CN103782378A - Apparatus and method for controlling temperature of heating element in thermocompression bonding process - Google Patents
Apparatus and method for controlling temperature of heating element in thermocompression bonding process Download PDFInfo
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- CN103782378A CN103782378A CN201280043984.0A CN201280043984A CN103782378A CN 103782378 A CN103782378 A CN 103782378A CN 201280043984 A CN201280043984 A CN 201280043984A CN 103782378 A CN103782378 A CN 103782378A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Abstract
An apparatus and a method for controlling temperature of a heating element of a thermocompression bonding machine in a thermocompression bonding process is disclosed. An input temperature profile is applied to apply heat to the heating element in the thermocompression bonding machine. A controller of the thermocompression bonding machine can be configured to receive a heating element temperature signal corresponding to a temperature of the heating element. A termperature compensation profile can be generated in the controller based on the heating element temperature signal and an input temperature signal corresponding to the input temperature profile. Power input to the heating element can be controlled in the controller based on the temperature compensation profile.
Description
Technical field
The present invention relates to the field that hot press intermediate thin rete connects different materials.The invention particularly relates to the apparatus and method of controlling the temperature of heating element for the thermo-compressed technique at bonded substrate.
Background technology
Thermocompression bonder and thermo-compressed technique are generally used for manufacturing consumer electronics, comprise mobile phone, notebook, touch pad (touchpad), electronic tool, display module, touch-screen (touch panel), liquid crystal display (LCD) panel etc.
Conventional thermocompression bonder has heating element (being often called thermode), and for applying heat and pressure to solidify the knitting layer in the middle of two substrates, thereby bonded substrate is to form board unit.Substrate can comprise polarizing coating material, membrane material, printed circuit board material, glass material or be suitable for any material of the requirement that meets thermo-compressed technique.The knitting layer material using in hot press can comprise scolder, anisotropic conductive film (ACF) or be suitable for any adhesive film of interconnect substrates.
In order to realize and obtain optimum engagement between substrate, general recommendation, the target closing line temperature curve of specifying based on grafting material supplier for solidifying the temperature curve (temperature profile) (being often called " closing line temperature curve ") of knitting layer.But, because there is thermal loss in thermo-compressed technique, so this is often difficult to realize in practice.Such thermal loss may be due to, for example, knitting layer is or/and the thermal loss in the thermal resistance of substrate to be joined and the each several part of thermocompression bonder.Thermal loss in joint technology causes knitting layer to solidify with the closing line temperature curve of specifying, and this may cause defects such as the bonding strength deficiency that engages space or engage.
At present, before the new product (such as flexible glass carried base board assembly) that has a knitting layer material of closing line temperature curve in use is reached the standard grade and produced, be necessary to be identified for heating the input temp curve of the thermode in thermocompression bonder.
For determining input temp curve, user usually needs the actual temperature (" closing line temperature ") of the closing line of measuring board unit to be joined.
In order to compensate above-mentioned thermal loss, operating personnel must adjust the input temp curve to thermode to be applied.But, because depend on operating personnel's experience, thus be difficult to determine should be how many to the adjustment of input temp curve.Fig. 1 illustrates the method 21 for determined input temp curve by operating personnel.With reference to Fig. 1, engage in the test for the first time for determining thermode temperature, thermocouple is fixed in closing line, as step 22, and use the input temp curve of the appointment closing line temperature curve (" target temperature curve ") based on treat the knitting layer using in the production of board unit to carry out heat hot electrode, as step 23.Conventionally, testing in joint for the first time, the closing line temperature curve measuring in closing line as step 24 due to above-mentioned thermal loss lower than specifying closing line temperature curve.Like this, in step 25, if the closing line temperature curve measuring is not equal to target temperature curve, user must adjust input temp curve and in step 23, apply the input temp curve after adjustment in step 26.For realize target closing line temperature curve, carry out temperature survey at closing line place and input temp curve is adjusted until at closing line place realize target temperature curve.
Depend on operating personnel's experience, can determine the thermode temperature curve using in production in step 27 before, general operation personnel must implement series of experiments joint conventionally.
But the shortcoming of said method 21 is seriously to rely on user's attentiveness and user's decision-making.User's decision-making may be subject to the impact of several factors, such as user training, experience and product know-how.In addition, the dependence of user being significantly associated with these methods significantly increases time cost conventionally.In large batch of production and manufacturing environment, time cost has a strong impact on product yield.
Summary of the invention
According to the first scheme of the present invention, provide a kind of temperature of the heating element in thermocompression bonder of controlling with the method for the thermal loss in compensation thermo-compressed technique, described thermo-compressed technique comprises input temp curve is applied to heating element heat is applied to board unit to be joined, and described method comprises:
A) in controller, receive the temp of heating element signal corresponding to the temperature of described heating element;
B) in described controller, produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
C) control to the power input of described heating element based on described temperature compensation curve;
The target temperature curve of the closing line of wherein said input temp curve based in described board unit.
