CN103773226A - Hydrophobic solution and method for solving slurry sagging of chip element outer electrode - Google Patents

Hydrophobic solution and method for solving slurry sagging of chip element outer electrode Download PDF

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CN103773226A
CN103773226A CN201310712504.1A CN201310712504A CN103773226A CN 103773226 A CN103773226 A CN 103773226A CN 201310712504 A CN201310712504 A CN 201310712504A CN 103773226 A CN103773226 A CN 103773226A
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hydrophobic
outer electrode
volume
treatment
electrode
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CN103773226B (en
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杨日章
王清华
陈先仁
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Shenzhen Sunlord Electronics Co Ltd
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Abstract

The invention discloses a hydrophobic solution and a method for solving slurry sagging of a chip element outer electrode. The hydrophobic solution comprises the following components in percentage by volume: 0.5-8 percent of octyl triethoxysilane, 1.0-5.0 percent of ethyl orthosilicate, 85-98 percent of isopropanol, 0.1-0.4 percent of hydrochloric acid, and 0.4-2.0 percent of glacial acetic acid, wherein the volume percentage concentration of glacial acetic acid is less than or equal to 2 percent, and the volume percentage concentration of hydrochloric acid is less than or equal to 4 percent. The chip element used for manufacturing an outer electrode is soaked in the hydrophobic solution for a period before the outer electrode is manufactured, so that the outer surface of the element is coated and covered with the hydrophobic solution, the soaked element is dried in a blowing manner, and a hydrophobic coating is formed on the surface of the element, the electrode slurry is applied to the upper electrode, so that the phenomenon of sagging, climbing and the like can be prevented, and occurrence of a crescent electrode is avoided.

