CN103781593B

CN103781593B - The method repolishing vinyl compositions ceramic tile

Info

Publication number: CN103781593B
Application number: CN201280043598.1A
Authority: CN
Inventors: 唐纳德·T·兰丁; 詹姆士·L·麦卡德尔
Original assignee: 3M Innovative Properties Co
Current assignee: 3M Innovative Properties Co
Priority date: 2011-09-12
Filing date: 2012-08-28
Publication date: 2017-03-01
Anticipated expiration: 2032-08-28
Also published as: CN103781593A; BR112014005560A2; WO2013039688A1; JP2014528845A; JP2017170613A; CA2848294A1; KR20140075712A; MX2014002837A; EP2755799A1; US20130065490A1

Abstract

The invention discloses a kind of method repolishing vinyl compositions tile floor, methods described order includes the exposed surface using a series of structured abrasive component (100) the wet lapping vinyl compositions tile floors being fixed to Mechanical Driven pad (210), and a series of wherein said structured abrasive components (100) have the grit size of reduction.Described structured abrasive component (100) includes being fixed to the forming lapping composite (140) of conformal backing (120), and wherein said forming lapping composite (140) includes the abrasive particle (145) being scattered in polymeric binder (148).Methods described may include the preceding grinding steps using strength nonwoven abrasive article.Methods described may include administration polymeric finishes after milling.

Description

The method repolishing vinyl compositions ceramic tile

Technical field

The method that the present invention relates broadly to safeguard for vinyl compositions ceramic tile and repair.

Background technology

Vinyl compositions ceramic tile is widely used as business and public organizations' environment（Such as grocery store and other retails Shop, school, hospital, light industry application（Such as laboratory）And restaurant）In floor.

There are two kinds of vinyl tiles.First vinyl asbestos ceramic tile is equivalent to Colophonium ceramic tile, except for the difference that second Thiazolinyl type of resin and non-bituminous or other resins are binding agent.For Colophonium tile floor, filled out using asbestos, pigment and inertia Material.

Since about nineteen eighty-two, do not manufacture vinyl asbestos ceramic tile.Remove asbestos, and use other fillers to replace asbestos.This Class floor tile is commonly referred to vinyl compositions ceramic tile（VC ceramic tile）.Its ratio vinyl asbestos ceramic tile more porous, is therefore more difficult to To produce original gloss.Due to there being of a relatively high filer content, these floors only can be obtained with ceramic tile form.VC ceramic tile The recommendation on floor is safeguarded and is usually directed to aqueous polymer emulsions coating and aqueous detergent and remover.

VC ceramic tile generally by with additive（Such as stabilizer and processing aid）The binding agent of mixing, filler and pigment group Become.Binding agent is made up of the polymer of vinyl chloride and/or copolymer, other modified resins and plasticizer.Vinylite is tough Property, chemically inert, thermoplastic and resistance to many solvent.By heat and pressure are applied to the vinyl sheet colouring And be that there is different-thickness by vinyl compositions tile forming（1/8- inch (0.32-cm) is most common）Solid sheet material, and Generally cutting squarely（For example 12- inch (30-cm) is square）.VC ceramic tile can be provided with surface polishing layer, but generally whole at it In individual thickness, outward appearance is substantially uniform.

The maintenance of the VC tile floor installed be usually directed to the several coatings coating of transparent polymer floor finish with Obtain gratifying glossiness, afterwards frequently（For example daily）Dedusting is simultaneously polished, and less frequently cleans, and frequently divest and It is coated with floor finish, to safeguard its outward appearance.

Content of the invention

Despite periodic maintenance, but as time go by, VC tile floor（For example there is one or more layers floor thereon apply The VC ceramic tile of decorations agent）It is typically due to the chemistry damage such as dug the physical damage of chisel and can occur because floor divests compositionss Badly lose its outward appearance.Further, since overflow（The overflow of such as iodine preservative）And the spot leading to can also contribute to VC The deterioration of the outward appearance of ceramic tile.In this case, replacing with of floor tile is typically remedied；However, this process be time-consuming and Expensive.

Advantageously, the method according to the invention can postpone to replace the needs of VC ceramic tile（For example reach the several years）, thus save Time, cost simultaneously reduce Environmental waste.

Additionally, in certain embodiments, using the method according to the invention rather than can divest and be coated operating, thus root Confusion and the time repolishing needed for flooring look can be significantly reduced according to the method for the present invention.

On the one hand, the invention provides a kind of method repolishing vinyl compositions tile floor, methods described bag Include sequential steps：

A) vinyl compositions are included using the first structure Grinding structural unit wet lapping being fixed to the first Mechanical Driven pad At least a portion of the exposed surface on the floor of ceramic tile, described first structure Grinding structural unit includes being fixed to the first conformal backing The first forming lapping composite, wherein said first forming lapping composite includes being scattered in first polymer binding agent In the first abrasive particle, wherein said first abrasive particle has the first particle mean size；And

B) using the exposed surface on the second structured abrasive component wet lapping floor being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the second abrasive particle being scattered in second polymer binding agent, wherein Described second abrasive particle has the second particle mean size, and wherein said second particle mean size is less than described first particle mean size；And And

Wherein step a) and b) respective during, the exposed surface on described floor described at least one of average Surface roughness R_aAll reduce.

In certain embodiments, methods described also includes after step b)：

C) using the 3rd structured abrasive component wet lapping being fixed to the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in third polymer binding agent The 3rd abrasive particle, wherein said 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size be less than described Second particle mean size；And

Wherein during step c), the described at least one of average surface roughness of the exposed surface on described floor Degree R_aReduce.

In certain embodiments, methods described is in step b) or step c)（If including）Also including afterwards will be transparent Polymeric finishes apply described at least a portion of the exposed surface to floor.

On the other hand, the invention provides a kind of method repolishing vinyl floor, methods described includes order and walks Suddenly：

A) include the exposed surface on floor of vinyl compositions ceramic tile using nonwoven abrasive component wet lapping at least A part, wherein said nonwoven abrasive component includes non-woven webs, and described non-woven webs have by the first polymerization Thing binding agent is attached to its first abrasive particle, and wherein said first abrasive particle has the first particle mean size；

B) using the exposed surface on first structure Grinding structural unit wet lapping floor being fixed to the first Mechanical Driven pad Described at least a portion, the first forming lapping that described first structure Grinding structural unit includes being fixed to the first conformal backing is combined Material, wherein said first forming lapping composite includes the second abrasive particle being scattered in second polymer binding agent, wherein Described second abrasive particle has the second particle mean size less than described first particle mean size；And

C) using the exposed surface on the second structured abrasive component wet lapping floor being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the 3rd abrasive particle being scattered in third polymer binding agent, wherein Described 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size is less than described second particle mean size；And And

Wherein step b) and c) respective during, the average surface roughness R of the ground exposed surface on floor_a All reduce.

In certain embodiments, methods described also includes after step c)：

D) using the 3rd structured abrasive component wet lapping being fixed to the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in the 4th polymeric binder The 4th abrasive particle, wherein said 4th abrasive particle has the 4th particle mean size, and wherein said 4th particle mean size be less than described 3rd particle mean size；And

Wherein during step d), the described at least one of average surface roughness of the exposed surface on described floor Degree R_aReduce.

In certain embodiments, methods described is in step c) or step d)（If including）Also including afterwards will be transparent Polymeric finishes apply to the ground exposed surface on floor.

The conformal highly irregular part to floor of conventional nonwoven diamond lap car mat, and for making floor table Face flattens not highly effective.By contrast, have for the structured abrasive component in the method according to the invention enough Hardness is so that they can effectively grind away the high speckle on floor, and produces similar new or even better than new outward appearance.

