CN103759633B - A kind of micro-interference platform based on MEMS - Google Patents
A kind of micro-interference platform based on MEMS Download PDFInfo
- Publication number
- CN103759633B CN103759633B CN201410032346.XA CN201410032346A CN103759633B CN 103759633 B CN103759633 B CN 103759633B CN 201410032346 A CN201410032346 A CN 201410032346A CN 103759633 B CN103759633 B CN 103759633B
- Authority
- CN
- China
- Prior art keywords
- reflecting mirror
- pad
- mems
- keyset
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The invention discloses a kind of micro-interference platform based on MEMS, including silicon substrate, the first reflecting mirror, the second movable reflecting mirror, spectroscope and the second reflecting mirror pad it is provided with on described silicon substrate, described second reflecting mirror pad for control described second reflecting mirror motion external control circuit be connected, be radiated at the light on described spectroscope can be split mirror be divided into two-way and respectively after the first reflecting mirror, the second reflecting mirror reflect on spectroscope produce interference fringe.The present invention utilizes semiconducter process and MEMS micromirror, designs a kind of miniature interference platform, can reduce interference platform size greatly on silicon chip, substantially reduces the volume interfering platform；Utilize semiconductor processing method simultaneously, the optical element accurate alignment such as index glass, fixed mirror, spectroscope can be reduced assembly error；Optics can be accomplished on same silicon chip, it is achieved interfere the modularity of platform；After volume production, the cost interfering platform can be substantially reduced.
Description
Technical field
The present invention relates to the optical design arts of MEMS, more specifically, relate to a kind of based on micro electronmechanical
Micro-interference platform of system.
Background technology
MEMS micro mirror is a most typical device in optical MEMS field.MEMS micro mirror becomes
Merit has benefited from its simple exquisite design, hews out the field that numerous tradition large reflective mirror cannot touch.Microcomputer
Nowadays electricity system micro mirror may be used for making micro projector, micro spectrometer, optical chromatography endoscopic imaging
Scanning, light are opened the light, optical attenuator etc., the features such as they are owned by efficiently, energy-conservation, small and exquisite, low price.
Laser interferometer can coordinate various refracting telescope and reflecting mirror etc. make linear position, speed, angle,
The measurement work of true Pingdu, straigheness, the depth of parallelism and perpendicularity etc., and can be as precision instrument machine or survey
The aligning tool of measuring appratus.The operation principle of interferometer is the light beam sent from laser instrument, after beam-expanding collimation
It is divided into two-way by spectroscope and produces on spectroscope after stationary mirror and moving reflector reflect respectively
Raw interference fringe, and the change of interference fringe is observed by mobile moving reflector.And it is sharp for interfering platform
The core component of optical interferometer, conventional interference platform is all by stationary mirror, moving reflector and spectroscope
Then these optics are built by composition in space.Therefore conventional interference platform size all compares
Greatly, assembling more complicated with debugging process operations, Adjustment precision is the highest, price comparison high, thus
Have impact on performance and the price of laser interferometer.
Summary of the invention
Based on problem above, object of the present invention is to provide a kind of micro-interference based on MEMS and put down
Platform, utilizes semiconducter process and MEMS micromirror device, have devised a kind of miniature interference on silicon chip
Platform, can reduce interference platform by volume, reduces and assembles and the complexity of the process of adjustment, improves Adjustment precision
And reduction cost price.
For reaching this purpose, the present invention by the following technical solutions:
A kind of micro-interference platform based on MEMS, including silicon substrate, described silicon substrate is provided with
One reflecting mirror, the second movable reflecting mirror, spectroscope and the second reflecting mirror pad, described second reflecting mirror
Pad, for being connected with the external control circuit controlling described second reflecting mirror motion, is radiated at described light splitting
Light on the mirror mirror that can be split is divided into two-way and respectively after the first reflecting mirror, the second reflecting mirror reflect
Spectroscope produces interference fringe.
As preferably, described second reflecting mirror is MEMS micromirror, and described MEMS micromirror is fixedly installed on switching
Being connected on plate and with the pad on keyset, described keyset is fixing to be pasted on a silicon substrate, and thereon
Electrical lead pad is connected with the second reflecting mirror pad on silicon substrate.
