CN103777437A - Camera module and portable terminal with camera - Google Patents
Camera module and portable terminal with camera Download PDFInfo
- Publication number
- CN103777437A CN103777437A CN201310487662.1A CN201310487662A CN103777437A CN 103777437 A CN103777437 A CN 103777437A CN 201310487662 A CN201310487662 A CN 201310487662A CN 103777437 A CN103777437 A CN 103777437A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- frame
- capturing element
- degassed
- camera module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a thin camera module which can easily and effectively achieve degasification and dust prevent. A basal body unit (20) of a lens driving unit (13) is installed through a bonding layer (40) containing a bonding agent. A basal body frame part (22) covers a shooting element (24) and has an opening at the top. The opening is closed by a transparent light filter (30), so that sensor confined space (S) of the shooting element (24) is enclosed. Degasification of the sensor confined space (S) is carried out by a degasification passageway part (50) which passes through the basal body frame part (22). The degasification passageway part (50) has an opening at a position closer to an inner side than the bonding layer (40) of an upper surface part (221a) of the basal body frame part (22). In addition, in the sensor confined space (S), the degasification passageway part (50) has an opening which is formed at a position deviating from a lateral direction of the shooting element (24).
Description
Technical field
The present invention relates to be installed on the camera module of the portable terminal such as portable phone, smart mobile phone and the portable terminal with camera, relate in particular to and possess the space and its outside camera module of degassed mouthful being communicated with and the portable terminal with camera that make for the installation of semiconductor capturing element.
Background technology
In recent years, popularized portable phone, portable game terminal, mobile information terminal (PDA:Personal Digital Assistant), be equipped with at portable phone the functions such as personal computer or PDA smart mobile phone etc., possess the portable terminal of camera-enabled as standard feature.In order to realize the camera-enabled of such portable terminal, the small-sized electronic part that is known as camera module is installed at portable terminal.
General camera module have install semiconductor capturing element base unit, make at semiconductor capturing element subject image imaging lens unit and hold lens unit and be fixed on the module bodies of base unit.
Semiconductor capturing element (following, be called " capturing element ") is by CCD image sensor (Charge Coupled Device Image Sensor), COMS(Complementary Metal Oxide Semiconductor Image Sensor) etc. formation.
Capturing element is at the upper state to be impaled by the matrix members of frame of frame shape of printed circuit board (PWB:printed wiring board, below, sensor base plate), is positioned at and is installed on its substantial middle.The converting optical signals of capturing element subject picture on sensitive surface by scioptics cell imaging is that electric signal is exported.In addition,, on sensor base plate, the region impaling in the outside of capturing element and by matrix members of frame, is provided with not shown CSP(Chip Size Package can be installed) region of parts, circuit block.The upper face side peristome of the matrix members of frame of this frame shape for example, is covered by light transmission optical filter (infrared intercepting filter: IRCF).
Light transmission optical filter is divided the installing space (sensor seal cavity) for the hollow of capturing element configuration together with sensor base plate and matrix members of frame.The upper face side peristome of matrix members of frame via light transmission optical filter by module bodies obturation.In module bodies, be provided with this lens unit is driven to the lens actuating device portion for can being freely shifted along optical axis direction.Coated with adhesive between this module bodies and matrix members of frame, solidifies module whole (module bodies and base unit) by ultraviolet ray (UV) irradiation or heating, cooling etc., both engaged, thus assembling camera module.
Like this, when engaging via cementing agent while holding the module bodies of lens unit and base unit, module whole is carried out to ultraviolet ray (UV) irradiation or heating, cooling etc.Therefore,, in the sensor seal cavity impaling at the capturing element by sensor base plate, matrix members of frame and light transmission optical filter, air expands, shrinks.Thereby if the inner air of sensor seal cavity does not discharge to outside, the interior pressure of sensor seal cavity uprises, and has the worry that makes the breakage of light transmission optical filter.
Therefore, in camera module in the past, for example, as one, in Patent Document 2, adopt have by sensor seal cavity and outside link up for ventilative hole (degassed mouthful).