The step of described generation temperature compensation curve can comprise:
For a series of time points, in described controller, apply First Series closing line temperature gap;
At a series of time points place, calculate a series of temp of heating element differences by a series of temp of heating element values of the temperature data corresponding to described heating element with corresponding to a series of input temp values of described input temp curve;
At a series of time points place, derive series of temperature offset based on described a series of temp of heating element differences and described First Series closing line temperature gap.
The step of the described power of described control input can comprise: more described temperature compensation curve and for heat being applied to predetermined a series of set value of the power of described heating element; A set value of the power based on from described predetermined a series of set value of the power produces temperature-compensating power signal.
According to alternative plan of the present invention, a kind of program is provided, be coded in computer readable recording medium storing program for performing, make computer carry out described method.
According to third party's case of the present invention, a kind of computer readable recording medium storing program for performing is provided, wherein make computer carry out the program of described method with computer-reader form record.
The step of described application First Series closing line temperature gap can comprise:
A), at a series of time points place, in described thermocompression bonder, measure a series of closing line temperature values corresponding to the temperature in the closing line of described board unit;
B), at a series of time points place, calculate a series of closing line temperature gaps by described a series of closing line temperature values and described a series of input temp value, to produce closing line temperature difference curve in the described controller of described thermocompression bonder;
C) by described closing line temperature difference profile memory in memory devices.
Described memory devices can be the memory in described controller.
Described method can also comprise: in described controller, receive the closing line temperature signal corresponding to the closing line temperature of described closing line; More described closing line temperature signal and described input temp signal in described controller; Based on the comparison at closing line temperature signal described in described controller and described input temp signal, compensate described First Series closing line temperature gap; And in described controller, derive second series through compensation closing line temperature gap.
The step of the described First Series closing line of described compensation temperature gap can comprise: multiplicative gain is applied to described First Series closing line temperature gap.
According to cubic case of the present invention, a kind of thermocompression bonder is provided, for compensating the thermal loss of thermo-compressed technique, comprise input temp curve is applied to heating element heat is applied to board unit to be joined, jointing machine comprises:
The first input interface, for receiving the temp of heating element curve of described heating element;
The second input interface, for receiving the closing line temperature curve of described board unit to be joined;
Controller, is configured to:
A) receive the temp of heating element signal corresponding to the described temp of heating element curve of described heating element;
B) produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
C) control to the power input of described heating element based on described temperature compensation curve.
Described memory can be the memory in described controller.
Described jointing machine can also comprise: be suitable for making described controller can on recording medium, record the input interface of described temperature difference curve
Described jointing machine can also comprise: the first amplifier, is connected to the first analog to digital converter, for converting one of described temp of heating element curve and closing line temperature curve to digital signal; And
The second amplifier, is connected to the second analog to digital converter, for converting one of temp of heating element curve and closing line temperature curve to digital signal.
According to the 5th scheme of the present invention, provide a kind of device, for controlling the temperature of heating element of thermocompression bonder, to compensate the thermal loss in thermo-compressed technique, comprise input temp curve is applied to thermode heat is applied to the board unit with closing line, described device has:
Processor; And
Memory; Described device is configured to, and under the control of described processor, carry out and be stored in instruction in described memory, for a series of time points:
A) in controller, receive the temp of heating element signal corresponding to the temperature of described heating element;
B) in described controller, produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
C) control to the power input of described heating element based on described temperature compensation curve.
Described device can be configured to a series of input temp values of storage corresponding to the temperature of the described heating element at a series of time points place.
Described device can be configured to:
A), for a series of time points, in described controller, receive First Series closing line temperature gap;
B), at a series of time points place, calculate a series of temp of heating element differences by a series of temp of heating element values of the temperature data corresponding to described heating element with corresponding to a series of input temp values of described input temp curve;
C), at a series of time points place, derive series of temperature offset based on described a series of temp of heating element differences and described First Series closing line temperature gap.
Described device can be configured to:
A) receive the closing line temperature signal corresponding to the closing line temperature of described closing line;
B) more described closing line temperature signal and described input temp signal;
C) comparison based on described closing line temperature signal and described input temp signal, compensates described First Series closing line temperature gap; And
D) derive the closing line temperature gap of second series through compensation.
Described device can be configured to: multiplicative gain is applied to described First Series closing line temperature gap, to obtain the closing line temperature gap of described second series through compensation.
Described device can be configured to:
More described temperature compensation curve and for heat being applied to predetermined a series of set value of the power of described heating element; And
A set value of the power based on from described predetermined a series of set value of the power produces temperature-compensating power signal.
