CN103752440A - Electrostatic atomization method for evenly distributing particles - Google Patents
Electrostatic atomization method for evenly distributing particles Download PDFInfo
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- CN103752440A CN103752440A CN201410010322.4A CN201410010322A CN103752440A CN 103752440 A CN103752440 A CN 103752440A CN 201410010322 A CN201410010322 A CN 201410010322A CN 103752440 A CN103752440 A CN 103752440A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/08—Plant for applying liquids or other fluent materials to objects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/16—Arrangements for supplying liquids or other fluent material
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- Application Of Or Painting With Fluid Materials (AREA)
- Electrostatic Spraying Apparatus (AREA)
Abstract
The invention discloses an electrostatic atomization method for evenly distributing particles. The electrostatic atomization method includes the steps of a), preparing a mixed solution containing the particles; b), delivering the mixed solution prepared in the step a) through a pipeline to the position of a needle; c), subjecting the solution delivered to the position of the needle in the step b) to flow control to form liquid drops to output, applying voltage on the outputted liquid drops, and enabling the liquid drops to be crushed at the tip of liquid cone to form a plurality of little liquid drops flying towards a substrate and finally depositing on the substrate to obtain the substrate with particles evenly distributed, wherein the size of the voltage is set in a manner that the voltage value gradually increases from zero. The solution containing the particles is dispersed, and large-scale and even particle distribution with monolayer dispersion can be obtained on the receiving substrate; the electrostatic atomization method is low in cost, small in particle spacing and high in promotion and application value.
Description
Technical field
The present invention relates to encapsulation field, relate in particular to a kind of electrostatic atomization method that uniform particles distributes.
Background technology
Along with light, thin, the little development trend of all kinds of consumption electronic products, microelectronics Packaging industry, have higher requirement to packaging technology in the fields such as the ultra-thin chip upside-down mounting of especially thin space chip assembling, flexible electronic industry.Traditional packaging technology mainly comprises BGA(Ball Grid Array) and FC(Flip Chip) technology, be subject to the restriction of the aspects such as cost and positioning precision, cannot adapt to semiconductor packages industry for the high density of encapsulation and the requirement of little die opening.
At present, anisotropic conductive film (Anisotropic Conductive Film, ACF) be COG(Chip on Glass) the interconnected medium of most widely used general one in encapsulation field, it is comprised of high molecular polymer and dispersed conductive particle therein, the diameter of conductive particle is approximately 3-5 μ m, normally a kind of resin particle of surperficial coated metal material.In COG encapsulation process, ACF is placed in and drives together with chip is bonded and fixed at glass substrate, and meanwhile, part particle is trapped between relatively outstanding salient point and ITO electrode, and is squeezed under external force condition, and between forms electrical connection.Therefore visible, the conductive particle number between salient point and ITO electrode has directly determined contact resistance.Therefore, there are two problems in ACF encapsulation: first, ACF encapsulation realizes by the conductive particle catching between chip bump and electrode of substrate, high-density packages has reduced the sectional area of salient point, make the conductive particle that captures between salient point and electrode fewer and feweri, thereby cause the increase of contact resistance, even open circuit.The second, complete between the interconnected chip bump of ACA and be scattered with unnecessary conductive particle, high-density packages has reduced the gap between salient point, and the conductive particle causing is reunited and will be caused the short circuit of adjacent salient point.
Packaging density is to weigh unique scale of Electronic Encapsulating Technology development.ACF interconnection technique has made spacing reach 30 μ m at present, but the problems referred to above have restricted the realization of ACF technology under less spacing.Domestic and international many companies or research organization have carried out a large amount of research work.Hitachi, Ltd has researched and developed a kind of novel ACF, has increased the seizure of conductive particle, but is not fairly obvious to the effect of avoiding of short circuit.A kind of novel bump structure with flange of LG company exploitation, can effectively increase the chance that conductive particle catches, but along with significantly the reducing of salient point area, this structure still cannot break through the bottleneck of ACF.The Microconnector ACF of Casio exploitation has carried out specially treated to conductive particle, but in actual production, when bump pitch narrows down to 10 μ m, short circuit phenomenon can sharply increase.
Therefore, those skilled in the art is devoted to develop a kind of novel ACF encapsulation technology and ACF conducting film, is intended to solve conductive particle reunion in existing ACF conducting film and easily causes short circuit or distribution of particles inequality easily to cause the problem opening circuit.