In patent documentation 1, in matrix members of frame, and be bonded in the planar portions of module bodies (upper surface), be provided with the groove of the labyrinth type structure of the inside and outside connection that makes matrix members of frame.In this planar portions, the position coated with adhesive beyond groove, has thereby formed the camera module of degassed mouthful forming by pasting light transmission optical filter (IRCF).
In addition, in patent documentation 2, disclose utilize cementing agent to engage solid-state image pickup element and cover solid-state image pickup element the portion of covering and at solid-state image pickup element and cover the semiconductor device that has formed hollow bulb between portion.In this semiconductor device, in order to prevent, covering the inside surface of portion (in hollow bulb) generation dewfall, being formed with the vent passage being communicated with from hollow bulb to outside at the binding part being formed by binding part agent.
Patent documentation 1: No. 3981348 communique of patent
Patent documentation 2: No. 4378394 communique of patent
But, for camera module itself, along with the miniaturization of the portable terminal of mounting object, expect that further miniaturization is lightening, and realize high pixelation.
In the structure of patent documentation 1, because the planar portions at coated with adhesive is formed with groove, so in the time engaging with module bodies via cementing agent, groove forms with the degree of depth of the influx that presupposes cementing agent in the mode of the cementing agent landfill of not invaded.That is, groove in advance using the cementing agent as coated thick+the degassed mouthful degree of depth after forming and the degree of depth that forms forms, thereby with the amount of this degree of depth correspondingly, the own thickening of the camera module of assembling (uprising), is difficult to realize lightening problem thereby have.In addition, there is the dust of the length suitable with its degree of depth to invade the worry of groove.The dust of invading is attached to the semiconductor capturing element that along with high pixelation size has further diminished, thereby has easy generation easily to become the problem of the larger impact (producing defective by dust) of stain etc. with respect to its pixel.
In addition, in the structure of patent documentation 2, because binding part based on cementing agent forms vent passage, thus need to be in the mode that only forms vent passage with cementing agent at assigned position coated with adhesive, thus bothersome structure become.
Summary of the invention
The present invention completes in view of such aspect, and its object is to provide and can easily and effectively gets both degassed and prevent that dust from flowing into both sides and can realize lightening camera module and the portable terminal with camera.
A mode of camera module of the present invention adopts following structure,, possess: base unit, its have be installed on sensor base plate capturing element, be installed on the sensor substrate and surround the surrounding of above-mentioned capturing element and at the matrix members of frame of the shooting face side opening of above-mentioned capturing element and the light transmission optical filter that covers above-mentioned opening and seal the installing space of above-mentioned capturing element, and module bodies, its storage makes the image of subject at the lens unit of above-mentioned capturing element imaging, and be fixed via tack coat, the cementing agent that this tack coat is applied by the bonded areas of the end face portion of the open side around the above-mentioned capturing element of encirclement in above-mentioned matrix members of frame forms, said lens unit is opposed across above-mentioned light transmission optical filter and above-mentioned capturing element, and the mode connect with above-mentioned matrix members of frame arranges, and carry out the degassed degassed passage portion of above-mentioned installing space, above-mentioned degassed passage portion in above-mentioned end face portion at the region opening near inner side than above-mentioned bonded areas, and, in above-mentioned installing space side, towards the position opening departing to side than above-mentioned capturing element.In addition, the portable terminal with camera of the present invention scheme adopts the structure of the camera module that is assembled with said structure.
The effect of invention is as follows.
According to the present invention, can easily and effectively take into account degassed and prevent that dust from flowing into both sides, and, can realize lightening.
Accompanying drawing explanation
Fig. 1 is the figure that represents the outward appearance of the camera module of an embodiment of the invention.
Fig. 2 is the exploded view that this camera module is decomposed into two unit.
Fig. 3 is the cut-open view of the A-A line direction of arrow of Fig. 1.
Fig. 4 is the stereographic map of the matrix members of frame of the camera module of an embodiment of the invention.
Fig. 5 is the amplification view of the degassed passage portion of this matrix members of frame shown in Fig. 3.
