CN103761562B - Double-interface IC card automatic producing device - Google Patents
Double-interface IC card automatic producing device Download PDFInfo
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- CN103761562B CN103761562B CN201410005486.8A CN201410005486A CN103761562B CN 103761562 B CN103761562 B CN 103761562B CN 201410005486 A CN201410005486 A CN 201410005486A CN 103761562 B CN103761562 B CN 103761562B
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Abstract
The invention discloses a kind of manufacture method of double-interface IC card, comprise the following steps: card base to be carried in card foundation trench and the chip being welded with wire is carried on card base; The wire of chip is welded in the chip groove of card base by hot weld; By chips welding in chip groove.The invention also discloses a kind of full automatic production equipment of double-interface IC card.Compare existing double-interface IC card manufacturing process, when being welded in chip groove by the steel wire on chip, the economical and practical hot welding of the present invention replaces the laser bonding that cost is high.By the replacement of technique, be conducive to the technological process of production simplifying double-interface IC card, be conducive to the manufacturing cost reducing double-interface IC card, be conducive to saving production cost.
Description
Technical field
The present invention relates to IC-card and manufacture field, particularly relate to a kind of double-interface IC card manufacture method and automatic producing device thereof.
Background technology
Along with the development of society, the double-interface card with integrated circuit (IC) chip 5 is widely used in life.Along with the increase of the amount of the demand of double-interface card, its processing technology also obtains very fast development.Just current, see figures.1.and.2, the processing technology of smart card mainly contains: manufacture card base 1 and chip 5; By butt-joint operation, one end of steel wire 4 is welded on chip 5; Card base 1 there is the chip groove 2 of milling cutter 3 milling, butt-joint had the chip 5 of steel wire 4 to be placed on card base 1, make the length direction of chip 5 identical with the length direction of chip groove 2 on card base 1; By laser bonding 6, by the conducting medium conducting in the other end of steel wire 4 and Ka Ji 1.Owing to employing this technique of laser bonding 6, make existing manufacture method cost too high, be unfavorable for cost-saving.
Foregoing, only for auxiliary understanding technical scheme of the present invention, does not represent and admits that foregoing is prior art.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of double-interface IC card manufacture method and automatic producing device thereof, is intended to the manufacturing cost of saving double-interface IC card.
For achieving the above object, a kind of double-interface IC card manufacture method provided by the invention, comprises the following steps:
Being carried to by card base in card foundation trench and by the chip being welded with wire is carried on described card base;
The wire of described chip is welded to by hot weld in the chip groove of described card base;
By described chips welding in described chip groove.
Preferably, described the step that the wire of described chip is welded in the chip groove of described chip by hot weld specifically to be comprised:
Between described chip groove and the tin sheet for heat conduction, adhibit quality conductive material is set;
Heat described tin sheet, melt described adhibit quality conductive material, make described wire bonds on institute's chip groove.
Preferably, also comprise after the step in the described chip groove wire of described chip being welded to described card base by hot weld:
Described chip is accommodated in the process of described chip groove, described wire is extruded toward the space between chip and chip groove, described wire is housed in described chip groove completely.
Preferably, described, described chips welding was also comprised before the step in described chip groove:
Revise the position of described chip in described chip groove;
Separately adjust the position of pre-soldering tip by thousand and prewelding process is carried out to revised described chip.
Preferably, separately adjust the position of pre-soldering tip described by thousand and also comprise after the step of prewelding process is carried out to revised described chip:
Detected by the outward appearance of CCD (Chinese full name: charge coupled cell, can be converted into digital signal optical image for CCD, English full name: Charge-coupledDevice) detector to described chip and described card base.
The present invention further provides a kind of double-interface IC card automatic producing device, comprise rotation group, described rotation group comprises rotating disk, the fixture be fixedly arranged on this rotating disk, wherein, described fixture is provided with the card foundation trench for fixing card base, described card base offers chip groove, and described rotating disk can with the vertical curve of its type heart of mistake for axle rotates;
Also comprise the following assembly being sequentially arranged in described rotation group periphery: for described card base is sent into described card foundation trench and by described card base from this card foundation trench be carried to next station remove card group, by be welded with wire chip conveyance to the stay wire groups described card base, be used for described wire bonds to the soldering group in described chip groove, the tangent line group being used for excising excess wire.
