value, make those conducting films be difficult to produce along boring under proof voltage demand
Slight crack conducting causes short circuit.
The manufacture method of 13. circuit board package structures as claimed in claim 9, also comprises:
Calculate the suitable angle that those conductive channels must rotate through broadwise in this substrate bore position relative fiber, when two is adjacent
During the radius difference of those conductive channels, one of which tool small radii is r, and the center of circle distance of this two adjacent conductive channel is
L, the circle center line connecting of this two adjacent conductive channel in this ring groove inwall and the angle of those longitudinal fibers and with this
The angle of a little transverse fibers is all higher than or equal to 1/2 (Sin-1(2r/L)), and
Calculate those wantonly two adjacent conductive channels in this ring groove inwall along fiber distance, take short value with in this ring
Comparing along fiber distance of wantonly two those adjacent conductive channels that type groove outer wall is outer, if being less than this short value, will be in this ring
Two those adjacent conductive channel distance elongations that type groove outer wall is outer, or revolve through broadwise in this substrate bore position relative fiber
Go to it along fiber distance more than or equal to this short value, make those conducting films be difficult to produce along boring under proof voltage demand
Slight crack conducting causes short circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210457584.6A CN103813632B (en) | 2012-11-14 | 2012-11-14 | Circuit board package structure and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210457584.6A CN103813632B (en) | 2012-11-14 | 2012-11-14 | Circuit board package structure and manufacture method thereof |
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| CN103813632A CN103813632A (en) | 2014-05-21 |
| CN103813632B true CN103813632B (en) | 2016-12-21 |
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| CN109116592B (en) * | 2018-07-19 | 2021-09-07 | 博讯光电科技(合肥)有限公司 | Novel LB glue assembling jig and using method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201663036U (en) * | 2009-12-04 | 2010-12-01 | 杨宗桦 | Magnetic element |
| CN102065637A (en) * | 2009-11-12 | 2011-05-18 | 平面磁性有限公司 | Packaging structure with magnetic element and forming method of the packaging structure |
| CN102316675A (en) * | 2010-06-30 | 2012-01-11 | 相互股份有限公司 | Circuit board and manufacture method thereof |
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2012
- 2012-11-14 CN CN201210457584.6A patent/CN103813632B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102065637A (en) * | 2009-11-12 | 2011-05-18 | 平面磁性有限公司 | Packaging structure with magnetic element and forming method of the packaging structure |
| CN201663036U (en) * | 2009-12-04 | 2010-12-01 | 杨宗桦 | Magnetic element |
| CN102316675A (en) * | 2010-06-30 | 2012-01-11 | 相互股份有限公司 | Circuit board and manufacture method thereof |
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