Fig. 6 is the enlarged drawing of the degassed passage portion of the camera module shown in Fig. 4.
Fig. 7 is the cut-open view that represents the mobile route of the dust of the camera module of present embodiment.
Fig. 8 is the stereographic map that is illustrated in bight path, base unit of the mobile dust in adjusting play.
Fig. 9 is the figure of an example of the more situation of the coated weight of cementing agent of presentation graphs 6 center wall portions.
In figure:
10-main unit, 12-lens unit, 13-lens driving unit, 20-base unit, 21-sensor base plate, 22-matrix members of frame, 22a-peristome, 24-capturing element, 30-light transmission optical filter, 40-tack coat, 50-degassed passage portion, 51-open passageway portion, 52-coniform passage portion, 54-slot part, 55-dust slot part, 56, 57-connection groove section, 60-adjusting play, 100-camera module, 220-frame main body, 221-frame wall portion, 221a-upper surface portion (end face portion), 222-teat, 224-inner side frame board, 241-die terminals, 242-shooting face, 2211-bight.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are at length described.
Fig. 1 is the figure that represents the outward appearance of the camera module 100 of an embodiment of the invention.
Fig. 2 is the stereographic map that camera module 100 is divided into two unit.Camera module 100 is mounted in the electronic unit of the portable terminal with camera such as portable phone.
As shown in Figure 1 and Figure 2, camera module 100 is arranged on an end side of flexible base, board (FPC:Flexible Printed Circuit) 11.Herein, camera module 100 possesses main unit 10 and the lower unit as base unit 20, and this main unit 10 has lens unit 12 and lens driving unit 13.
FPC11 is the printed circuit board that has used the insulated substrate with flexibility, and it is formed as band shape, and an end is connected with the sensor base plate 21 of base unit 20.In the other end of this FPC11, the connector that is connected with portable terminal main body side (diagram is omitted) is installed, via this FPC11, sensor base plate 21 is electrically connected with the substrate of not shown portable terminal main body.
Fig. 3 is the A-A line cut-open view of Fig. 1.
As shown in Figure 3, lens unit 12 has the lens combination 12a being made up of multi-disc lens and these lens combination is contained in to inner lens carrier 12b, makes the image of subject in the sensitive surface imaging of the capturing element 24 of base unit 20.In addition,, at the outer peripheral face of lens carrier 12b, be wound with coil 131.
Return to Fig. 1 and Fig. 2, the desired physical dimension of contrast camera module 100, it is foursquare roughly rectangular-shaped that lens driving unit 13 is while being formed as overlooking.In addition, as shown in Figure 2, in the both sides of the lower side edge of a side of lens driving unit 13, be provided with highlightedly two actuator terminal 13a(that are connected with VCM with reference to Fig. 2).These actuator terminals 13a by scolding tin 13b(with reference to Fig. 1) and be connected with the pad (diagram is omitted) of the sensor base plate 21 of base unit 20, thereby realize the automatic focusing function of camera module 100.
This accommodates the lens driving unit 13 of lens unit 12, main unit 10 engages (with reference to Fig. 2 and Fig. 3) with base unit 20 via tack coat 40.In addition, capturing element 24(is installed with reference to Fig. 5 and Fig. 6 in inside) base unit 20(specifically, matrix members of frame 22) in, the upper mounting of the layer lens driving unit 13 of the cementing agent applying at an upper portion thereof.And, adjusting after optical axis position, by adhesive cures being fixed via the overall operation of heating.
In base unit 20, have capturing element 24(with reference to Fig. 5 and Fig. 6 by covered internal configurations by light transmission optical filter 30) matrix members of frame 22, to install capturing element 24 space (installing space), sensor seal cavity seals.
As shown in FIG. 2 and 3, base unit 20 possesses overleaf with FPC11(with reference to Fig. 1, Fig. 2) sensor base plate 21, matrix members of frame 22, capturing element 24, the light transmission optical filter 30 being connected and the tack coat 40 that light transmission optical filter 30 is bonded in to matrix members of frame 22.