As used herein：

Term " conformal " means to respond the pressure applying and surrenders and/or conformal；

Term " (methyl) acryloyl group " refers to acryloyl group and/or methylacryloyl；

Term " polymer " " and " polymer " refer to organic polymer；

Term " follow-up " means in the time afterwards, its can for immediately or in the time afterwards（For example, at one or After multiple grinding steps between two parties or other processes or event）；And

Term " wet lapping " refers to grind in presence of water, described water optionally containing one or more other component, Such as organic solvent, pH adjusting agent, coloring agent, dyestuff, aromatic, disinfectant and surfactant.

As used herein, surface roughness R_aAnd R_zAs defined in EXAMPLEPART below.

After considering specific embodiment and appended claims, will be further understood that the feature of the present invention and excellent Point.

Brief description

Figure 1A is the schematic side elevation that can be used for implementing an exemplary structured Grinding structural unit 100 of the present invention.

Figure 1B is the zoomed-in view of the region 1B in Figure 1A.

Fig. 1 C is the schematic side elevation that can be used for implementing an exemplary structured Grinding structural unit 105 of the present invention.

Fig. 2 is the knot being fixed to compressible Mechanical Driven pad with resilience that can be used for implementing the method according to the invention The schematic perspective upward view of one exemplary arrangement of structure Grinding structural unit.

Although accompanying drawing indicated above shows some embodiments of the present invention, such as described in discuss, it is also contemplated that Other embodiment.In all cases, the present invention is shown with exemplary and non-limiting way.It should be appreciated that this area Technical staff can be designed that other modification a large amount of and embodiment, these modification and embodiment are also former in the present invention In the scope and spirit of reason.Accompanying drawing may be not necessarily to scale.In all of the figs, same reference numerals can be used to represent Same parts.

Specific embodiment

The method according to the invention is applied to and repolishes vinyl compositions tile floor.Preferably, implementing according to this Before the method for invention, floor to be repolished should be checked, and replace crannied, raised and/or bubble or broken Broken ceramic tile.In certain embodiments, technology can be divested and remove pre-existing floor finish using routine is wet.At some In embodiment, using strength nonwoven abrasive component, the floor finish being for example used in conventional wet strip divests pad, goes Except pre-existing floor finish.Preferably, during repolishing, so that the floor area being related to is isolated and avoid the public to enter Enter.

In one embodiment, according to the method repolishing vinyl floor of the present invention include using be fixed to first can The first structure Grinding structural unit wet lapping compressing Mechanical Driven pad with resilience includes the floor of vinyl compositions ceramic tile Exposed surface, then wet using the second structured abrasive component being fixed to the second compressible Mechanical Driven pad with resilience Grind the exposed surface on floor.In certain embodiments, methods described subsequently also includes compressible having back using being fixed to the 3rd The exposed surface on the 3rd structured abrasive component wet lapping floor of the Mechanical Driven pad of elastic force.

After using one of structured abrasive component wet lapping, the ground part of typical VC tile floor More smooth than before grinding steps（There is less roughness）.Certainly, degree of roughness will depend upon initially thick before grinding Persistent period when rugosity, grinding and the power of applying, the property of Grinding structural unit and grit size.For example, in some embodiments In, using structured abrasive component wet lapping（Such as step a), b) and c)；Or step b), c) and d), depending on embodiment） Afterwards, average surface roughness R_aMay be less than or equal to 120 microinch（3.05 micron）（For example tied using 300- μm of diamond After structure abrasive disk wet lapping）, 95 microinch（2.41 micron）（For example wet using 45- μm of diamond lattic structure abrasive disk After grinding）, 80 microinch（2.03 micron）（For example after using 10- μm of diamond lattic structure abrasive disk wet lapping）As little as 70 microinch（1.78 micron）, 60 microinch（1.52 micron）, 50 microinch（1.27 micron）, 40 microinch（1.02 micron）, 30 microinch（0.76 micron）（For example after using 6- μm of diamond lattic structure abrasive disk wet lapping）, or 20 microinch （0.51 micron）, or even less than 10 microinch（0.25 micron）（For example grinding using 3- μm of diamond lattic structure abrasive disk is wet After mill）.

Similarly, using structured abrasive component wet lapping（Such as step a), b) and c)；Or step b), c) and d), Depending on embodiment）Afterwards, surface roughness R of the ground part of VC tile floor_zMay be less than or equal to 700 microinch （17.8 microns）（For example after using 300- μm of diamond lattic structure abrasive disk wet lapping）, 600 microinch（15.2 microns）（For example after using 45- μm of diamond lattic structure abrasive disk wet lapping）, 525 microinch（13.3 microns）（For example using After 10- μm of diamond lattic structure abrasive disk wet lapping）As little as 500 microinch（12.7 microns）, 430 microinch（10.9 is micro- Rice）, 360 microinch（9.14 micron）, 280 microinch（7.11 micron）, 180 microinch（4.57 micron）（For example using 6- μ After m diamond lattic structure abrasive disk wet lapping）, or 150 microinch（3.81 micron）, or even less than 100 microinch（2.54 Micron）（For example after using 3- μm of diamond lattic structure abrasive disk wet lapping）.

Referring now to Figure 1A, exemplary structured abrasive component 100 includes being arranged at the first surface of conformal backing 120 Structured abrasive layer 110 on 122.Optional attachment interface system 130 is fixed to conformal backing 120 by adhesive phase 135 Second surface 124.Optional attachment interface system 130 also includes the annulus 160 of hook and look fasteners, and hook-shaped interface pad 150, described hook-shaped interface pad 150 has the unci of hook and look fasteners system on opposite sides thereof.

Structured abrasive layer 110 includes multiple forming lapping composites 140, and described forming lapping composite 140 is It is distributed in the composite of the abrasive particle 145 in binding agent 148（For example, see Figure 1B）.Generally, forming lapping composite is firm Property.Forming lapping composite 140, by the one or more boundary separates related to the shape of forming lapping composite, makes Obtain a forming lapping composite to separate to a certain degree with adjacent grinding composite material.There is forming lapping composite （Such as Accurate Shaping grinding composite material）Abrasive article before one of list of references be United States Patent (USP) No.5, 152,917（Pieper et al.）.Subsequently there are other lists of references many.As used herein, " Accurate Shaping grinds composite wood to term Material " refers to have effigurate grinding composite material, and described shape is formed in the following way：Solidification abrasive particle and curable binder The curable flowable mixture of agent precursor, simultaneously mixture be both supported on backing, again filling the tool of production surface on Cavity.This Accurate Shaping grinding composite material has and the shape of cavity accurate identical shape.Multiple this composites Pattern with non-random（I.e. the pattern of the tool of production is anti-phase）3D shape outwardly is provided from backing surface.Each is multiple By borders, the base portion on border is the interface with the backing attached by the composite of Accurate Shaping to condensation material.Border surplus Remaining part is divided and is limited by the cavity on the surface of the tool of production, and composite solidifies in described cavity.Composite entirely outer Surface is limited by backing or by cavity in its forming process.

Available conformal backing 120 may include those being known to be used in abrasive article, such as metal, thick polymer piece Material and/or film（Such as Merlon）, impregnated dose process cloth（Such as glass and/or polyester cloth）And nonwoven Thing, they treated or the form primed and combinations thereof.Example includes polyester sheet, polyolefin sheets（Example As polyethylene and crystalline p p sheet）, polyamide sheet material, polyimides sheet material and polycarbonate sheet.

Abrasive particle 145 may include, for example, aloxite (AI2O3)（Such as white fused aluminum oxide, thermally treated aluminium oxide and Brown aluminium oxide）, ceramic alumina（Including shaped ceramic alumina particle）, the aluminium oxide of heat treated, carborundum, diamond （Natural and synthesis）, cubic boron nitride, boron carbide, titanium carbide, cubic boron nitride, garnet, aloxite (AI2O3)-oxidation Zirconium, diamond, zirconium oxide and combinations thereof.In these, preferred diamond.Available diamond can be natural diamond Or diamond.Diamond may include face coat（Such as nickel or other metals）, to improve diamond in resinous substrates Holding.