Description

A kind of method of hydrophobic sol and solution slice component outer electrode slurry sagging
Technical field
The present invention relates to hydrophobic sol and adopt hydrophobic sol to solve the method for slice component outer electrode slurry sagging.
Background technology
In recent years, along with being widely used of chip components and parts, and its various aspects of performance and appearance requirement are also tending towards to variation, some bad order of chip components and parts restricts again some electrical property conversely simultaneously.Such as, chip components and parts outer electrode normally forms with physical mechanical mode dip-coating electrode slurry, electrode slurry easily soaks at product surface, spreads, climbs, sagging, will form semi-moon shaped outer electrode (being crescent moon electrode) after curing molding, causes product appearance, electrically bad.Crescent moon electrode can produce point discharge effect at electroplating process, causes coating extend too fast and climb plating to magnet, and when serious, two ends outer electrode links together and causes element short circuit; Crescent moon electrode can cause product stray capacity to increase, thereby affects product electrical property.
Traditional result of the above problems comprises: 1), by improving slurry thixotropy index, viscosity, adjust dip-coating parameter, cost plenty of time and material resources cost, not only effect significantly and consistence, reproducibility poor; 2) by plasma treatment to components and parts modifying surface, make that electrode slurry is difficult for soaking at product surface, spreads, climbs, sagging, thereby it is bad to solve crescent moon electrode.But these methods need spend high equipment, raw material and energy cost, and the not easy operation control of plasma treatment process complexity.
Summary of the invention
The object of the invention is to propose a kind of hydrophobic sol and adopt hydrophobic treatment to solve the method for slice component outer electrode slurry sagging, have to overcome existing method the problem that processing cost is high, complex process is difficult for manipulation.
Hydrophobic sol provided by the invention, comprises following component:
Figure BDA0000443113790000011
Above per-cent is volume percent, and wherein, the concentration expressed in percentage by volume of described Glacial acetic acid is less than or equal to 2%, and the concentration expressed in percentage by volume of described hydrochloric acid is less than or equal to 4%.
The method of solution slice component outer electrode slurry sagging provided by the invention, is included in to make before outer electrode the element of outer electrode to be produced is carried out to following pre-treatment:
S1, hydrophobic treatment: the element of outer electrode to be produced is soaked and is submerged in completely in described hydrophobic sol, so that the outside surface of described element is covered parcel by described hydrophobic sol, 0.5%~8% the octyl triethoxyl silane that described hydrophobic sol comprises that per-cent by volume measures, 1.0%~5.0% tetraethoxy, 85%~98% Virahol, 0.1%~0.4% hydrochloric acid and 0.4%~2.0% Glacial acetic acid, the concentration expressed in percentage by volume of wherein said Glacial acetic acid is less than or equal to 2%, and the concentration expressed in percentage by volume of described hydrochloric acid is less than or equal to 4%;
S2, dry up: the element of crossing through step S1 hydrophobic treatment is dried up below at 300 ℃.Exceed 300 ℃, hydrophobic film layer is easily destroyed, thereby while causing follow-up making outer electrode, still occurs electrode slurry sagging phenomenon.
Find by analysis, electrode slurry soaks at product surface, spreads, climbs, the major cause of sagging is, electrode slurry has wetting ability, and product surface also often has certain wetting ability.Method of the present invention, the element of outer electrode to be produced is through hydrophobic treatment and after drying up, form one deck hydrophobic film layer on surface, be coated with the element of hydrophobic film layer, again in the top electrode coated electrode slurry with make outer electrode, due to the effect of hydrophobic film layer, the hydrophilic electrode slurry that is coated in upper end electrode can be mutually not wetting with element surface, there will not be the phenomenon of diffusion, sagging, and the hydrophobic film layer that the present invention's solution used forms can be eliminated completely in outer electrode sintering processes process, do not affect subsequent handling, do not affect the performance of element yet.
Preferably, in step S1, the soak time of described element in described hydrophobic sol is 5-10min, after having soaked, pours described hydrophobic sol into sealed vessel.If soak time is lower than 5min, be difficult to form effective hydrophobic film layer, effect is undesirable, reaches perfect condition after 5min, hydrophobic sol consumption no significant difference in 5-10min, after the time exceedes 10min, the remarkable hydrophobic film layer effect increasing but form of hydrophobic sol consumption meeting is constant.After immersion completes, pour hydrophobic sol in returnable sealed storage, to avoid its loss through volatilization, the hydrophobic sol of recovery can be recycled and can not affect and improve effect.