Preferably, also comprise the Xi Pian working group for stamping-out and transport tin sheet, this Xi Pian working group comprises the first drive unit, for the mould of tin sheet described in stamping-out, for placing the some Xi Tai of tin sheet and the conveying device for described tin sheet being transported to described some Xi Tai.
Preferably, also comprise the whole line group for being pushed toward the space between described chip and described chip groove by described wire, put and comprise the second drive unit, for drawing and move the suction nozzle of described chip, pushing the whole wire clamp of described wire for described whole group, wherein, described whole wire clamp is positioned at above described card base, and described suction nozzle is positioned at the top of described whole wire clamp.
Preferably, also comprise prewelding group, described prewelding group comprises the 3rd drive unit, pre-soldering tip, for controlling thousand parted hairs of described pre-soldering tip position and the correction folder for revising chip position, wherein, described pre-soldering tip is positioned at the described top revising folder.
Preferably, whether the described chip and Ka Ji also comprised for detecting pre-postwelding meets the CCD test set that subsequent processing requires, described pick-up unit comprises stationary platform and light sensitive device, and described light sensitive device is positioned at directly over described stationary platform.
Compare existing double-interface IC card manufacturing process, when being welded in chip groove by the steel wire on chip, the economical and practical hot welding of the present invention replaces the laser bonding that cost is high.By the replacement of technique, be conducive to the technological process of production simplifying double-interface IC card, be conducive to the manufacturing cost reducing double-interface IC card, be conducive to saving production cost.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of background technology double-interface IC card;
Fig. 2 is the operation schematic diagram be welded to by steel wire in the manufacture method of background technology double-interface IC card in chip groove;
Fig. 3 is the schematic flow sheet of the first embodiment of the manufacture method of double-interface IC card of the present invention;
Fig. 4 is the refinement schematic flow sheet of the step of hot weld welding lead in Fig. 3;
Fig. 5 is the schematic flow sheet of the second embodiment of the manufacture method of double-interface IC card of the present invention;
Fig. 6 is the schematic flow sheet of the 3rd embodiment of the manufacture method of double-interface IC card of the present invention;
Fig. 7 is the schematic flow sheet of the 4th embodiment of the manufacture method of double-interface IC card of the present invention;
Fig. 8 is the structural representation of double-interface IC card automatic producing device of the present invention;
Fig. 9 is the structural representation of the rotation group of double-interface IC card automatic producing device of the present invention;
Figure 10 is the structural representation removing card group of double-interface IC card automatic producing device of the present invention;
Figure 11 is the stay wire groups of double-interface IC card automatic producing device of the present invention and the structural representation of line shearing group;
Figure 12 is the structural representation of the Xi Pian working group of double-interface IC card automatic producing device of the present invention;
Figure 13 is the structural representation of the whole line group of double-interface IC card automatic producing device of the present invention;
Figure 14 is the whole cable clamp structure schematic diagram of the whole line group of double-interface IC card automatic producing device of the present invention;
Figure 15 is the structural representation of the prewelding group of double-interface IC card automatic producing device of the present invention;
Figure 16 is the structural representation of the CCD test set of double-interface IC card automatic producing device of the present invention;
Figure 17 is the operation schematic diagram be welded to by steel wire in the manufacture method of double-interface IC card of the present invention in chip groove;
Figure 18 is the structural representation of the second point tin device of double-interface IC card automatic producing device of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Be described further with regard to technical scheme of the present invention below in conjunction with drawings and the specific embodiments.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The present invention proposes a kind of manufacture method of double-interface IC card.
With reference to the schematic flow sheet that Fig. 3, Fig. 3 are the first embodiment of the manufacture method of double-interface IC card of the present invention.
The invention provides a kind of manufacture method of double-interface IC card, with reference to Fig. 3, in a first embodiment, the manufacture method of this double-interface IC card comprises:
Step S10: card base 101 to be carried in card foundation trench 92 and the chip 105 being welded with wire 104 is carried on card base 101;
First, removing card group 10 is placed in the card foundation trench 92 of rotation group 90 by the card base 101 being milled with chip groove 102 made, card base 101 is fixed on rotating disk 93 by card foundation trench 92, butt-joint has the chip 105 of wire 104 to be carried on card base 101 by stay wire groups 20, in the present embodiment, wire 104 is steel wire 104, makes the free end of the steel wire 104 on chip 105 by the chip groove 102 on card base 101.In chip groove 102, dew has the antenna in card base 101, steel wire 104 and sky linear contact lay.