Abrasive particle 145 also is present in grinding in aggregation.This aggregation includes multiple abrasive particles, host material and optional Additive.Host material can be organic and/or inorganic.Host material can be, for example, fluoropolymer resin, glass（Such as glass The diamond aggregation of glass bonding）, metal, glass ceramics, pottery（For example as United States Patent (USP) No.6,790,126（Wood et al.） Described in ceramic bonding agglomerate）, or combinations thereof.For example, glass（As silica glass, glass ceramics, boron Silicate glass, phenolic resin, epoxy resin, acrylic compounds and other trees described in the context of composite binding agent Fat）Can be used as host material.Grinding aggregation can be random shaping, or has the reservation shape being associated with.With each Plant to grind aggregation and prepare the related other details of their method and be found in such as United States Patent (USP) No.4,311,489 (Kressner)、4,652,275（Bloecher et al.）、4,799,939（Bloecher et al.）、5,549,962（Holmes etc. People）、5,975,988(Christianson)、6,620,214(McArdle)、6,521,004（Culler et al.）、6,551, 366（D'Souza et al.）、6,645,624（Adefris et al.）With 7,169,031（Fletcher et al.）And the U.S. announces Patent application 2007/0026770（Fletcher et al.）In.

The grinding aggregation of glassy bond can for example be obtained in the following way：There is provided by glass binder be obtained multiple Vitreous body, each vitreous body has restriction shape, and vitreous body has softening temperature；Multiple abrasive particles are provided；By the plurality of glass Glass body and the plurality of abrasive particle mix formation mixture；Described mixture is heated to the softening temperature of described vitreous body Degree is so that vitreous body softens and is kept substantially described restriction shape simultaneously；Abrasive particle is attached to softened vitreous body with shape Become multiple grinding aggregations；And aggregation is ground in cooling so that the glass binder of vitreous body hardens.Further details are retouched It is set forth in United States Patent (USP) No.7,887,608（Schwabel et al.）In.

Abrasive particle may also include surface treatment or coating, such as coupling agent or metal or ceramic coating.Preferably, abrasive particle has At least 7, it is more preferably at least 8, more preferably at least 9 Mohs hardness.

Abrasive particle preferably has at about 0.01 micron（Little particle）To 500 microns（Bulky grain）, more preferably from about 0.25 micron extremely About 500 microns, even more preferably about 3 microns to about 400 microns, most preferably from about 5 microns to about 50 microns in the range of average Granularity.Grit size is reported as " mesh " or " grade " sometimes, and both are commonly known abrasive particle sizing method.

The selection of grit size generally depends on the point using abrasive particle in method that repolishes in the present invention, and abrasive particle is flat All sizes are with each continuous structure Grinding structural unit（Such as first, then second, and optionally and then the 3rd）And reduce.

Forming lapping composite 140 optionally includes diluting granule, and described dilution granule is insufficient to firmly effectively to fill Work as abrasive particle.The granularity of these dilution granules can have the identical order of magnitude with abrasive particle.Such dilution granule example include Gypsum Fibrosum, Marble, limestone, flint, silicon dioxide, glass envelope, bead and aluminium silicate.

Abrasive particle 145 is attached with binding agent 148 to form forming lapping composite 140 each other（For example, with reference to Figure 1B）.Viscous Knot agent 148 is organic and/or polymeric binder, and derived from binder precursor.In a preferred embodiment, abrasive particle 145 exists Grind aggregation in glassy bond（Not shown）In.

During preparation structure grinding layer 110, binder precursor is exposed to energy source, and described energy source contributes to Cause polymerization or the solidification of binder precursor.

The example of energy source includes heat energy and radiation energy, and radiation energy includes electron beam, ultraviolet light and visible ray.Described poly- During conjunction, binder precursor is polymerized or is solidified, and is converted into solidification binding agent.When binder precursor solidifies, form bonding Agent substrate.

Can be formed for example curable（Energy via such as UV light or heat）The binding agent of organic binder bond precursor material 148.Example includes alkylation Lauxite, melamine formaldehyde resin and alkylation benzo guanamine-formaldehyde resins；Acrylic acid Ester resin（Including acrylate and methacrylate）, such as vinyl acrylate, acrylated epoxy resins, acrylate Change polyurethane, acrylated polyesters, acroleic acid esterification acrylic resin (acrylated acrylics), acroleic acid esterification Polyethers, vinyl ethers, acrylate carburetion and acrylated silicone；Alkyd resin, such as urethane alkyd resins, poly- Ester resin, reactive amino Ethyl formate resin；Phenolic resin, such as resol and linear phenol-aldehyde resin, phenolic aldehyde/latex Resin；Epoxy resin, such as bisphenol epoxy, isocyanates, isocyanuric acid ester；Polyorganosiloxane resin（Including alkyl alkoxy Silane resin）, reaction-ity ethylene base resin, phenolic resin（Resol and linear phenol-aldehyde resin）Deng.Described resin can There is provided as monomer, oligomer, polymer or combinations thereof.In order to be conducive to solidifying, binder precursor may include light and draws Send out one or more of agent, cross-linking agent, thermal initiator, catalyst and combinations thereof.Such material is many institutes in this area Known.

Preparation has the structured abrasive component of the coating of forming lapping composite and optional size（Wherein said multiple Condensation material includes the grinding aggregation being fixed in primer）Another available method be described in United States Patent (USP) No.6,217,413 (Christianson) in.

Impressing and/or silk screen printing can also be used for forming forming lapping composite, such as such as United States Patent (USP) No.5, and 014, 468（Ravipati et al.）Described in.

Structured abrasive component can have any shape, such as plate-like, square, daisy shape (daisies), rectangular band, ring Shape, crescent, spiral type, wavy line or any 2 dimension geometries.

The example of the commercially available structured abrasive component be applied to the present invention includes, for example, can be used as 3M TRIZACT Golden, the red and blue disk of DIAMOND HX derives from the 3M company of St. Paul, MN（3M Company,St.Paul, Minnesota）Those.

Special about being found in the such as U.S. for the method for preparation structure Grinding structural unit and the further details of material Sharp No.5,152,917（Pieper et al.）With 5,435,816（Spurgeon et al.）、5,437,754(Calhoun)、5,454, 844（Hibbard et al.）、5,304,223（Pieper et al.）With 7,300,479（McArdle et al.）In.

Optional attachment interface system 130 may include, for example, the unci of hook and look fasteners system, or from engagement mechanism The end-blocking bar of fastener（For example as United States Patent (USP) No.5672186（Chesley et al.）Or 5,201,101（Rouser et al.）Institute State）.Optional attachment interface system may include multiple element, such as with interface pad（It has hook and eye on opposite sides The unci of part）The annulus of the hook and look fasteners of combination, thus provides the hook-shaped appearance for being attached to Mechanical Driven pad Face.

In another embodiment shown in Fig. 1 C, exemplary structured Grinding structural unit 105 includes being arranged at conformal backing 120 First surface 122 on structured abrasive layer 110.Attachment interface system 137 is fixed to conformal backing by adhesive phase 135 120 second surface 124.As illustrated, attachment interface system 137 includes blocking bar from engaging fastener 1/2nd, described End-blocking bar includes froth bed 170, auxiliary binder layer 175 and end-blocking bar backing 180 from 1/2nd of engaging fastener.However, Also can be using other attachment interface systems with hook protuberance（Such as J-shaped hook fastener and T-hook fastener）.

Suitably optional boundary layer is usually compressible and conformal.Preferably, optional attachment layer has enough General thickness so that its by structured abrasive component increase to over its attachment Mechanical Driven pad surface so that machinery drive Dynamic pad does not significantly reduce the contact pressure between structured abrasive component and floor surface.Therefore, in certain embodiments, optionally Boundary layer can have the thickness in the range of 2 millimeters to 13 millimeters, preferably 2 millimeters to 5 millimeters.