An advantage that produces temperature compensation curve in controller is, in thermo-compressed technique, can in thermocompression bonder, carry out synchronously temperature control.
An advantage based on the input of temperature compensation curve power ratio control is, can be that automatic and less dependence operating personnel are about knowledge how to adjust the input temp to heating element to be applied for compensating the method for thermal loss.
Another advantage of power ratio control input is, can control and compensate based on temperature-compensating power signal the temperature of heating element.
Accompanying drawing explanation
To by way of example and describe various embodiment of the present invention with reference to the accompanying drawings now, in accompanying drawing:
Fig. 1 is the flow chart of the known method of the input temp curve for determining the heating element to thermocompression bonder to be applied;
Fig. 2 is according to the isometrical drawing of the thermocompression bonder of embodiment (isometric view);
Fig. 3 is the schematic block diagram of parts in thermocompression bonder;
Fig. 4 is the schematic block diagram of the controller of thermocompression bonder;
Fig. 5 is the schematic block diagram that thermocompression bonder arranges;
Fig. 6 is the schematic block diagram arranging for the thermocompression bonder of thermo-compressed technique;
Fig. 7 is the flow chart of the method for determining temperature difference curve;
Fig. 8 is temperature for the controlling heating element flow chart with the method for the thermal loss of compensation thermo-compressed technique;
Fig. 9 is temperature for the controlling heating element flow chart with the method for the thermal loss of compensation thermo-compressed technique;
Figure 10 A is the flow chart for the method for definite closing line temperature difference curve through compensation according to embodiment;
Figure 10 B is the flow chart of the method for determining the closing line temperature difference curve through compensating; And
Figure 11 is the flow chart of the method for the power input for control to heating element based on temperature compensation curve.
Embodiment
Fig. 2 be can be in thermo-compressed technique for the manufacture of the isometrical drawing of the thermocompression bonder 30 of the products such as the assembly that carries flexible circuit such as touch-screen display, glass assembly or formed by different baseplate materials.In Fig. 2, the heating element 33(that is used for the heat that applies bonded substrate assembly in assembling is commonly referred to thermode) before, thermocompression bonder 30 has thermode assembly 31.Thermocompression bonder 30 has for the platform 14 at joint technology supporting substrate assembly.Jointing machine 30 also comprises the input unit 32 for receiving input temp curve.Input unit 32 can be for example touch-screen display or can comprise the pointing apparatus (pointing device) for receive input from operating personnel.Thermocompression bonder 30 can have for receiving corresponding to the first input interface of thermometric the first temperature input of closing line and for receiving the second input interface corresponding to thermometric the second temperature input of thermode.Based on thermode temperature survey, thermocompression bonder has controller 35, and controller 35 can be implemented temperature-compensating and the power input to heating element 33 based on function of temperature compensation control, thereby in the closing line of board unit, obtains target closing line temperature.To in Fig. 3 and Fig. 4, describe heating element 33 and controller 35 in detail.
The first and second input interfaces of thermocompression bonder 30 can be maybe to comprise socket plug, temperature card reading connector etc., and it is configured such that controller 35 can be by receiving measured temperature such as the thermocouple equitemperature measuring equipment that is connected to temperature measuring set.In one embodiment, thermocompression bonder can also be configured to comprise and can detect and the 3rd input interface of reception program from the storage medium of such as flash memory device, hard disk drive, CD drive etc.The data wire of the outer computer that in addition, controller 35 can be by can be connected to executive program carrys out the fetch program.The first and second input interfaces can be the connectors that is suitable for receiving thermocouple input etc.
Fig. 3 is the schematic block diagram of parts relevant to the temperature control of heating element 33 in thermocompression bonder 30.Controller 35 is configured to receive input temp curve 45 by input equipment 32 from user or operating personnel.Controller 35 by transmitted signal 41 with communicate by letter such as the unit (firing unit) 34 of firing of firing mechanism, control the operating state of heating element 33 and/or control the temperature of heating element 33.Be understandable that, can will be operatively coupled between controller 35 and heating element 33 such as a series of driver parts of servo motor, so that mobile or location heating element 33.
In addition, thermocompression bonder 30 can comprise be connected to the first analog to digital converter 50(ADC50) the first amplifier 49(AMP49) and be connected to the second analog to digital converter 52(ADC52) the second amplifier 51(AMP51).AMP49 can amplify the first temperature input 43 receiving by the first input interface, and ADC50 can be converted to digital signal 53 by the temperature input 43 through amplifying, and digital signal 53 is sent to controller 35 via input 40.For example, if the first temperature input 43 is a series of closing line measured temperatures at a series of time points place, each temperature value can be converted into signal 53, and signal 53 can be regarded as closing line temperature curve.Similarly, the second temperature input 44 can be to be at a series of time points the series of temperature measured value measuring on heating element 33.AMP51 can amplify the second temperature input 44, to obtain the temperature input 44 through amplifying, the temperature input 44 through amplifying is sent to the second analog to digital converter 52(ADC52).The 2nd ADC52 converts the temperature input 44 through amplifying to digital signal 54, and digital signal 54 can be sent to controller 35 via input 39.Digital signal 54 can be regarded as temp of heating element curve.Controller 35 can be configured to processing digital signal 53 and 54 and control or be adjusted to the power input signal 41 of firing unit 34.Based on the power input signal 41 that carrys out self-controller 35, fire unit 34 and apply and fire signal 42 with heat hot electrode 33, thereby in closing line, obtain needed temperature.