Summary of the invention
Because the above-mentioned defect of prior art, technical problem to be solved by this invention is to provide a kind of electrostatic atomization method that uniform particles distributes, adopt electrostatic atomization method to disperse the solution that contains particle, on reception substrate, obtain distribution of particles extensive, even, Monolayer Dispersion.
Further, this method technical problem to be solved is also to provide a kind of conductive particle equally distributed electrostatic atomization method, obtains conductive particle extensive, even, Monolayer Dispersion and distribute on reception electrode of substrate.The method can solve in the preparation of existing ACF conducting film, in conducting film, conductive particle reunion easily causes short circuit or distribution of particles inequality easily to cause the problem opening circuit, conductive particle is had no effect, cost is low, in the final distribution of particles forming, grain spacing can be very little, broken through the spacing restriction of ACF, has higher propagation and employment and be worth.
Principle and thinking that the present invention solves the problems of the technologies described above are: particle is dispersed in solvent, utilize the physical methods such as supersonic oscillations to obtain the good particle solution of decentralization, and be transported to micro-injection pump by plumbing installation, then under high voltage electrostatic field, particle aaerosol solution is carried out to electrostatic spray, on reception electrode of substrate, obtain particle extensive, even, Monolayer Dispersion.Described particle can be conductive particle, can be also non-conductive particle.
For achieving the above object, the invention provides a kind of electrostatic atomization method that uniform particles distributes, comprise the following steps:
A) mixed solution that preparation contains particle;
B) mixed solution of step a) is passed through to pipeline transportation, be delivered to syringe needle place;
C) to being delivered to the solution control flow at syringe needle place in step b), form drop output, and the drop of output is applied to voltage, the size of voltage is set to: magnitude of voltage increases gradually from 0, make drop occur broken at the most advanced and sophisticated place of liquid cone, form several droplets, and to orientation substrate flight, be finally deposited on substrate the baseplate material that preparation uniform particles distributes.
Wherein, drop under the effect of the external force such as added electrostatic field and gravitational field, the drop distortion that is stretched, its shape changes spindle pattern and stable state prod cast formula into gradually by circle, the most advanced and sophisticated place, tip that is the drop that forms stable state prod cast formula of liquid cone.
Further, in step a), particle is weighed, and be dissolved in solvent, form the mixed solution of certain mass mark, adopt ultrasonic dispersal device to carry out ultrasonic wave dispersion to mixed solution, make particle and solvent in mixed solution form suspension;
Wherein, solvent is the one in distilled water, ethanol, ethylene glycol, acetone, isopropyl alcohol or methyl alcohol, or solvent is the one in ethanol and distilled water mixing material, ethylene glycol and distilled water mixing material, acetone and distilled water mixing material, isopropyl alcohol and distilled water mixing material or methyl alcohol and distilled water mixing material.
Further, particle is conductive particle or non-conductive particle; The diameter of particle is less than 50 μ m; Non-conductive particle is resin particle; Resin particle is by polyethylene, polypropylene, acrylic resin, polystyrene, polyvinyl chloride, polyvinyl acetate, ABS resin, AS resin, ultrapas, polyamide, Merlon, polyacetals, at least one composition in polyphenylene oxide and the aromatic polyether ketone of modification.
Further, in step b), also comprise, the mixed solution in transport process is carried out to magnetic agitation, make mixed solution in transport process, keep the dispersion of particle.
Further, in step c), the flow of drop output is less than 10ml/h, and the internal diameter of the pin hole of syringe needle is less than 2mm.
Further, in step c), substrate is stainless steel, silicon chip or chip.
Further, in step c), when droplet flies to substrate, droplet is subject to heat radiation effect, and thermal-radiating mode is set to: base plate heating or environment heat radiation, make the solvent in droplet be evaporated or volatilize.
Further, the die opening between syringe needle and substrate is less than 50mm; The implementation of voltage is set to: one end of voltage is connected with syringe needle, and the other end of voltage is connected with substrate or the platform of substrate below connects, and forms electrostatic field; The size of voltage is 0.5kv～30kv.
Alternatively, the implementation of voltage can also be set to: the electrostatic atomization apparatus of realizing electrostatic atomization method is placed in to non-contacting electrostatic field; Electrostatic field can adopt that ring-type, wire electrode etc. are dissimilar, the electrode of different size; The size of voltage is 0.5kv～30kv.
Preferably, die opening is 1mm～20mm, and magnitude of voltage is 1kv～10kv, and the mass fraction of mixed solution is 0.005%～5%, and the diameter of pin hole is less than 1mm.