In addition, the tack coat 40 shown in Fig. 2 is using the state representation of the curing shape of the state as bondd light transmission optical filter 30 and matrix members of frame 22.In addition, although not shown, base unit 20 also possesses the CSP parts and the circuit block etc. that are installed on sensor base plate 21 and are impaled by matrix members of frame 22.
Capturing element 24 is CCD(Charge Coupled Device) image sensor or CMOS(Complementary metal Oxide Semiconductor) solid-state image pickup element such as image sensor.Capturing element 24 is electric signal by the converting optical signals that is imaged on the subject picture on sensitive surface by lens unit 12, and exports to the signal processing part (DSP:Digital Signal Processor omits diagram) of portable terminal main body side.
Capturing element 24 is arranged on the substantial middle of sensor base plate 21.Capturing element 24 is for example being fixed to (chips welding) after sensor base plate 21 by resin system cementing agent, with the metal wire connection electrode of (wire bond) capturing element 24 and the connection pad of sensor base plate 21, thereby be installed on sensor base plate 21.
Matrix members of frame 22 is installed on sensor base plate 21 by mode with the periphery that surrounds this capturing element 24.
Fig. 4 is the stereographic map of matrix members of frame 22.Matrix members of frame 22 shown in Fig. 2 and Fig. 4 is following box-shaped bodies,, cover the periphery of capturing element 24, and by being formed at the peristome 22a of central portion, (shooting face 242 sides of the capturing element 24 representing in Fig. 3) opening above capturing element 24.This matrix members of frame 22 is configured as convex form in the situation that of side-looking, along the periphery of sensor base plate 21 and bond by resin system cementing agent.In addition, matrix members of frame 22 is now in the time overlooking, to be roughly foursquare framework.
Matrix members of frame 22 possesses and the in the situation that of side-looking, is configured as the frame main body 220 of convex form (with reference to Fig. 5～Fig. 7), and inner side frame board 224 and the degassed passage portion 50 of surrounding peristome 22a outstanding from the top of the outer edge of the interior side direction capturing element 24 of frame main body 220.
For frame main body 220, by the outstanding upper surface teat 222 lower than frame wall portion 221 of cubic lateral surface of the frame wall portion 221 from frame shape, and in the time of side-looking, be convex form (with reference to Fig. 3).On the top of the frame main body 220 of this convex form, mounting lens driving unit 13.Lens driving unit 13(is with reference to Fig. 1 and Fig. 2) bottom (lower surface 135) via tack coat 40(with reference to Fig. 1～Fig. 3) be fixed on upper surface portion (end face portion) 221a.Tack coat 40 by be coated on frame main body 220 frame wall portion 221 upper surface portion (end face portion) 221a frame shape bonded areas cementing agent form.
Thus, lens driving unit 13 is fixed on upper surface portion 221a via the tack coat 40 of cementing agent.Thus, lens unit 12 is surrounded by lens driving unit 13 and matrix members of frame 22 in the mode of sealing.
In addition, as shown in FIG. 2 and 3, tack coat 40 is sandwiched between the upper surface portion 221a of the frame wall portion 221 of frame main body 220 and lower surface 135, and this lower surface 135 surrounds lens unit 12 in lens driving unit 13.Thus, in camera module 100, at sticky junction layer 40(, the bonded areas of upper surface portion 221a) near the region of inner side, be formed for adjusting the corresponding space of the thickness with tack coat 40 of optical axis position, i.e. adjusting play 60.In addition, the thickness G of adjusting play 60 is preferably 0 < G≤100 μ m.
Inner side frame board 224, in matrix members of frame 22, is enclosed in the part (peristome 22a) of the upper opening of capturing element 24., inner side frame board 224 is configured in than the upper surface of frame main body 220, is specifically the low position of upper surface portion 221a of frame wall portion 221.Thus, as matrix members of frame 22 entirety, be the recessed shape of middle body while overlooking, inner side frame board 224 forms the bottom surface sections of recessed shape.In addition in this recessed part, can freely insert, the bottom of the lens unit 12 of main unit 10.
