CN103796489A - Heat collecting end and heat sink - Google Patents
Heat collecting end and heat sink Download PDFInfo
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- CN103796489A CN103796489A CN201410015861.7A CN201410015861A CN103796489A CN 103796489 A CN103796489 A CN 103796489A CN 201410015861 A CN201410015861 A CN 201410015861A CN 103796489 A CN103796489 A CN 103796489A
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- collecting terminal
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Abstract
The invention relates to a heat collecting end. The heat collecting end comprises a cover plate, a microchannel module and a base. The microchannel module is provided with a plurality of cylindrical holes, and the cylindrical holes are used for allowing working media to pass through. The base is provided with an inlet and an outlet which are oppositely formed. The microchannel module is fixedly arranged between the cover plate and the base. The cylindrical holes of the microchannel module extend to the outlet side of the base from the inlet side of the base. An upper slope body is arranged between the inlet of the base and an inlet of the microchannel module, and a lower slope body is arranged between an outlet of the microchannel module and the outlet of the base. In addition, the invention further provides a heat sink including the heat collecting end.
Description
Technical field
The present invention relates to a kind of hot collecting terminal and use the heat abstractor of this hot collecting terminal, relate in particular to a kind of hot collecting terminal and heat abstractor that uses lotus root shape porous material.
Background technology
In recent years, the thermal boundary problem that high integrationization causes has become one of the major issue of the development such as restriction computer chip, photoelectric device and technical bottleneck, how highly effective and safe chip dispel the heat and becomes one of important topic that electronic device studies.
For example, the general principle of CPU heat dissipation design is between CPU and environment, and an alap thermal resistance is provided, and object is control core temperature, makes it to work in the temperature range allowing.Through years development, Fluid for Single-phase Fluid Loop System heat dissipation technology has benefited from its heat dissipation capacity greatly and assembles the features such as convenient, is widely used at high-end CPU field of radiating.
The thermal resistance of this form heat abstractor comprises hot collecting terminal, the loose end of hot type and the transmission channel between the two, when work, liquid in hot collecting terminal is absorbed by cover plate and is conducted the CPU heat coming by convection action, under the driving of pump, transfer to the loose end of hot type so that by heat dissipation to environment.Because the loose end of hot type can coordinate the mode of Wind Volume fan that heat is all arranged and is dissipated in environment by intensive manifold, make hot collecting terminal liquid inlet temperature near constant in ambient temperature, thereby the key that affects radiator performance is just the heat exchange efficiency of hot collecting terminal.
Hot collecting terminal heat exchange efficiency is relevant with its inner runner that participates in heat convection, and the exchange capability of heat that runner is complicated can make fluid pass through with microminiaturization time promotes.Complicated runner increases the contact-making surface of fluid and matrix, and then strengthens convection action, and the runner of microminiaturization easily makes fluid heat absorption develop into nucleate boiling, and then obtains larger heat-sinking capacity.Current common runner form has solid matter copper post, individual layer micro-channel and multilayer micro-channel etc.But the pressure drop of known microchannel is large, often need high-power pump to match with it, therefore cost is difficult to control, market using value is not high.
Summary of the invention
In view of this, necessaryly a kind of hot collecting terminal is provided and uses the heat abstractor of this hot collecting terminal, little to realize the microchannel pressure drop of hot collecting terminal and heat abstractor, and the relatively cheap effect of cost.
A kind of hot collecting terminal, it comprises: a cover plate; One microchannel module, this microchannel module has multiple cylindrical holes, and the plurality of cylindrical hole is used for passing through working media; One base, this base has the entrance and exit being oppositely arranged.Described microchannel module is fixedly installed between described cover plate and described base, wherein, multiple cylindrical holes of described microchannel module extend to outlet side from described base entrance side, between described base entrance and described microchannel module entrance, being a upward slope body, is a descending body between described microchannel module outlet and the outlet of described base.