As preferably, described keyset includes keyset substrate, and keyset substrate has light hole, described
The periphery of light hole is coating area, and described pad is the routing pad being arranged on coating area periphery, described MEMS
Micro mirror is fixed on coating area and makes MEMS micromirror be connected with routing pad by routing mode.
As preferably, described keyset includes keyset substrate, and keyset substrate has light hole, described
The periphery of light hole is MEMS rest area, and described pad is to be arranged on the weldering of the falling stake weldering within MEMS rest area
Dish, described MEMS micromirror utilizes the mode of flip chip bonding to be fixed on MEMS rest area.
As preferably, described second reflecting mirror is MEMS micromirror, and described silicon substrate offers the second reflecting mirror
Draw-in groove, described second reflecting mirror draw-in groove sidewall connects the second reflecting mirror draw-in groove pad, and described MEMS micromirror is straight
Connect or be indirectly fixed on by the way of slot in the second reflecting mirror draw-in groove.
As preferably, described MEMS micromirror is indirectly fixed in the second reflecting mirror draw-in groove by keyset, institute
State keyset and include that keyset substrate, described MEMS micromirror are fixed on the MEMS rest area of keyset substrate,
Described keyset substrate lower end is provided with pad, and described pad inserts in the second reflecting mirror draw-in groove.
As preferably, described MEMS micromirror includes MEMS pedestal and is arranged on the MEMS of MEMS pedestal lower end
Pad, described MEMS micromirror is directly fixed in the second reflecting mirror draw-in groove.
As preferably, described first reflecting mirror is fixed pan mirror.
As preferably, described first reflecting mirror is MEMS micromirror.
As preferably, described silicon substrate has the first reflecting mirror draw-in groove, described first reflecting mirror draw-in groove sidewall
Connecting and have the first reflecting mirror draw-in groove pad, described MEMS micromirror is by the way of slot fixing on a silicon substrate the
In one reflecting mirror draw-in groove.
The invention have the benefit that the present invention is by providing a kind of micro-interference based on MEMS to put down
Platform, this interference platform includes silicon substrate, and silicon substrate is provided with the first reflecting mirror, the movable second reflection
Mirror, spectroscope and the second reflecting mirror pad, the second reflecting mirror pad is used for and controls described second reflecting mirror
The external control circuit of motion is connected, and is radiated at the mirror that can be split of the light on described spectroscope and is divided into two-way also
On spectroscope, interference fringe is produced respectively after the first reflecting mirror, the second reflecting mirror reflect.Utilize this
Invention can reduce interference platform size greatly, substantially reduces the volume interfering platform；Utilize half simultaneously
Conductor processing method, can reduce group by optical element accurate alignment such as index glass, fixed mirror, spectroscopes
Dress error；Optics can be accomplished on same silicon chip, it is achieved that interfere the modularity of platform；In amount
In puerperal, utilize the interference platform obtained by semiconductor machining more a lot of than traditional platform low cost.
Accompanying drawing explanation
Fig. 1 is micro-interference platform top view that the specific embodiment of the invention one provides；
Fig. 2 is the first keyset top view that the specific embodiment of the invention one provides；
Fig. 3 is the another kind of keyset top view that the specific embodiment of the invention one provides；
Fig. 4 is micro-interference platform top view that the specific embodiment of the invention two provides；
Fig. 5 is a kind of keyset top view that the specific embodiment of the invention two provides；
Fig. 6 is the MEMS micromirror structural representation that the specific embodiment of the invention two provides.
Wherein:
1: silicon substrate；2: the first reflecting mirrors；3: the second reflecting mirrors；4: spectroscope；5: the first reflections
Mirror pad；6: the second reflecting mirror pads；
31: keyset；32: keyset；
311: keyset substrate；312: coating area；313: light hole；314: routing pad；315:
Electrical lead pad；
321: keyset substrate；322:MEMS rest area；323: light hole；324: the weldering of falling stake pad；
325: electrical lead pad；
1 ': silicon substrate；4 ': spectroscope；5 ': the first reflecting mirror pad；6 ': the second reflecting mirror weldering
Dish；7 ': the first reflecting mirror draw-in groove；8 ': the second reflecting mirror draw-in groove；
31 ': keyset；32 ': MEMS micromirror；
71 ': the first reflecting mirror draw-in groove pad；
81 ': the second reflecting mirror draw-in groove pad；
311 ': keyset substrate；312 ': MEMS rest area；313 ': light hole；314 ': weldering
Dish；
321 ': MEMS pedestal；322 ': MEMS micromirror minute surface；323 ': MEMS pad.