Further, the number of syringe needle is at least one; The material of syringe needle can be stainless steel, glass.
In preferred embodiments of the present invention, a kind of equally distributed electrostatic atomization method of conductive particle, in turn includes the following steps:
As can be seen here, the electrostatic atomization location mode that uniform particles of the present invention distributes, can realize being uniformly distributed of conductive particle in semiconductor packages, the method by the solution that contains conductive particle by conveying pipe with transport pump and be delivered to syringe needle place, under high voltage electrostatic field, drop is subject to surface tension, viscous force, gravity, the acting in conjunction of the many kinds of forces such as electric field force.When voltage rises to a certain size, electric field force is strong to disequilibrating, stretching solution, and make drop that the broken droplet that is enclosed with particle that forms occur at place, tip.Droplet flies towards substrate, and solvent evaporation or volatilization finally leave particle and on substrate, form uniform particles dispersion distribution.The present invention has no effect to conductive particle, and cost is low, and in the final distribution of particles forming, grain spacing can be very little, has broken through the spacing restriction of ACF, has higher propagation and employment and is worth.
In addition, when voltage of the present invention progressively rises to certain value from less value, the solution at the pin hole place of syringe needle is under high voltage electrostatic field, and the drippage pattern of its state during from low voltage, is gradually varied to spindle pattern, then is transitioned into stable state prod cast formula.Stable state prod cast formula is compared to pattern above, and the form of its atomization is more stable, and the atomizing particle distribution spot forming on substrate is more regular, is more suitable for quantitative controlled distribution of particles.
In addition, drop of the present invention is in the process of substrate flight, can use bottom plate heating, or the mode such as environment heat radiation, for atomization environment heat temperature raising, accelerate volatilization and the evaporation of solvent, be convenient to particle and better stay on substrate, make particle can on substrate, not be subject to the impact of solution and occurrence positions changes.
Below with reference to accompanying drawing, the technique effect of design of the present invention, concrete structure and generation is described further, to understand fully object of the present invention, feature and effect.
Accompanying drawing explanation
Fig. 1 is the physical dispersion transport system schematic diagram of the mixed solution that contains particle of a preferred embodiment of the present invention;
Fig. 2 is the electrostatic atomization distribution of particles system schematic of the preferred embodiment shown in Fig. 1.
The specific embodiment
As shown in Figure 1, be the physical dispersion transport system schematic diagram of the mixed solution of a preferred embodiment of the present invention.Wherein, physical dispersion transport system comprises mixed solution storage silo 1, ultrasonic dispersal device 2, conveying pipe 3, magnetic stirring apparatus 4, transports pump 5 and flexible pipe 6.
Mixed solution storage silo 1 is placed in ultrasonic dispersal device 2, and ultrasonic dispersal device 2 carries out ultrasonic dispersion to the mixed solution in mixed solution storage silo 1, makes particle and solvent in mixed solution form suspension.Alternatively, ultrasonic dispersal device 2 is ultrasonic oscillation instrument.
Mixed solution storage silo 1 by conveying pipe 3 with transport pump 5 and be connected, this transports pump 5 power conveying in conveying pipe 3 for mixed solution is provided, and controls flow velocity and the flow of mixed solution in conveying pipe 3.Alternatively, transport pump 5 for micro-injection pump or peristaltic pump.
The outside of conveying pipe 3 is provided with magnetic stirring apparatus 4, and mixed solution, in the course of conveying of conveying pipe 3, utilizes magnetic stirring apparatus 4 to continue concussion dispersion soln, the state that keeps particle to disperse in solvent.The front end that transports pump 5 is connected with flexible pipe 6.
As shown in Figure 2, be the electrostatic atomization distribution of particles system schematic of the embodiment shown in Fig. 1.This system comprises high-voltage power apparatus 7, micro-injection pump 8, substrate 9, earth terminal 10 and Motion Control Platform 11.One end of high-voltage power apparatus 7 is connected with the syringe needle of micro-injection pump 8, and the other end is connected with substrate 9, and substrate 9 is connected with earth terminal 10, makes to form high-voltage electrostatic field between syringe needle and substrate 9.Motion Control Platform 11 is connected with the bottom of substrate 9, for controlling the movement of preparation process substrate 9, guarantees the lasting propelling of electrostatic atomization operation.
