CN103794517A - Circular type crystal grain placement method - Google Patents

Circular type crystal grain placement method Download PDF

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Publication number
CN103794517A
CN103794517A CN201210432047.6A CN201210432047A CN103794517A CN 103794517 A CN103794517 A CN 103794517A CN 201210432047 A CN201210432047 A CN 201210432047A CN 103794517 A CN103794517 A CN 103794517A
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CN
China
Prior art keywords
crystal grain
circular
arrangement
placing
district
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Pending
Application number
CN201210432047.6A
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Chinese (zh)
Inventor
杜昭颖
赖柏言
鐘仁厚
陈光诚
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WECON AUTOMATIC MACHINERY CO Ltd
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WECON AUTOMATIC MACHINERY CO Ltd
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Priority to CN201210432047.6A priority Critical patent/CN103794517A/en
Publication of CN103794517A publication Critical patent/CN103794517A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The invention relates to a circular type crystal grain placement method. The method comprises: measuring the length of a diagonal line of a crystal grain arrangement zone of a crystal grain arrangement frame; in the crystal grain arrangement zone of the crystal grain arrangement frame, measuring the diameter length of a largest circular area so as to solve a preset circular crystal grain arrangement area; in the preset circular crystal grain arrangement area, setting an arrangement flat edge direction of crystal grains and a arrangement initial line of the crystal grains; again in the preset circular crystal grain arrangement area, setting a position interval of each crystal grain; and placing the crystal grains in the preset circular crystal grain arrangement area according to the set arrangement flat edge direction, the set arrangement initial line and the set position interval such that the utilization rate of crystal grain bearing can be improved in the crystal grain arrangement frame, and the benefits of crystal grain production power are improved.

