CN103748975A - Flexible printed circuit board and method for producing flexible printed circuit board - Google Patents
Flexible printed circuit board and method for producing flexible printed circuit board Download PDFInfo
- Publication number
- CN103748975A CN103748975A CN201280040897.XA CN201280040897A CN103748975A CN 103748975 A CN103748975 A CN 103748975A CN 201280040897 A CN201280040897 A CN 201280040897A CN 103748975 A CN103748975 A CN 103748975A
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- Prior art keywords
- insulating barrier
- flexible printed
- wiring board
- coated
- printed wiring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0594—Insulating resist or coating with special shaped edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Abstract
A flexible printed circuit board (10) comprsing a substrate layer (11), a wiring circuit (12a) and an insulating layer (13) comprising a photosensitive resin, is provided with an insulating layer covered region (Q1), which is covered by the insulating layer (13), and an insulating layer non-covered region (Q2), which is not covered by the insulating layer (13). When viewed from the direction perpendicular to the surface (H) of the flexible printed circuit board (10), the intersection angles (A1-A4) of the intersections of the boundary line (K1) between the insulating layer covered region (Q1) and the insulating layer non-covered region (Q2) and the line (T2) representing the side surface (12a-1) of the wiring circuit (12a) covered by the insulating layer covered region (Q1) are formed into acute angles.
Description
Technical field
The present invention relates to a kind of manufacture method with flexible printed wiring board and this flexible printed wiring board of the insulating barrier being formed by photoresist.
Background technology
In recent years, the flexible printed wiring board of internal configurations about advancing the electronic equipment of miniaturization, is preferably used the flexible printed wiring board with characteristics such as flexibility, bendabilities.
Above-mentioned flexible printed wiring board is formed by following part conventionally: substrate layer, and it consists of insulative resin; Wiring circuit, it consists of conductive metal, is formed on substrate layer; And insulating barrier, it consists of insulative resin, coated substrate layer and wiring circuit.
In addition, in above-mentioned flexible printed wiring board, sometimes after making the coated substrate layer of photoresist and wiring circuit, through exposure-processed, development treatment, cure process, form insulating barrier.
Prior art as representing above-mentioned flexible printed wiring board, has for example following patent documentation 1.
Patent documentation 1: Japanese kokai publication hei 10-321993 communique
Summary of the invention
But, being formed by photoresist in the flexible printed wiring board of insulating barrier as shown in above-mentioned patent documentation 1, conventionally do not consider the relation with the circuit direction (the laying direction of wiring circuit) of wiring circuit, and the end surface shape of design insulating barrier.
Thus, according to the end surface shape of insulating barrier, have in the fabrication stage of flexible printed wiring board (specifically, in being used to form the development treatment and cure process of insulating barrier), forming the coated bad problems such as region generating slight crack of insulating barrier.
Therefore, the present invention solves above-mentioned the problems of the prior art, the relation of the circuit direction (the laying direction of wiring circuit) of consideration and wiring circuit, and the end surface shape of the insulating barrier that design consists of photoresist.Thus, problem of the present invention is, the manufacture method of a kind of flexible printed wiring board and this flexible printed wiring board is provided, and it can prevent effectively in the fabrication stage of flexible printed wiring board, coated bad at the region generating slight crack etc. that forms insulating barrier.
Flexible printed wiring board of the present invention consists of following part: substrate layer; Wiring circuit, it is formed on this substrate layer; And insulating barrier, it consists of photoresist, coated described substrate layer and described wiring circuit.And the 1st of this flexible printed wiring board is characterised in that, in described flexible printed wiring board, to have the coated region of the insulating barrier being coated by described insulating barrier and can't help the non-coated region of the coated insulating barrier of described insulating barrier.And, when on the surface from flexible printed wiring board, vertical direction is observed, the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle forming with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect form acute angle.
According to the 1st feature of the invention described above, flexible printed wiring board consists of following part: substrate layer; Wiring circuit, it is formed on this substrate layer; And insulating barrier, it consists of photoresist, coated described substrate layer and described wiring circuit.And, in described flexible printed wiring board, there is the coated region of the insulating barrier being coated by described insulating barrier and can't help the non-coated region of the coated insulating barrier of described insulating barrier, when on the surface from flexible printed wiring board, vertical direction is observed, the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle forming with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect form acute angle.Thus, can effectively prevent in the fabrication stage of flexible printed wiring board, coated bad at the region generating slight crack etc. that forms insulating barrier.Thus, can realize and manufacture the flexible printed wiring board that efficiency is high, rate of finished products is high.
In addition, the 2nd of flexible printed wiring board of the present invention is characterised in that, on the basis of the 1st feature of the invention described above, described intersecting angle is less than 90 degree for being more than or equal to 15 degree.