If there is no optional attachment interface system, then can be using for installing pad（Such as binding agent）Some other Method.In this case, and actually in most of the cases it may be desirable to multiplely by structured abrasive component It is fixedly installed to compressible Nonwoven Machinery actuator pad with resilience, ground with the structuring being formed for each type used The assembly of mill component.Therefore, grind it is only necessary to change structuring to change over another kind from a kind of structured abrasive element type Mill component/compressible Mechanical Driven pad assembly with resilience, rather than single structured abrasive component is installed again.

First, second and the 3rd optional structured abrasive component independently include being fixed to the forming lapping of conformal backing Composite（If i.e. backing stands to exceed subsidiary flexure, it is susceptible to irreversible mechanical failure）.Forming lapping is multiple Each of condensation material includes the abrasive particle being scattered in first polymer binding agent.In each continuous structure Grinding structural unit The particle mean size of abrasive particle be less than before one, thus produce ever-increasing smoothness level, and obtain simultaneously suitable General abrasive speed.

Although the forming lapping composite of structured abrasive component contains ever-reduced granularity, miscellaneous part（Example As binding agent abrasive particle composition, conformal backing）Can change with the size of grinding composite material, shape and/or arrangement.In certain situation Under, this may result in the increase of the surface roughness of VC tile floor, and generally should avoid this group of structured abrasive component Close, or carry out other grinding steps so that floor surface is smooth afterwards.In order to avoid this problem it is generally desirable to except abrasive particle Average-size outside, structured abrasive component is substantially the same（For example with regard to the shape of forming lapping composite, size, group Become and arrange, for the composition of abrasive particle and/or conformal backing）.

Mechanical Driven pad can be by any material being capable of supporting construction Grinding structural unit（Such as metallic plate, non-woven mat, bubble Foam, rubber disc）It is obtained.In certain embodiments, Mechanical Driven pad can compress and recover and no significant permanent deformation（It is it For compressible and with resilience）.Compressibility and resilience allow Mechanical Driven pad to float over the height on floor gradually Irregularities（It can for example be led to by the concrete surface of lower section）On, and rigid mechanical actuator pad in this case may be used It is readily susceptible to dig chisel floor（For example depend on floor care Machine Design）.Preferably, Mechanical Driven pad includes non-woven material, institute State non-woven material and there is dish type（Although other shapes also can be used）, and there is the conventional polishing pad for turning arm buffing machine The typical thickness of institute and compressibility.For example, Mechanical Driven pad may include non woven fibre disk, and described non woven fibre disk has Thickness in the range of 1 to 5 centimetre (cm) and the diameter in the range of 0.3 to 1 meter.Available non-woven material may include, and for example, closes Become fiber（Such as polyester, polyamide, polyolefin and bi-component core-shell structure copolymer synthetic fibers）, natural fiber（For example Fructus Musae, Caulis et Folium Lini, Cotton, Corchorus olitorius L., Folium Agaves variegatae, Folium Agaves Sisalanae, Cortex cocois radiciss, Semen sojae atricolor and Fructus Cannabiss）, and aforesaid combination.Mechanical Driven pad can have and is bonded to non-knitting Make the abrasive particle of fiber.

Fluffy resilient Nonwoven Machinery actuator pad can be obtained, such as according to conventional methods by using being purchased from New York The Macedonian blue many machines corporation in state（Rando Machine Corporation,Macedon,New York）Rando Webber lapper forms low-density gas and spins fleece.In certain embodiments, the blend of fiber can be used.One exemplary This blend include polyester（Polyethylene terephthalate）It is poly- that the melting of chopped fiber and curling sheath core bonds Ester chopped fiber.Fleece subsequently optionally heats in thermal convection current baking oven, with any melting bonding in activated fiber net Fiber, and net described in pre-bonded.The example of the fiber of suitable melting bonding is described in United States Patent (USP) No.5,082,720 (Hayes) in.Fiber be preferably stretching and curling, but alternatively continuous filament yarn, as formed by extrusion, For example as described in United States Patent (USP) No.4,227,350 (Fitzer).

Subsequently by making the fleece of optional pre-bonded between the applicator roll of double roller coating machine, thus using liquid binder Agent precursor composition is coated with described fleece, and wherein bottom applicator roll is partly submerged in liquid binder resin compositionss.Exemplary Liquid-containing binder precursor composition include aminoplast, Lauxite, phenolic resin, epoxy resin and carbamate, to the greatest extent Pipe also can use other binder precursor.Subsequently coated nonwoven web is placed in and is heated to solidify liquid binder precursor tree In the baking oven of fat, and nonwoven web through bonding is obtained.

In certain embodiments, Mechanical Driven pad includes the open nonwoven fibrous substrate without outside backing layer（Example As non woven fibre disk）.Suitably non-woven compressible backing with resilience is also available from commercial source, such as 3M WHITE SUPER POLISH PAD4100,3M RED BUFFER PAD5100 and 3M NATURAL BLEND WHITE PAD3300 ground Plate pad, the above-mentioned 3M company being all from St. Paul, MN（3M Company,St.Paul.,MN）.Real at some Apply in example, compressible backing with resilience may include foam（Such as foam panel）.Also can be constructed using laminate, for example foam With non-woven webs laminate.

VC ceramic tile outward appearance generally in its whole thickness is substantially uniform.VC ceramic tile can extensively derive from commercial offers The Armstrong world industry company of business, such as Pennsyivania's Lancaster（Armstrong World Industries, Inc.,Lancaster,Pennsylvania）；The Mai Ningdun grinding machine company of New Jersey Cyren（Mannington Mills, Salem,New Jersey）；Tender parent company of the Congo with New Jersey not plucked instrument Weir（Congoleum Corp., Mercerville,New Jersey）.

Structured abrasive component is fixed to compressible backing with resilience（For example first structure Grinding structural unit, second Structured abrasive component or the 3rd optional structured abrasive component）, described compressible backing with resilience transfers generally to pacify It is filled to the low speed of the type for safeguarding VC tile floor（I.e. about 175 to about 350 revs/min）Plant equipment.Example includes handss The rotation floor machine of dynamic operation and hand-held (walk-behind) or riding type (riding) automatic ground washing machine.Fig. 2 shows can For implementing example components 200 of the structured abrasive component 100 being fixed to Mechanical Driven pad 210 of the present invention.Can Any an appropriate number of structured abrasive component using any arrangement（For example, the quantity of structured abrasive component can for 1,2, 3rd, 4,5,6,7,8,9,10 or more）.Generally, structured abrasive component is symmetrically arranged in compressible Mechanical Driven with resilience On the surface of pad, although also can be using other arrangements.And, usual setting structure Grinding structural unit so that they with compressible The periphery edge of Mechanical Driven pad with resilience is adjacent, although also can be using other arrangements.

In certain embodiments, in the wet grinding procedure using structured abrasive component（For example a), b) and optional c)） Afterwards, the non-woven mat with the diamond being bonded to it can be used for finally polishing UV tile floor.Example include can as 3M SCOTCH-BRITE PURPLE DIAMOND FLOOR PAD PLUS and 3M SCOTCH-BRITE from 3M company Those of SIENNA DIAMOND FLOOR PAD PLUS.This pad can also be used for one or more other low speed wet lappings In step, one or more of other low speed wet grinding procedure can be optionally used for strengthening the process according to the present invention.In order to Improve the high speed polishing of the aesthetic qualities of floor surface（For example under the speed more than 1000 revs/min）It is preferably used as according to this Invention method in final step, but this and nonessential.Polishing for example can be made using method well known in the art at a high speed Electricity consumption, battery or propane polishing machine and carry out.