Description

Circular formula crystal grain method for placing
Technical field
The present invention relates to a kind of circular formula crystal grain method for placing, be particularly involved in crystal grain the utilization rate that can promote crystal grain carrying in framework is set, reach the circular formula crystal grain method for placing that crystal grain production capacity benefit promotes.
Background technology
Crystal grain is the basis that makes integrated circuit package, and the manufacturing process of integrated circuit package includes following several key step: first prepare highly purified liquid semiconductor raw material (as silicon), then utilize crystal seed (seed) and generate columned crystal bar (ingot) by crystal pulling (pooling), crystal bar (ingot) is cut into slices to (slicing) to cut into dish shape, and the wafer forming, again on wafer by the crystal grain of many (die) cutting and separating, afterwards sequentially via glutinous brilliant (die mount/die bond), bonding wire (wire bond), sealing (mold), shear/be shaped (trim/form), lettering (mark), electroplate (plating) and detect steps such as (inspection) to complete the making of an integrated circuit package.
In above-mentioned glutinous crystalline substance (die mount/die bond) process, that the crystal grain that utilizes grain sorting machine (Chip Mapping-Sorter) that the crystal grain sorting out is posted to elasticity mucous membrane district (Blue Tape) A1 according to sub-category (Bin) proper alignment to inside arranges framework (Frame) A upper (as shown in Figure 2 A), and known crystal grain arrangement mode is to utilize rectangular crystal grain to put method, refer to shown in Fig. 1, known rectangular crystal grain storing method comprises the following step:
200: set crystal grain and put district's diagonal; Arrange and in framework A, establish a pair of linea angulata M, the length L of its diagonal M prior to a crystal grain;
210: calculate crystal grain and put district; The catercorner length setting according to step 200, in order to calculate maximum rectangular area, (length and width that is maximum rectangular area is (0 ﹒ 5 2) L) and mucous membrane district A1, crystal grain put district;
220: set crystallite dimension, spacing; Put in district A2 in the crystal grain of maximum rectangular area, can cook up the length and width of the arrangement rectangle of crystal grain storing district B according to crystallite dimension, spacing;
230: calculate crystal grain and put position; In crystal grain is put the length and width of arrangement rectangle of district B; Go out crystal grain according to crystallite dimension, distance computation and put position B1.
240: crystal grain is put; Each crystal grain is sequentially put respectively in the crystal grain calculating according to crystallite dimension, spacing and put position B1.
Only, arrange in framework (Frame) A at the crystal grain of formed objects, its space utilization rate is higher, can obtain crystal grain carrying quantity just more; But, put method with regard to known rectangular crystal grain, be that multiple crystal grain B are put in crystal grain and arranged in its elasticity mucous membrane district (Blue Tape) of framework (Frame) A A1 (as shown in Fig. 2 B and Fig. 2 C) in rectangular arranged mode, its space utilization rate of the method is lower, cannot allow crystal grain production capacity benefit promote.
Summary of the invention
In view of the foregoing, the invention provides a kind of circular formula crystal grain method for placing, give up existing rectangular crystal grain and put method, improve space utilization rate lower, the problem that crystal grain production capacity benefit cannot promote.
The disclosed circular formula crystal grain method for placing according to the present invention, includes: the catercorner length of measuring a crystal grain and arrange its crystal grain setting area of framework; Among this crystal grain arranges its crystal grain setting area of framework, the diameter of measuring maximum circular area is long, in the hope of a default circular crystal grain setting area; Among this default circular crystal grain setting area, set the row that begin that line up of the flat edge direction of arrangement of crystal grain and crystal grain; Among this default circular crystal grain setting area, set the location gap of each crystal grain again; Crystal grain is arranged to flat edge direction according to setting, lined up begin row and location gap and put among this default circular crystal grain setting area.
By this, by the disclosed circular formula crystal grain method for placing of the present invention, can the space utilization rate that promote crystal grain carrying in framework be set in a crystal grain, the benefit that reaches crystal grain production capacity promotes.
Accompanying drawing explanation
Fig. 1 is that known rectangular crystal grain is put method one schematic flow sheet;
Fig. 2 A is that known rectangular crystal grain is put method rectangular frame schematic diagram;
Fig. 2 B is that known rectangular crystal grain is put method rectangular frame crystal grain placement schematic diagram;
Fig. 2 C is that known rectangular crystal grain is put method circular frame crystal grain placement schematic diagram;
Fig. 3 is circular formula crystal grain method for placing of the present invention one schematic flow sheet;
Fig. 4 A is circular formula crystal grain method for placing rectangular frame schematic diagram of the present invention;
Fig. 4 B is that circular formula crystal grain method for placing rectangular frame crystal grain of the present invention is placed schematic diagram;
Fig. 4 C is that circular formula crystal grain method for placing circular frame crystal grain of the present invention is placed schematic diagram;
Fig. 5 is the concrete Application Example schematic diagram of circular formula crystal grain method for placing of the present invention;
Fig. 6 is circular another embodiment schematic flow sheet of formula crystal grain method for placing of the present invention;
Fig. 7 is circular another embodiment schematic diagram of formula crystal grain method for placing of the present invention;
Fig. 8 is the another embodiment flow chart of circular formula crystal grain method for placing of the present invention;
Fig. 9 is the another embodiment schematic diagram of circular formula crystal grain method for placing of the present invention.
Description of reference numerals: 1-crystal grain arranges framework; 11-crystal grain setting area; The default circular crystal grain of 111-setting area; 2-crystal grain; 100-sets crystal grain and puts district's diagonal; 110-planning crystal grain is put district; 120-sets crystal grain and puts condition; 120 '-set crystal grain to put condition; 120 "-setting crystal grain are put condition; 130-calculates the putting position of crystal grain; 140-crystal grain is put; A-crystal grain arranges framework; A1-elasticity mucous membrane district; A2-crystal grain rest area; B-crystal grain; B1-crystal grain placement location; 200-sets crystal grain setting area diagonal; 210-calculates crystal grain setting area; 220-sets crystallite dimension and spacing; 230-calculates crystal grain and puts position; 240-crystal grain is put.
Embodiment
For the effect that makes those skilled in the art facilitate simple and direct understanding further feature content of the present invention and advantage and to reach can more manifest, hereby the present invention is coordinated to Figure of description, describe feature of the present invention and advantage in detail, following embodiment further describes viewpoint of the present invention, but non-to limit anyways category of the present invention.
First, as shown in Fig. 3, Fig. 4 A, Fig. 4 B and Fig. 4 C, the present invention relates to a kind of circular formula crystal grain method for placing, it comprises following steps:
Step 100: set crystal grain and put district's diagonal; Set a crystal grain and put in the crystal grain setting area 11 of framework 1 and establish a pair of linea angulata M, and to make the catercorner length in crystal grain setting area 11 be L;