With reference to Fig. 4, controller 35 can comprise processor 55, and processor 55 is configured to process the signal corresponding to closing line temperature curve and temp of heating element curve.For a series of time points, processor 55 can be configured to: storage is corresponding to a series of input temp values of the temperature at this serial time point place heating element; Storage is corresponding to the sensing temperature value of respective series that is in the temperature that closing line place senses at this serial time point; Calculate the series of temperature difference between described a series of input temp value and described a series of sensing temperature value; And derive the temperature curve through compensation from described series of temperature difference.
Fig. 5 is that the thermocompression bonder based on hot press in Fig. 2 30 arranges 60 schematic block diagram.Before starting to produce board unit in thermo-compressed technique, arrange 60 for determining the closing line temperature difference curve of board unit 66 to be joined.Board unit 66 can be made up of inter-engagement layer, flexible circuit board 67 and glass substrate 68.Alternately, board unit 66 can be made up of flexible circuit board 67 and printed circuit board base board 68.In arranging 60, do not comprise inter-engagement layer.The input temp curve of the appointment closing line temperature curve (" target temperature curve ") based on knitting layer can be applied to heating element 33.Input temp curve 61 is provided by operating personnel, and can be programmed or be stored in the memory of controller 35.
D (x)=T
tBL– T
mBL(equation 1)
Wherein, D (x) is the temperature difference curve of a series of time points place corresponding to series of temperature difference, T
tBLa series of target closing line temperature values at a series of time points place, and T
mBLa series of closing line temperature values that measure at a series of time points place.Described a series of target closing line temperature value can form target closing line temperature curve, and input temp curve 61 can based target closing line temperature.In following table, table 1 illustrates the example from the 60 series of temperature differences that obtain are set.
Table 1
In curve below, curve 1 is the example of the temperature profile of the value relative time based in table 1, and the closing line temperature measuring and the target closing line temperature at a series of time points place is shown.
Curve 1
Temperature difference curve D (x) can be stored in the memory or memory devices of controller 35.It should be understood that D(x) depend on knitting layer and form the substrate of board unit.Therefore, D(x) equation (equation 1) can be equally applicable to different baseplate materials and different knitting layer materials.
By the poor curve of board unit accounting temperature based on to be joined, can think that the technique of Fig. 7 can make thermocompression bonder 30 board unit configuration and the automatic closing line of material Rapid Implementation based on different to compensate.Measure the advantage of closing line temperature in thermocompression bonder and be, temperature survey process can be synchronizeed with thermocompression bonder.Synchronous advantage is in single setting, to determine temperature difference curve D (x), and without external temperature measuring instrument.In addition, closing line temperature difference curve can be stored in the memory of memory devices or controller 35.In a kind of situation, operating personnel can set the time point quantity of operation thermo-compressed setting up procedure to determine that the closing line temperature difference Curves of board unit needs.For example, the input unit of thermocompression bonder can be configured to allow operating personnel to input the time point quantity of operation thermo-compressed setting up procedure.
Fig. 6 is for 80 schematic block diagram being set at the thermocompression bonder of heat pressing process bonded substrate assembly 70.Board unit 70 is made up of inter-engagement layer 71, flexible circuit board 72 and glass substrate 73.In the thermo-compressed technique of board unit 70, thermocouple 84 is installed to heating element or thermode 33, to measure a series of temp of heating element values at a series of time points place, and the temp of heating element curve that its formation measures.Thermocouple 84 can be positioned at the center of heating element 33, and the temperature of heating element can be consistent.Controller 35 can be configured to be received in via the second input interface 40 a series of temp of heating element values of the heating element of measuring on a series of time points.In controller 35, can produce temperature compensation curve based on temp of heating element curve and according to equation (equation 2).
A=T
tBL– T
mT+ D (x) (equation 2)
Wherein, for a series of time points, A is the series of temperature offset at described a series of time points place, T
tBLa series of target closing line temperature values at described a series of time points place, and T
mTa series of temp of heating element values that measure at described a series of time points place.T
tBLcan be used as input temp curve and be input to controller by user.In following table, table 2 illustrates to depend on and arranges 80 and the example of the series of temperature offset that obtains based on equation 2.