Step S20: the wire 104 of chip is welded in the chip groove 102 of card base 101 by hot weld;
In the position that steel wire 104 contacts with chip groove 102, by hot welding, steel wire 104 is welded in chip groove 102, makes chip 105 and Ka Ji 101 by steel wire 104 conducting.
Step S30: chip 105 is welded in 102 chip grooves;
Stir chip 105, make chip 105 stand on card base 101, chip 105 is welded with the direction of an object chip groove 102 of steel wire 104; Chip 105 is drawn and is placed in chip groove 102 by chip 105 by sucker, makes chip 105 cover steel wire 104 between chip 105 and chip groove 102 completely.First hot weld process, cold welding process are carried out to chip 105, more whether the chip 105 detected after welding is qualified, then carries out receipts clipping technique to qualified IC-card, completes the manufacture of double-interface IC card.
Comparing existing double-interface IC card manufacturing process, when being welded in chip groove 102 by the steel wire 104 on chip 105, replacing with economical and practical hot welding the laser bonding that cost is high.By the replacement of technique, be conducive to the technological process of production simplifying double-interface IC card, be conducive to the manufacturing cost reducing double-interface IC card, be conducive to saving production cost.
More specifically, as shown in Figure 4, with reference to Figure 17, above-mentioned steps S20 specifically comprises:
Step S21: adhibit quality conductive material is set between chip groove 102 and the tin sheet 107 for heat conduction;
First be placed into by tin bar on tin sheet 107 blanking die 32, mould 32 carries out stamping-out according to the size of welding position in chip groove 102 to tin bar, and the tin sheet 107 after stamping-out is moved on a tin platform 33.In the present embodiment, adhibit quality conductive material is tin cream, and in chip groove 102, on the location point that steel wire 104 contacts with chip groove 102, tin cream and/or some tin device 34 put tin cream on tin sheet 107.
Step S22: heating tin sheet 107, fusing adhibit quality conductive material, makes wire bonds on chip groove;
High temperature sucker 106 is drawn tin sheet 107 and is transported to chip groove 102 by tin sheet 107 from Dian Xitai 33, and the position contacted with chip groove 102 by steel wire 104 covers.High temperature sucker 106, by the tin cream fusing in chip groove 102 and/or on tin sheet 107, makes the antenna conducting in steel wire 104 and chip groove 102 and is fixed in chip groove 102 by steel wire 104.
Present embodiments provide a kind of a kind of method be welded and fixed by hot weld by steel wire 104 on chip 105 in chip groove 102.Tin cream is used for fixing steel wire 104, and by the antenna conducting in steel wire 104 and chip groove 102, tin sheet 107 is for isolating tin cream and high temperature sucker 106, make tin cream can not adhere on high temperature sucker 106, simultaneously, in tin cream fusion process, tin cream compresses by tin sheet 107, makes the firm welding of steel wire 104 and chip groove 102 reliable.The carrying tin sheet 107 of tin sheet 107 and the fusing of tin cream integrate by high temperature sucker 106, by the use of high temperature sucker 106, improve the efficiency of welding process, are conducive to the raising of hot welding efficiency.
Further, the fusing point of conductive material is between 0-150 DEG C, and the fusing point of tin sheet 107 is between 170-190 DEG C, and welding temperature is below 150-165 DEG C.
Particularly, the preferred tin cream of adhibit quality conductive material used, the fusing point of tin cream, at about 145 DEG C, covers the fusing point of the tin sheet 107 in chip groove 102 at about 180 DEG C, and the temperature of high temperature sucker 106 controls between tin cream fusing point and tin sheet 107 fusing point.In welding process, tin sheet 107 drawn by high temperature sucker 106, and move to directly over position that in chip groove 102, steel wire 104 contacts with chip groove 102, then covered by contact position, heat is delivered to tin cream by tin sheet 107 by sucker, is melted by tin cream.Certainly, tin cream also can be that other fusing point is lower than 150 DEG C and the next solid-state conductive material of normal temperature in other embodiments.
In the present embodiment, the fusing point of tin sheet 107 higher than the fusing point of tin cream, for heat trnasfer fusing tin cream provides necessary condition, make high temperature sucker 106 when not directly contact melting material realize welding.