At the upper surface of this inner side frame board 224, the mode of the peristome 22a being impaled by inner side frame board 224 with obturation is pasted light transmission optical filter 30.Herein, light transmission optical filter 30 is pasted on inner side frame board 224 by cementing agent, thus closed peristome 22a.
Light transmission optical filter 30 is IR cutoff filters (also referred to as " IRCF ") of removing the light signal in IR region, and it is disposed at the top of capturing element 24.This light transmission optical filter 30 is specifically inner side frame board 224 by being pasted on matrix members of frame 22(), cover peristome 22a, and divide the sensor seal cavity S as the installing space of capturing element 24 by sensor base plate 21 and matrix members of frame 22, and become sealing state.The part of in addition, dividing such sensor seal cavity S is also known as sensor package (sensor pkg).
This sensor sealing S only via be located at matrix members of frame 22 degassed passage portion 50 and with outside, the top of the upper surface portion 221a of matrix members of frame 22 is communicated with.
Herein, as shown in Figure 4, degassed passage portion 50 arranges in the bight of matrix members of frame 22.Particularly, degassed passage portion 50 is arranged on the position of leaving from the shooting face 242 of capturing element 24, is arranged on part, the i.e. bight of the wall thickness that can guarantee regulation in the frame wall portion 221 of matrix members of frame 22.
Herein, degassed passage portion 50 arranges by the mode of the inner side in a bight 2211 in the bight of incision upper surface portion 221a.
This degassed passage portion 50 is at length described.Fig. 5 is the amplification view of the degassed passage portion 50 of the matrix members of frame 22 shown in Fig. 3, and Fig. 6 is the enlarged drawing of the degassed passage portion 50 of Fig. 4.
Herein, degassed passage portion 50 is at frame main body 220(specifically, rectangular box-like frame wall portion 221) the through hole that arranges in the mode connecting abreast with optical axis direction of bight.
The opening of the sensor seal cavity S side of coniform passage portion 52 in sensor seal cavity S, be disposed at the outside of capturing element 24 region directly over, be positioned at the position that the edge part (die terminals 241) from capturing element 24 leaves to side., coniform passage portion 52 is in sensor seal cavity S side, towards the position opening departing to side than capturing element 24.In addition, the inner peripheral surface of this coniform passage portion 52 is towards the hole enlargement of sensor seal cavity S side, thereby in sensor seal cavity S, can make broad area and the adjusting play 60 of the side of the capturing element 24 departing from from capturing element 24 be communicated with.
, coniform passage portion 52 is configured in the position of leaving from the shooting face 242 of capturing element 24 on matrix members of frame 22.Degassed passage portion 50 is in sensor seal cavity S, the position of leaving from shooting face 242 in the side of capturing element 24,, in the region that does not configure capturing element 24 near outside than capturing element 24, upper surface portion 221a and sensor seal cavity S are communicated with.
In addition, the position at upper surface portion 221a opening (region) in open passageway portion 51 as shown in Figure 6, at upper surface portion 221a, and is provided with the slot part 54, the dust slot part (dust stockpiles groove) 55 that surround open passageway portion 51 around it.
In addition, this slot part 54 is connected with the connection groove section 56,57 that the inner edge along upper surface portion 221a forms.These connection groove section 56,57 are identical with slot part 54, prevent that the cementing agent that is coated on upper surface portion 221a is to open passageway portion 51 side flow.
From the upper face side of recess center side, matrix members of frame 22 of matrix members of frame 22 flows into, utilize this dust slot part 55 at dust, open passageway portion 51 is front to be stockpiled it entering to make this dust.
For the manufacture of this camera module 100, first, independent assembling is made up of lens unit 12 and lens driving unit 13 respectively main unit 10 and base unit 20.
And, at the rectangular box-like upper surface portion 221a coated with adhesive of base unit 20 center wall portions 221.Thus, tack coat 40 is set on upper surface portion 221a.
Like this, load lens driving unit 13 by the tack coat 40 via cementing agent on upper surface portion 221a, form the corresponding adjusting play 60 of thickness with tack coat 40.Adjusting play 60 is gaps that θ, XY for carrying out lens adjust, so that with respect to the capturing element 24 of base unit 20 sides, adjusts position, the inclination of the lens of the lens unit 12 that lens driving unit 13 keeps.