Detailed description of the invention
Further illustrate technical scheme below in conjunction with the accompanying drawings and by detailed description of the invention.
Fig. 1 is micro-interference platform top view that the specific embodiment of the invention one provides.The present invention utilizes and partly leads
Body processing technology makes micro-interference platform, as it is shown in figure 1, the base of microfluidic platform is semiconductor machining silicon chip,
Namely silicon substrate 1, described silicon substrate 1 is provided with the first reflecting mirror 2, the second movable reflecting mirror 3,
Spectroscope 4.In the present embodiment, described spectroscope 4 is block prism, and described first reflecting mirror 2 is as solid
Horizontal glass, the second movable reflecting mirror 3 are as index glass.Silicon substrate 1 entirety is more smooth, and beneficially first is anti-
Penetrate mirror the 2, second reflecting mirror 3 and the assembling of spectroscope 4.Silicon substrate 1 edge is provided with the second reflecting mirror pad
6, it is used for being connected with external control circuit and then controlling the motion of described second reflecting mirror 3.Silicon substrate simultaneously
There is the telltale mark placing block prism on 1, be used for being accurately positioned block prism and block prism is fixed on silicon
On substrate 1.The light being radiated on described spectroscope 4 mirror 4 that can be split is divided into two-way anti-from first respectively
Penetrate on spectroscope 4, after mirror the 2, second reflecting mirror 3 reflects, produce interference fringe.
In the present embodiment, described second reflecting mirror 3 is MEMS micromirror, and described MEMS micromirror is fixedly installed
On the keyset 31 of little silicon materials.Fig. 2 is the first that the specific embodiment of the invention one provides
Keyset top view, as in figure 2 it is shown, described keyset 31 includes keyset substrate 311, keyset substrate
Having light hole 313 on 311, the periphery of described light hole 313 is coating area 312, and described pad is for arranging
At the routing pad 314 of coating area 312 periphery, coating area 312 gluing shown in the figure, afterwards by MEMS
Micro mirror is placed into the position location shown in figure, after MEMS micromirror and keyset are fixing, utilizes routing mode
MEMS micromirror is made to be connected with routing pad 314.And it is additionally provided with electricity on the edge of keyset substrate 311 to draw
Wire bonding dish 315, electrical lead pad 315 is with the second reflecting mirror pad 6 on silicon substrate 1 by electrical lead even
Connect.The second reflecting mirror pad 6 that silicon substrate 1 edge is arranged, can use external electric wiring and MEMS micromirror
Connect, and then utilize external electric signal to drive MEMS micromirror to move.The described keyset 31 with MEMS
On the limit of the block prism that can be affixed directly to silicon substrate 1, so can ensure that between index glass and fixed mirror
Equivalent optical path, be conducive to overall assembling, regulate more simple and convenient simultaneously.
In the present embodiment, described first reflecting mirror 2 can be that fixed mirror can also be for index glass.Select fixing
During mirror, can be plane mirror, select index glass time, can be the same with index glass be MEMS micromirror.Select MEMS
Micro mirror, can directly be attached to MEMS micromirror on the limit of block prism during assembling, and its installation process can be with
Two-mirror 3 is identical with the installation process of silicon substrate 1.Now, the top edge of silicon substrate 1 is provided with first
Reflecting mirror pad 5, can be connected with MEMS micromirror with external electric wiring, and then utilize external electric signal
Driving MEMS micromirror moves.During use, can change by adding different voltage to two MEMS micromirror
The direction of motion of two MEMS micromirror, makes two MEMS micromirror minute surface move toward one another, thus increases interference
The optical path difference of system.Add a regulation voltage to fixed mirror simultaneously, minute surface can be carried out some fine settings,
Thus the error that correcting system brings due to assembling.
