CN103809172B - Radar device for vehicle - Google Patents
Radar device for vehicle Download PDFInfo
- Publication number
- CN103809172B CN103809172B CN201310503084.6A CN201310503084A CN103809172B CN 103809172 B CN103809172 B CN 103809172B CN 201310503084 A CN201310503084 A CN 201310503084A CN 103809172 B CN103809172 B CN 103809172B
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- Prior art keywords
- substrate
- monolithic integrated
- microwave circuit
- integrated microwave
- radio frequency
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 56
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000011664 signaling Effects 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 11
- 230000007704 transition Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
- G01S7/032—Constructional details for solid-state radar subsystems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
- G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60W—CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT
- B60W2420/00—Indexing codes relating to the type of sensors based on the principle of their operation
- B60W2420/40—Photo, light or radio wave sensitive means, e.g. infrared sensors
- B60W2420/408—Radar; Laser, e.g. lidar
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2400/00—Special features of vehicle units
- B60Y2400/30—Sensors
- B60Y2400/301—Sensors for position or displacement
- B60Y2400/3017—Radars
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention discloses a radar device for a vehicle. The radar device includes a PTFE substrate, a first radio frequency substrate, a second radio frequency substrate, and a waveguide tube. The PTFE substrate includes a first layer for a high-frequency signal line to pass through and a second layer being the reference point of a grounding signal, the first radio frequency substrate is connected to the second layer of the PTFE substrate via a prepreg, the second radio frequency substrate is connected to the first radio frequency substrate via a prepreg, and the waveguide tube is formed by communicating from the second radio frequency substrate to the second layer of the PTFE substrate. Therefore, the radar device can maximally prevent signal leakage and improves heat radiation performance.
Description
Technical field
The present invention relates to vehicle radar installations, more particularly, to a kind of prevent signals leakiness and heat dispersion is improved
Vehicle radar installations.
Background technology
In existing vehicle, the radar installations of application is launched to perceive object and is received continuous radar waveform.
In this radar installations, in order to perceive the direction and goal thing at the objects such as guardrail or front vehicles place
Accurate location, possessing has array antenna, and wherein array antenna is neatly arranged by multiple antenna element that every predetermined interval configures
Row (array) are formed.
This vehicle radar and an example of antenna assembly, have US publication us2012/0050091a1.
Described vehicle radar and antenna assembly, as shown in the profile in Fig. 1, are formed with transmitting antenna and reception antenna
Antenna substrate 10 main substrate 14 is bonded in by adhesive 12.
On described main substrate 14, emission part 20 and enlarging section 30 and acceptance division 40 pass through BGA (ball grid
Array, abbreviation bga) tin ball (solder ball) 50 combination.
In described emission part 20, inscape is installed on emission part circuit substrate 22, amplifier in described enlarging section 30
32 are installed on enlarging section circuit substrate 34, and in described acceptance division 40, inscape is installed on acceptance division circuit substrate 42.
In order to connect described emission part 20 and transmitting antenna, using feeding pads (power feed pad) 60, in order to institute
State antenna substrate 10 transmission signal and use coaxial line 70, be provided with the surface of described coaxial line 70 and lead to as signal
The waveguide pipe 80 on road.
But, in radar arrangement as above, it is difficult to proper alignment feeding pads and emission part exactly during fabrication.
It is additionally, since and by bga tin ball (solder ball) 50, emission part 20 and enlarging section 30 and acceptance division 40 are combined
In described main substrate 62 so that making difficult, there is signals leakiness；Due to inserting feeding pads in antenna substrate 10
With coaxial line 70 so that complex procedures；It is pasted on after printed circuit board (PCB) (pcb) using bga tin bundle of spheres packaging part (package)
Be difficult to grasp soldering bad although can be grasped using expensive device such as x line equipment and special microscopes, but its lack
Point is that expense rises.
Content of the invention
Technical problem
Embodiments of the invention are researched and developed to solve problem as above, it is desirable to provide a kind of vehicle radar
Device, it can effectively prevent signals leakiness, because heat dissipation characteristics are improved such that it is able to improving transmitter module and receiving mould
The performance of block, simultaneously because the simplification of production process is additionally it is possible to improve manufacturing process.