It is the schematic flow sheet of the second embodiment of the manufacture method of double-interface IC card of the present invention according to Fig. 5, Fig. 5.
Second embodiment of the invention proposes a kind of manufacture method of double-interface IC card.On the basis of above-described embodiment, between above-mentioned steps S20 and step S30, also comprise step S40:
S40: chip is accommodated in the process of chip groove, wire is extruded toward the space between chip and chip groove, wire is housed in chip groove completely.
Card base 101 is fixed on the workbench of whole line group 60, avoids driving card base 101 in the process of extruding steel wire 104, make chip 105 can not accurately put into chip groove 102.Chip 105 is drawn by the suction nozzle 64 of whole line group 60 from card base 101, and is moved to directly over chip groove 102 by chip 105, then slowly moves down, finally chip 105 is put into chip groove 102 accurately.Move down in the process of chip groove 102 at chip 105, whole wire clamp 65 in steel wire 104 both sides is toward the space contraction between chip 105 and chip groove 102, steel wire 104 is expressed in this space, ensures that steel wire 104 can not leak outside chip 105 when chip 105 puts into chip groove 102.
When the use of whole wire clamp 65 makes chip 105 put into chip groove 102, the situation that there will not be steel wire 104 to expose, is conducive to the machining precision improving IC-card, is conducive to improving the qualification rate that chip 105 enters groove, thus improves the work efficiency manufacturing IC-card.
With reference to the schematic flow sheet that Fig. 6, Fig. 6 are the 3rd embodiment of the manufacture method of double-interface IC card of the present invention.
Third embodiment of the invention proposes a kind of manufacture method of double-interface IC card.On the basis of above-described embodiment, between above-mentioned steps S40 and step S30, also comprise step S51 and S52:
S51: revise the position of chip 105 in chip groove 102;
Be fixed on by card base 101 on the workbench of prewelding group 70, avoid driving card base 101 in the process revising chip 105 position and prewelding, make the position of chip 105 can not get revising, the position of prewelding is inaccurate.The position that 73 pairs of chip groove 102 chips 105 are pressed from both sides in the correction of prewelding group 70 is revised, and makes chip 105 be arranged in the optimum position of chip groove 102.
S52: separately by thousand 71 adjust the position of pre-soldering tip 74 and prewelding process is carried out to revised chip 105;
Separately 71 respectively position all around in pre-soldering tip 74 surface level is accurately adjusted by two thousand, pre-soldering tip 74 is made to be positioned at directly over chip 105, pre-soldering tip 74 pairs of chips 105 carry out prewelding process, make chip 105 pre-fix in chip groove 102, can not drop in chip groove 102 easily.
Prewelding process makes chip 105 tentatively be fixed with the relative position of chip groove 102, for fixing welding technology below provides basis, position; The use of thousand parted hairs 71 makes the position of prewelding more accurate, is conducive to the precision improving prewelding, is conducive to the success ratio improving prewelding, is of value to being welded and fixed of chip 105.
With reference to the schematic flow sheet that Fig. 7, Fig. 7 are the 4th embodiment of the manufacture method of double-interface IC card of the present invention.
Fourth embodiment of the invention proposes a kind of manufacture method of double-interface IC card.On the basis of above-described embodiment, between above-mentioned steps S52 and step S30, also comprise step S60:
S60: detected by the outward appearance of CCD detector to chip 105 and Ka Ji 101;
Whether detected by the outward appearance of light sensation equipment to IC-card, the antenna seen if there is in card base 101 is exposed at outside chip 105, have steel wire 104 to be exposed at the outside of chip 105, on the position whether chip 105 is suitable in chip groove 102.
In the present embodiment, operation is detected by setting up CCD, the outward appearance of IC-card can be detected before chip 105 is welded in chip groove 102 admittedly, select the IC-card not meeting quality standard in time, Effective selection goes out to need to readjust the IC-card of chip 105 position, effectively decrease the underproof probability of solid postwelding, be conducive to saving production cost.
The present invention further provides a kind of double-interface IC card automatic producing device.
With reference to the structural representation that Fig. 8 to Figure 11, Fig. 8 are double-interface IC card automatic producing device.