Table 2
Based on the temperature compensation curve producing according to equation 2, controller 35 can be configured to control to the power input of heating element subsequently, for compensating the temperature curve of closing line.In one embodiment, each condition A fires the power input that power setting that unit is relevant and duration set and is associated to relating to.Duration setting can be weighed take millisecond as unit, and power setting can be weighed with volt or wattage.Particularly, shown in table 3, input and be applied to the question blank of the series of temperature compensated curve condition formation of the power lasting (time) of heating element by the power that corresponds to heating element.Can in controller, derive and storing temperature compensated curve condition.
Table 3
By value and the input of a series of power of the temperature compensation curve A that lists in comparison sheet 3, the power input that controller 35 can control to heating element is to increase the temperature of heating element according to power and duration or to make the temperature oblique line of heating element rise (ramp).Power and duration are larger, mean that the rate of rise of temperature of heating element is larger.It should be understood that the quality of joint can also depend on the thermal coefficient of expansion of material.In a kind of situation, in applicable equations 2, with after deriving temperature compensation value and applying the power input based on temperature compensation value, the closing line temperature measuring can equal target closing line temperature, that is, and and as listed below condition.
T
mBL=T
tBL(condition 1)
But, for can change at boundary condition such as for the heat transfer in the transient state system of thermo-compressed technique, the thermal loss in thermo-compressed technique is not linear.For example, when the temperature of heating element is higher, thermal loss is larger, and it causes the closing line temperature measuring to be less than target closing line temperature, as cooks noodle as shown in part:
T
mBL<T
tBL(condition 2)
In the situation that above-mentioned condition 2 exists, can realize the function of recovering damage with higher temperature.In one embodiment, can be by applying multiplicative gain G to D(x) (, in the case, D'(x)=G × D (x)) on revise D(x) to obtain the D'(x through compensation), thereby compensate thermal loss according to equation (equation 3).
A'=T
tBL– T
mT+ G × D (x) (equation 3)
Wherein A' is temperature compensation curve, and G is multiplicative gain.
Can obtain G based on iterative method, on thermocompression bonder, test and engage test.In order to optimize the closing line temperature in thermo-compressed technique, preferred condition is as follows:
G=1.2 (condition 3)
In addition, in one embodiment, can be by the 60 adjustment T that arrange based in Fig. 5
tBLrevise D(x with the process that repeats definite closing line temperature difference curve) to obtain the D'(x through compensation).
Fig. 7 be implemented by the controller 35 of Fig. 4 C for being defined as the flow chart of method 90 of the temperature difference curve that compensates thermal loss.With reference to the thermocompression bonder setting of Fig. 5, the flow process for determining temperature difference curve is described.In the time target temperature curve being applied to heating element 33 in step 91, can in step 92, measure the temperature of closing line temperature and by described thermograph in the memory of controller 35.In step 93, can carry out the poor curve of accounting temperature by controller 35 based target temperature curves and the closing line temperature curve measuring.In step 94, temperature difference curve can be stored in memory devices.Described memory devices can be memory in controller 35 or the recordable media such as flash card.
Fig. 8 is the flow chart of the method 100 of the thermal loss for compensating thermo-compressed technique.In step 101, target temperature curve is applied to heating element 33.In step 102, can measure the temperature of heating element 33 and by described thermograph in the memory of controller 35.In step 103, can use above-mentioned equation 2 accounting temperature compensated curve A, and in step 104, the power that can control to heating element 33 by controller 35 serviceability temperature compensated curve A is inputted, for compensating thermal loss.In a kind of situation, can measure the closing line temperature of board unit to determine whether closing line temperature equals to realize the desired target closing line of optimum engagement quality temperature in board unit.
Fig. 9 is the flow chart of the other method 200 of the thermal loss for compensating thermo-compressed technique.Step 201,202,203 in the method 200 of Fig. 9 is similar in operation to the step 101,102,103 in the method 100 of Fig. 8.In step 204, the temperature compensation value of controller based in step 203 controls to the power input of sending out heating element 33, and in step 205, measures closing line temperature.In step 206, check measurement to closing line temperature whether satisfy condition 1 be T
mBL=T
tBL.If do not satisfy condition 1, i.e. T corresponding to "No" condition
mBL<T
tBL, in step 208, calculate closing line temperature difference curve D through compensation ' (x), and repeating step 201 and 202 to obtain the second offset A' in step 203.Equation accounting temperature offset A' below basis in step 208:
A'=T
TBL–T
MT+D(x)
Wherein, D(x)=D'(x) corresponding to the compensation closing line temperature difference curve obtaining according to the method 90 in Fig. 7.In the first production line, the value of G is set to 1.But, depending on the closing line temperature measuring, the value of G can adjust to 1.2.Based on temperature compensation value A', can control to the power input of heating element, and when satisfying condition T
mBL=T
tBL, this processing finishes during corresponding to "Yes" condition in step 209.