In the present embodiment, described keyset 32 can also be another kind of structure, as it is shown on figure 3, described turn
Fishplate bar 32 includes keyset substrate 321, and keyset substrate 321 has light hole 323, described light hole
The periphery of 323 is MEMS rest area 322, and described pad is to be arranged on the stake of falling within MEMS rest area 312
Weldering pad 324, this keyset also has the electrical lead pad 325 being connected with external electrical lead wires.Conducting resinl is coated with
On the weldering of falling stake pad 324 in the drawings, the mode that MEMS micromirror utilizes the weldering of falling stake is placed into shown in figure
MEMS rest area 322, after MEMS micromirror and keyset are fixing, is utilized by electrical lead pad 325 afterwards
Electrical lead is connected with the second reflecting mirror pad 6 on silicon substrate 1, the most again with outside MEMS control circuit the most even
Connect.The connection procedure of keyset and silicon substrate 1 and the keyset of the first structure and silicon with MEMS micromirror
The connection procedure of substrate 1 is identical.
Fig. 4 is micro-interference platform top view that the specific embodiment of the invention two provides.As shown in Figure 4, turn
Fishplate bar 31 ' uses slot mode to be connected with silicon substrate 1 '.Concrete, described second reflecting mirror 3 is MEMS
Micro mirror, described silicon substrate 1 ' is provided with spectroscope 4 ', offers the second reflecting mirror near spectroscope 4 '
Draw-in groove 8 ', described second reflecting mirror draw-in groove 8 ' sidewall connects the second reflecting mirror draw-in groove pad 81 '.Described
What MEMS micromirror was direct or indirect is fixed in the second reflecting mirror draw-in groove 8 ' by the way of slot.Silicon substrate
The edge of 1 ' upper second side, reflecting mirror draw-in groove 8 ' place is provided with the second reflecting mirror pad 6 '.
Fig. 5 is a kind of keyset top view that the specific embodiment of the invention two provides.Keyset 31 ' is made
Form as shown in Figure 5, described keyset 31 ' includes keyset substrate 311 ', keyset substrate 311 '
On be provided with light hole 313 ', the surrounding of light hole 313 ' is MEMS rest area 312 ', described MEMS
Micro mirror is fixed on the MEMS rest area 312 ' of keyset substrate 311 ', described keyset substrate 311 ' lower end
Being provided with pad 314 ', described pad 314 ' inserts in the second reflecting mirror draw-in groove 8 ', described MEMS micromirror
Indirectly it is fixed in the second reflecting mirror draw-in groove 8 ' by keyset 31 '.As it has been described above, directly will switching
Plate 31 ' is put in the second reflecting mirror draw-in groove 8 ' on silicon substrate 1 ', afterwards, it is possible to use external electric
Second reflecting mirror pad 6 ' is connected by wiring with MEMS micromirror, and then utilizes external electric signal to drive MEMS
Micromirror movements.Keyset 31 ' is attached directly together with the second reflecting mirror draw-in groove 8 ', such keyset
31 ' are directly connected to silicon substrate 1 ', it is not necessary to electrical lead connects.Keyset 31 ' puts into the second reflection
After mirror draw-in groove 8 ', in order to ensure that the comparison that keyset 31 ' is connected with silicon substrate 1 ' consolidates, available glue
Water is reinforced.
Fig. 6 is the MEMS micromirror structural representation that the specific embodiment of the invention two provides.Quasiconductor is utilized to add
Work technique directly processes the MEMS micromirror 32 ' with draw-in groove, structure as depicted, described MEMS micromirror
Including MEMS pedestal 321 ', be arranged on the MEMS micromirror minute surface 322 ' of MEMS pedestal 321 ' middle and upper part with
And it is arranged on the MEMS pad 323 ' of MEMS pedestal 321 ' lower end.Can be directly by MEMS micromirror 32 '
The MEMS pad 323 ' of lower end is fixed on the second reflecting mirror draw-in groove 8 ' of silicon substrate 1 ' by the way of slot
In, now, described MEMS micromirror 32 ' is the most directly fixed in the second reflecting mirror draw-in groove 8 '.It
After, it is possible to use the second reflecting mirror pad 6 ' is connected by external electric wiring with MEMS micromirror 32 ', and then
Utilize external electric signal to drive MEMS micromirror 32 ' to move.MEMS micromirror 32 ' now need not switching
Plate, it is to avoid this operation is welded in routing or stake, makes micro-interference platform assembly precision higher, processes simpler.
In the present embodiment, identical with specific embodiment one, described first reflecting mirror 2 can be fixed mirror also
It can be index glass.When selecting fixed mirror, can be plane mirror, when selecting index glass, can be the same with index glass
It it is MEMS micromirror.Select MEMS micromirror, can be connected with silicon substrate 1 ' in the way of using slot during assembling
Connect.When using slot mode, described silicon substrate 1 ' has the first reflecting mirror draw-in groove 7 ', described first anti-
Penetrating the connection of mirror draw-in groove 7 ' sidewall and have the first reflecting mirror draw-in groove pad 71 ', described MEMS micromirror is by slot
Mode is fixed in the upper first reflecting mirror draw-in groove 7 ' of silicon substrate 1 '.Silicon substrate 1 ' top edge is provided with first
Reflecting mirror pad 5 ', can with external electric wiring by the first reflecting mirror pad 5 ' with MEMS micromirror even
Connect, and then utilize external electric signal to drive MEMS micromirror to move.It is of course also possible to MEMS is the most micro-
Mirror is attached on the limit of block prism, and its installation process can be with the second reflecting mirror 3 and silicon in specific embodiment one
The installation process of substrate 1 is identical.
Certainly, in specific embodiment one, when MEMS micromirror selected by the first reflecting mirror 2, it would however also be possible to employ slot
Mode is connected with described silicon substrate 1.
The present invention processes bulk silicon substrate first with semiconducter process, it is ensured that silicon substrate smooth
Degree.Groove or the position line of block prism is placed in processing on a silicon substrate, it can be ensured that the placement of block prism
Position accurate.Secondly being fixed to by MEMS micromirror on the keyset of silicon processing, keyset is directly attached to cube
On prism, so can ensure that assembly precision.Recycling electrical lead is connected with silicon substrate afterwards.Fixed mirror can
To select plane mirror or MEMS micromirror, when selecting MEMS micromirror, can be by index glass and fixed mirror
MEMS micromirror adds different driving signals to increase the optical path difference of whole system.By semiconducter process and
Corresponding assemble method, can improve the assembly precision of micro-interference platform, reduces and assembles difficulty, reduces simultaneously
The cost of micro-interference platform.
The present invention utilizes semiconducter process to combine MEMS micromirror, it can be ensured that spectroscope and two MEMS
Minute surface is accurately positioned.Technology processing can be carried out, by index glass, fixed mirror and spectroscope on semi-conductor silicon chip
It is put on same silicon chip, thus forms a miniature intervention module, application afterwards can greatly reduce
The difficulty assembled, improves the precision of assembling simultaneously.Owing to MEMS micromirror is smaller, the interference platform obtained
Volume is little, it is simple to carry.Utilizing semiconductor technology, design accuracy is high, and precision is up to 1-2 micron even more
Little.The MEMS micromirror low cost utilized, thus greatly reduce the cost of manufacture interfering platform.Pass through
MEMS control design case can accurately control the movement of MEMS index glass, thus observes interference.
The know-why of the present invention is described above in association with specific embodiment.These describe and are intended merely to explain this
The principle of invention, and limiting the scope of the invention can not be construed to by any way.Based on herein
Explaining, those skilled in the art need not pay performing creative labour can associate other tool of the present invention
Body embodiment, within these modes fall within protection scope of the present invention.
Claims (6)
1. a micro-interference platform based on MEMS, it is characterised in that include silicon substrate (1),
The first reflecting mirror (2), movable the second reflecting mirror (3), spectroscope it is provided with on described silicon substrate (1)
(4) and the second reflecting mirror pad (6), described second reflecting mirror pad (6) for control described the
The external control circuit that two-mirror (3) moves is connected, and is radiated at the luminous energy on described spectroscope (4)
The mirror (4) that is enough split is divided into two-way and is reflected back from the first reflecting mirror (2), the second reflecting mirror (3) respectively
On spectroscope (4), interference fringe is produced after Laiing；Wherein, described second reflecting mirror (3) is MEMS micromirror,
Described MEMS micromirror is fixedly installed on keyset (31) and above and is connected with the pad on keyset (31), institute
State that keyset (31) is fixing to be pasted onto on silicon substrate (1), and electrical lead pad thereon (315) with
The second reflecting mirror pad (6) on silicon substrate (1) connects；Described keyset (31) includes keyset base
Plate (311), keyset substrate (311) has light hole (313), described light hole (313)
Periphery is coating area (312), and described pad is the routing pad (314) being arranged on coating area (312) periphery,
Described MEMS micromirror is fixed on coating area (312) and makes MEMS micromirror and routing pad by routing mode
(314) connect.
2. a micro-interference platform based on MEMS, it is characterised in that include silicon substrate (1),
The first reflecting mirror (2), movable the second reflecting mirror (3), spectroscope it is provided with on described silicon substrate (1)
(4) and the second reflecting mirror pad (6), described second reflecting mirror pad (6) for control described the
The external control circuit that two-mirror (3) moves is connected, and is radiated at the luminous energy on described spectroscope (4)
The mirror (4) that is enough split is divided into two-way and is reflected back from the first reflecting mirror (2), the second reflecting mirror (3) respectively
On spectroscope (4), interference fringe is produced after Laiing；Wherein, described second reflecting mirror (3) is MEMS micromirror,
Described MEMS micromirror is fixedly installed on keyset (32) and above and is connected with the pad on keyset (32), institute
State that keyset (32) is fixing to be pasted onto on silicon substrate (1), and electrical lead pad thereon (325) with
The second reflecting mirror pad (6) on silicon substrate (1) connects；Described keyset (32) includes keyset base
Plate (321), keyset substrate (321) has light hole (323), described light hole (323)
Periphery is MEMS rest area (322), and described pad is for being arranged on falling inside MEMS rest area (322)
Stake weldering pad (324), described MEMS micromirror utilizes the mode of flip chip bonding to be fixed on MEMS rest area (322).
3. a micro-interference platform based on MEMS, it is characterised in that include silicon substrate (1 '),
The first reflecting mirror (2), movable the second reflecting mirror (3), light splitting it is provided with on described silicon substrate (1 ')
Mirror (4 ') and the second reflecting mirror pad (6 '), described second reflecting mirror pad (6 ') is used for and control
Make the external control circuit that described second reflecting mirror (3) moves to be connected, be radiated at described spectroscope (4 ')
On the light mirror (4 ') that can be split be divided into two-way and respectively from the first reflecting mirror (2), the second reflecting mirror
(3) on spectroscope (4 '), interference fringe is produced after reflecting；Described second reflecting mirror (3) is
MEMS micromirror, described silicon substrate (1 ') offers the second reflecting mirror draw-in groove (8 '), described second anti-
Penetrate the connection of mirror draw-in groove (8 ') sidewall and have the second reflecting mirror draw-in groove pad (81 '), between described MEMS micromirror
Connect is fixed in the second reflecting mirror draw-in groove (8 ') by the way of slot；Described MEMS micromirror is by turning
Fishplate bar (31 ') is indirectly fixed in the second reflecting mirror draw-in groove (8 '), and described keyset (31 ') is wrapped
Including keyset substrate (311 '), described MEMS micromirror is fixed on the MEMS of keyset substrate (311 ')
Rest area (312 '), described keyset substrate (311 ') lower end is provided with pad (314 '), described
Pad (314 ') inserts in the second reflecting mirror draw-in groove (8 ').
4. according to based on MEMS the micro-interference platform one of claims 1 to 3 Suo Shu, its feature
Being, described first reflecting mirror (2) is fixed pan mirror.
5. according to based on MEMS the micro-interference platform one of claims 1 to 3 Suo Shu, its feature
Being, described first reflecting mirror (2) is MEMS micromirror.
Micro-interference platform based on MEMS the most according to claim 3, it is characterised in that
Described first reflecting mirror (2) is MEMS micromirror, and described silicon substrate (1 ') has the first reflecting mirror draw-in groove
(7 '), described first reflecting mirror draw-in groove (7 ') sidewall connects the first reflecting mirror draw-in groove pad (71 '),
First reflecting mirror MEMS micromirror is fixed on the upper first reflecting mirror draw-in groove of silicon substrate (1 ') by the way of slot
In (7 ').
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410032346.XA CN103759633B (en) | 2014-01-23 | 2014-01-23 | A kind of micro-interference platform based on MEMS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410032346.XA CN103759633B (en) | 2014-01-23 | 2014-01-23 | A kind of micro-interference platform based on MEMS |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103759633A CN103759633A (en) | 2014-04-30 |
| CN103759633B true CN103759633B (en) | 2017-01-04 |
Family
ID=50526909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410032346.XA Active CN103759633B (en) | 2014-01-23 | 2014-01-23 | A kind of micro-interference platform based on MEMS |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103759633B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110275288B (en) * | 2019-06-21 | 2021-06-22 | 无锡迅杰光远科技有限公司 | Multidirectional MEMS scanning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027203B2 (en) * | 2002-03-19 | 2006-04-11 | Xanoptix Inc. | Combination micromachine and optical device array |
| US7710574B2 (en) * | 2007-01-23 | 2010-05-04 | Board Of Regents, The University Of Texas System | Devices in miniature for interferometric use and fabrication thereof |
| CN102439509A (en) * | 2009-05-05 | 2012-05-02 | 雷模特斯有限公司 | Passive alignment method and its application in micro projection devices |
| CN203350529U (en) * | 2013-06-18 | 2013-12-18 | 无锡微奥科技有限公司 | Micro-electro-mechanical interference platform with closed-loop control system |
-
2014
- 2014-01-23 CN CN201410032346.XA patent/CN103759633B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027203B2 (en) * | 2002-03-19 | 2006-04-11 | Xanoptix Inc. | Combination micromachine and optical device array |
| US7710574B2 (en) * | 2007-01-23 | 2010-05-04 | Board Of Regents, The University Of Texas System | Devices in miniature for interferometric use and fabrication thereof |
| CN102439509A (en) * | 2009-05-05 | 2012-05-02 | 雷模特斯有限公司 | Passive alignment method and its application in micro projection devices |
| CN203350529U (en) * | 2013-06-18 | 2013-12-18 | 无锡微奥科技有限公司 | Micro-electro-mechanical interference platform with closed-loop control system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103759633A (en) | 2014-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101477306B (en) | High-speed multi-beam parallel laser direct-writing device | |
| CN201345033Y (en) | High-speed multi-beam parallel laser direct-writing device | |
| CN110230999B (en) | Five-degree-of-freedom error synchronous measurement device and method for linear motion system | |
| JP2003014997A (en) | Microminiature optoelectronic machine system(moems) | |
| CN101571383A (en) | Detecting device for measuring difference of relative radius of curvature between sub-lenses of sphere surface spliced telescope | |
| CN103837080B (en) | Sub-micrometer precision coaxial confocal towards micro assemby is directed at detection method and device | |
| US6980303B2 (en) | Light-emitting/receiving combined unit and displacement sensors using the same | |
| CN103344609A (en) | Micro Fourier transform spectrometer | |
| CN100470194C (en) | Laser automatic-aligning system | |
| CN103759633B (en) | A kind of micro-interference platform based on MEMS | |
| TWI550473B (en) | Ultra-low profile optical finger navigation illumination system through segmentation | |
| US20140009580A1 (en) | Three-dimensional measurement system | |
| CN109581827A (en) | Photoetching projection objective lens optimal focal plane detection device and method | |
| CN113804112A (en) | Displacement measurement system and lithographic apparatus | |
| CN107621601B (en) | System and method for testing positioning accuracy of motion axis of flying probe testing machine | |
| CN203396702U (en) | Miniature Fourier transformation spectrometer | |
| US10101578B2 (en) | Micro-electro-mechanical device having a tiltable structure, with detection of the position of the tiltable structure | |
| CN108983382B (en) | Multi-degree-of-freedom optical adjusting device and adjusting method | |
| TWM600928U (en) | Integrated measurement system | |
| JP5449263B2 (en) | Manufacturing process equipment | |
| JP3356104B2 (en) | Method and apparatus for measuring rolling angle of moving stage | |
| CN104266583A (en) | Multi-degree-of-freedom measuring system | |
| CN102508223A (en) | Electronic control device having variable beam expansion ratios and applied to terahertz laser source | |
| CN103419212A (en) | Normal alignment method and device for arbitrary curved surface | |
| CN112857263A (en) | Oblique illumination type color confocal measurement system and detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221226 Address after: B2-305, No. 200, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Weiwen Semiconductor Technology Co.,Ltd. Address before: Room 302, Auxiliary Building C, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, New District, Wuxi City, Jiangsu Province, 214000 Patentee before: WUXI WIO TECHNOLOGY Co.,Ltd. |