After using this adjusting play 60 to carry out adjusting, by making adhesive cures via the overall operation of heating camera module 100, lens driving unit 13 is fixed on to base unit 20 and assembling camera module 100.
Action effect to degassed passage portion 50 in the camera module 100 forming like this describes.
In camera module 100, as shown in Figure 5, at the matrix members of frame 22 of the base unit 20 via tack coat 40 stationary body unit 10, be provided with degassed passage portion 50, this degassed passage portion 50 is communicated with the adjusting play 60 of the top of sensor seal cavity S and matrix members of frame 22.Adjusting play 60 is continuous with the space S 2 of the upper face side of light transmission optical filter 30.
Thus, the sensor seal cavity S in matrix members of frame 22 is communicated with adjusting play 60 in camera module 100 via degassed passage portion 50, and continuous with the space S 2 of the upper face side of light transmission optical filter 30 via adjusting play 60.
Like this, in camera module 100, via degassed passage portion 50, can carry out the discrepancy of the air in sensor seal cavity S.Thus, can prevent from changing caused physical injury because of the caused unfavorable condition of interior pressure that the driving of lens unit 12 produces in sensor seal cavity S, dewfall or the pressure that particularly humiture changes, external pressure changes in caused sensor pkg.
In addition, as shown in Figure 7, in camera module 100, in the situation that having driven lens unit 12, as shown in arrow F1, have the dust of several μ m sizes from lens unit 12(specifically, lens barrel) and lens driving unit 13 between situation about falling to light transmission optical filter 30 sides.
And the dust that the space S 2 on light transmission optical filter 30 falls enters in adjusting play 60.In addition, adjusting play 60 is arranged on the part (bight being impaled by main unit 10, base unit 20 and tack coat 40) at the position that surrounds light transmission optical filter 30, and be adjusted to tens of μ m, extremely low thereby dust is invaded probability in this adjusting play 60.
Fig. 8 is the stereographic map that is illustrated in the bight 2211 path, base unit 20 of the mobile dust in adjusting play 60.In addition,, in this Fig. 8, for ease of explanation, in camera module 100, omitted the main unit 10 on the top of adjusting play 60.
In camera module 100, for also bring into play the degassed passage portion 50 of function as being communicated with this adjusting play 60 and sensor seal cavity S degassed mouthful for, make the opening of sensor seal cavity S side be positioned at the side of capturing element 24., the position that the opening of the sensor seal cavity S side of degassed passage portion 50 further leaves at the shooting face 242 from capturing element 24, to sensor base plate 21 side openings.
Thus, dust passes through adjusting play 60(by arrow F2 direction indication), the place falling as the dust entering in degassed passage portion 50 becomes outside the die terminals 241 of capturing element 24 as shown in the arrow F3 of Fig. 7.Thereby, can make the probability of adhesive dust on the shooting face 242 of capturing element 24 be roughly 0, namely, even the in the situation that of in dust flow sensor seal cavity S, also can prevent that dust is attached to defective that shooting face 242(what is called is caused by dust), thus high quality image can be obtained.
Like this, in camera module 100, can easily and effectively take into account degassed in sensor seal cavity S and prevent that dust from flowing into both sides.
In addition, in camera module 100, degassed passage portion 50 is used the gap area (adjusting play 60) of being divided by tack coat 40 between lens driving unit 13 and base unit 20, and the space S 2 of the upper face side of sensor seal cavity S and light transmission optical filter 30 is communicated with.,, in order to carry out the degassed of sensor seal cavity S, do not need the stream that connects degassed passage portion 50 and space S 2 is set in addition, by making it, in the optical axis of lens unit 12 is adjusted the thickness range of needed adjusting play 60, to realize lightening.
In addition, at the upper surface portion 221a of matrix members of frame 22, and around degassed passage portion 50, be provided with slot part 54, connection groove section 56,57.
