CN103809705A - Computer case - Google Patents
Computer case Download PDFInfo
- Publication number
- CN103809705A CN103809705A CN201310676875.9A CN201310676875A CN103809705A CN 103809705 A CN103809705 A CN 103809705A CN 201310676875 A CN201310676875 A CN 201310676875A CN 103809705 A CN103809705 A CN 103809705A
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- Prior art keywords
- heat dissipation
- computer
- heat radiation
- case
- heat
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Abstract
The invention discloses a computer case. The computer case comprises a case shell, wherein a liquid immersion box is arranged in the case shell, a mainboard is arranged in the liquid immersion box, the liquid immersion box is filled with non-conducting liquid, the liquid immersion box is connected with a heat dissipation grid through a crystal display tube, a radiator is connected with one side of the heat dissipation grid, the radiator is connected with the heat dissipation grid through a wire, one end of the heat dissipation grid is connected to the case shell, the other end of the heat dissipation grid penetrates through a tube nest to be connected to a ventilation pipeline, cooling fins are distributed all over the ventilation pipeline, the ventilation pipeline is connected with the heat dissipation grid in a communication mode, the tube nest is of a bent structure, one end of the tube nest is connected to the case shell, the other end of the tube nest is connected with an air case in a communication mode, a front tube is further arranged on the tube nest, and the front tube is of an L structure. According to the computer case, all the ports, in communication with a computer, of peripheral equipment can be integrated on a wiring port, and lines can be conveniently neatened; due to the fact that the non-conducting liquid is used for bringing heat generated by the computer to the surface of the computer case so that the heat can be dissipated, the heat dissipation area is increased, and the heat dissipation effect is good.
Description
Technical field
The present invention relates to a kind of computer equipment, particularly a kind of computer housing.
Background technology
At present, during for the heat dissipating method of electronic component in computer housing, heat is delivered to heat radiator by silicone grease and dispels the heat, in the time that heat is too high, take away fin surface heat by fan blow air.Along with the performance of product improves, energy consumption strengthens, and has brought the heating of electronic product rapid, and thermal value is high, and electronic component heating relies on rapidly silicone grease to carry out heat conduction, transferring heat fast.And desktop chassis need to be pegged graft with peripherals, but due to the increasing of peripherals, peripherals and cabinet to be connected plug very frequent, operate and bother very much.
Summary of the invention
The technical problem to be solved in the present invention is: overcome the problems referred to above, provide a kind of can be by the Interface integration of all peripherals and computer communication to wiring port, and the convenient circuit that arranges, the heat that simultaneously utilizes non-conductive liquid that computer is produced brings to the cabinet surface computer housing of walking that falls apart.
To achieve these goals, the technical solution used in the present invention is such: computer housing of the present invention, comprise casing, in casing, be provided with immersion case, immersion case inside is provided with mainboard and is marked with non-conductive liquid, immersion case is connected with heat radiation grid by crystal display tube, heat radiation grid one side is connected with heating radiator, heating radiator is connected with heat radiation grid by wire, heat radiation grid one end is connected on casing, its other end is connected on ventilating duct through integrated pipe, ventilating duct is covered with heat radiator outward, ventilating duct is connected with heat radiation grid, integrated pipe adopts bending structure, integrated pipe one end is connected on casing, its other end and air cabinet are connected, on integrated pipe, be also provided with preposition pipe, preposition pipe adopts L-type structure, preposition pipe one end is connected with integrated pipe, its other end is connected with rearmounted panel, rearmounted panel is provided with wiring port, wiring port is arranged on rearmounted panel middle part, and be horizontally set.
Further, as a kind of concrete version, between immersion case of the present invention and air cabinet, be provided with sealing panel.
Further, as a kind of concrete version, ventilating duct of the present invention adopts aluminum alloy materials to make.
Further, as a kind of concrete version, non-conductive liquid of the present invention is silicone oil or transformer oil.
Compared with prior art, the invention has the advantages that: computer housing of the present invention can be by the Interface integration of all peripherals and computer communication to wiring port, and the convenient circuit that arranges, the heat that simultaneously utilizes non-conductive liquid that computer is produced brings to cabinet surface and falls apart, increased area of dissipation, radiating effect is good.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention;
In figure: 1. casing; 2. immersion case; 3. air cabinet; 4. ventilating duct; 5. crystal display tube; 6. heat radiation grid; 7. heating radiator; 8. integrated pipe; 9. preposition pipe; 10. rearmounted panel; 11. wiring port.
Embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present invention is only described in a schematic way, and therefore it only shows the formation relevant with the present invention.
The preferred embodiment of computer housing of the present invention as shown in Figure 1, comprise casing 1, in casing 1, be provided with immersion case 2, immersion case 2 inside are provided with mainboard and are marked with non-conductive liquid, immersion case 2 is connected with heat radiation grid 6 by crystal display tube 5, heat radiation grid 6 one sides are connected with heating radiator 7, heating radiator 7 is connected with heat radiation grid 6 by wire, heat radiation grid 6 one end are connected on casing 1, its other end is connected on ventilating duct 4 through integrated pipe 8, the outer heat radiator that is covered with of ventilating duct 4, ventilating duct 4 is connected with heat radiation grid 6, integrated pipe 8 adopts bending structure, integrated pipe 8 one end are connected on casing 1, its other end and air cabinet 3 are connected, on integrated pipe 8, be also provided with preposition pipe 9, preposition pipe 9 adopts L-type structure, preposition pipe 9 one end are connected with integrated pipe 8, its other end is connected with rearmounted panel 10, rearmounted panel 10 is provided with wiring port 11, wiring port 11 is arranged on rearmounted panel 10 middle parts, and be horizontally set, between described immersion case 2 and air cabinet 3, be provided with sealing panel, described ventilating duct 4 adopts aluminum alloy materials to make, described non-conductive liquid is silicone oil or transformer oil.
Computer housing of the present invention can be by the Interface integration of all peripherals and computer communication to wiring port, and the convenient circuit that arranges, the heat that simultaneously utilizes non-conductive liquid that computer is produced brings to cabinet surface and falls apart, and has increased area of dissipation, and radiating effect is good.
Take above-mentioned foundation desirable embodiment of the present invention as enlightenment, by above-mentioned description, relevant staff can, not departing from the scope of this invention technological thought, carry out various change and modification completely.The technical scope of this invention is not limited to the content on instructions, must determine its technical scope according to claim scope.
Claims (4)
1. a computer housing, comprise casing, it is characterized in that: in casing, be provided with immersion case, immersion case inside is provided with mainboard and is marked with non-conductive liquid, immersion case is connected with heat radiation grid by crystal display tube, heat radiation grid one side is connected with heating radiator, heating radiator is connected with heat radiation grid by wire, heat radiation grid one end is connected on casing, its other end is connected on ventilating duct through integrated pipe, ventilating duct is covered with heat radiator outward, ventilating duct is connected with heat radiation grid, integrated pipe adopts bending structure, integrated pipe one end is connected on casing, its other end and air cabinet are connected, on integrated pipe, be also provided with preposition pipe, preposition pipe adopts L-type structure, preposition pipe one end is connected with integrated pipe, its other end is connected with rearmounted panel, rearmounted panel is provided with wiring port, wiring port is arranged on rearmounted panel middle part, and be horizontally set.
2. computer housing according to claim 1, is characterized in that: between described immersion case and air cabinet, be provided with sealing panel.
3. computer housing according to claim 1, is characterized in that: described ventilating duct adopts aluminum alloy materials to make.
4. computer housing according to claim 1, is characterized in that: not silicone oil or transformer oil of described non-conductive liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310676875.9A CN103809705A (en) | 2013-12-13 | 2013-12-13 | Computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310676875.9A CN103809705A (en) | 2013-12-13 | 2013-12-13 | Computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103809705A true CN103809705A (en) | 2014-05-21 |
Family
ID=50706611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310676875.9A Pending CN103809705A (en) | 2013-12-13 | 2013-12-13 | Computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103809705A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006004461A1 (en) * | 2006-01-30 | 2007-08-02 | Frank Beuschlein | Very low noise computer with oil filling has electronic assemblies that are immersed in oil and that radiate loss heat attached to housing |
| US20070267741A1 (en) * | 2006-05-16 | 2007-11-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| CN201054109Y (en) * | 2007-06-04 | 2008-04-30 | 张杨 | Oil-dipped self-cooling computer enclosure |
| CN203241898U (en) * | 2013-04-28 | 2013-10-16 | 孙冲冲 | Immersion heat dissipation computer case |
| CN203720733U (en) * | 2013-12-13 | 2014-07-16 | 成都佳美嘉科技有限公司 | Computer case |
-
2013
- 2013-12-13 CN CN201310676875.9A patent/CN103809705A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006004461A1 (en) * | 2006-01-30 | 2007-08-02 | Frank Beuschlein | Very low noise computer with oil filling has electronic assemblies that are immersed in oil and that radiate loss heat attached to housing |
| US20070267741A1 (en) * | 2006-05-16 | 2007-11-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
| CN201054109Y (en) * | 2007-06-04 | 2008-04-30 | 张杨 | Oil-dipped self-cooling computer enclosure |
| CN203241898U (en) * | 2013-04-28 | 2013-10-16 | 孙冲冲 | Immersion heat dissipation computer case |
| CN203720733U (en) * | 2013-12-13 | 2014-07-16 | 成都佳美嘉科技有限公司 | Computer case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140521 |