Preferably, in step S2, the mode drying up is: pour described element into tilting and dry up in basket and dry up below at 40 ℃ with 60-100r/min rotating speed.Excess Temperature can cause product to be difficult for disperseing, to separate and bond agglomerating; Adopt tilting to dry up basket and dry up with 60~100r/min rotating speed, make in the process drying up, element can fully roll, disperse, and avoids cohering agglomerating.
Preferably, described pre-treatment also comprises: S3, grind chamfering: the element after drying up in step S2 is placed in to chamfering tank, and adds and 1/4~3/4 grinding medium of the water of element same volume and component size, adopt beveler to grind chamfering.To remove element hydrophobic film layer seamed edge.
Preferably, described beveler is planet beveler, and with the rotating speed of 80-120r/min to element grinding chamfering 5-8min.Planet beveler possesses rotation and revolution function, and its chamfering efficiency is high, good uniformity.
Preferably, described pre-treatment also comprises: S4, separation: after completing steps S3, the screen cloth of the order number that employing and element, described grinding medium size match in water by described grinding medium and product separation.
Preferably, described pre-treatment also comprises: S5, oven dry: will separate the element obtaining through step S4 300 ℃ of following oven dry.Exceed 300 ℃, hydrophobic film layer is easily destroyed, thereby while causing follow-up making outer electrode, still occurs electrode slurry sagging phenomenon.
The method of solution slice component outer electrode slurry sagging provided by the invention, compared with prior art, at least there is following beneficial effect: as long as adopt hydrophobic sol to carry out pre-treatment to the element of outer electrode to be produced before making outer electrode, make element surface be coated last layer hydrophobic film layer, after dry in the time that coated electrode slurry is made outer electrode, there is the infiltration that hydrophilic electrode slurry just can not appear at element surface again, diffusion, sagging and climbing, prevent from forming crescent moon electrode, not only attractive in appearance but also avoided the phenomenons such as the element short circuit that may cause because of crescent moon electrode to occur, guarantee the electrical property that slice component is good, and have simple to operate with respect to existing method, realize the advantage that cost is low.
Accompanying drawing explanation
Fig. 1 is the outer electrode schematic diagram directly forming after undressed slice component upper end electrode coated electrode slurry;
Fig. 2 adopts hydrophobic sol provided by the invention to process the outer electrode schematic diagram forming after coated electrode slurry again.
Embodiment
Preferred embodiment the invention will be further described to contrast accompanying drawing combination below.
In the time making the outer electrode of slice component, normally coated electrode slurry forms outer electrode, because element surface is wetting ability, and electrode slurry also belongs to hydrophilic fluid, after electrode slurry is applied up, at easily wetting, diffusion, sagging and climb of element surface, thereby form the element with crescent moon electrode 100 as shown in Figure 1, easily cause electrically bad.
For this reason, the invention provides a kind of hydrophobic sol that adopts the slice component of outer electrode to be produced is carried out to pre-treatment, make element surface form one deck hydrophobic film layer, to solve the technical problem of electrode slurry sagging, to avoid the formation of crescent moon electrode.
Embodiment 1
The hydrophobic sol that the present embodiment adopts is produced as follows:
Measure following component according to volume percent:
Octyl triethoxyl silane 0.5%;
Tetraethoxy 1.0%;
Virahol 85.0%;
Hydrochloric acid 0.1%;
Glacial acetic acid 0.4%;
Wherein the concentration expressed in percentage by volume of Glacial acetic acid is 1%, and the concentration expressed in percentage by volume of hydrochloric acid is 1.5%, then all aforesaid components are joined in sealed vessel under ambient temperature and moisture environment, leave standstill 6 hours stand-by.
In accordance with the following methods, adopt the above-mentioned hydrophobic sol configuring to carry out following pre-treatment to the element of outer electrode to be produced:
S1, hydrophobic treatment: the slice component of outer electrode to be produced poured in hydrophobic treatment container and spread out, guarantee that hydrophobic sol flooded element completely, soaking 5min, after having soaked, hydrophobic sol being poured into and in the returnable of sealing, waited to continue use;
S2, dry up: dry up in basket pouring tilting into through the element of step S1 hydrophobic treatment, the condition blowing down 60min with the rotating speed of 60r/min at 300 ℃, makes element fully dry;
S3, grinding chamfering: the element drying up through step S2 is put into a 5L chamfering tank, add again and 1/4 grinding medium (as the aluminum oxide of φ 3) of the water of the same volume of element and component size, adopt planet beveler to grind chamfering 5min with the rotating speed of 80r/min;
S4, separation: after completing steps S3, the screen cloth that is used in the order number that element, grinding medium size match separates grinding medium in water with element;
S5, oven dry: step S4 is separated to the element obtaining and under the condition of 100 ℃, dry.
After above-mentioned five steps pre-treatment, then at upper end electrode place coated electrode slurry, electrode slurry can not infiltrate again, diffusion, sagging and climb, and as shown in Figure 2, its outer electrode 200 no longer includes crescent moon electrode to the slice component producing.
Embodiment 2
The hydrophobic sol that the present embodiment adopts is produced as follows:
Measure following component according to volume percent:
Octyl triethoxyl silane 4.5%;
Tetraethoxy 3.0%;
Virahol 91.5%;
Hydrochloric acid 0.2%;
Glacial acetic acid 1.2%;
Wherein the concentration expressed in percentage by volume of Glacial acetic acid is 1.5%, and the concentration expressed in percentage by volume of hydrochloric acid is 2.5%, then all aforesaid components are joined in sealed vessel under ambient temperature and moisture environment, leave standstill 6 hours stand-by.
In accordance with the following methods, adopt the above-mentioned hydrophobic sol configuring to carry out following pre-treatment to the element of outer electrode to be produced:
S1, hydrophobic treatment: the slice component of outer electrode to be produced poured in hydrophobic treatment container and spread out, guarantee that hydrophobic sol flooded element completely, soaking 7.5min, after having soaked, hydrophobic sol being poured into and in the returnable of sealing, waited to continue use;
S2, dry up: dry up in basket pouring tilting into through the element of step S1 hydrophobic treatment, the condition blowing down 75min with the rotating speed of 80r/min at 40 ℃, makes element fully dry;
S3, grinding chamfering: the element drying up through step S2 is put into a 5L chamfering tank, add again and 1/2 grinding medium (as the aluminum oxide of φ 3) of the water of the same volume of element and component size, adopt planet beveler to grind chamfering 6.5min with the rotating speed of 100r/min;
S4, separation: after completing steps S3, the screen cloth that is used in the order number that element, grinding medium size match separates grinding medium in water with element;
S5, oven dry: step S4 is separated to the element obtaining and under the condition of 200 ℃, dry.
After above-mentioned five steps pre-treatment, then at upper end electrode place coated electrode slurry, electrode slurry can not infiltrate again, diffusion, sagging and climb, and as shown in Figure 2, its outer electrode 200 no longer includes crescent moon electrode to the slice component producing.
Embodiment 3
The hydrophobic sol that the present embodiment adopts is produced as follows:
Measure following component according to volume percent:
Octyl triethoxyl silane 8.0%;
Tetraethoxy 5.0%;
Virahol 98.0%;
Hydrochloric acid 0.4%;
Glacial acetic acid 2.0%;
Wherein the concentration expressed in percentage by volume of Glacial acetic acid is 2%, and the concentration expressed in percentage by volume of hydrochloric acid is 4%, then all aforesaid components are joined in sealed vessel under ambient temperature and moisture environment, leave standstill 6 hours stand-by.
In accordance with the following methods, adopt the above-mentioned hydrophobic sol configuring to carry out following pre-treatment to the element of outer electrode to be produced:
S1, hydrophobic treatment: the slice component of outer electrode to be produced poured in hydrophobic treatment container and spread out, guarantee that hydrophobic sol flooded element completely, soaking 10min, after having soaked, hydrophobic sol being poured into and in the returnable of sealing, waited to continue use;
S2, dry up: dry up in basket pouring tilting into through the element of step S1 hydrophobic treatment, the condition blowing down 90min with the rotating speed of 100r/min at 25 ℃, makes element fully dry;
S3, grinding chamfering: the element drying up through step S2 is put into a 5L chamfering tank, add again and 3/4 grinding medium (as the aluminum oxide of φ 3) of the water of the same volume of element and component size, adopt planet beveler to grind chamfering 8min with the rotating speed of 120r/min;
S4, separation: after completing steps S3, the screen cloth that is used in the order number that element, grinding medium size match separates grinding medium in water with element;
S5, oven dry: step S4 is separated to the element obtaining and under the condition of 300 ℃, dry.
After above-mentioned five steps pre-treatment, then at upper end electrode place coated electrode slurry, electrode slurry can not infiltrate again, diffusion, sagging and climb, and as shown in Figure 2, its outer electrode 200 no longer includes crescent moon electrode to the slice component producing.
To sum up, adopt hydrophobic sol of the present invention according to method provided by the invention, the slice component of outer electrode to be produced to be carried out after pre-treatment, surface is coated by hydrophobic film layer, coated electrode slurry again, the outer electrode that obtains is smooth, without crescent moon electrode, the phenomenon such as do not have sagging, climb, and carrying out in the process of outer electrode sintering processes, this hydrophobic film layer can be eliminated completely, function on element and characteristic do not produce any impact, and present method cost is low, easy to operate, solve the effective of electrode slurry sagging.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For those skilled in the art, without departing from the inventive concept of the premise, can also make some being equal to substitute or obvious modification, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.