A kind of heat abstractor, it comprises hot collecting terminal as above, the loose end of hot type, connects the pipeline of described hot collecting terminal and the loose end of hot type, and is at least arranged at the working media of described hot collecting terminal, the loose end of hot type or pipeline.
Compared with prior art, hot collecting terminal provided by the invention and the heat abstractor with this hot collecting terminal are because microchannel module microchannel is multiple cylindrical holes, and its inner wall smooth, so little along stroke pressure loss; Between described base entrance and described microchannel module entrance, being a upward slope body, is a descending body between described microchannel module outlet and the outlet of described base, has reduced the eddy current of porch, microchannel, has reduced the pressure loss; Therefore do not need high-power pump to match with it, so cost is relatively cheap.
Accompanying drawing explanation
Fig. 1 is the composition schematic diagram of the heat abstractor that provides of embodiment of the present invention.
Fig. 2 is the overall structure schematic diagram of the hot collecting terminal that provides of embodiment of the present invention.
Fig. 3 is the exploded view of the hot collecting terminal that provides of embodiment of the present invention.
Fig. 4 is the inverted structural representation of hot collecting terminal cover plate that embodiment of the present invention provides.
Fig. 5 is the hot collecting terminal that provides of embodiment of the present invention along the profile that in Fig. 2, V-V line is cut open.
Main element symbol description
| |
10 |
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11 |
| The loose end of |
12 |
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13 |
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14 |
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15 |
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21 |
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22 |
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23 |
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211 |
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212 |
| Groove | 213 |
| Screwed |
214 |
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221 |
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222 |
| Seal groove | 230 |
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231 |
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232 |
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233 |
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234 |
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235 |
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236 |
| Screwed |
239 |
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237、238 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with the accompanying drawings and the specific embodiments, hot collecting terminal provided by the invention and heat abstractor are described in further detail.
Refer to Fig. 1, embodiment of the present invention provides a kind of heat abstractor 10, and this heat abstractor 10 is for the heat radiation such as computer chip, photoelectric device.
Described heat abstractor 10 comprises hot collecting terminal 11, the loose end 12 of hot type, connects the pipeline 13 of described hot collecting terminal and the loose end of hot type, be arranged at the pump 14 of described pipeline 13, and be at least arranged at the working media 15 of described hot collecting terminal 11, the loose end 12 of hot type or pipeline 13.Described hot collecting terminal 11, the loose end 12 of hot type and pump 14 are connected to form close access by pipeline 13.
Refer to Fig. 2, Fig. 3 and Fig. 5, described hot collecting terminal 11 comprises cover plate 21, microchannel module 22 and base 23.
See also Fig. 4, the material of described cover plate 21 can be copper, magnesium or silicon etc.This cover plate 21 is made up of central part 211 and edge part 212, the thickness of this central part 211 is preferably 1 millimeter, the lateral surface of this central part 211 protrudes from described edge part 212, and the medial surface of this central part 211 forms a cylinder shape groove 213 lower than described edge part 212.The lateral surface of described central part 211 is heat-absorbent surfaces, and for contacting with described CPU, the medial surface of described groove 213 is for welding with microchannel module 22.Be formed with multiple screwed holes 214 at the edge part 212 of described cover plate 21.Certainly, described cover plate 21 can be also a flat board.
The material of described microchannel module 22 can be copper, magnesium or silicon etc., and this microchannel module 22 has multiple cylindrical holes 221, and the plurality of cylindrical hole 221 forms microchannel for passing through working media 15.The surface size of described microchannel module 22 with treat radiating element sizableness.This microchannel module 22 is connected to described cover plate central part 211 by diffusion welding (DW) to be had on the surface of groove 213, and the effect of diffusion welding (DW) is to guarantee not add any foreign material under weld strength condition, can be down to minimum in connection with locating thermal resistance.
Described microchannel module 22 is to utilize the prepared lotus root shape of metal-gas eutectic directional solidification processes porous material, this lotus root shape porous material inside has that massive parallel is arranged and the cylindrical hole of inner wall smooth, average pore size can be controlled between 0 to 1 millimeter by changing preparation technology parameter, from cross section visual angle, be covered with tiny circular hole, face porosity be whole circular hole areas account for cross-sectional area ratio in 40% left and right, specific area is huge.Therefore, in the time passing to working media 15, can give play to efficient heat exchange property, and relatively cheap its market using value that promoted of cost.
The heat exchange property of described microchannel module 22 is subject to the impact in aperture larger, according to analog computation and experimental results, water is during as working media, can adopt the microchannel module 22 of small-bore, the average pore size that is to say the cylindrical hole 221 in this microchannel module 22 is less than 600 microns, preferably average pore size scope is 300 microns to 500 microns, and optimum average pore size is 400 microns of left and right.Low-melting-point metal or low-melting alloy are during as working media, can adopt wide-aperture microchannel module 22, the average pore size that is to say the cylindrical hole 221 in this microchannel module 22 is greater than 600 microns, preferably average pore size scope is 700 microns to 900 microns, and optimum average pore size is 800 microns of left and right.
Because metal current-gas eutectic directional solidification processes level is not enough to guarantee that all cylindrical holes 221 are penetrating on the length direction more than 25 millimeters, mean the cylindrical hole 221 that can have in actual applications obstruction, the microchannel number of actual participation convection action so will reduce, and heat exchange property is just had a greatly reduced quality.So, on the length direction perpendicular to cylindrical hole 221, can adopt line cutting mode to offer some grooves 222, object is the penetrating ratio that increases cylindrical hole 221 in each segmentation, make more microchannel participate in convection action, reduce the flow resistance of working media 15 simultaneously, thereby enhancing heat transfer effect, the width of groove 222 is 0.5 millimeter, groove 222 does not cut completely, object is the globality that guarantees microchannel module 22, fixing and being installed while facilitating diffusion welding (DW), the side of slotting is solder side, object is to guarantee that the top one deck cylindrical hole 221 is penetrating good.
The material of described base 23 is metal or polymethyl methacrylate.This base 23 has the end face 231 and the bottom surface 232 that are oppositely arranged, and is arranged at the side 233 between this end face 231 and bottom surface 232.Described end face 231 offers a groove 234, and this groove 234 is for placing described microchannel module 22, and described side 233 has the entrance 235 and the outlet 236 that are oppositely arranged.Described entrance 235 and outlet 236 are all communicated with described groove 234.Between described base entrance 235 and the entrance of microchannel module 22, be provided with liquid mixing section 237, between the outlet of microchannel module 22 and described base outlet 236, be provided with liquid mixing section 238, liquid mixing section 237, the mode that 238 structure directly affects working media fluid and enters microchannel, heat exchange property impact on microchannel is great, liquid mixing section 237 herein, 238 are all processed to ramp shaped, , between described base entrance 235 and described microchannel module entrance, it is a upward slope body, between described microchannel module outlet and described base outlet 236, it is a descending body.And the angle between described upward slope body and described base entrance 235 is 45 degree to 55 degree, be preferably 50 degree left and right.Angle between described descending body and described base outlet 236 is 45 degree to 55 degree, is preferably 50 degree left and right.Its effect is eddy current and the cyclone reducing in liquid mixing section 237,238, guarantees when working media fluid enters microchannel to stablize gently, has reduced the pressure loss of whole stroke working media fluid simultaneously.
Described end face 231 offers multiple screwed holes 239, and in the present embodiment, the quantity of this screwed hole 239 equates with the quantity of described cover plate 21 upper screwed holes 214.Inner side at described end face 231 upper screwed holes 239 is provided with seal groove 230, for placing sealing ring 24.
Described microchannel module 22 is fixedly installed between the groove 213 of described cover plate 21 and the groove 234 of described base 23 by screw 25, and wherein, multiple cylindrical holes 221 of described microchannel module 22 extend to outlet side from described base entrance side.And between described cover plate 21 and described base 23, be provided with sealing ring 24, can make hot collecting terminal 11 be hedged off from the outer world, reach sealing effectiveness.
Described working media 15 can be water, low-melting-point metal or low-melting alloy.Described low-melting-point metal is as gallium etc., and described low-melting alloy is as gallium indium alloy, gallium-indium-tin alloy, Na-K alloy etc.
Described pipeline 13 is copper tube or plastic tube.
The outer surface of described hot collecting terminal cover plate central part 211 scribbles heat-conducting silicone grease, under external jig pressure with treat that the heating face of radiating element fits tightly.The described heat for the treatment of that radiating element sends conducts to described cover plate 21 by heat exchange pattern.Working media liquid enters entrance liquid mixing section 237 through described base entrance 235 under the driving of pump 14, enter in the cylindrical hole 221 of microchannel module 22 by the transition flow on slope in entrance liquid mixing section 237, after heat convection is carried out with wall in cylindrical hole inside, flow out cylindrical hole 221 and enter outlet liquid mixing section 238, in this process, working media liquid absorption is from the heat for the treatment of that radiating element sends, temperature raises, finally flow out from described base outlet 236, flow into the loose end 12 of hot type through pipeline 13 and carry out far-end heat radiation.Then enter next round circulation through pump 14.
Described hot collecting terminal 11 is relevant with the jig pressure of heat abstractor 10 with the thickness of described cover plate 21 from the efficiency in the time that radiating element absorbs heat, less cover sheet thickness and larger jig pressure can reduce this part of thermal resistance, but easily there is distortion in cover plate 21 in actual use, cause sealing effectiveness to be affected, even cause working media leak of liquid.The thickness of described cover plate central part 211 is preferably 1 millimeter, this is mainly to carry out comprehensive consideration from the mechanical strength of cover plate 21 and heat-conducting effect,,, when the thickness of this central part 211 is 1 millimeter, this cover plate 21 has preferably heat-conducting effect when having better mechanical strength.
In addition, described cover plate 21 is designed to have central part 211 and edge part 212, and described central part 211 to, higher than the shape of described edge part 212, have following effect:
(1) in the time that described cover plate 21 is fastening with described base 23 by described screw 25, the active force of twisting screw acts on the sealing ring 24 between described side edge thereof portion 212 and described base 23, due to described cover plate central part 211 with the edge part 212 as screw fastening face not in same plane, so, described active force can not be passed to described central part 211, but a part of active force can be distributed to the vertical portion that connects described central part 211 and edge part 212.Therefore, may there is deformation in described vertical portion, but deformation can not occur central part 211, therefore state the sealing of hot collecting terminal 11 described in can not affecting.
(2) when by described hot collecting terminal 11 clampings to treating radiating element, when jig imposes larger pressure, described cover plate central part 211 will be subject to larger pressure, due to cover plate central part 211 with the edge part 212 as screw fastening face not in same plane, so, pressure can not be passed to described edge part 212, but a part of pressure is passed to the vertical portion that connects described central part 211 and edge part 212, described this vertical portion of described sealing ring 24 distance is nearer again, so this pressure-acting is to sealing ring 24 place places, therefore, cover plate 21 is not only difficult for producing distortion, also can promote the sealing of described hot collecting terminal 11.
The embodiment of the present invention provides a kind of heat abstractor for i7-4960x model C PU heat radiation, and the material of cover plate, microchannel module and base in this heat abstractor is fine copper.Wherein, it is the 28 (32 (microchannel modules of 5 millimeters that described microchannel module adopts length and width high, the porosity of this microchannel module is 40.68%, 596 microns of average pore sizes, cut the quartering along cylindrical hole length direction with line, cut apart 0.5 millimeter of groove width, slot segmentation leaves 0.5 millimeter and does not cut off, and fluting one side is carried out diffusion welding (DW) as the surface of contact-making surface and described cover plate groove.Adopt water as working media, in the time that microchannel module inlet flow rate is 65mL/s, the good heat radiating can realize this CPU power consumption reaches 300W under overclocking condition time, now CPU surface temperature is only 66 ℃, the maximum temperature allowing far below the normal work of CPU.
The hot collecting terminal that the embodiment of the present invention provides and heat abstractor are due to microchannel module microchannel inner wall smooth, so little along stroke pressure loss; Microchannel aperture size is little, and porosity is high, so cooling surface area is large; Grooving segment processing is carried out in microchannel, so through hole ratio is large, radiating efficiency is high; Import and export liquid mixing section and be provided with slope, reduced the eddy current of porch, microchannel, reduced the pressure loss, thus do not need high-power pump to match with it, so cost is relatively cheap.Described cover plate is designed to have central part and edge part, and described central part adapts to larger jig pressure higher than the shape of described edge part, and sealing is good; Microchannel module adopts the preparation of metal-gas eutectic directional solidification processes, so technique is simple, processing cost is low.As can be seen here, hot collecting terminal of the present invention and heat abstractor are highly suitable for large power consumption and treat the heat radiation of radiating element.
In addition, those skilled in the art can also do other and change in spirit of the present invention, and the variation that these do according to spirit of the present invention, all should be included in the present invention's scope required for protection.
Claims (14)
1. a hot collecting terminal, it comprises:
One cover plate;
One microchannel module, this microchannel module has multiple cylindrical holes, and the plurality of cylindrical hole is used for passing through working media;
One base, this base has the entrance and exit being oppositely arranged;
Described microchannel module is fixedly installed between described cover plate and described base, wherein, multiple cylindrical holes of described microchannel module extend to outlet side from described base entrance side, between described base entrance and described microchannel module entrance, being a upward slope body, is a descending body between described microchannel module outlet and the outlet of described base.
2. hot collecting terminal as claimed in claim 1, is characterized in that, the angle between described upward slope body and described base entrance is 45 to 55 degree, and the angle between described descending body and the outlet of described base is 45 to 55 degree.
3. hot collecting terminal as claimed in claim 2, is characterized in that, the angle between described upward slope body and described base entrance is preferably 50 degree, and the angle between described descending body and the outlet of described base is preferably 50 degree.
4. hot collecting terminal as claimed in claim 1, it is characterized in that, described cover plate is made up of central part and edge part, the lateral process of this central part is for described edge part, the inner side of this central part forms a groove lower than described edge part, and described microchannel module is fixedly installed between described cover plate groove and described base.
5. hot collecting terminal as claimed in claim 1, is characterized in that, when described working media is water, the aperture of multiple cylindrical holes of described microchannel module is less than 600 microns.
6. hot collecting terminal as claimed in claim 1, is characterized in that, when described working media is water, the aperture of multiple cylindrical holes of described microchannel module is 300 microns to 500 microns.
7. hot collecting terminal as claimed in claim 1, is characterized in that, when described working media is low-melting-point metal or alloy, the aperture of multiple cylindrical holes of described microchannel module is greater than 600 microns.
8. hot collecting terminal as claimed in claim 1, is characterized in that, when described working media is water, the aperture of multiple cylindrical holes of described microchannel module is 700 microns to 900 microns.
9. hot collecting terminal as claimed in claim 1, it is characterized in that, described microchannel module is spaced apart is provided with multiple grooves, the bearing of trend of the plurality of groove is perpendicular to the bearing of trend of described multiple cylindrical holes, and the diffusion into the surface with multiple grooves of described microchannel module is welded to the surface of described cover plate groove.
10. hot collecting terminal as claimed in claim 1, is characterized in that, described susceptor surface offers seal groove, and described hot collecting terminal further comprises sealing ring, and sealing circle is arranged at described seal groove.
11. 1 kinds of heat abstractors, it comprises hot collecting terminal as described in claim 1 to 10 any one, the loose end of hot type, connects the pipeline of described hot collecting terminal and the loose end of hot type, and is at least arranged at that described hot collecting terminal, hot type are loose to be held or the working media of pipeline.
12. heat abstractors as claimed in claim 11, is characterized in that, described working media is water, low-melting-point metal or low-melting alloy.
13. heat abstractors as claimed in claim 12, is characterized in that, described low-melting-point metal is gallium.
14. heat abstractors as claimed in claim 12, is characterized in that, described low-melting alloy is gallium indium alloy, gallium-indium-tin alloy or Na-K alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015861.7A CN103796489B (en) | 2014-01-14 | 2014-01-14 | Use hot collecting terminal and the heat abstractor of porous microchannel module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410015861.7A CN103796489B (en) | 2014-01-14 | 2014-01-14 | Use hot collecting terminal and the heat abstractor of porous microchannel module |
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| Publication Number | Publication Date |
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| CN103796489A true CN103796489A (en) | 2014-05-14 |
| CN103796489B CN103796489B (en) | 2016-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410015861.7A Expired - Fee Related CN103796489B (en) | 2014-01-14 | 2014-01-14 | Use hot collecting terminal and the heat abstractor of porous microchannel module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200745A (en) * | 2018-01-22 | 2018-06-22 | 清华大学 | Hot collecting terminal and radiator |
| CN113133270A (en) * | 2020-01-14 | 2021-07-16 | 航天海鹰(哈尔滨)钛业有限公司 | Confined space forced cooling system based on special-shaped diffusion welding water-cooling plate |
| CN113811149A (en) * | 2021-08-05 | 2021-12-17 | 浙江大学 | Two-phase micro-channel heat dissipation device for high-power IGBT module heat management |
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| US20050252641A1 (en) * | 2004-05-13 | 2005-11-17 | Juei-Chi Chang | Heat dissipation device having thermally conductive cover board |
| US20060225867A1 (en) * | 2005-04-11 | 2006-10-12 | Samsung Electronics Co., Ltd. | Heat sink apparatus for electronic device |
| US20100139904A1 (en) * | 2005-08-11 | 2010-06-10 | Osaka University | Heat sink and method of producing the same |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
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2014
- 2014-01-14 CN CN201410015861.7A patent/CN103796489B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050252641A1 (en) * | 2004-05-13 | 2005-11-17 | Juei-Chi Chang | Heat dissipation device having thermally conductive cover board |
| US20060225867A1 (en) * | 2005-04-11 | 2006-10-12 | Samsung Electronics Co., Ltd. | Heat sink apparatus for electronic device |
| US20100139904A1 (en) * | 2005-08-11 | 2010-06-10 | Osaka University | Heat sink and method of producing the same |
| CN103188912A (en) * | 2011-12-27 | 2013-07-03 | 刘源 | Lotus-type regular porous metal microchannel heat sink using liquid metal working medium |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108200745A (en) * | 2018-01-22 | 2018-06-22 | 清华大学 | Hot collecting terminal and radiator |
| CN108200745B (en) * | 2018-01-22 | 2024-04-26 | 清华大学 | Heat collecting end and heat radiating device |
| CN113133270A (en) * | 2020-01-14 | 2021-07-16 | 航天海鹰(哈尔滨)钛业有限公司 | Confined space forced cooling system based on special-shaped diffusion welding water-cooling plate |
| CN113811149A (en) * | 2021-08-05 | 2021-12-17 | 浙江大学 | Two-phase micro-channel heat dissipation device for high-power IGBT module heat management |
| CN113811149B (en) * | 2021-08-05 | 2022-11-04 | 浙江大学 | Two-phase micro-channel heat dissipation device for heat management of high-power IGBT module |
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| CN103796489B (en) | 2016-09-21 |
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