In the use procedure of the present embodiment, one end of flexible pipe 6 in Fig. 1 with transport pump 5 and be connected, the other end is connected with the micro-injection pump 8 in Fig. 2, by the solution that contains conductive particle by conveying pipe 3 with transport syringe needle place that pump 5 is delivered to micro-injection pump 8 and form drop and drip downwards.Under high voltage electrostatic field, drop is subject to surface tension, viscous force, gravity, the acting in conjunction of the many kinds of forces such as electric field force.When voltage rises to a certain size, electric field force is strong to disequilibrating, stretching solution, and make drop that the broken droplet that is enclosed with particle that forms occur at place, tip.Droplet is towards substrate 9 direction flights, and solvent evaporation or volatilization finally leave particle and on substrate, form uniform particles dispersion distribution.
In the electrostatic atomization method that uniform particles provided by the invention distributes, by controlling the diameter of syringe needle of micro-injection pump 8, the character of solution, and die opening, selection of substrate 9 etc., the effect that all directly the final atomization of impact and particle disperse, below in conjunction with specific embodiment, the present invention is described in further detail.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, and be not used in restriction invention.
The electrostatic atomization method that uniform particles distributes, comprises the following steps:
1, select ethanol as solvent, particle 0.03g, solvent 30g, the miscible formation solution of particle and solvent.Use ultrasonic oscillation instrument to carry out ultrasonic vibration 30min, form and disperse good suspension.
2, the flow set of micro-injection pump is 1ml/h, solution is extracted and is pushed to out syringe needle place.
3, the external diameter of syringe needle is 0.35mm, and internal diameter is 0.18mm, and die opening is 20mm.The substrate of selecting is the silicon chip of 3.5 inches of diameters.
4, the positive pole of voltage is connected on syringe needle to substrate ground connection.Regulation voltage, since 0 rising to 5.6kv, forms and stablizes spray patterns.Before forming stable spray patterns, utilize baffle plate unstable by what form under pattern before, drop shelves not of uniform size fall, and after stable mode starts, remove baffle plate.The time of atomization 2min under this pattern.
5, base plate heating, promotes the quick volatilization of ethanol by heat radiation and thermal convection current, make not have large drop to affect the position of particle on substrate.
In the present embodiment, finally on substrate, obtaining density is 4500/mm
2the distribution of particles effect of left and right.Average headway between particle is less than 30 μ m, is about 15～20 μ m left and right.
The electrostatic atomization method that uniform particles distributes, comprises the following steps:
1, select isopropyl alcohol as solvent, particle 0.05g, solvent 30g, the miscible formation solution of particle and solvent.Ultrasonic vibration 30min, forms and disperses good suspension.
2, the flow set of micro-injection pump is 0.5ml/h, solution is extracted and is pushed to out syringe needle place.
3, the external diameter of syringe needle is 0.35mm, and internal diameter is 0.18mm, and die opening is 20mm.The substrate of selecting is the silicon chip of 3.5 inches of diameters.
4, the positive pole of voltage is connected on syringe needle to substrate ground connection.Regulation voltage, since 0 rising to 6.28kv, forms and stablizes spray patterns.Before forming stable spray patterns, utilize baffle plate unstable by what form under pattern before, drop shelves not of uniform size fall, and after stable mode starts, remove baffle plate.The time of atomization 1.5min under this pattern.
5, base plate heating, promotes the quick volatilization of ethanol by heat radiation and thermal convection current, make not have large drop to affect the position of particle on substrate.
In the present embodiment, finally on substrate, obtaining density is 3140/mm
2the distribution of particles effect of left and right.Average headway between particle is less than 30 μ m, is about 15～20 μ m left and right.
Inventor also analyzes for technique and the result of embodiment, and operation principle of the present invention and flow process are launched to further illustrate:
For the larger solution of viscosity, also longer in the time of ultrasonic dispersion, the simultaneously setting of flow is also less, can so that allow electric field force have time enough to carry out stretcher strain to solution, finally make its broken droplet that forms like this.In addition, electrical conductivity also has impact to atomizing effect.The solution that electrical conductivity is larger, charge mobility is high, and the electric-field intensity of generation is large, and therefore broken and necking deformation phenomenon more easily occurs, and the required magnitude of voltage of stable state atomization is also lower.
For the larger liquid of viscosity, because its viscosity is large, surface tension is larger, and occurring in atomization process, compared to low viscous liquid, regular better, diameter and the behavior of the droplet forming in repeated stretching process have more repeatability.In addition, nebulisation time is the important element that the density of atomizing particle is had a direct impact, but nebulisation time can not be long, longly easily causes sedimentation and the reunion of particle in solution.When the time more in short-term, voltage is larger, breakup of drop process is more thorough, the situation of particle agglomeration or gathering becomes serious.In the time range allowing, the time is longer, and the density of distribution of particles is larger, and the spacing between particle is less.