Can preconditioning VC tile floor so that it is more suitable for the grinding according to the present invention.For example, chemical stripping agent can be used To remove existing floor finish with the non-woven pad that divests.Advantageously, omit chemical stripping, because it is loaded down with trivial details, time-consuming and be Aesthetic unhappy.Therefore, in certain embodiments, do not use pre-conditioning step, and in other embodiments, ground using strength Mill car mat is removing finishing agent and the assistance of no stripper（Although water can be used for dust control）.This strength grinds car mat Example can be used as 3M BLACK STRIPPER PAD7200,3M BROWN STRIPPER PAD7100,3M HIGH PRODUCTIVITY PAD7300 and 3M CLEAN AND STRIP XT car mat obtain, and above-mentioned are all from 3M company.

Regardless of whether preconditioning floor, all using the first knot being fixed to the first compressible Mechanical Driven pad with resilience Structure Grinding structural unit grinds a part for the exposed surface of VC tile floor, and described first structure Grinding structural unit includes being fixed to First forming lapping composite of the first conformal backing, wherein said first forming lapping composite includes being scattered in first The first abrasive particle in polymeric binder, wherein said first abrasive particle has the first particle mean size.In certain embodiments, first Particle mean size is in the range of 200 to 400 microns, preferably 250 to 350 microns.

After completing the first wet grinding procedure, repeat described process again using the second structured abrasive component, and the Two abrasive particles have the second particle mean size less than the first particle mean size.In certain embodiments, the second particle mean size is 25 to 75 Micron, in the range of preferably 35 to 65 microns.

After the wet grinding procedure using the first and second structured abrasive components completes, floor can be thus capable of sufficiently recovering with In use.However, it is in some cases, it can be possible to preferably executed as described above other（Such as the 3rd and the optional the 4th）Wet grind Honed journey, but using continuously less average grain size.

Once as described above grind（I.e. Chong Pu surface and/or recovery）VC tile floor, can apply transparent polymer and cover with paint, lacquer, colour wash, etc. Agent is to improve outward appearance and to protect floor to avoid wearing and tearing.Transparent polymer finishing agent may include water solublity or water-dispersible film formers, Such as metal-free acrylic compounds finishing agent, using crosslinked many containing acid polymer and water solublity or water dispersible of transition metal Component（Such as bi-component）Polyurethane.Transparent polymer finishing agent can the mixture containing film former.

The example of suitable commercial clear polymeric finishes includes acrylic compounds floor finish 3M SCOTCHGARD VINYL FLOOR PROTECTOR, 3M CORNERSTONE, 3M SCOTCHGARD UHS25FLOOR FINISH and 3M SCOTCHGARD LM25FLOOR FINISH, and polyurethane finishing agent, Tathagata is from the 3M company of St. Paul, MN （3M Company,Saint Paul,Minnesota）3M SCOTCHGARD ULTRA DURABLE FLOOR FINISH.

The selected embodiment of the present invention

In the first embodiment, the invention provides a kind of method repolishing vinyl compositions tile floor, described Method includes sequential steps：

B) using the exposed surface on the second structured abrasive component wet lapping floor being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the second abrasive particle being scattered in second polymer binding agent, wherein Described second abrasive particle has the second particle mean size, and wherein said second particle mean size is less than described first particle mean size；And

In a second embodiment, the invention provides a kind of method according to first embodiment, wherein in step a) with b) During respective, the described at least one of average surface roughness R of the exposed surface on described floor_zAll reduce.

In the third embodiment, the invention provides a kind of method according to first or second embodiments, wherein said Each of one structured abrasive component also includes the first attachment interface system being fixed to the described first conformal backing, described First attachment interface system has the multiple rings relative with the described first conformal backing, wherein said first structure Grinding structural unit Described first Mechanical Driven pad is fixed to by the first attachment interface component, described first attachment interface component has two relatively Interarea, described two relative interareas have the hook extending from it.

In the fourth embodiment, the invention provides one kind is according to any one of first embodiment to 3rd embodiment institute The method stated, each of wherein said first structure Grinding structural unit also includes be fixed to the described first conformal backing One conformal froth bed and the attachment interface system with the multiple hooks relative with the described first conformal froth bed.

In the 5th embodiment, the invention provides one kind is according to any one of first embodiment to fourth embodiment institute The method stated, each of wherein said second structured abrasive component also includes be fixed to the described second conformal backing Two conformal froth beds and the attachment interface system with the multiple hooks relative with the described second conformal froth bed.

In the sixth embodiment, the invention provides one kind according to first embodiment to any one of the 5th embodiment institute The method stated, each of wherein said second structured abrasive component also includes be fixed to the described second conformal backing Two attachment interface systems, described second attachment interface system has the multiple rings relative with the described second conformal backing, wherein institute State the second structured abrasive component and described second Mechanical Driven pad, described attachment interface component are fixed to by attachment interface component There are two relative interareas, described two relative interareas have the hook extending from it.

In the 7th embodiment, the invention provides one kind is according to any one of first embodiment to sixth embodiment institute The method stated, wherein said first and second Mechanical Driven pads are compressible and with resilience.

In the 8th embodiment, the invention provides one kind according to first embodiment to any one of the 7th embodiment institute The method stated, wherein said first forming lapping composite, described second forming lapping composite or above-mentioned both for essence Really shape.

In the 9th embodiment, the invention provides one kind according to first embodiment to any one of the 8th embodiment institute The method stated, wherein said first particle mean size is in the range of 400 microns to 600 microns.

In the tenth embodiment, the invention provides one kind according to first embodiment to any one of the 9th embodiment institute The method stated, wherein said second particle mean size is in the range of 25 microns to 75 microns.

In the 11st embodiment, the invention provides one kind is according to any one of first embodiment to the tenth embodiment Described method, at least one of wherein said first or second forming lapping composite includes remaining in vitreous bond Super abrasive particle in agent.

In the 12nd embodiment, the invention provides a kind of according to arbitrary in first embodiment to the 11st embodiment Method described in, wherein after step b), the described at least one of average surface of the exposed surface on described floor is thick Rugosity R_aLess than or equal to 95 microinch.

In the 13rd embodiment, the invention provides a kind of according to arbitrary in first embodiment to the 12nd embodiment Method described in, it also includes after step b)：

C) using the 3rd structured abrasive component wet lapping being fixed to the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in third polymer binding agent The 3rd abrasive particle, wherein said 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size is less than described the Two particle mean sizes；And

In the 14th embodiment, the invention provides a kind of according to arbitrary in first embodiment to the 13rd embodiment Method described in, wherein after step c), the ground exposed surface on described floor has putting down less than 80 microinch All surface roughnesses.

In the 15th embodiment, the invention provides a kind of according to arbitrary in first embodiment to the 14th embodiment Method described in, it also includes transparent polymer finishing agent is applied to the exposed surface on described floor after step b) Described at least a portion.

In the 16th embodiment, the invention provides a kind of method repolishing vinyl floor, methods described includes Sequential steps：

C) using the exposed surface on the second structured abrasive component wet lapping floor being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the 3rd abrasive particle being scattered in third polymer binding agent, wherein Described 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size is less than described second particle mean size；And

In the 17th embodiment, the invention provides a kind of method according to the 16th embodiment, wherein said Nonwoven abrasive component includes floor finish and divests pad.

In the 18th embodiment, the invention provides a kind of according to the 16th embodiment or the 17th embodiment Method, wherein step a) and b) respective during, the described at least one of average table of the exposed surface on described floor Surface roughness R_zAll reduce.

In the 19th embodiment, the invention provides a kind of according in the 16th embodiment to the 18th embodiment appoint Method described in one, each of wherein said first structure Grinding structural unit also includes being fixed to the described first conformal back of the body First conformal froth bed of lining and the attachment interface system with the multiple hooks relative with the described first conformal froth bed.

In the 20th embodiment, the invention provides a kind of according in the 16th embodiment to the 19th embodiment appoint Method described in one, each of wherein said second structured abrasive component also includes being fixed to the described second conformal back of the body Second conformal froth bed of lining and the attachment interface system with the multiple hooks relative with the described second conformal froth bed.