Figure 10 A be illustrate determine the closing line temperature difference curve D through compensation ' the flow chart of further method 210 (x).In step 211, by the second input temp curve T'(x) be applied to heating element.Calculate T'(x according to following formula):
T'(x)=T
TBL+D(x)
Wherein, D(x) corresponding to the temperature difference curve obtaining according to the method 90 in Fig. 7.Be similar to the step 92 of method 90, in step 212, measure closing line temperature T '
mBLand be recorded in the memory of controller 35.In step 213, can by controller 35 based on the second input temp curve and the closing line temperature curve that measures calculate temperature difference curve D through compensation ' (x).In a kind of situation, method 210 can be for board unit to be joined by flexible circuit board with have in the application forming such as the printed circuit board (PCB) of the conducting metal circuit pattern of copper circuit pattern.
Figure 10 B be illustrate determine the closing line temperature difference curve D through compensation ' the flow chart of other method 215 (x).Be similar to the step 91 of method 90 in Fig. 7, can be by target temperature curve T
tBLbe applied to thermode.Be similar to the step 92 of method 90, in step 217, measure closing line temperature T
mBLand be recorded in the memory of controller 35.In step 218, can by controller 35 according to following formula calculate through compensation temperature difference curve D ' (x):
D'(x)=G×(T
TBL–T
MBL)
Wherein G is the multiplicative gain of deriving based on hot press.In the first production line, the value of G is set to 1.But, depending on the closing line temperature measuring, the value of G can adjust to 1.2.Based on temperature compensation value A', can control to the power input of heating element, and when satisfying condition T
mBL=T
tBL, during corresponding to "Yes" condition in step 209, this processing finishes.In a kind of situation, in the application that method 215 can be made up of flexible circuit board and glass substrate for board unit to be joined.
Figure 11 illustrates the flow chart that controls to the processing 400 of the power input of heating element for the temperature compensation value A based on Fig. 8 and Fig. 9 step 104 or A'.In the time the control of the power input to heating element 33 being started in step 401, a series of predetermined power input settings of C.T offset A or A' and the condition corresponding to a series of A or A' in step 402.For example, power input is set and can be comprised the power setting of firing circuit (weighing with voltage) and the duration setting of firing in unit 34, and the condition of A or A' can be set and be associated with predetermined power.For example, with reference to table 3, if the value of A or A' is less than 0.1, power setting is 1, and the duration is set as 1, and like this, the condition based on A in step 403 selects one group of predetermined power input to set.It can be to set the time of weighing take millisecond as unit that duration is set.Therefore,, in step 404, set power is applied to thermode 33 so that heat is applied to board unit based on selected power input.
The advantage of said temperature compensation method is, the hot press of the product that can be each type based on identical board unit is implemented disposable setting.It should be understood that in order heating element to be heated to required temperature with the thermal loss in compensation closing line, can correspondingly configure and fire unit or fire circuit.For example, the quantity of the point in temperature curve can change, and such as temperature, near design temperature time, the duration of firing is less.When the duration hour, the frequency of firing may be more.Like this, the quantity of the point in whole temperature curve has changed.It should be understood that said method can fire unit for standard known to the skilled in thermo-compressed field.For example, fire unit and can comprise and be operationally connected to large electric current or the high voltage installation of firing relay circuit, for by controller control high-current equipment.Fire relay circuit and can comprise the equipment for switching high-current equipment, such as power relay switch, semiconductor switch etc.High-current equipment can be the heater storehouse (heater cartridge) of different wattages (watt level), or can be for make closing line temperature approach the transformer (having different transformation ratios (rating)) of target closing line temperature based on temperature compensation curve.The temperature-compensating cycle that can the each new board unit of rapid Optimum.
Be according to the advantage of the said method of embodiment because operating personnel do not need to adjust input temp with the thermal loss in the closing line of board unit in compensation thermo-compressed technique, for the less technical ability that depends on operating personnel of temperature-compensating of joint technology.
Although specifically illustrate and described embodiments of the invention with reference to specific embodiment, but it will be understood by those skilled in the art that and can make the various changes in form or in details and not depart from the spirit and scope of the present invention that limited by appended claims it.Scope of the present invention thereby indicated by appending claims, and the institute that intention contains in meaning and the scope of the equivalent that enters claim changes.
Claims (21)
1. control the method for the temperature of the heating element in thermocompression bonder for one kind, in order to compensate the thermal loss in thermo-compressed technique, described thermo-compressed technique comprises input temp curve is applied to described heating element heat is applied to board unit to be joined, and described method comprises:
A) in controller, receive the temp of heating element signal corresponding to the temperature of described heating element;
B) in described controller, produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
C) control the power input to described heating element based on described temperature compensation curve;
Wherein said input temp curve is the target temperature curve of closing line based in described board unit.
2. method according to claim 1, wherein produces described temperature compensation curve and comprises:
For a series of time points, in described controller, apply First Series closing line temperature gap;
At a series of time points place, calculate a series of temp of heating element differences by a series of temp of heating element values of the temperature data corresponding to described heating element with corresponding to a series of input temp values of described input temp curve;
At a series of time points place, derive series of temperature offset based on described a series of temp of heating element differences and described First Series closing line temperature gap.
3. method according to claim 1 and 2, wherein control described power input and comprise:
More described temperature compensation curve and for heat being applied to predetermined a series of set value of the power of described heating element;
A set value of the power based on from described predetermined a series of set value of the power produces temperature-compensating power signal.
4. a program, is coded in computer readable recording medium storing program for performing, and computer is carried out according to the method described in any one in claim 1 to 4.
5. a computer readable recording medium storing program for performing, wherein carries out according to the program of the method described in any one in claim 1 to 4 computer with computer-reader form record.
6. method according to claim 2, wherein apply described First Series closing line temperature gap and comprise:
A), at a series of time points place, in described thermocompression bonder, measure a series of closing line temperature values corresponding to the temperature in the closing line of described board unit;
B), at a series of time points place, calculate a series of closing line temperature gaps by described a series of closing line temperature values and described a series of input temp value, to produce closing line temperature difference curve in the described controller of described thermocompression bonder;
C) by described closing line temperature difference profile memory in memory devices.
7. according to method in any one of the preceding claims wherein, wherein said memory devices is the memory in described controller.
8. according to method in any one of the preceding claims wherein, described method also comprises:
In described controller, receive the closing line temperature signal corresponding to the closing line temperature of described closing line;
More described closing line temperature signal and described input temp signal in described controller;
Based on the comparison at closing line temperature signal described in described controller and described input temp signal, compensate described First Series closing line temperature gap; And
In described controller, derive the closing line temperature gap of second series through compensation.
9. according to method in any one of the preceding claims wherein, wherein compensate described First Series closing line temperature gap and comprise:
Multiplicative gain is applied to described First Series closing line temperature gap.
10. a thermo-compressed technique, for joining glass substrate to flexible circuit board, comprises the step according to method in any one of the preceding claims wherein.
11. 1 kinds of thermocompression bonders, for compensating the thermal loss of thermo-compressed technique, described thermo-compressed technique comprises input temp curve is applied to heating element heat is applied to board unit to be joined, described jointing machine comprises:
The first input interface, for receiving the temp of heating element curve of described heating element;
The second input interface, for receiving the closing line temperature curve of described board unit to be joined;
Controller, is configured to:
D) receive the temp of heating element signal corresponding to the described temp of heating element curve of described heating element;
E) produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
F) control the power input to described heating element based on described temperature compensation curve.
12. jointing machines according to claim 11, also comprise:
The first amplifier, is connected to the first analog to digital converter, for converting one of described temp of heating element curve and closing line temperature curve to digital signal; And
The second amplifier, is connected to the second analog to digital converter, for converting one of described temp of heating element curve and closing line temperature curve to digital signal.
13. according to claim 11 to the jointing machine described in any one in 12, and wherein said controller is configured to:
Based on one of described closing line temperature curve and described temp of heating element curve and described input temp curve calculation series of temperature difference, to obtain temperature difference curve;
Based on described series of temperature difference accounting temperature compensated curve; And
Control the power input to described heating element based on described temperature compensation curve.
14. according to claim 11 to the jointing machine described in any one in 13, and wherein said controller has memory, one of following for storing: described input temp curve, described temp of heating element curve or described closing line temperature curve.
15. jointing machines according to claim 13, also comprise input interface, are suitable for making described controller can on recording medium, record described temperature difference curve.
16. 1 kinds of devices, be used for the temperature of the heating element of controlling thermocompression bonder, with the thermal loss in compensation thermo-compressed technique, described thermo-compressed technique comprises input temp curve is applied to thermode heat is applied to the board unit with closing line, and described device has:
Processor; And
Memory;
Described device is configured under the control of described processor, and carry out and be stored in instruction in described memory, for a series of time points:
D) in controller, receive the temp of heating element signal corresponding to the temperature of described heating element;
E) in described controller, produce temperature compensation curve based on described temp of heating element signal with corresponding to the input temp signal of described input temp curve; And
F) control the power input to described heating element based on described temperature compensation curve.
17. devices according to claim 16, wherein said device is configured to a series of input temp values of storage corresponding to the temperature of the described heating element at described a series of time points place.
18. according to the device described in claim 16 or 17, and wherein said device is configured to:
A), for a series of time points, in described controller, receive First Series closing line temperature gap;
B), at a series of time points place, calculate a series of temp of heating element differences by a series of temp of heating element values of the temperature data corresponding to described heating element with corresponding to a series of input temp values of described input temp curve;
C), at a series of time points place, derive series of temperature offset based on described a series of temp of heating element differences and described First Series closing line temperature gap.
19. devices according to claim 18, wherein said device is configured to:
A) receive the closing line temperature signal corresponding to the closing line temperature of described closing line;
B) more described closing line temperature signal and described input temp signal;
C) comparison based on described closing line temperature signal and described input temp signal, compensates described First Series closing line temperature gap; And
D) derive the closing line temperature gap of second series through compensation.
20. devices according to claim 19, wherein said device is configured to:
Multiplicative gain is applied to described First Series closing line temperature gap, to obtain the closing line temperature gap of described second series through compensation.
21. according to claim 16 to the device described in any one in 20, and wherein said device is configured to:
More described temperature compensation curve and for heat being applied to predetermined a series of set value of the power of described heating element; And
A set value of the power based on from described predetermined a series of set value of the power produces temperature-compensating power signal.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG201106514-1 | 2011-09-09 | ||
| SG2011065141A SG188677A1 (en) | 2011-09-09 | 2011-09-09 | An apparatus and a method for controlling temperature of a heating element in a thermocompression bonding process |
| PCT/SG2012/000326 WO2013036206A1 (en) | 2011-09-09 | 2012-09-07 | An apparatus and a method for controlling temperature of a heating element in a thermocompression bonding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103782378A true CN103782378A (en) | 2014-05-07 |
Family
ID=47832452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043984.0A Pending CN103782378A (en) | 2011-09-09 | 2012-09-07 | Apparatus and method for controlling temperature of heating element in thermocompression bonding process |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR20140091673A (en) |
| CN (1) | CN103782378A (en) |
| SG (1) | SG188677A1 (en) |
| TW (1) | TW201325862A (en) |
| WO (1) | WO2013036206A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863584A (en) * | 2016-06-15 | 2019-06-07 | 沃特洛电气制造公司 | Power converter for hot systems |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117112981B (en) * | 2023-10-23 | 2024-01-09 | 北京华力兴科技发展有限责任公司 | Optimal acquisition method for steel plate thickness measurement data |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121544A (en) * | 1997-10-15 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Thermal pressure bonding of work |
| JPH11121508A (en) * | 1997-10-09 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Thermocompression bonder for work and thermocompression bonding for the work |
| JPH11121146A (en) * | 1997-10-09 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Heater temperature control device and heater temperature control method in work thermo-compression bonding device |
| JPH11119841A (en) * | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Device and method for thermocompression bonding of works |
| US20040188023A1 (en) * | 2003-03-27 | 2004-09-30 | Naotaka Sasaki | Double-side lamination system |
| CN102009498A (en) * | 2010-11-01 | 2011-04-13 | 杭州珂瑞特机械制造有限公司 | Insert block type thermal compression welding device and thermal compression welding method |
-
2011
- 2011-09-09 SG SG2011065141A patent/SG188677A1/en unknown
-
2012
- 2012-09-07 TW TW101132700A patent/TW201325862A/en unknown
- 2012-09-07 KR KR1020147009314A patent/KR20140091673A/en not_active Application Discontinuation
- 2012-09-07 CN CN201280043984.0A patent/CN103782378A/en active Pending
- 2012-09-07 WO PCT/SG2012/000326 patent/WO2013036206A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11121508A (en) * | 1997-10-09 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Thermocompression bonder for work and thermocompression bonding for the work |
| JPH11121146A (en) * | 1997-10-09 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Heater temperature control device and heater temperature control method in work thermo-compression bonding device |
| JPH11119841A (en) * | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Device and method for thermocompression bonding of works |
| JPH11121544A (en) * | 1997-10-15 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Thermal pressure bonding of work |
| US20040188023A1 (en) * | 2003-03-27 | 2004-09-30 | Naotaka Sasaki | Double-side lamination system |
| CN102009498A (en) * | 2010-11-01 | 2011-04-13 | 杭州珂瑞特机械制造有限公司 | Insert block type thermal compression welding device and thermal compression welding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863584A (en) * | 2016-06-15 | 2019-06-07 | 沃特洛电气制造公司 | Power converter for hot systems |
| CN109863584B (en) * | 2016-06-15 | 2023-05-26 | 沃特洛电气制造公司 | Power converter for thermal system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201325862A (en) | 2013-07-01 |
| SG188677A1 (en) | 2013-04-30 |
| WO2013036206A1 (en) | 2013-03-14 |
| KR20140091673A (en) | 2014-07-22 |
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Application publication date: 20140507 |