In preparation process, inventor also finds, when voltage rises to certain value from less value, the solution at place, syringe needle aperture is under high voltage electrostatic field, the drippage pattern of its state during from low voltage, is gradually varied to spindle pattern, then is transitioned into stable state prod cast formula.Stable state prod cast formula is compared to pattern above, and the form of its atomization is more stable, and the atomizing particle distribution spot forming on substrate is more regular, is more suitable for quantitative controlled distribution of particles.
Hour, the diameter of solution that is positioned at aperture is corresponding less for syringe needle diameter, and solution is now subject to the effect of surface tension, electric field force and gravity, and syringe needle diameter is generally less than 2mm, and preferably diameter is below 1mm.Electric field force plays a leading role, when applied voltage rises to certain value, electric field force is enough large to such an extent as to can overcome the constraint of surface tension to drop, the drop distortion that is stretched, the broken less drop of a lot of diameters that generates at place, tip, in these drops, be wrapped in conductive particle, and fly to towards the direction of substrate.In the process of flight, the solvent evaporates in drop or evaporation, stay particle on substrate, to form distribution of particles.
Distance between syringe needle and substrate is adjustable, and when die opening becomes large, also phase strain is large for the electric-field intensity that the broken formation of solution droplet is required or magnitude of voltage.Die opening is generally not more than 50mm, and preferably die opening is in 30mm, generally in 1～20mm left and right.Corresponding with it, make the magnitude of voltage of electrostatic atomization under stable state situation generally lower than 30kv, with die opening, reduce and reduce, when die opening is during at 1～20mm, its stable state required voltage value is in 1kv～10kv effect.
Distribution of particles on substrate, its density becomes positive correlation with the time of atomization and the mass fraction of particle.Because granular mass mark is when larger, the reunion situation of particle is comparatively serious, and therefore the mass fraction of preferred solution particle is 0.005%～5%.Time is longer, and grain density is larger, but overlong time easily causes distribution of particles to pile up, and then causes serious reunion.Its distribution of particles density is at 30000/mm
2below, generally at 10000/mm
2below, the die opening between its particle can be less than the degree of 10 μ m.
In addition, can be understood by those of ordinary skills, the particle in the present embodiment can be conductive particle, can be also non-conductive particle.The diameter of preferred particulates is less than 50 μ m.Wherein, non-conductive particle is resin particle; Resin particle is by polyethylene, polypropylene, acrylic resin, polystyrene, polyvinyl chloride, polyvinyl acetate, ABS resin, AS resin, ultrapas, polyamide, Merlon, polyacetals, at least one composition in polyphenylene oxide and the aromatic polyether ketone of modification.
When the particle in the present embodiment is selected conductive particle, can be used for preparing the equally distributed ACF conducting film of conductive particle and ACA conducting resinl, overcoming conductive particle reunion in prior art easily causes short circuit or distribution of particles inequality easily to cause the problem opening circuit, obtain extensive, evenly, the conductive particle of Monolayer Dispersion, and the final distribution of particles density obtaining and grain spacing are all better than the spacing of ACF method.The method cost of the present embodiment is low, and technique is simple, and particle, without impact, is had to stronger promotional value.
In other embodiments, solvent can be the one in distilled water, ethanol, ethylene glycol, acetone, isopropyl alcohol or methyl alcohol, and described solvent can also be the one in ethanol and distilled water mixing material, ethylene glycol and distilled water mixing material, acetone and distilled water mixing material, isopropyl alcohol and distilled water mixing material or methyl alcohol and distilled water mixing material.Can be according to the proportion of conductive particle, select different solvents to disperse particle.
In other embodiments, the material of substrate can be conductive material, can be also electrically non-conductive material, and is applicable to the other materials conducting electricity or non-conductive particle adheres to, in this no limit.Preferably, the material of substrate is stainless steel, silicon chip, chip etc.
In other embodiments, can there be various ways the high-voltage electrostatic field forming between syringe needle and substrate, and its object is to form a syringe needle to the positive field between substrate.For example, when syringe needle connects high-voltage power apparatus anodal, substrate ground connection, forms electrostatic field; Also or be syringe needle ground connection, substrate connects negative high voltage, forms electrostatic field.Certainly, similar voltage applying mode is not limited to this.Can be understood that, make to form between syringe needle or similar device and substrate positive field, all should be in protection scope of the present invention.