Thus, as shown in Figure 9, when when being coated in cementing agent fixing base unit 20 on upper surface portion 221a and main unit 10, cementing agent is by conquassation, even to degassed passage portion 50 side flow, be also directed to slot part 54, connection groove section 56,57, thereby can not arrive degassed passage portion 50.Thus, can prevent the inflow of cementing agent to degassed passage portion 50.
In addition, with degassed passage portion 50 adjacency, and than degassed passage portion 50 near the center side of matrix members of frame 22, i.e. optical axis side, be provided with dust slot part 55.For this dust slot part 55, though dust from the space S 2 lateral adjustment gaps 60 of the upper face side of light transmission optical filter 30 interior flowing (as the arrow F2 of Fig. 7 and Fig. 8 represents), also can make this dust enter that open passageway portion 51 is front to be stockpiled it.
In addition,, for the invention described above, only otherwise depart from purport of the present invention, can carry out various changes, and the present invention relates to the content of this change certainly.
Utilizability in industry
Camera module of the present invention has following effect,, can easily and effectively take into account degassed and prevent that dust from flowing into both sides, and can realize lightening, as for portable phone, portable game terminal, mobile information terminal (PDA:Personal Digital Assistant), be equipped with the module of the portable terminal such as smart mobile phone of the functions such as personal computer or PDA at portable phone and useful.
Claims (6)
1. a camera module, is characterized in that, possesses:
Base unit, its have be installed on sensor base plate capturing element, be installed on the sensor substrate and surround the surrounding of above-mentioned capturing element and at the matrix members of frame of the shooting face side opening of above-mentioned capturing element and the light transmission optical filter that covers above-mentioned opening and seal the installing space of above-mentioned capturing element; And
Module bodies, its storage makes the image of subject at the lens unit of above-mentioned capturing element imaging, and be fixed via tack coat, the cementing agent that this tack coat is applied by the bonded areas of the end face portion of the open side around the above-mentioned capturing element of encirclement in above-mentioned matrix members of frame forms, said lens unit is opposed across above-mentioned light transmission optical filter and above-mentioned capturing element
And the mode connect with above-mentioned matrix members of frame arranges and carries out the degassed degassed passage portion of above-mentioned installing space,
Above-mentioned degassed passage portion in above-mentioned end face portion at the region opening near inner side than above-mentioned bonded areas, and, in above-mentioned installing space side, towards the position opening departing to side than above-mentioned capturing element.
2. camera module according to claim 1, is characterized in that,
End face portion at above-mentioned matrix members of frame is provided with slot part, and this slot part is separated region and the above-mentioned bonded areas of above-mentioned inner side of the opening that is provided with above-mentioned degassed passage portion.
3. camera module according to claim 1 and 2, is characterized in that,
In the region of the above-mentioned inner side of above-mentioned end face portion, and stockpile groove being provided with dust than above-mentioned opening near inner side.
4. according to the camera module described in claim 1～3 any one, it is characterized in that,
The inner peripheral surface of above-mentioned degassed passage portion in above-mentioned matrix members of frame towards the hole enlargement of above-mentioned installing space side.
5. according to the camera module described in claim 1～4 any one, it is characterized in that,
Above-mentioned degassed passage portion is formed at the bight of above-mentioned matrix members of frame.