In the present embodiment, double-interface IC card automatic producing device comprises rotation group 90, rotation group 90 comprises rotating disk 93, the fixture 91 be fixedly arranged on this rotating disk 93, wherein, fixture 91 is provided with the card foundation trench 92 for fixing card base 101, card base 101 offers chip groove 102, rotating disk 93 can with the vertical curve of its type heart of mistake for axle rotates; Also comprise the following assembly being sequentially arranged in rotation group 90 periphery: for card base 101 being sent into card foundation trench 92 and card base 101 being carried to removing card group 10, being transported by the chip 105 being welded with wire 104 to the stay wire groups 20 card base 101, the tangent line group that is used for wire 104 to be welded to soldering group in chip groove 102, is used for excising excess wire 104 of next station from this card foundation trench 92.
Particularly, as shown in Figs. 8 to 11, in the present embodiment, rotating disk 93 is index plate 93, and index plate 93 is provided with four fixtures 91 for fixing card base 101, and each fixture 91 has card foundation trench 92.Removing card group 10 is transported in card foundation trench 92 by sucker by the card base 101 with chip groove 102, and card base 101 is fixed; Index plate 93 stops after rotating counterclockwise proper angle, and steel wire 104 clamped by the anchor clamp 21 of stay wire groups 20, butt-joint is had the chip 105 of steel wire 104 to be placed on card base 101, makes steel wire 104 and the sky linear contact lay in card base 101; Index plate 93 stops after being rotated counterclockwise certain angle, and soldering group is welded steel wire 104, is welded to by steel wire 104 on the antenna in card base 101; Stop after index plate 93 rotates to an angle counterclockwise again, tangent line group is by other Partial Resections outside steel wire 104 liang of stiff ends; Initial position is got back to after index plate 93 rotates to an angle counterclockwise again, card base 101 is drawn and after rotating to an angle by the sucker removed in card group 10, card base 101 is placed into next station, and meanwhile, a new card base 101 is placed in card foundation trench 92 by another sucker removing card group 10.Four fixtures 91 on index plate 93 work simultaneously.
In the present embodiment, card group 10, stay wire groups 20, soldering group and tangent line group is removed by arranging at index plate 93 periphery, allow index plate 93 rotary operation, simultaneously, multiple fixtures 91 on index plate 93 work simultaneously, are conducive to improving the work efficiency of this part on the antenna that to be welded to by the steel wire 104 on chip 105 in card foundation trench 92.
Further, with reference to Figure 12, also comprise Xi Pian 107 working group 30 for stamping-out and transport tin sheet 107, this Xi Pian 107 working group 30 comprise the first drive unit 31, for stamping-out tin sheet 107 mould 32, for arrange on tin sheet 107 adhibit quality conductive material some tin device 34, for place tin sheet 107 some tin platform 33 and for tin sheet 107 is transported to a conveying device for tin platform 33, wherein, point tin platform 33 is provided with the perforation 35 through this tin platform 33, and some tin device 34 is positioned at the below of perforation 35.
Particularly, as shown in figure 12, in the present embodiment, be placed into by tin bar in tin sheet 107 mould 32, tin sheet 107 mould 32 pairs of tin bars carry out stamping-out.The size of tin sheet 107 is determined according to the area exposing antenna in chip groove 102, guarantees that tin sheet 107 can cover the position of steel wire 104 and sky linear contact lay completely.Tin sheet 107 after stamping-out is moved on a tin platform 33, and the some tin device 34 below some tin platform 33, carries out a tin by the lower surface of perforation 35 pairs of tin sheets 107, be applied to the surface of tin sheet 107 by tin cream.
In the present embodiment, main shaping tin sheet 107 and arrange tin cream on tin sheet 107, by the setting of tin sheet 107 mould 32, conveniently can obtain the tin sheet 107 of preset shape and size, is conducive to the forming efficiency improving tin sheet 107; Tin sheet 107 is placed on a tin platform 33, is conducive to the application of subsequent processing to tin sheet 107.
As shown in figure 18, Figure 18 is the structural representation of the second point tin device 110 of double-interface IC card automatic producing device of the present invention.In the present embodiment, after card base 101 is arranged at card foundation trench 92, point establishes tin cream on the antenna in chip groove 102.Second point tin device 110 comprises: put tin amount in order to reference mark tin device at every turn and put the some tin controller 111 of tin frequency, in order to the tin cylinder 113 of accommodating tin cream, in order to control the 3rd motor 112 that tin cylinder 113 moves up and down and the four-cylinder 114 going out tin action in order to control tin cylinder 113.When card base 101 is arranged at after in card foundation trench 92, calibration spirals and 93 forwards correct position to, 3rd motor 112 controls tin cylinder 113 and moves down to above chip groove 102, and the 4th gas 114 cylinder controls tin cylinder 113 tin, and some tin controller 111 puts tin amount and the some tin frequency of tin according to concrete operating conditions at every turn.