According to the 2nd feature of the invention described above, on the basis of the action effect of realizing in the 1st feature of the invention described above, because described intersecting angle is less than 90 degree for being more than or equal to 15 degree, therefore, can further effectively prevent in the fabrication stage of flexible printed wiring board, coated bad at the region generating slight crack etc. that forms insulating barrier.Thus, can realize and manufacture the flexible printed wiring board that efficiency further improves, rate of finished products further improves.
In addition, the 3rd of flexible printed wiring board of the present invention is characterised in that, on the basis of the 1st or the 2nd feature of the invention described above, described intersecting angle is less than 60 degree for being more than or equal to 30 degree.
According to the 3rd feature of the invention described above, on the basis of the action effect of realizing in the 1st or the 2nd feature of the invention described above, because described intersecting angle is less than 60 degree for being more than or equal to 30 degree, therefore, can further effectively prevent in the fabrication stage of flexible printed wiring board, coated bad at the region generating slight crack etc. that forms insulating barrier.Thus, can realize and manufacture the flexible printed wiring board that efficiency further improves, rate of finished products further improves.
In addition, the 4th of flexible printed wiring board of the present invention is characterised in that, on the basis of the 1st to the 3rd any one feature of the invention described above, described wiring circuit forms by many, and, at least some 20 μ m that are less than or equal in the interval between the width of wiring circuit and adjacent wiring circuit.
According to the 4th feature of the invention described above, on the basis of the action effect of realizing in the 1st to the 3rd any one feature of the invention described above, because described wiring circuit forms by many, and, at least some 20 μ m that are less than or equal in interval between the width of wiring circuit and adjacent wiring circuit, therefore, can produce and can realize the granular of wiring circuit and the flexible printed wiring board of high density distribution.
In addition, the 5th of flexible printed wiring board of the present invention is characterised in that, on the basis of the 1st to the 4th any one feature of the invention described above, the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier is waveform.
According to the 5th feature of the invention described above, on the basis of the action effect of realizing in the 1st to the 4th any one feature of the invention described above, the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier is waveform.Thus, can intersect by the boundary line in the coated region of insulating barrier and the non-coated region of insulating barrier, with side by the coated wiring circuit in the coated region of insulating barrier and the angle that forms, on the side of wiring circuit both sides, effectively form acute angle.Thus, can realize and manufacture the flexible printed wiring board that efficiency further improves, rate of finished products further improves.
In addition, the manufacture method of flexible printed wiring board of the present invention is the method for manufacturing having the flexible printed wiring board of the 1st feature of the invention described above.And the 6th of the manufacture method of this flexible printed wiring board is characterised in that at least have following operation: substrate layer forms operation, in this operation, form substrate layer; Wiring circuit forms operation, in this operation, on described substrate layer, forms wiring circuit; And insulating barrier forms operation, in this operation, after photoresist being coated on described substrate layer and described wiring circuit, through exposure-processed, development treatment, cure process, form the coated region of the insulating barrier being coated by insulating barrier and can't help the non-coated region of the coated insulating barrier of insulating barrier.And, make not produce slight crack at the boundary member with the non-coated region of described insulating barrier in the coated region of described insulating barrier.As its measure, at described insulating barrier, form in operation, when on the surface from flexible printed wiring board, vertical direction is observed, the mode that forms acute angle with the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle that forms with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect, forms insulating barrier.
According to the 6th feature of the invention described above, the manufacture method of flexible printed wiring board is the method for manufacturing having the flexible printed wiring board of the 1st feature of the invention described above.And the manufacture method of this flexible printed wiring board at least has following operation: substrate layer forms operation, in this operation, form substrate layer; Wiring circuit forms operation, in this operation, on described substrate layer, forms wiring circuit; And insulating barrier forms operation, in this operation, after photoresist being coated on described substrate layer and described wiring circuit, through exposure-processed, development treatment, cure process, form the coated region of the insulating barrier being coated by insulating barrier and can't help the non-coated region of the coated insulating barrier of insulating barrier.And, as the boundary member with the non-coated region of described insulating barrier in the coated region of described insulating barrier, do not produce slight crack and the measure taked, at described insulating barrier, form in operation, when on the surface from flexible printed wiring board, vertical direction is observed, the mode that forms acute angle with the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle that forms with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect, forms insulating barrier.Thus, can effectively prevent in insulating barrier forms operation, coated bad at the coated region generating slight crack of insulating barrier etc.Thus, can realize the manufacture method of manufacturing the high and flexible printed wiring board that rate of finished products is high of efficiency.
The effect of invention
According to flexible printed wiring board of the present invention, can effectively prevent in the fabrication stage of flexible printed wiring board, the region generating slight cracks of the insulating barrier consisting of photoresist in formation etc. are coated bad.Thus, can realize and manufacture the flexible printed wiring board that efficiency is high, rate of finished products is high.In addition, can produce and can realize the granular of wiring circuit and the flexible printed wiring board of high density distribution.