In the 21st embodiment, the invention provides a kind of according in the 16th embodiment to the 20th embodiment Method described in any one, each of wherein said first structure Grinding structural unit also includes being fixed to described first conformal First attachment interface system of backing, described first attachment interface system has relative with the described first conformal backing multiple Ring, wherein said first structure Grinding structural unit is fixed to described first Mechanical Driven pad, institute by the first attachment interface component State the first attachment interface component and there are two relative interareas, described two relative interareas have the hook extending from it.

In the 22nd embodiment, the invention provides one kind is according in the 16th embodiment to the 21st embodiment The method described in any one, each of wherein said second structured abrasive component also includes being fixed to described second and fits Second attachment interface system of shape backing, described second attachment interface system has relative with the described second conformal backing multiple Ring, wherein said second structured abrasive component is fixed to described second Mechanical Driven pad by attachment interface component, described attached Junction surface member has two relative interareas, and described two relative interareas have the hook extending from it.

In the 23rd embodiment, the invention provides one kind is according in the 16th embodiment to the 22nd embodiment The method described in any one, wherein said first and second Mechanical Driven pads are compressible and with resilience.

In the 24th embodiment, the invention provides one kind is according in the 16th embodiment to the 23rd embodiment The method described in any one, wherein said first forming lapping composite, described second forming lapping composite or on Stating both is Accurate Shaping.

In the 25th embodiment, the invention provides one kind is according in the 16th embodiment to the 24th embodiment The method described in any one, wherein said second particle mean size is in the range of 400 microns to 600 microns.

In the 26th embodiment, the invention provides one kind is according in the 16th embodiment to the 25th embodiment The method described in any one, wherein said 3rd particle mean size is in the range of 25 microns to 75 microns.

In the 27th embodiment, the invention provides one kind is according in the 16th embodiment to the 26th embodiment The method described in any one, at least one of wherein said first or second forming lapping composite include remain in glass Super abrasive particle in glass matter binding agent.

In the 28th embodiment, the invention provides one kind is according in the 16th embodiment to the 27th embodiment The method described in any one, wherein after step c), the average surface roughness of the ground exposed surface on described floor Degree R_aLess than or equal to 2.4 microns.

In the 29th embodiment, the invention provides one kind is according in the 16th embodiment to the 28th embodiment The method described in any one, it also includes after step c)：

D) using the 3rd structured abrasive component wet lapping being fixed to the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in the 4th polymeric binder The 4th abrasive particle, wherein said 4th abrasive particle has the 4th particle mean size, and wherein said 4th particle mean size is less than described the Three particle mean sizes；And

In the 30th embodiment, the invention provides a kind of according in the 16th embodiment to the 29th embodiment Method described in any one, wherein after step d), the described at least one of average table of the exposed surface on described floor Surface roughness R_aLess than or equal to 80 microinch.

In the 31st embodiment, the invention provides a kind of according in the 16th embodiment to the 30th embodiment Method described in any one, it also includes transparent polymer finishing agent is applied to the exposure table on described floor after step c) The described at least a portion in face.

It is further illustrated by the following non-limiting examples objects and advantages of the present invention, but the tool described in these examples Body material and its consumption, and other condition and details be not construed as carrying out improper restriction to the present invention.

Example

Except as otherwise noted, the otherwise all numbers in the remainder of example and this specification, percent, ratio etc. It is by weight.

Material used in example

3M SCOTCHGARD VINYL FLOOR PROTECTOR is to be designed as protective floor agent from 3M company The aqueous mixture of the inorganic particle of polymer and nano-scale.

" T300 " refers to 5 inches（13 centimetres）300- μm of diamond lattic structure abrasive disk of diameter, it is in flexible cloth backing On there is microreplicated composite diamond lap structure, be provided with the hook-shaped mounting disc of 3M, and with trade name " 3M TRIZACT DIAMOND HX GOLD " is available from 3M company.

" T45 " refers to 5 inches（13 centimetres）45- μm of diamond lattic structure abrasive disk of diameter, it is on flexible cloth backing There is microreplicated composite diamond lap structure, be provided with the hook-shaped mounting disc of 3M, and with trade name " 3M TRIZACT DIAMOND HX RED " is available from 3M company.

" T10 " refers to 5 inches（13 centimetres）10- μm of diamond lattic structure abrasive disk of diameter, it is on flexible cloth backing There is microreplicated composite diamond lap structure, be provided with the hook-shaped mounting disc of 3M, and with trade name " 3M TRIZACT DIAMOND HX BLUE " is available from 3M company.

" T6 " refers to 5 inches（13 centimetres）6- μm of diamond lattic structure abrasive disk of diameter, it is being laminated to the Merlon back of the body 5 mils of lining（130 microns）Microreplicated composite diamond lap structure is had on film, and with trade name " 3M TRIZACT673LA level A6 " is available from 3M company.

" T3 " refers to 5 inches（13 centimetres）3- μm of diamond lattic structure abrasive disk of diameter, it is being laminated to the Merlon back of the body 5 mils of lining（130 microns）Microreplicated composite diamond lap structure is had on film, from " the 3M of 3M company TRIZACT673LA level A3 ".

" PDP " refers to 20 inches（43 centimetres）The diamond lap non-woven floor polishing pad of diameter, it is with trade name " 3M SCOTH-BRITE PURPLE DIAMOND FLOOR PAD PLUS " is available from 3M company.

" WSP1 " refers to 17 inches（43 centimetres）The non-woven floor polishing pad of diameter, it is with trade name " 3M WHITE SUPERPOLISH PAD4100 " is available from 3M company.

" WSP2 " refers to 20 inches（43 centimetres）The non-woven floor polishing pad of diameter, it is with trade name " 3M WHITE SUPERPOLISH PAD4100 " is available from 3M company.

Method of testing

Surface finish measurement

The surface roughness of vinyl composite (VC) ceramic tile is by R_zAnd R_aLimit.The R on surface_aCalculation for scratch depth The measuring of art meansigma methodss.It is the meansigma methodss of 5 single roughness depth of five continuous measurement length, wherein individually coarse Depth is the vertical distance between peak and center line.R_zFor measuring the meansigma methodss of 5 single roughness depth of length, wherein Individually roughness depth is the vertical distance between peak and minimum point.In table 1, the surface roughness data of report is use The meansigma methodss of six measurements that profilograph is carried out on six VC ceramic tile samples, described profilograph can be with trade name " SURTRONIC25PROFILOMETER " derives from the gloomy company of Taylor Hope of Britain Leicester（Taylor Hobson,Inc., Leicester,England）.

Glossiness measures

Using the BYK- Gardner company available from Columbia, MD（BYK-Gardner,Columbia, Maryland）" 4430 " type gloss meter measure the glossiness of VC ceramic tile sample under 20,60 and 85 degree of angle.In table 1 and 2 The gloss value of report is the meansigma methodss of six measurements carrying out on six VC ceramic tile samples.

Electrostatic coefficient of friction is dried（DSCF）Measurement

Using the Rigen's Scientific Instruments Corporation available from Texas South Lake（Regan Scientific Instruments,Inc.,Southlake,Texas）" BOT-3000 " type friction wear testing machine measure VC ceramic tile drying Electrostatic coefficient of friction（DSCF）.In table 1 and 2, the DSCF data of report is four measurements carrying out on a VC ceramic tile sample Meansigma methodss.

In example 1-10 and comparative example B-D, when using diamond lattic structure abrasive disk to grind floor, dragged by line Carry out methods described in the presence of the water applying.Complete one of the diamond lattic structure abrasive disk using each type or After multiple wet grinding procedure, remove gained ground slurry from floor surface.Drying carries out polishing at a high speed.

Example 1-2

Make to stand within the several months 6 feet × 5 feet of frequently walk（1.83 meters × 1.52 meters）The warp of area The vinyl compositions floor tile of abrasion stands following grinding steps.