Further, with reference to Figure 13 and Figure 14, also comprise the whole line group 60 for being pushed toward the space between chip 105 and chip groove 102 by wire 104, whole line group comprise the second drive unit, for draw and moving chip 105 suction nozzle 64, push the whole wire clamp 65 of wire 104, wherein, whole wire clamp 65 is positioned at above card base 101, and suction nozzle 64 is positioned at the top of whole wire clamp 65.
Particularly, as shown in Figure 13 and Figure 14, the second drive unit comprises the first cylinder 63, second cylinder 62 and the first motor 61.First motor 61 controls line arranging device and moves down after correct position, second cylinder 62 controls suction nozzle 64 and is drawn by chip 105, and chip 105 is moved to directly over chip groove 102, first motor 61 controls line arranging device and moves down, make chip 105 close in chip groove 102, in the process, the first cylinder 63 controls whole wire clamp 65 and shrinks, and steel wire 104 is shunk.Wherein, whole wire clamp 65 is arranged in Y shape, and when whole wire clamp 65 starts to shrink, whole wire clamp 65 opening is comparatively large, and can be included in Y shape by steel wire 104, along with the movement of whole wire clamp 65, steel wire 104 is contracted in together.
In the present embodiment, by the use of whole wire clamp 65, making chip 105 when being placed in chip groove 102, steel wire 104 can not be allowed to spill chip 105, namely chip 105 can cover steel wire 104 completely.The use of the whole wire clamp 65 of Y shape, makes steel wire 104 can be contracted in together, is conducive to the efficiency improving whole line.
Further, with reference to Figure 15, also comprise prewelding group 70, prewelding group 70 comprises the 3rd drive unit, in advance soldering tip 74, for controlling thousand parted hairs 71 of pre-soldering tip 74 position and the correction folder 73 for revising chip 105 position, wherein, pre-soldering tip 74 is positioned at the top revising folder 73.
Particularly, as shown in figure 15, the 3rd drive unit comprises: the second motor 75 and the 3rd cylinder 72.3rd cylinder 72 controls to revise folder 73 and shrinks, revise the position of chip 105 in chip groove 102, thousand 71 adjust pre-soldering tip 74 position all around separately accurately, control directly over pre-soldering tip 74 to chip 105, second motor 75 controls pre-soldering tip 74 and moves down on chip 105, carries out prewelding to chip 105.
In the present embodiment, the use of thousand parted hairs 71, makes the position of pre-soldering tip 74 be arranged accurately, is conducive to the precision improving prewelding, is conducive to the effect improving prewelding.
Further, with reference to Figure 16, also comprise chip 105 for detecting pre-postwelding and Ka Ji 101 and whether meet the CCD test set 80 that subsequent processing requires, pick-up unit comprises stationary platform 82 and light sensitive device, and light sensitive device is positioned at directly over stationary platform 82.
Particularly, as shown in figure 16, in the present embodiment, the CCD detector 81 of light sensitive device can be model be GF503BASG in other embodiments, can certainly be other CCD light sensation equipment.Card base 101 is arranged in stationary platform 82, and CCD detector 81 pairs of IC-cards detect.
In the present embodiment, by the setting of CCD detector 81, the IC-card of pre-postwelding is detected, effectively decrease the generation of substandard product, improve the qualification rate of IC-card, be conducive to saving production cost.