At other embodiment, in the process of flying to substrate at drop, can use bottom plate heating, or the mode such as environment heat radiation, for atomization environment heat temperature raising, accelerate solvent evaporates and evaporation, so that particle better stays on substrate, make particle can on substrate, not be subject to the impact of solution and occurrence positions changes.
In other embodiments, the material of described syringe needle can be convenient to the material that solution transports and exports for stainless steel, glass or other.The number of syringe needle is not limited to 1, can be 2 or multiple, forms needle array or syringe needle group, can carry out the electrostatic atomization processing of many places mixing drop simultaneously, improves the deposition efficiency of particle on substrate.
More than describe preferred embodiment of the present invention in detail.Should be appreciated that those of ordinary skill in the art just can design according to the present invention make many modifications and variations without creative work.Therefore, all technical staff in the art, all should be in by the determined protection domain of claims under this invention's idea on the basis of existing technology by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (10)
1. the electrostatic atomization method that uniform particles distributes, is characterized in that, comprises the following steps:
A) mixed solution that preparation contains particle;
B) the described mixed solution of step a) is passed through to pipeline transportation, be delivered to syringe needle place;
C) to being delivered to the solution control flow at syringe needle place in step b), form drop output, and the drop of output is applied to voltage, the size of described voltage is set to: magnitude of voltage increases gradually from 0, make drop occur broken at the most advanced and sophisticated place of liquid cone, form several droplets, and to orientation substrate flight, be finally deposited on described substrate the baseplate material that preparation uniform particles distributes.
2. the method for claim 1, it is characterized in that, in step a), particle is dissolved in solvent, the mixed solution that formation mass fraction is 0.005%～5%, adopt ultrasonic dispersal device to carry out ultrasonic wave dispersion to described mixed solution, make particle and solvent in described mixed solution form suspension.
3. method as claimed in claim 2, it is characterized in that, described solvent is the one in distilled water, ethanol, ethylene glycol, acetone, isopropyl alcohol or methyl alcohol, or described solvent is the one in ethanol and distilled water mixing material, ethylene glycol and distilled water mixing material, acetone and distilled water mixing material, isopropyl alcohol and distilled water mixing material or methyl alcohol and distilled water mixing material.
4. the method for claim 1, is characterized in that, described particle is conductive particle or non-conductive particle; The diameter of described particle is less than 50 μ m; Described non-conductive particle is resin particle; Described resin particle is by polyethylene, polypropylene, acrylic resin, polystyrene, polyvinyl chloride, polyvinyl acetate, ABS resin, AS resin, ultrapas, polyamide, Merlon, polyacetals, at least one composition in polyphenylene oxide and the aromatic polyether ketone of modification.
5. the method for claim 1, is characterized in that, in step b), also comprises, the mixed solution in transport process is carried out to magnetic agitation, makes described mixed solution in transport process, keep the dispersion of particle.
6. the method for claim 1, is characterized in that, in step c), the flow of described drop output is less than 10ml/h, and the internal diameter of the pin hole of described syringe needle is less than 2mm.
7. the method for claim 1, is characterized in that, in step c), described substrate is stainless steel, silicon chip or chip.
8. the method for claim 1, it is characterized in that, in step c), when described droplet flies to described substrate, described droplet is subject to heat radiation effect, described thermal-radiating mode is set to: base plate heating or environment heat radiation, make the solvent in described droplet be evaporated or volatilize.
9. the method for claim 1, is characterized in that, the die opening between described syringe needle and described substrate is less than 50mm; The implementation of described voltage is set to: one end of described voltage is connected with described syringe needle, and the other end of described voltage is connected with described substrate or the platform of described substrate below connects, and forms electrostatic field; The size of described voltage is 0.5kv～30kv.
10. the method for claim 1, is characterized in that, the implementation of described voltage is set to: the electrostatic atomization apparatus of realizing described electrostatic atomization method is placed in to non-contacting electrostatic field; The size of described voltage is 0.5kv～30kv.
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| CN110570391A (en) * | 2019-07-24 | 2019-12-13 | 天津科技大学 | Image analysis method for spray freezing coating effect based on Image J |
| CN108906524B (en) * | 2018-07-14 | 2022-01-18 | 福州大学 | Method for encapsulating quantum dot light guide plate based on electrostatic atomization film forming |
| CN115055139A (en) * | 2022-06-27 | 2022-09-16 | 广东电网有限责任公司 | Epoxy resin filler dispersing device and dispersing method thereof |
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