Diamond lattic structure abrasive disk will be provided with（As above）The interface pad on both surfaces with hook be attached to The rotary-type floor machine of the outfit WSP1 Mechanical Driven pad of operation under 175 revs/min.Subsequently four T300 disks are attached to interface Pad, using floor machine in 88ft/min（26.82 ms/min）Lower grinding test zone four times.Subsequently measurement surface fineness, light Damp degree and electrostatic friction co-efficient value is dried.Replace T300 disk with T45 disk, repeat described process, measurement surface is bright and clean again afterwards Degree, glossiness and electrostatic friction co-efficient value is dried.Continuously continue process of lapping using thinner T10 abrasive disk.In each grinding Measurement surface fineness, glossiness and electrostatic friction co-efficient value is dried after step.

Mark the half of test zone and be appointed as " E-1 " of example 1, second half is appointed as " E-2 " of example 2.Use T6 T10 abrasive disk replaced by disk, using floor machine in 88ft/min（26.82 ms/min）Lower abrasive areas E-2 tetra- times.Then use T3 Disk replaces T6 disk, regrinding region E-2 in an identical manner.Subsequently in 88ft/min（26.82 ms/min）（1PDP walks Suddenly）Using the Tan Nantetelunde company available from state of Michigan village of Holland with PDP floor grinding pad（Tennant Trend, Inc.,Holland,Michigan）" SPEEDSHINE2000 " type high speed polishing machine polish E-1 and E-2 whole test section Domain six times.Use " 3M EASY SHINE APPLICATOR SYSTEM " by the trade name " 3M from 3M company The vinyl compositions ceramic tile protective agent of SCOTCHGARD VINYL FLOOR PROTECTOR " is applied to the region through polishing, Lay equal stress on regrinding light step（2PDP step）, afterwards using WSP2 car mat（1WSP step）Polishing six times.Using vinyl Protective floor agent is coated with whole test zone again, and then PDP and WSP car mat used as discussed above polishes again（It is respectively 3PDP and 2WSP step）.Then measure the surface smoothness of two region E-1 and E-2, glossiness and electrostatic friction is dried Coefficient value.Result record is in following table 1.

Example 3 and Comparative examples A

Carry out these examples using the vinyl compositions tile floor in laboratory building.Divest and give the floor a flush area Domain.Separate region using identical floor is used for each example.Example 3 is prepared using structured abrasive disk and is used for 3M The floor of SCOTCHGARD VINYL FLOOR PROTECTOR coating, as described below.Comparative examples A is using in 3M SCOTCHGARD VINYL FLOOR PROTECTOR technical data list（2011 2 months）In listed floor preparation section making Standby floor.After prepared by floor, two examples all follow 3M SCOTCHGARD VINYL FLOOR PROTECTOR technology number According to list（2011 2 months）Application procedures.

For example 3, process floor as follows：

1. use T300 diamond lattic structure abrasive disk 4 times

2. use T45 diamond lattic structure abrasive disk 4 times

3. use T10 diamond lattic structure abrasive disk 4 times

4. use T6 diamond lattic structure abrasive disk 4 times

5. use T3 diamond lattic structure abrasive disk 4 times

6. it is derived from the 1st coating of the 3M SCOTCHGARD VINYL FLOOR PROTECTOR floor finish of 3M company

7. use PDP polishing pad to polish

8. use WSP polishing pad to polish

2nd coating of 9.3M SCOTCHGARD VINYL FLOOR PROTECTOR floor finish

10. use PDP polishing pad to polish

11. use the polishing of WSP polishing pad

For Comparative examples A, process floor as follows：

1. use the 3M SCOTCH-BRITE SIENNA DIAMOND FLOOR PAD PLUS polishing pad polishing of 3M company

2. polished using PDP

1st coating of 3.3M SCOTCHGARD VINYL FLOOR PROTECTOR floor finish

4. polished using PDP

5. polished using WSP

2nd coating of 6.3M SCOTCHGARD VINYL FLOOR PROTECTOR floor finish

7. use PDP polishing pad to polish

8. use WSP polishing pad to polish

Using BYK- Gardner's gloss meter（The BYK- Gardner of Columbia, MD（BYK-Gardner, Columbia,Maryland））Measurement 20 ° and 60 ° of glossiness.Using the Ma Er federal corporate from Rhode Island Providence （Mahr Federal,Inc.,Providence,Rhode Island）Perthometer M1 profilograph measurement surface Roughness R_aAnd R_z.Using Elcometer6015NOVO-GLOSS | Q DOI haze meter（The easy height on state of Michigan Rochester mountain Company（Elcometer,Inc.,Rochester Hills,Michigan））Measure fresh degree of reflecting（DOI）, mist degree and peak value minute surface Reflectance（R_spec）.Measurement is carried out four different positions in each ground measured zone.It is average that these measure Value is shown in table 2（As follows）In.

Example 4 10 and comparative example B D

Vinyl compositions tile floor in laboratory building carries out these examples.Divest and give the floor a flush area Domain.Separate region using identical floor is used for each example.Example 4-10 and comparative example B-C uses the structure of various combination Change abrasive disk to prepare the ground for being coated with using 3M SCOTCHGARD VINYL FLOOR PROTECTOR floor finish Plate, and Comparative Example D only prepares floor using PDP car mat polishing floor.After prepared by floor, all examples all follow 3M SCOTCHGARD VINYL FLOOR PROTECTOR technical data list（2011 2 months）Application procedures.

Example 4

1. use T45 diamond lattic structure abrasive disk four times

2. use T10 diamond lattic structure abrasive disk four times

3. use PDP polishing pad to polish

Example 5

1. use T300 diamond lattic structure abrasive disk four times

2. use T45 diamond lattic structure abrasive disk four times

3. use T10 diamond lattic structure abrasive disk four times

4. use PDP polishing pad to polish

Example 6

1. use T300 diamond lattic structure abrasive disk four times

2. use T10 diamond lattic structure abrasive disk four times

3. use PDP polishing pad to polish

Comparative example B

1. use T300 diamond lattic structure abrasive disk four times

2. use PDP polishing pad to polish

Example 7

1. use T45 diamond lattic structure abrasive disk four times

2. use T10 diamond lattic structure abrasive disk four times

3. use PDP polishing pad to polish

Comparative example C

1. use T45 diamond lattic structure abrasive disk four times

2. use PDP polishing pad to polish

Example 8

1. use T300 diamond lattic structure abrasive disk four times

2. use T45 diamond lattic structure abrasive disk four times

3. use T10 diamond lattic structure abrasive disk four times

Example 9

1. use T300 diamond lattic structure abrasive disk four times

2. use T45 diamond lattic structure abrasive disk four times

3. use T10 diamond lattic structure abrasive disk four times

4. use T6 diamond lattic structure abrasive disk four times

Example 10

1. use T300 diamond lattic structure abrasive disk four times

2. use T45 diamond lattic structure abrasive disk four times

3. use T10 diamond lattic structure abrasive disk four times

4. use T6 diamond lattic structure abrasive disk four times

5. use T3 diamond lattic structure abrasive disk four times

Comparative Example D

1. use PDP polishing pad to polish

Measurement is carried out in each ground test floor area at six different positions.It is average that these measure Value is shown in table 3（As follows）In.

All patents mentioned by herein and publication are incorporated by reference in its entirety herein accordingly.Except as otherwise noted, Otherwise all examples given herein be regarded as nonrestrictive.In the condition without departing from the scope of the present invention and essence Under, those skilled in the art can carry out various modifications and change, and it is to be understood that the present invention should not be undeservedly to the present invention It is limited to exemplary embodiment as herein described.