6. the portable terminal with camera, is characterized in that,
Be assembled with the camera module described in claim 1～5 any one.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012230744A JP6079124B2 (en) | 2012-10-18 | 2012-10-18 | Camera module and mobile terminal with camera |
| JP2012-230744 | 2012-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103777437A true CN103777437A (en) | 2014-05-07 |
| CN103777437B CN103777437B (en) | 2018-04-10 |
Family
ID=50569852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310487662.1A Active CN103777437B (en) | 2012-10-18 | 2013-10-17 | Camera module and the portable terminal with camera |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6079124B2 (en) |
| CN (1) | CN103777437B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105022204A (en) * | 2015-08-07 | 2015-11-04 | 深圳市世尊科技有限公司 | Camera module for mobile terminal and mobile terminal |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208638454U (en) * | 2018-08-08 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | Lens module |
| CN114070962B (en) * | 2020-07-30 | 2024-04-05 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and assembly method of photosensitive assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1916682A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Module of digital camera lens |
| CN2914517Y (en) * | 2006-01-16 | 2007-06-20 | 毅嘉电子（苏州）有限公司 | Image module of soft board attaching photographic chip |
| US20100149410A1 (en) * | 2008-12-11 | 2010-06-17 | Shinko Electric Industries Co., Ltd. | Electronic component apparatus |
| JP2012124633A (en) * | 2010-12-07 | 2012-06-28 | Konica Minolta Advanced Layers Inc | Imaging apparatus and portable terminal |
| US20120229701A1 (en) * | 2011-03-07 | 2012-09-13 | Flextronics Ap, Llc | Camera module with protective air ventilation channel |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101711A (en) * | 2003-09-22 | 2005-04-14 | Renesas Technology Corp | Solid state imaging device and its manufacturing method |
| JP2008135983A (en) * | 2006-11-28 | 2008-06-12 | Citizen Miyota Co Ltd | Solid-state imaging device |
-
2012
- 2012-10-18 JP JP2012230744A patent/JP6079124B2/en active Active
-
2013
- 2013-10-17 CN CN201310487662.1A patent/CN103777437B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1916682A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Module of digital camera lens |
| CN2914517Y (en) * | 2006-01-16 | 2007-06-20 | 毅嘉电子（苏州）有限公司 | Image module of soft board attaching photographic chip |
| US20100149410A1 (en) * | 2008-12-11 | 2010-06-17 | Shinko Electric Industries Co., Ltd. | Electronic component apparatus |
| JP2012124633A (en) * | 2010-12-07 | 2012-06-28 | Konica Minolta Advanced Layers Inc | Imaging apparatus and portable terminal |
| US20120229701A1 (en) * | 2011-03-07 | 2012-09-13 | Flextronics Ap, Llc | Camera module with protective air ventilation channel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105022204A (en) * | 2015-08-07 | 2015-11-04 | 深圳市世尊科技有限公司 | Camera module for mobile terminal and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103777437B (en) | 2018-04-10 |
| JP6079124B2 (en) | 2017-02-15 |
| JP2014082702A (en) | 2014-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7061130B2 (en) | Imaging module and its mold photosensitive assembly and manufacturing method, as well as electronic equipment | |
| JP4852535B2 (en) | Imaging device | |
| KR102195988B1 (en) | Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device | |
| JP2007142042A (en) | Semiconductor package, manufacturing method thereof, semiconductor module, and electronic equipment | |
| CN101326811A (en) | Wafer based camera module and method of manufacture | |
| CN103765865A (en) | Imaging element module and method for manufacturing same | |
| JP2003347531A (en) | Image sensor module and its manufacturing method | |
| US10243014B2 (en) | System-in-package image sensor | |
| US20100002107A1 (en) | Solid-state image pickup apparatus and manufacturing method thereof | |
| US9386199B2 (en) | Camera module | |
| JP2006245246A (en) | Solid state imaging apparatus | |
| US20140252522A1 (en) | Camera module | |
| JP2008277593A (en) | Circuit board, optical device employing the same, camera module, and manufacturing method for the circuit board | |
| CN103777437A (en) | Camera module and portable terminal with camera | |
| US20200043965A1 (en) | Module, method for manufacturing module, and electronic device | |
| EP3518032B1 (en) | Camera module, manufacturing method, and electronic device | |
| JP2013110593A (en) | Camera module | |
| WO2011114847A1 (en) | Imaging device and portable terminal | |
| KR100730062B1 (en) | Camera module having improved noise characteristics | |
| KR100769713B1 (en) | Camera module package | |
| JP2005176117A (en) | Imaging apparatus | |
| JP2007329813A (en) | Solid-state imaging apparatus and imaging apparatus provided with the solid-state imaging apparatus | |
| KR101470012B1 (en) | Camera Module | |
| KR20110080344A (en) | Camera module having impurities preventing apparatus | |
| KR101026830B1 (en) | Camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |