CN103809172A - Radar device for vehicle - Google Patents
Radar device for vehicle Download PDFInfo
- Publication number
- CN103809172A CN103809172A CN201310503084.6A CN201310503084A CN103809172A CN 103809172 A CN103809172 A CN 103809172A CN 201310503084 A CN201310503084 A CN 201310503084A CN 103809172 A CN103809172 A CN 103809172A
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- China
- Prior art keywords
- substrate
- monolithic integrated
- microwave circuit
- integrated microwave
- radar installations
- Prior art date
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- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 13
- 238000009434 installation Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000011664 signaling Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 abstract 4
- 238000012545 processing Methods 0.000 description 11
- 230000007704 transition Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008447 perception Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
- G01S7/032—Constructional details for solid-state radar subsystems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
- G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- B60W2420/408—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2400/00—Special features of vehicle units
- B60Y2400/30—Sensors
- B60Y2400/301—Sensors for position or displacement
- B60Y2400/3017—Radars
Abstract
The invention discloses a radar device for a vehicle. The radar device includes a PTFE substrate, a first radio frequency substrate, a second radio frequency substrate, and a waveguide tube. The PTFE substrate includes a first layer for a high-frequency signal line to pass through and a second layer being the reference point of a grounding signal, the first radio frequency substrate is connected to the second layer of the PTFE substrate via a prepreg, the second radio frequency substrate is connected to the first radio frequency substrate via a prepreg, and the waveguide tube is formed by communicating from the second radio frequency substrate to the second layer of the PTFE substrate. Therefore, the radar device can maximally prevent signal leakage and improves heat radiation performance.
Description
Technical field
The present invention relates to vehicle radar installations, relate in particular to a kind of vehicle radar installations that prevents that signals leakiness and heat dispersion are improved.
Background technology
The radar installations of applying in existing vehicle is launched for perception object and is received continuous radar waveform.
In this radar installations, for perception is such as the accurate location of the direction and goal thing at the object such as guardrail or front vehicles place, possess and have array antenna, wherein array antenna is formed by multiple antenna element proper alignment (array) of the predetermined space configuration of being separated by.
An example of radar and antenna assembly for this vehicle, has U.S. publication US2012/0050091A1.
Described vehicle uses radar and antenna assembly as shown in the sectional view in Fig. 1, and the antenna substrate 10 that is formed with emitting antenna and receiving antenna is bonded in main substrate 14 by bonding agent 12.
On described main substrate 14, emission part 20 and enlarging section 30 and acceptance division 40 are by ball grid array (Ball Grid Array is called for short BGA) tin ball (solder ball) 50 combinations.
In described emission part 20, inscape is installed on emission part circuit substrate 22, and in described enlarging section 30, amplifier 32 is installed on enlarging section circuit substrate 34, and in described acceptance division 40, inscape is installed on acceptance division circuit substrate 42.
In order to connect described emission part 20 and emitting antenna, use feeding pads (power feed pad) 60, in order to use coaxial line 70 to described antenna substrate 10 transmission of signals, the waveguide pipe 80 as signal path is installed directly over described coaxial line 70.
But, in radar arrangement as above, be difficult to during fabrication proper alignment feeding pads and emission part exactly.
And, owing to emission part 20 and enlarging section 30 and acceptance division 40 being incorporated into described main substrate 62 by BGA tin ball (solder ball) 50, make to make difficulty, there is the possibility of signals leakiness; Owing to inserting feeding pads and coaxial line 70 in antenna substrate 10, make complex procedures; After utilizing BGA tin bundle of spheres packaging part (package) to be pasted on printed circuit board (PCB) (PCB), very difficult grasp soldering is bad, grasped although can utilize expensive device such as x-ray equipment and special microscope, its shortcoming is that expense rises.
Summary of the invention
Technical matters
Embodiments of the invention are researched and developed in order to solve problem as above, aim to provide a kind of vehicle radar installations, it can effectively prevent signals leakiness, because heat dissipation characteristics is improved, thereby can improve the performance of transmitter module and receiver module, due to the simplification of production process, can also improve manufacturing process simultaneously.
Technical scheme
The vehicle of the embodiment of the present invention comprises with radar installations: ptfe substrate, and it has the ground floor that supplies high-frequency signal line process and the second layer that becomes the reference point of ground signalling; The first radio frequency substrate, it is engaged on the second layer of described ptfe substrate by prepreg (Prepreg); The second radio frequency substrate, it is engaged on described the first radio frequency substrate by prepreg; And waveguide pipe, it connects to the second layer of described ptfe substrate and forms from described the second radio frequency substrate.
Wherein, can be more than 77GHz by the high frequency of described high-frequency signal line.
Wherein, on described the second radio frequency substrate, coin can be to embed form setting, to guarantee pad function and the heat sinking function of monolithic integrated microwave circuit.
Wherein, described coin can be done by copper.
And described monolithic integrated microwave circuit can comprise transmitting monolithic integrated microwave circuit and receive monolithic integrated microwave circuit.Wherein, in order to engage described transmitting monolithic integrated microwave circuit and the substrate that receives monolithic integrated microwave circuit by Bonding (wire bonding) mode, on described substrate, can form cavity.
The thickness of described cavity can form to such an extent that be greater than the thickness of described monolithic integrated microwave circuit.
Described high-frequency signal line is can be on described ptfe substrate gold-plated and form by Copper Foil.
In order to form short-circuit structure, above described substrate, can cover outer cover.
Technique effect
According to the vehicle radar installations of the embodiment of the present invention, leakage that can effectively anti-stop signal, improves the performance of radar installations, and because heat dissipation characteristics is outstanding, the performance of transmitter module and receiver module is improved.
And, owing to being used for installing BGA tin ball and the heat sink of transmitter module and receiver module on antenna substrate without use, therefore not only can reduce the weight of radar installations, and can improve the combination operation between Anneta module and transmitter module and receiver module, can enhance productivity.
Accompanying drawing explanation
Fig. 1 is the sectional view that shows the vehicle radar installations of prior art;
Fig. 2 is the block diagram that shows common higher-frequency radar;
Fig. 3 is the exploded perspective view that shows common higher-frequency radar;
Fig. 4 is the side view that shows the radio-frequency module of the embodiment of the present invention and the syndeton of antenna;
Fig. 5 is the vertical view that shows the radio-frequency module of the embodiment of the present invention and the syndeton of antenna;
Fig. 6 is the radio-frequency module of the embodiment of the present invention and the connection mode graphoid of antenna;
Fig. 7 is the radio-frequency module of the embodiment of the present invention and the connecting analog result chart of antenna.
Description of reference numerals
100: Anneta module 120: radio frequency (RF) module
130: signal processing module 140: radome
150: shell
Embodiment
With reference to the accompanying drawings, describe embodiments of the invention in detail.
As shown in Figure 2, the higher-frequency radar that can be used in vehicle comprises Anneta module 100, radio-frequency module 120, signal processing module 130 etc.
Described Anneta module 100 is made up of emitting antenna and receiving antenna, its effect is to receive the 77GHz signal transmitting from described radio frequency (RF) module 120, radiated by emitting antenna, the signal that receiving antenna receives radiation transfers to after object the signal of secondary reflection again, transfers to described radio-frequency module 120.
In order to transmit described 77GHz signal, in order to be made into the guided wave cast of WR-10 size (1.27mm X2.54mm), to stop the loss of signal, need Precision Machining.
Described radio-frequency module 120 is by for the monolithic integrated microwave circuit of launching and receive (Monolithic Microwave IC, be called for short MMIC) and phase-locked loop (Phase Locked Loop, be called for short PLL) form, wherein phase-locked loop generates (Chirp) waveform of warbling also by the phase place of benchmark frequency and output frequency, the phase place of output frequency is synchronizeed, to generate required frequency with reference frequency.
The PLL of described radio-frequency module 120 generates chirp waveforms, and the signal of generation transfers to emitting antenna by transmitting monolithic integrated microwave circuit.
Transfer to the signal that receives monolithic integrated microwave circuit by described receiving antenna, become base band (baseband) signal by receiving monolithic integrated microwave circuit frequency reducing conversion (down converting), transfer to described signal processing module 130.
Described transmitting monolithic integrated microwave circuit being connected in the situation of emitting antenna, and described receiving antenna is connected in the situation that receives monolithic integrated microwave circuit, is the loss of anti-stop signal, needs the optimal design of transition (Transition).
Because described 77GHz high-frequency signal is extremely responsive to trickle distortion or operation error, gap, thus extremely important with the syndeton of antenna.
The effect of described signal processing module 130 is to control the PLL of described radio-frequency module 120 and process the baseband signal of transmitting from described radio-frequency module 120.
And, because described signal processing module 130 possesses power supply unit, therefore play to the effect of monolithic integrated microwave circuit and each integrated circuit (IC) supply power supply of radio-frequency module 120.
The baseband signal of transmitting from described radio-frequency module 120, process processing when converting digital signal to by analog to digital converter (ADC), the object in perception front.
The signal transmitting to signal processing module 130 from described radio-frequency module 120 is relative low frequency signal, therefore almost there is no the loss of signal.
With reference to the basic configuration of the higher-frequency radar showing as Fig. 3, in higher-frequency radar 200, radome 140, described Anneta module 100, radio-frequency module 120 and signal processing module 130 stack gradually and are contained in shell 150.
As shown in Figure 4 and Figure 5, described radio-frequency module 120 is directly connected with Anneta module 100.
With regard to board structure, ground floor and the second layer are made up of the two sides of teflon (Teflon) 107 substrates, in described ground floor, are configured for high-frequency signal line process.Described 77GHz high-frequency signal is through the surface of teflon 107 substrates, and therefore the specific inductive capacity of substrate and loss tangent (Loss tangent) are very important.
The kind of substrate determines live width and the structure of transition (transition).
The second layer of described substrate becomes the reference point of ground connection (ground) signal.The 3rd layer to layer 6 by intermediate frequency (IF) signal wire from receiving monolithic integrated microwave circuit transmission, control the control signal wire of various integrated circuit, form to power lead and the ground connection of various integrated circuit supply power supplys.
Because described signal is relative low frequency signal, thereby do not use expensive ptfe substrate 107, but use cheap FR4 substrate 103,105, described substrate engages by prepreg (Prepreg) 104,106.
Described transmitting monolithic integrated microwave circuit is engaged in after substrate with bare chip (bare die) with receiving monolithic integrated microwave circuit, needs Bonding (wire bonding) operation.When Bonding, in order to reduce the offset between monolithic integrated microwave circuit and substrate, preferably on substrate, form cavity (cavity) 102.
The thickness of monolithic integrated microwave circuit is 0.725mm, considers the height of bonding agent while joint, and the thickness of described cavity 102 is decided to be to 0.745mm and processes.
In addition, when radar running, monolithic integrated microwave circuit generates a large amount of heat, if the heat of monolithic integrated microwave circuit is too much, performance can decline, and therefore dispels the heat extremely important, for the heat radiation of monolithic integrated microwave circuit, can take to install the method for aluminium heat sink.By installing in the situation that aluminium heat sink dispels the heat, the Space processing waveguide pipe that should will engage with antenna on aluminium heat sink, therefore likely produces the problem of arranging, and adds trade union and causes manufacturing cost rising owing to appending.
In order to solve described problem, in an embodiment of the present invention, be only embedded in coin (coin) 108 at monolithic integrated microwave circuit area.Described coin 108 is made by copper, is attached to layer 5 and layer 6 space, plays pad function and the heat sinking function of monolithic integrated microwave circuit simultaneously.
Use after coin 108 as mentioned above, make to process without appending waveguide pipe 101 parts that are connected with antenna, and owing to being directly connected with antenna, make to be easy to arrange Anneta module and radio-frequency module.
Fig. 6 shows the described radio-frequency module 120 of the embodiment of the present invention and the simulation of the syndeton of Anneta module 100, after transition (Transition) is used-and short circuit (Back-short) structure, be covered with outer cover (Cover) 110 for this short structure.
Substrate uses teflon 112, and 77GHz high-frequency signal line 111 forms by Copper Foil is gold-plated.In addition, to use ground plane 113 in order to determine the benchmark of signal, to use prepreg 114 in order engaging with downside substrate.
The hole that forms waveguide pipe size on 114 of described ground plane 113 and prepregs, is connected with the waveguide pipe 115 of antenna.The waveguide pipe 115 of antenna, due to for 77GHz signal process, is therefore used the waveguide pipe that is of a size of WR-10, and this waveguide pipe can minimize loss the transmission of 75GHz～110GHz signal.
In view of mismachining tolerance 30um, simulate the size of waveguide pipe 115 with the size of 1.4mm X2.8mm.During due to simulation, suppose waveguide pipe Beautifully finished, therefore, which kind of degree the processing precise degree of the processing of ground plane 113 and prepreg 114 and waveguide pipe 115 and ground plane 113 and prepreg 114 are arranged in the waveguide pipe 115 of antenna error freely, and performance is produced to maximum effect.Afterwards-short circuiting transfer (Back-shor t Transition) structure makes after the one side short circuit of waveguide pipe, the electric field that probe is placed in to 1/4 wavelength of being separated by from fault position reaches maximum face (E-plane), thereby realizes as the TE10 pattern of holotype of waveguide pipe and the conversion of the Quasi-TEM mode of micro-band (microstrip).
The advantage of described structure is that, compared with using opening E-plane probe, characteristic variations departs from insensitive to arrangement.
Fig. 7 shows the result of described simulation, and with regard to transition, the extent of damage in working band (76GHz～77GHz) is extremely important.Even if monolithic integrated microwave circuit sends peak power signal, the power that is transferred to antenna still depends on the loss causing by Bonding and transition.Therefore, simulate as target the signal of monolithic integrated microwave circuit is transferred to antenna with minimal loss.Afterwards-short circuiting transfer structure has demonstrated the reflection loss below 20dB in the 75.62GHz～78.42GHz frequency band that comprises working band (76GHz～77GHz), insertion loss maximum in frequency band has demonstrated 0.7dB, demonstrates and the similar performance of existing structure.
Described embodiments of the invention disclose for above-mentioned purpose is described, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (8)
1. a vehicle radar installations, is characterized in that, comprising:
Ptfe substrate, it has the ground floor that supplies high-frequency signal line process and the second layer that becomes the reference point of ground signalling;
The first radio frequency substrate, it is engaged in by prepreg on the second layer of described ptfe substrate;
The second radio frequency substrate, it is engaged on described the first radio frequency substrate by prepreg; And
Waveguide pipe, it connects to the second layer of described ptfe substrate and forms from described the second radio frequency substrate.
2. vehicle radar installations according to claim 1, is characterized in that:
Be more than 77GHz by the high frequency of described high-frequency signal line.
3. vehicle radar installations according to claim 1, is characterized in that:
On described the second radio frequency substrate, coin is to embed form setting, to guarantee pad function and the heat sinking function of monolithic integrated microwave circuit.
4. vehicle radar installations according to claim 3, is characterized in that:
Described coin is made by copper.
5. vehicle radar installations according to claim 3, is characterized in that:
Described monolithic integrated microwave circuit comprises transmitting monolithic integrated microwave circuit and reception monolithic integrated microwave circuit,
Wherein, on described substrate, form cavity, to engage described transmitting monolithic integrated microwave circuit and the substrate that receives monolithic integrated microwave circuit by Bonding mode.
6. vehicle radar installations according to claim 3, is characterized in that:
The thickness of described cavity forms to such an extent that be greater than the thickness of described monolithic integrated microwave circuit.
7. vehicle radar installations according to claim 1, is characterized in that:
Described high-frequency signal line is gold-plated and form by Copper Foil on described ptfe substrate.
8. vehicle radar installations according to claim 1, is characterized in that:
On cover above described substrate, outer cover becomes short-circuit structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120125604A KR102061649B1 (en) | 2012-11-07 | 2012-11-07 | Radar device for vehicle |
| KR10-2012-0125604 | 2012-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103809172A true CN103809172A (en) | 2014-05-21 |
| CN103809172B CN103809172B (en) | 2017-01-18 |
Family
ID=50706224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310503084.6A Active CN103809172B (en) | 2012-11-07 | 2013-10-23 | Radar device for vehicle |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102061649B1 (en) |
| CN (1) | CN103809172B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108983241A (en) * | 2018-09-29 | 2018-12-11 | 芜湖易来达雷达科技有限公司 | The hybrid circuit board of 77GHZ millimeter wave ADAS radar |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102252382B1 (en) * | 2014-07-22 | 2021-05-14 | 엘지이노텍 주식회사 | Radar apparatus |
| KR102244536B1 (en) * | 2015-01-12 | 2021-04-26 | 엘지이노텍 주식회사 | Apparatus for adjusting radiation pattern of a radar antenna and a radar apparatus for a vehicle |
| KR102065025B1 (en) * | 2017-01-20 | 2020-01-10 | 주식회사 인비지블 | Transmission Member of Electromagnetic Wave of Radar For Vehicle |
| DE102019200902A1 (en) | 2019-01-24 | 2020-07-30 | Audi Ag | Radar sensor, motor vehicle and method for producing a radar sensor |
| KR102221818B1 (en) * | 2019-09-06 | 2021-03-03 | 중앙대학교 산학협력단 | Multi-layer antenna using dielectric open type cavity |
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| CN1161570A (en) * | 1996-02-08 | 1997-10-08 | 冲电气工业株式会社 | Bumpless method of attaching inner leads to semiconductor integrated circuits |
| CN2745222Y (en) * | 2004-11-13 | 2005-12-07 | 方大集团股份有限公司 | An LED packaging structure |
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| WO2010122860A1 (en) * | 2009-04-23 | 2010-10-28 | 三菱電機株式会社 | Radar device and antenna device |
| CN102200574A (en) * | 2010-03-25 | 2011-09-28 | 费元春 | High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component |
| CN102394380A (en) * | 2010-07-06 | 2012-03-28 | 古野电气株式会社 | Slot array antenna and radar device |
| JP2012116251A (en) * | 2010-11-30 | 2012-06-21 | Equos Research Co Ltd | Camber angle adjusting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003209411A (en) * | 2001-10-30 | 2003-07-25 | Matsushita Electric Ind Co Ltd | High frequency module and production method for high frequency module |
| KR101175745B1 (en) | 2011-02-18 | 2012-08-21 | 현대모비스 주식회사 | Vehicle radar apparatus for detecting the rear using main lobe and grating lobe and detecting method thereof |
-
2012
- 2012-11-07 KR KR1020120125604A patent/KR102061649B1/en active IP Right Grant
-
2013
- 2013-10-23 CN CN201310503084.6A patent/CN103809172B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1161570A (en) * | 1996-02-08 | 1997-10-08 | 冲电气工业株式会社 | Bumpless method of attaching inner leads to semiconductor integrated circuits |
| CN2745222Y (en) * | 2004-11-13 | 2005-12-07 | 方大集团股份有限公司 | An LED packaging structure |
| CN101243328A (en) * | 2005-08-11 | 2008-08-13 | 罗伯特·博世有限公司 | Radar sensor having a compact design |
| WO2010122860A1 (en) * | 2009-04-23 | 2010-10-28 | 三菱電機株式会社 | Radar device and antenna device |
| CN102200574A (en) * | 2010-03-25 | 2011-09-28 | 费元春 | High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component |
| CN102394380A (en) * | 2010-07-06 | 2012-03-28 | 古野电气株式会社 | Slot array antenna and radar device |
| JP2012116251A (en) * | 2010-11-30 | 2012-06-21 | Equos Research Co Ltd | Camber angle adjusting device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108983241A (en) * | 2018-09-29 | 2018-12-11 | 芜湖易来达雷达科技有限公司 | The hybrid circuit board of 77GHZ millimeter wave ADAS radar |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103809172B (en) | 2017-01-18 |
| KR102061649B1 (en) | 2020-01-02 |
| KR20140059026A (en) | 2014-05-15 |
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