Claims

1. a kind of method repolishing vinyl compositions tile floor, methods described includes sequential steps：

A) include vinyl compositions ceramic tile using the first structure Grinding structural unit wet lapping being fixed to the first Mechanical Driven pad The exposed surface on floor at least a portion, described first structure Grinding structural unit includes be fixed to the first conformal backing One forming lapping composite, wherein said first forming lapping composite includes being scattered in first polymer binding agent First abrasive particle, wherein said first abrasive particle has the first particle mean size in 200 microns to 400 micrometer ranges；And

B) using the exposed surface on floor described in the second structured abrasive component wet lapping being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the second abrasive particle being scattered in second polymer binding agent, wherein Described second abrasive particle has the second particle mean size, and wherein said second particle mean size be less than described first particle mean size and In the range of 25 microns to 75 microns；And wherein step a) and b) respective during, the exposed surface on described floor Described at least one of average surface roughness R_aAll reduce.

2. method according to claim 1, wherein step a) and b) respective during, the exposed surface on described floor Described at least one of average surface roughness R_zAll reduce.

3. method according to claim 1, each of wherein said first structure Grinding structural unit also includes fixing To the first attachment interface system of described first conformal backing, described first attachment interface system has and the described first conformal back of the body Serve as a contrast relative multiple rings, wherein said first structure Grinding structural unit is fixed to described first machine by the first attachment interface component Tool actuator pad, described first attachment interface component has two relative interareas, and described two relative interareas have and prolong from it The hook stretched.

4. method according to claim 1, each of wherein said first structure Grinding structural unit also includes fixing To the conformal froth bed of described first conformal backing, with the attachment interface system with the multiple hooks relative with described conformal froth bed System.

5. method according to claim 1, each of wherein said second structured abrasive component also includes fixing To the conformal froth bed of described second conformal backing, with the attachment interface system with the multiple hooks relative with described conformal froth bed System.

6. method according to claim 1, each of wherein said second structured abrasive component also includes fixing To the second attachment interface system of described second conformal backing, described second attachment interface system has and the described second conformal back of the body Serve as a contrast relative multiple rings, wherein said second structured abrasive component is fixed to described second machinery by attachment interface component and drives Dynamic pad, described attachment interface component has two relative interareas, and described two relative interareas have the hook extending from it.

7. method according to claim 6, wherein said first Mechanical Driven pad and the second Mechanical Driven pad are compressible And with resilience.

8. method according to claim 1, wherein said first forming lapping composite, described second forming lapping are multiple Condensation material or above-mentioned both for Accurate Shaping.

9. method according to claim 1, wherein said first particle mean size is in the range of 250 microns to 350 microns.

10. method according to claim 1, wherein said second particle mean size is in the range of 35 microns to 65 microns.

11. methods according to claim 1, wherein said first forming lapping composite or the second forming lapping are combined At least one of material includes remaining in the super abrasive particle in glass binder.

12. methods according to claim 1, wherein after step b), the exposed surface on described floor described at least The average surface roughness R of a part_aLess than or equal to 95 microinch.

13. methods according to claim 1, it also includes after step b)：

C) use is fixed to described in the 3rd structured abrasive component wet lapping of the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in third polymer binding agent The 3rd abrasive particle, wherein said 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size be less than described Second particle mean size；And

Wherein during step c), the described at least one of average surface roughness R of the exposed surface on described floor_a Reduce.

14. methods according to claim 13, wherein after step c), the ground exposed surface tool on described floor There is the average surface roughness less than 80 microinch.

15. methods according to claim 1, it also includes for transparent polymer finishing agent being applied to institute after step b) State described at least a portion of the exposed surface on floor.

A kind of 16. methods repolishing vinyl floor, methods described includes sequential steps：

A) at least one of exposed surface of the floor of vinyl compositions ceramic tile is included using nonwoven abrasive component wet lapping Point, wherein said nonwoven abrasive component includes non-woven webs, and described non-woven webs have and glued by first polymer Knot agent is attached to its first abrasive particle, and wherein said first abrasive particle has the first particle mean size；

B) using the exposed surface on floor described in first structure Grinding structural unit wet lapping being fixed to the first Mechanical Driven pad Described at least a portion, the first forming lapping that described first structure Grinding structural unit includes being fixed to the first conformal backing is combined Material, wherein said first forming lapping composite includes the second abrasive particle being scattered in second polymer binding agent, wherein Described second abrasive particle has less than described first particle mean size and the second average grain in 200 microns to 400 micrometer ranges Degree；And

C) using the exposed surface on floor described in the second structured abrasive component wet lapping being fixed to the second Mechanical Driven pad Described at least a portion, the second forming lapping that described second structured abrasive component includes being fixed to the second conformal backing is combined Material, wherein said second forming lapping composite includes the 3rd abrasive particle being scattered in third polymer binding agent, wherein Described 3rd abrasive particle has the 3rd particle mean size, and wherein said 3rd particle mean size be less than described second particle mean size and In the range of 25 microns to 75 microns；And wherein step b) and c) respective during, described floor ground The average surface roughness R of exposed surface_aAll reduce.

17. methods according to claim 16, wherein said nonwoven abrasive component includes floor finish and divests pad.

18. methods according to claim 17, wherein step a) and b) respective during, the exposure table on described floor The described at least one of average surface roughness R in face_zAll reduce.

19. methods according to claim 16, each of wherein said first structure Grinding structural unit also includes solid The fixed conformal froth bed to described first conformal backing, with the attachment interface with the multiple hooks relative with described conformal froth bed System.

20. methods according to claim 16, each of wherein said second structured abrasive component also includes solid The fixed conformal froth bed to described second conformal backing, with the attachment interface with the multiple hooks relative with described conformal froth bed System.

21. methods according to claim 16, each of wherein said first structure Grinding structural unit also includes solid Fixed the first attachment interface system to described first conformal backing, described first attachment interface system has conformal with described first The relative multiple rings of backing, wherein said first structure Grinding structural unit is fixed to described first by the first attachment interface component Mechanical Driven pad, described first attachment interface component has two relative interareas, and described two relative interareas have from it The hook extending.

22. methods according to claim 16, each of wherein said second structured abrasive component also includes solid Fixed the second attachment interface system to described second conformal backing, described second attachment interface system has conformal with described second The relative multiple rings of backing, wherein said second structured abrasive component is fixed to described second machinery by attachment interface component Actuator pad, described attachment interface component has two relative interareas, and described two relative interareas have the hook extending from it.

23. methods according to claim 16, wherein said first Mechanical Driven pad and the second Mechanical Driven pad are to press Contracting and with resilience.

24. methods according to claim 16, wherein said first forming lapping composite, described second forming lapping Composite or above-mentioned both for Accurate Shaping.

25. methods according to claim 16, wherein said second particle mean size is in 250 microns to 350 microns of scope Interior.

26. methods according to claim 16, wherein said 3rd particle mean size is in the range of 35 microns to 65 microns.

27. methods according to claim 16, wherein said first forming lapping composite or the second forming lapping are multiple At least one of condensation material includes remaining in the super abrasive particle in glass binder.

28. methods according to claim 16, wherein after step c), the ground exposed surface on described floor Average surface roughness R_aLess than or equal to 2.4 microns.

29. methods according to claim 16, it also includes after step c)：

D) use is fixed to described in the 3rd structured abrasive component wet lapping of the 3rd compressible Mechanical Driven pad with resilience Described at least a portion of the exposed surface on floor, described 3rd structured abrasive component includes being fixed to the 3rd conformal backing 3rd forming lapping composite, wherein said 3rd forming lapping composite includes being scattered in the 4th polymeric binder The 4th abrasive particle, wherein said 4th abrasive particle has the 4th particle mean size, and wherein said 4th particle mean size be less than described 3rd particle mean size；And

Wherein during step d), the described at least one of average surface roughness R of the exposed surface on described floor_a Reduce.

30. methods according to claim 16, wherein after step d), the exposed surface on described floor described at least The average surface roughness R of a part_aLess than or equal to 80 microinch.

31. methods according to claim 16, it also includes being applied to transparent polymer finishing agent after step c) Described at least a portion of the exposed surface on described floor.