These are only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize instructions of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a double-interface IC card automatic producing device, it is characterized in that, comprise rotation group, described rotation group comprises rotating disk, the fixture be fixedly arranged on this rotating disk, wherein, described fixture is provided with the card foundation trench for fixing card base, and described card base offers chip groove, and described rotating disk can with the vertical curve of its type heart of mistake for axle rotates;
Also comprise the following assembly being sequentially arranged in described rotation group periphery: for described card base is sent into described card foundation trench and by described card base from this card foundation trench be carried to next station remove card group, by be welded with the chip conveyance of wire to the stay wire groups described card base, be used for by described wire bonds to the soldering group in described chip groove, and for excising the tangent line group of excess wire;
Described rotating disk is index plate, and described index plate is provided with four described fixtures for fixing described card base, and each described fixture has described card foundation trench; Removing card group is transported in described card foundation trench by sucker by the described card base with described chip groove, and described card base is fixed; Described index plate stops after rotating counterclockwise proper angle, and wire clamped by the anchor clamp of stay wire groups, butt-joint is had the chip of wire to be placed on card base, makes the sky linear contact lay of wire and Ka Jinei; Index plate stops after being rotated counterclockwise certain angle, and soldering group is welded wire, by wire bonds on the antenna in card base; Index plate stops after rotating to an angle counterclockwise again, and tangent line group is by other Partial Resections outside wire two stiff end; Get back to initial position after index plate rotates to an angle counterclockwise again, card base is drawn and after rotating to an angle, card base is placed into next station by the sucker removed in card group, and meanwhile, a new card base is placed in card foundation trench by another sucker removing card group; Four fixtures on index plate work simultaneously;
Described double-interface IC card automatic producing device also comprises the Xi Pian working group for stamping-out and transport tin sheet, and this Xi Pian working group comprises the first drive unit, for the mould of tin sheet described in stamping-out, for placing the some Xi Tai of tin sheet and the conveying device for described tin sheet being transported to described some Xi Tai;
Described double-interface IC card automatic producing device also comprises the whole line group for being pushed toward the space between described chip and described chip groove by described wire, described whole line group comprises the second drive unit, for drawing and move the suction nozzle of described chip, pushing the whole wire clamp of described wire, wherein, described whole wire clamp is positioned at above described card base, and described suction nozzle is positioned at the top of described whole wire clamp;
Described second drive unit comprises the first cylinder, the second cylinder and the first motor; Described first Electric Machine Control line arranging device moves down after correct position, described second cylinder controls suction nozzle by chip pick-up, and chip is moved to directly over chip groove, described first Electric Machine Control line arranging device moves down, make chip close in chip groove, in the process, described first cylinder controls whole wire clamp and shrinks, and makes wire contraction; Wherein, described whole wire clamp is that Y shape is arranged, and when described whole wire clamp starts to shrink, whole wire clamp opening is comparatively large, and can be included in Y shape by wire, along with the movement of whole wire clamp, wire is contracted in together.
2. double-interface IC card automatic producing device as claimed in claim 1, it is characterized in that, also comprise prewelding group, described prewelding group comprises the 3rd drive unit, in advance soldering tip, for controlling thousand parted hairs of described pre-soldering tip position and the correction folder for revising chip position, wherein, described pre-soldering tip is positioned at the described top revising folder.
3. double-interface IC card automatic producing device as claimed in claim 2, it is characterized in that, whether the described chip and Ka Ji also comprised for detecting pre-postwelding meets the CCD test set that subsequent processing requires, described pick-up unit comprises stationary platform and light sensitive device, and described light sensitive device is positioned at directly over described stationary platform.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410005486.8A CN103761562B (en) | 2014-01-06 | 2014-01-06 | Double-interface IC card automatic producing device |
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| CN201410005486.8A CN103761562B (en) | 2014-01-06 | 2014-01-06 | Double-interface IC card automatic producing device |
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| CN103761562B true CN103761562B (en) | 2016-03-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104148833B (en) * | 2014-08-01 | 2015-09-30 | 广州市明森机电设备有限公司 | A kind of Double interface intelligent card chip welding method and welding equipment |
| CN109786305B (en) * | 2019-01-28 | 2021-02-26 | 上海东方磁卡信息股份有限公司 | Non-contact card manufacturing equipment and non-contact card manufacturing method |
| CN110883442B (en) * | 2019-09-29 | 2021-03-30 | 江苏凯尔生物识别科技有限公司 | Turnover chip welding device |
| CN111805041B (en) * | 2020-07-13 | 2021-12-14 | 微见智能封装技术(深圳)有限公司 | Chip ring iron welding method and device |
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| CN101499428A (en) * | 2009-02-19 | 2009-08-05 | 东莞锐发智能卡科技有限公司 | Double-interface card production method and equipment |
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Address after: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee after: Shenzhen Yuanmingjie Technology Co., Ltd. Address before: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee before: SHENZHEN YUANMINGJIE TECHNOLOGY CO., LTD. |