Technical scheme
The vehicle radar installations of the embodiment of the present invention includes: ptfe substrate, and it has for high-frequency signal line warp
The ground floor crossed and become ground signalling datum mark the second layer；First radio frequency substrate, it passes through prepreg (prepreg)
It is engaged on the second layer of described ptfe substrate；Second radio frequency substrate, it is engaged in described first by prepreg
On radio frequency substrate；And waveguide pipe, it is from described second radio frequency substrate insertion to the second layer of described ptfe substrate
Formed.
Wherein, the high frequency by described high-frequency signal line can be more than 77ghz.
Wherein, on described second radio frequency substrate, coin can be to embed prominent form, to guarantee the integrated electricity of monolithic microwave
The pad function on road and heat sinking function.
Wherein, described coin can be made by copper.
And, described monolithic integrated microwave circuit can include launching monolithic integrated microwave circuit and receive monolithic microwave collection
Become circuit.Wherein, in order to by wire bonding (wire bonding) mode engage described transmitting monolithic integrated microwave circuit with
Receive the substrate of monolithic integrated microwave circuit, cavity can be formed on the substrate.
The thickness of described cavity can be formed larger than the thickness of described monolithic integrated microwave circuit.
Described high-frequency signal line can be gold-plated and formed by Copper Foil on described ptfe substrate.
In order to form short-circuit structure, outer cover can cover in side on the substrate.
Technique effect
Vehicle radar installations according to embodiments of the present invention, is capable of the leakage of effectively anti-stop signal, improves radar installations
Performance, because heat dissipation characteristics are outstanding, transmitter module is improved with the performance of receiver module.
It is additionally, since on antenna substrate without using bga tin ball and the radiating for installing transmitter module and receiver module
Plate, therefore can not only reduce the weight of radar installations, and can improve between Anneta module and transmitter module and receiver module
Combination operation, it is possible to increase production efficiency.
Brief description
Fig. 1 is the profile of the vehicle radar installations of display prior art；
Fig. 2 is the block diagram of the common higher-frequency radar of display；
Fig. 3 is the exploded perspective view of the common higher-frequency radar of display；
Fig. 4 is the side view with the attachment structure of antenna for the radio-frequency module of the display embodiment of the present invention；
Fig. 5 is the top view with the attachment structure of antenna for the radio-frequency module of the display embodiment of the present invention；
Fig. 6 is the connection simulation drawing with antenna for the radio-frequency module of the embodiment of the present invention；
Fig. 7 is that the radio-frequency module of the embodiment of the present invention simulates result figure table with the connection of antenna.
Description of reference numerals
100: Anneta module 120: radio frequency (rf) module
130: signal processing module 140: radome
150: shell
Specific embodiment
With reference to the accompanying drawings, embodiments of the invention are described in detail.
As shown in Fig. 2 the higher-frequency radar that can be used in vehicle includes Anneta module 100, radio-frequency module 120, signal transacting
Module 130 etc..
Described Anneta module 100 is made up of transmitting antenna and reception antenna, and its effect is to receive from described radio frequency (rf) mould
Block 120 transmission 77ghz signal, radiated by transmitting antenna, reception antenna receive radiation signal transmission to object again
The signal of secondary reflection, transmits to described radio-frequency module 120.
In order to transmit described 77ghz signal, in order to be fabricated to the guided wave cast of wr-10 size (1.27mm x2.54mm),
To stop the loss of signal, need Precision Machining.
Described radio-frequency module 120 is by the monolithic integrated microwave circuit (monolithic for launching and receive
Microwave ic, abbreviation mmic) and phase-locked loop (phase locked loop, abbreviation pll) composition, wherein phase-locked loop
Generation is warbled (chirp) waveform by the phase place of benchmark frequency and output frequency, makes phase place and the benchmark of output frequency
Frequency Synchronization, to generate required frequency.
The pll of described radio-frequency module 120 generates chirp waveforms, and the signal of generation passes through to launch monolithic integrated microwave circuit biography
Transport to transmitting antenna.
Transmitted to the signal receiving monolithic integrated microwave circuit by described reception antenna, integrated by receiving monolithic microwave
Circuit frequency reducing conversion (down converting) becomes base band (baseband) signal, transmits to described signal processing module 130.
In the case that described transmitting monolithic integrated microwave circuit is connected to transmitting antenna, and described reception antenna is connected
In the case of receiving monolithic integrated microwave circuit, it is the loss of anti-stop signal, needs most preferably setting of transition (transition)
Meter.
Because described 77ghz high-frequency signal is extremely sensitive to trickle distortion or operation error, gap, thus with antenna
Attachment structure is extremely important.
The effect of described signal processing module 130 is to control the pll of described radio-frequency module 120 and process from described radio frequency mould
The baseband signal of block 120 transmission.
And, because described signal processing module 130 possesses power supply unit, thereby serve to micro- to the monolithic of radio-frequency module 120
Ripple integrated circuit and the effect of each integrated circuit (ic) supply power supply.
From the baseband signal of described radio-frequency module 120 transmission, the same of data signal is converted into by analog-digital converter (adc)
When through processing, perception front object.
The signal transmitting to signal processing module 130 from described radio-frequency module 120 is rather low-frequency signals, does not therefore almost have
There is the loss of signal.
With reference to the basic configuration of the higher-frequency radar showing as Fig. 3, radome 140, described antenna in higher-frequency radar 200
Module 100, radio-frequency module 120 and signal processing module 130 stack gradually and are contained in shell 150.
As shown in Figure 4 and Figure 5, described radio-frequency module 120 and Anneta module 100 are directly connected to.
For board structure, ground floor and the second layer are made up of the two sides of polytetrafluoroethylene (PTFE) (teflon) 107 substrate,
In described ground floor, it is configured and passes through for high-frequency signal line.Described 77ghz high-frequency signal is through polytetrafluoroethylene (PTFE) 107 substrate
The dielectric constant on surface, therefore substrate and loss angle tangent (loss tangent) are critically important.
The species of substrate determines live width and the structure of transition (transition).
The second layer of described substrate becomes the datum mark of ground connection (ground) signal.Third layer is to layer 6 by single from receiving
Piece microwave integrated circuit transmission intermediate frequency (if) holding wire, control various integrated circuits control signal wire, to various integrated electricity
The power line of power supply is supplied on road and ground connection is constituted.
Because described signal is rather low-frequency signals, thus do not use the ptfe substrate 107 of costliness, but use
Cheap fr4 substrate 103,105, described substrate passes through prepreg (prepreg) 104,106 and engages.
Described transmitting monolithic integrated microwave circuit is engaged with bare chip (bare die) with receiving monolithic integrated microwave circuit
After substrate, need wire bonding (wire bonding) operation.During wire bonding in order to reduce monolithic integrated microwave circuit with
Offset between substrate, forms cavity (cavity) 102 preferably on substrate.
The thickness of monolithic integrated microwave circuit be 0.725mm it is contemplated that engage when adhesive height, described cavity
102 thickness is set to 0.745mm and is processed.
In addition, during radar operating, monolithic integrated microwave circuit generates substantial amounts of heat, if the heat of monolithic integrated microwave circuit
Excessively, performance can decline, and therefore radiates extremely important, for the radiating of monolithic integrated microwave circuit, can take installation aluminium radiating
The method of plate.In the case of being radiated by installation aluminium heat sink, to should add with the space of sky wire bonding on aluminium heat sink
Work waveguide pipe, it is therefore possible to producing the problem of arrangement, can cause manufacturing cost to rise due to adding processing.
In order to solve described problem, in an embodiment of the present invention, only it is embedded in firmly in monolithic integrated microwave circuit area
Coin (coin) 108.Described coin 108 is made by copper, is attached to layer 5 and layer 6 space, simultaneously works as monolithic microwave
The pad function of integrated circuit and heat sinking function.
So that waveguide pipe 101 part that processing is connected with antenna need not be added after coin 108 used as discussed above, and
Due to being directly connected with antenna so that being easy to arrange Anneta module and radio-frequency module.
Fig. 6 shows the described radio-frequency module 120 of the embodiment of the present invention and the simulation of the attachment structure of Anneta module 100, mistake
Cross (transition) and use rear-short-circuit (back-short) structure, be covered with outer cover (cover) 110 for this short structure.
Substrate uses polytetrafluoroethylene (PTFE) 112, and 77ghz high-frequency signal line 111 is formed by Copper Foil is gold-plated.In addition, in order to determine
The benchmark of signal and use ground plane 113, use prepreg 114 to engage with lower board.
The hole of waveguide pipe size, the waveguide pipe 115 with antenna are formed on described ground plane 113 and prepreg 114 face
Connect.The waveguide pipe 115 of antenna due to for 77ghz signal pass through, therefore using a size of waveguide pipe of wr-10, this waveguide pipe
Losing and transmitting of 75ghz～110ghz signal can be minimized.
In view of mismachining tolerance 30um, simulate the size of waveguide pipe 115 with the size of 1.4mm x2.8mm.Due to during simulation
It is assumed that waveguide pipe Beautifully finished, therefore, the processing precise journey of the processing of ground plane 113 and prepreg 114 and waveguide pipe 115
Which kind of degree degree and ground plane 113 and prepreg 114 are free from errors arranged in the waveguide pipe 115 of antenna, to performance
Produce maximum effect.After afterwards-short circuiting transfer (back-shor t transition) structure makes the one side short circuit of waveguide pipe, will visit
Pin be placed in be separated by from fault position 1/4 wavelength electric field reach maximum face (e- plane), thus realize as waveguide pipe
The conversion of the quasi- tem pattern of the te10 pattern of holotype and micro-strip (microstrip).
The advantage of described structure is, compared with using opening e- plane probe, characteristic variations deviate insensitive to arrangement.
Fig. 7 shows the result of described simulation, the extent of damage for transition, in working band (76ghz～77ghz)
Extremely important.Even if monolithic integrated microwave circuit sends peak power signal, the power being transferred to antenna is still determined by
The loss that wire bonding and transition cause.Therefore, with minimal loss the signal transmission of monolithic integrated microwave circuit
It is simulated to antenna for target.Afterwards-short circuiting transfer structure is including the 75.62ghz of working band (76ghz～77ghz)
The reflection loss of below 20db is shown, insertion loss maximum in frequency band shows 0.7db in～78.42ghz frequency band,
Show the performance similar with existing structure.
Described embodiments of the invention disclose in order to above-mentioned purpose is described, those of ordinary skill in the art should manage
Solution: it still can be modified to the technical scheme described in foregoing embodiments, or to wherein some or all of skill
Art feature carries out equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from each reality of the present invention
Apply the scope of a technical scheme.
Claims (7)
1. a kind of vehicle radar installations is it is characterised in that include:
Ptfe substrate, it has the ground floor and the second of the datum mark becoming ground signalling passing through for high-frequency signal line
Layer；
First radio frequency substrate, it is engaged on the second layer of described ptfe substrate by prepreg；
Second radio frequency substrate, it is engaged on described first radio frequency substrate by prepreg；And
Waveguide pipe, it forms from described second radio frequency substrate insertion to the second layer of described ptfe substrate,
Wherein, only in the monolithic integrated microwave circuit area of described second radio frequency substrate, coin to embed prominent form, with true
Protect pad function and the heat sinking function of monolithic integrated microwave circuit.
2. vehicle radar installations according to claim 1 it is characterised in that:
It is more than 77ghz by the high frequency of described high-frequency signal line.
3. vehicle radar installations according to claim 1 it is characterised in that:
Described coin is made by copper.
4. vehicle radar installations according to claim 1 it is characterised in that:
Described monolithic integrated microwave circuit includes launching monolithic integrated microwave circuit and receives monolithic integrated microwave circuit,
Wherein, form cavity on the substrate, so that described transmitting monolithic integrated microwave circuit is engaged by wire bonding mode
With the substrate receiving monolithic integrated microwave circuit.
5. vehicle radar installations according to claim 4 it is characterised in that:
The thickness of described cavity is formed larger than the thickness of described monolithic integrated microwave circuit.
6. vehicle radar installations according to claim 1 it is characterised in that:
Described high-frequency signal line is gold-plated and formed by Copper Foil on described ptfe substrate.
7. vehicle radar installations according to claim 1 it is characterised in that:
Upper outer cover covers in side on the substrate becomes short-circuit structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0125604 | 2012-11-07 | ||
| KR1020120125604A KR102061649B1 (en) | 2012-11-07 | 2012-11-07 | Radar device for vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103809172A CN103809172A (en) | 2014-05-21 |
| CN103809172B true CN103809172B (en) | 2017-01-18 |
Family
ID=50706224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310503084.6A Active CN103809172B (en) | 2012-11-07 | 2013-10-23 | Radar device for vehicle |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102061649B1 (en) |
| CN (1) | CN103809172B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102252382B1 (en) * | 2014-07-22 | 2021-05-14 | 엘지이노텍 주식회사 | Radar apparatus |
| KR102244536B1 (en) * | 2015-01-12 | 2021-04-26 | 엘지이노텍 주식회사 | Apparatus for adjusting radiation pattern of a radar antenna and a radar apparatus for a vehicle |
| KR102065025B1 (en) * | 2017-01-20 | 2020-01-10 | 주식회사 인비지블 | Transmission Member of Electromagnetic Wave of Radar For Vehicle |
| CN108983241A (en) * | 2018-09-29 | 2018-12-11 | 芜湖易来达雷达科技有限公司 | The hybrid circuit board of 77GHZ millimeter wave ADAS radar |
| DE102019200902A1 (en) | 2019-01-24 | 2020-07-30 | Audi Ag | Radar sensor, motor vehicle and method for producing a radar sensor |
| KR102221818B1 (en) * | 2019-09-06 | 2021-03-03 | 중앙대학교 산학협력단 | Multi-layer antenna using dielectric open type cavity |
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|---|---|---|---|---|
| CN1161570A (en) * | 1996-02-08 | 1997-10-08 | 冲电气工业株式会社 | Bumpless method of attaching inner leads to semiconductor integrated circuits |
| CN2745222Y (en) * | 2004-11-13 | 2005-12-07 | 方大集团股份有限公司 | An LED packaging structure |
| CN101243328A (en) * | 2005-08-11 | 2008-08-13 | 罗伯特·博世有限公司 | Radar sensor having a compact design |
| CN102200574A (en) * | 2010-03-25 | 2011-09-28 | 费元春 | High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component |
| CN102394380A (en) * | 2010-07-06 | 2012-03-28 | 古野电气株式会社 | Slot array antenna and radar device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209411A (en) * | 2001-10-30 | 2003-07-25 | Matsushita Electric Ind Co Ltd | High frequency module and production method for high frequency module |
| US8624775B2 (en) * | 2009-04-23 | 2014-01-07 | Mitsubishi Electric Corporation | Radar apparatus and antenna device |
| JP2012116251A (en) * | 2010-11-30 | 2012-06-21 | Equos Research Co Ltd | Camber angle adjusting device |
| KR101175745B1 (en) | 2011-02-18 | 2012-08-21 | 현대모비스 주식회사 | Vehicle radar apparatus for detecting the rear using main lobe and grating lobe and detecting method thereof |
-
2012
- 2012-11-07 KR KR1020120125604A patent/KR102061649B1/en active IP Right Grant
-
2013
- 2013-10-23 CN CN201310503084.6A patent/CN103809172B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1161570A (en) * | 1996-02-08 | 1997-10-08 | 冲电气工业株式会社 | Bumpless method of attaching inner leads to semiconductor integrated circuits |
| CN2745222Y (en) * | 2004-11-13 | 2005-12-07 | 方大集团股份有限公司 | An LED packaging structure |
| CN101243328A (en) * | 2005-08-11 | 2008-08-13 | 罗伯特·博世有限公司 | Radar sensor having a compact design |
| CN102200574A (en) * | 2010-03-25 | 2011-09-28 | 费元春 | High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component |
| CN102394380A (en) * | 2010-07-06 | 2012-03-28 | 古野电气株式会社 | Slot array antenna and radar device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103809172A (en) | 2014-05-21 |
| KR102061649B1 (en) | 2020-01-02 |
| KR20140059026A (en) | 2014-05-15 |
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