Step 110: planning crystal grain is put district; That using crystal grain, the diagonal M of the crystal grain setting area 11 in framework 1 to be set long as the diameter of maximum circular area, put district 111(as shown in 4B figure in the hope of a default circular crystal grain), being that the diameter length of maximum circular area equals circular crystal grain and puts the catercorner length in district 111, is also M and make the diameter length of maximum circular area;
Step 120: set crystal grain and put condition; That setting crystallite dimension and spacing are as the condition of putting, in order to can make crystal grain 2 put in district 111 in default circular crystal grain according to size and the arranged with interval of crystal grain 2;
Step 130: the putting position that calculates crystal grain; In default circular crystal grain setting area 111, mark the putting position 111a of each crystal grain 2 according to size, the pedometer of crystal grain 2;
Step 140: crystal grain is put; Sequentially put in default circular crystal grain and put among district 111 according to the putting position 111a of each crystal grain 2 of calculate by crystal grain 2.
The specific embodiment of a kind of circular formula crystal grain method for placing of the present invention completing by above-mentioned steps, lining up of its crystal grain 2 begins while classifying first row as shown in Figure 5; The arrangement mode of crystal grain 2 is to start equidistant arrangement from circular top first row, in the time that first row crystal grain 2 is arranged end, can start from first row crystal grain 2 tail ends to second row outermost locations to arrange, in the time that second row crystal grain 2 is arranged end, start to arrange to the 3rd row's outermost locations from second row crystal grain 2 front ends again, sequentially be discharged into lower arrangement to fourth, fifth, Liu ﹒ ﹒ ﹒ N, finish until arrange; So, utilize headtotail alignment problem, use and reach timesaving arrangement mode.If while making the diameter length of its circular crystal grain setting area 111 be M, area can be put and be the M of pi/2 in circular crystal grain setting area 111 2, and known rectangle crystal grain setting area length and width are M, and its cornerwise length is √ 2M, and known rectangle crystal grain setting area can be put area and is M 2; Therefore known rectangle crystal grain setting area area and circular crystal grain setting area 111 Area Ratios are about 1:1.3, utilize circular arrangement mode can put more crystal grain quantity compared to rectangular arranged mode in order to do making.Thus, the crystal grain 2 quantity numbers of putting on the crystal grain setting area 11 of formed objects have individual considerable influence for the production capacity of back-end process, for example: if can put 1.3 ten thousand crystal grain 2 in circular arrangement mode on a crystal grain setting area 11; Secondly, if can put 10,000 crystal grain 2 on a formed objects crystal grain setting area 11 in rectangular arranged mode.If when making a crystal grain die bond machine die bond quantity being 180,000 in one day, crystal grain 2 arranges 1 of framework with the crystal grain of circular arrangement mode needs to carry out and manually change sheet program 23 times; Secondly, crystal grain 2 arranges framework with the crystal grain of rectangular arranged mode needs to carry out and manually changes sheet program 30 times; Need 3 minutes if sheet is once manually changed in order execution again, crystal grain 2 can be saved approximately 21 minutes for one day in circular arrangement mode, and approximately can promote 1 ~ 3% production capacity.So, by the disclosed circular formula crystal grain method for placing of the present invention, can arrange in framework 1 and promote the space utilization rate that crystal grain 2 carries in a crystal grain, the benefit that reaches crystal grain 2 production capacities promotes.In addition, described crystal grain setting area 11 has elasticity mucous membrane characteristic; And described crystal grain arranges framework 1 and can be rectangle or circle, these crystal grain 2 are put in crystal grain and are arranged in the crystal grain setting area 11 of framework 1 (as shown in Fig. 4 B and Fig. 4 C) in circular arrangement mode.
Moreover, please also refer to the another embodiment of a kind of circular formula crystal grain method for placing of the present invention shown in Fig. 6, wherein, in described in step 120, the present invention among default circular crystal grain setting area 111, can set crystal grain 2 arrangement open the row that begin; By this, see through the begin setting of row of opening of arranging of crystal grain 2, can make crystal grain 2 open to begin row to be flat limit and arrange, avoid crystal grain arrange framework 1 in end processing procedure (as crystal grain die bond processing procedure) in the time putting, easily there is the situation of the wrong direction of pendulum.Be positioned at circular top if set as shown in Figure 7 the flat edge direction of arrangement of crystal grain 2, and lining up of setting crystal grain 2 begins while classifying the 3rd row as; The arrangement mode of crystal grain 2 is to arrange from circular top the 3rd equidistant arrangement of beginning, in the time that the 3rd row's crystal grain 2 is arranged end, can arrange to the 4th row's outermost locations since the 3rd row's crystal grain 2 tail ends, in the time that the 4th row's crystal grain 2 is arranged end, arrange to the 5th row's outermost locations since the 4th row's crystal grain 2 front ends again, sequentially be discharged into lower arrangement to the 6th, seven, Ba ﹒ ﹒ ﹒ N, finish until arrange; So, crystal grain 2 of the present invention is in circular arrangement mode, can set lining up of crystal grain 2 row that begin according to operator.
Secondly, please also refer to another embodiment of a kind of circular formula crystal grain method for placing of the present invention shown in Fig. 8, wherein, among step 120 is set forth in default circular crystal grain setting area 111, can set the flat edge direction of arrangement of the arrangement of crystal grain 2; By this, see through the setting of the flat edge direction of arrangement arranged of crystal grain 2, definable goes out crystal grain and arranges the directivity of framework 1, avoid crystal grain arrange framework 1 in end processing procedure (as crystal grain die bond processing procedure) in the time putting, easily there is the situation of the wrong direction of pendulum.Be positioned at circular right-handly if set as shown in Figure 9 the flat edge direction of arrangement of crystal grain 2, and set lining up of crystal grain 2 and begin while classifying the third line as; The arrangement mode of crystal grain 2 is to start equidistant arrangement from circular top the third line, in the time that the third line crystal grain 2 is arranged end, can start to arrange to the 4th row's outermost locations from the third line crystal grain 2 tail ends, in the time that fourth line crystal grain 2 is arranged end, start from fourth line crystal grain 2 front ends to fifth line outermost locations again to arrange, sequentially be discharged into lower arrangement to fourth, fifth, Liu ﹒ ﹒ ﹒ N, finish until arrange; So, utilize and set crystal grain 2 of the present invention in circular arrangement mode, can set according to operator the row that begin that line up of the flat edge direction of arrangement of crystal grain 2 and crystal grain 2, use to reach and produce the arrangement of crystal grain 2 and form flat limit, and make the flat limit arrangement of crystal grain 2 there is direction, avoid crystal grain framework 1 to be set in holding processing procedure (as crystal grain die bond processing procedure) in the time putting, the situation of the wrong direction of pendulum easily occurs.
Only, above-listed detailed description is for the illustrating an of possible embodiments of the present invention, and this embodiment is not in order to limit the present invention, and does not allly depart from the equivalence that skill spirit of the present invention does and implement or change, and all should be contained in the scope of the claims of the application.