Claims (8)

1. a hydrophobic sol, comprises following component:
Figure FDA0000443113780000011
Above per-cent is volume percent, and wherein, the concentration expressed in percentage by volume of described Glacial acetic acid is less than or equal to 2%, and the concentration expressed in percentage by volume of described hydrochloric acid is less than or equal to 4%.
2. a method that solves slice component outer electrode slurry sagging, is characterized in that: before making outer electrode, the element of outer electrode to be produced is carried out to following pre-treatment:
S1, hydrophobic treatment: the element of outer electrode to be produced is soaked and is submerged in completely in hydrophobic sol, so that the outside surface of described element is covered parcel by described hydrophobic sol, wherein, described hydrophobic sol comprises 0.5%~8% octyl triethoxyl silane, 1.0%~5.0% tetraethoxy, 85%~98% Virahol, 0.1%~0.4% hydrochloric acid and 0.4%~2.0% the Glacial acetic acid of the metering of per-cent by volume, the concentration expressed in percentage by volume of wherein said Glacial acetic acid is less than or equal to 2%, and the concentration expressed in percentage by volume of described hydrochloric acid is less than or equal to 4%;
S2, dry up: the element of crossing through step S1 hydrophobic treatment is dried up below at 300 ℃.
3. method as claimed in claim 2, is characterized in that: in step S1, the soak time of described element in described hydrophobic sol is 5-10min.
4. method as claimed in claim 2, is characterized in that: in step S2, the mode drying up is: pour described element into tilting and dry up in basket and dry up below at 40 ℃ with 60-100r/min rotating speed.
5. the method as described in claim 2 to 4 any one, is characterized in that, described pre-treatment also comprises:
S3, grind chamfering: the element after drying up in step S2 is placed in to chamfering tank, and adds and 1/4~3/4 grinding medium of the water of element same volume and component size, adopt beveler to grind chamfering.
6. method as claimed in claim 5, is characterized in that: described beveler is planet beveler, and with the rotating speed of 80-120r/min to element grinding chamfering 5-8min.
7. method as claimed in claim 6, is characterized in that, described pre-treatment also comprises:
S4, separation: after completing steps S3, employing separates described grinding medium in water with the screen cloth of the order number that element, described grinding medium size match with element.
8. method as claimed in claim 7, is characterized in that, described pre-treatment also comprises:
S5, oven dry: will separate the element obtaining through step S4 300 ℃ of following oven dry.
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN105575831A (en) * 2015-12-21 2016-05-11 深圳顺络电子股份有限公司 Method for manufacturing external electrode of electronic element
CN112316844A (en) * 2020-10-30 2021-02-05 广东风华高新科技股份有限公司 Surface modification solution and application thereof
CN115635385A (en) * 2022-09-30 2023-01-24 广东微容电子科技有限公司 Chamfering method of MLCC

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CN101863625A (en) * 2009-04-17 2010-10-20 信义汽车玻璃(东莞)有限公司 Hydrophobic solution, hydrophobic glass for vehicle and manufacturing method thereof
CN102290239A (en) * 2010-05-19 2011-12-21 株式会社村田制作所 Method for a producing ceramic electronic component

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CN1435392A (en) * 2002-01-26 2003-08-13 福耀玻璃工业集团股份有限公司 Method for making hydrophobic solution and hydrophobic glass
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Publication number Priority date Publication date Assignee Title
CN105575831A (en) * 2015-12-21 2016-05-11 深圳顺络电子股份有限公司 Method for manufacturing external electrode of electronic element
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CN112316844A (en) * 2020-10-30 2021-02-05 广东风华高新科技股份有限公司 Surface modification solution and application thereof
CN115635385A (en) * 2022-09-30 2023-01-24 广东微容电子科技有限公司 Chamfering method of MLCC
CN115635385B (en) * 2022-09-30 2023-06-20 广东微容电子科技有限公司 Chamfering method of MLCC

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