Claims (6)

1. a circular formula crystal grain method for placing, comprises following steps:
100: set crystal grain and put district's diagonal; Setting a crystal grain puts in the crystal grain setting area of framework and establishes a pair of linea angulata M;
110: planning crystal grain is put district; The diagonal that crystal grain setting area in framework is set using crystal grain is long as the diameter of maximum circular area, puts district in the hope of a default circular crystal grain;
120: set crystal grain and put condition; Size and the spacing of setting crystal grain, in order to can make crystal grain put in district in default circular crystal grain according to crystallite dimension, arranged with interval;
130: the putting position that calculates crystal grain; In default circular crystal grain setting area, mark the putting position of each crystal grain according to crystallite dimension, pedometer;
140: crystal grain is put; Sequentially put in default circular crystal grain and put among district according to the putting position of each crystal grain by crystal grain.
2. circular formula crystal grain method for placing as claimed in claim 1, wherein this crystal grain condition of putting also comprises lining up of the crystal grain row that begin.
3. circular formula crystal grain method for placing as claimed in claim 1 or 2, wherein this crystal grain condition of putting more comprises the flat edge direction of arrangement.
4. circular formula crystal grain method for placing as claimed in claim 3, wherein this crystal grain arranges framework and can be rectangle.
5. circular formula crystal grain method for placing as claimed in claim 3, wherein this crystal grain arranges framework and can be circle.
6. circular formula crystal grain method for placing as claimed in claim 3, wherein this crystal grain setting area has elasticity mucous membrane characteristic.
CN201210432047.6A 2012-11-01 2012-11-01 Circular type crystal grain placement method Pending CN103794517A (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114146955A (en) * 2021-10-15 2022-03-08 佛山市国星半导体技术有限公司 Arrangement method of LED crystal grains and finished square piece
CN114972317A (en) * 2022-06-22 2022-08-30 合肥工业大学 Square crystal grain placement planning method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050005434A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
US20080194059A1 (en) * 2005-05-04 2008-08-14 Haochuan Wang Method and apparatus for creating rfid devices
TW201017807A (en) * 2008-10-17 2010-05-01 Wecon Automation Co Ltd Model-type die sorting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050005434A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
US20080194059A1 (en) * 2005-05-04 2008-08-14 Haochuan Wang Method and apparatus for creating rfid devices
TW201017807A (en) * 2008-10-17 2010-05-01 Wecon Automation Co Ltd Model-type die sorting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114146955A (en) * 2021-10-15 2022-03-08 佛山市国星半导体技术有限公司 Arrangement method of LED crystal grains and finished square piece
CN114146955B (en) * 2021-10-15 2023-11-14 佛山市国星半导体技术有限公司 Arrangement method of LED crystal grains and finished square sheet
CN114972317A (en) * 2022-06-22 2022-08-30 合肥工业大学 Square crystal grain placement planning method
CN114972317B (en) * 2022-06-22 2024-04-05 合肥工业大学 Square grain placement planning method

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Effective date of registration: 20160309

Address after: Taiwan, China Hsinchu Po Pu Pu Pu Road, Lane 99, No. 127

Applicant after: Nine yuan electronic Limited by Share Ltd

Address before: Hsinchu City, Taiwan, China

Applicant before: Wecon Automatic Machinery Co., Ltd.

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Application publication date: 20140514

RJ01 Rejection of invention patent application after publication