In addition, according to the manufacture method of flexible printed wiring board of the present invention, can effectively prevent from forming in operation at insulating barrier, the region generating slight crack of the insulating barrier consisting of photoresist in formation etc. are coated bad.Thus, can realize the manufacture method of manufacturing the high and flexible printed wiring board that rate of finished products is high of efficiency.
Accompanying drawing explanation
Figure 1A means the figure of the flexible printed wiring board that embodiments of the present invention are related, means the whole vertical view of flexible printed wiring board.
Figure 1B means the figure of the flexible printed wiring board that embodiments of the present invention are related, be Fig. 4 A a-a line direction want portion's profile.
Fig. 2 is the profile of the manufacture method of the related flexible printed wiring board of reduced representation embodiments of the present invention.
Fig. 3 is the profile of the manufacture method of the related flexible printed wiring board of reduced representation embodiments of the present invention.
Fig. 4 A is the figure of the manufacture method of the related flexible printed wiring board of reduced representation embodiments of the present invention, mean pattern mask 20 is configured in to this state above resin bed 13a in exposure-processed want portion's vertical view.
Fig. 4 B is the figure of the manufacture method of the related flexible printed wiring board of reduced representation embodiments of the present invention, means that substrate layer 11 after developing by development treatment, wiring circuit 12a, resin bed 13a's wants portion's vertical view.
Fig. 4 C is the figure of the manufacture method of the related flexible printed wiring board of reduced representation embodiments of the present invention, is the profile of the b-b line direction of Fig. 4 B.
Fig. 5 means the vertical view of wanting portion of the flexible printed wiring board that embodiments of the present invention are related.
Fig. 6 A is the figure of the manufacture method of the existing flexible printed wiring board of reduced representation and existing flexible printed wiring board, means the vertical view of wanting portion of existing flexible printed wiring board.
Fig. 6 B is the figure of the manufacture method of the existing flexible printed wiring board of reduced representation and existing flexible printed wiring board, meaning the figure of profile of the c-c line direction of Fig. 6 A, is schematically represent by the development treatment in the fabrication stage of existing flexible printed wiring board and cure process and on resin bed 130a, produce the figure of the state of slight crack (crackle).
The explanation of label
10 flexible printed wiring boards
11 substrate layers
12 conductive layers
12a wiring circuit
12a-1 side
13 insulating barriers
13-1 end face
13a resin bed
20 pattern masks
30 exposing units
40 thermmohardening unit
100 flexible printed wiring boards
110 substrate layers
120 conductive layers
120a wiring circuit
120a-1 side
130 insulating barriers
130-1 end face
130a resin bed
A1 intersecting angle
A2 intersecting angle
A3 intersecting angle
A4 intersecting angle
B1 intersecting angle
B2 intersecting angle
B3 intersecting angle
B4 intersecting angle
C1 slight crack
D1 substrate layer forms operation
E wiring circuit forms operation
F insulating barrier forms operation
F1 resin bed formation processing
F2 exposure-processed
F3 cure process
K1 boundary line
K2 boundary member
L width
M height
Q1 insulating barrier is coated region
The non-coated region of Q2 insulating barrier
R wiring circuit exposes region
S interval
T1 line
T2 line
Embodiment
With reference to the following drawings, the manufacture method of the related flexible printed wiring board 10 of embodiments of the present invention and this flexible printed wiring board 10 is described, for the present invention is understood.But the following description is only embodiments of the present invention, does not limit the content of recording in claims.
The flexible printed wiring board 10 that embodiments of the present invention are related as shown in Figure 1B, is that the so-called one side flexible printed wiring board of wiring circuit 12a is only set at the one side of substrate layer 11.
In addition, as shown in Figure 1A, be to there is the flexible printed wiring board that the wiring circuit that wiring circuit 12a is exposed from insulating barrier 13 exposes region R.This wiring circuit exposes region R and utilizes as portion of terminal etc.
Below, with further reference to Fig. 2 to Fig. 5, the manufacture method of the related flexible printed wiring board 10 of embodiments of the present invention is described, and flexible printed wiring board 10 is described in detail.
With reference to Fig. 2 A, by substrate layer, form step D 1, form the substrate layer 11 being formed by insulative resin.
In addition, as insulative resin, so long as the material using usually used as the insulative resin that forms the substrate layer of flexible printed wiring board such as polyimides, polyester etc. can be used any material.
In addition, especially, preferably use and except flexibility, also there is the material of high-fire resistance.Can preferably use polyimide based resins such as polyamide-based resin or polyimides, polyamidoimide or PEN.
In addition, as heat-resistant resin, so long as the material that polyimide resin, epoxy resin etc. are used usually used as the heat-resistant resin that forms the substrate layer of flexible printed wiring board can be used any material.
In addition, the thickness of substrate layer 11 is preferably made as 5 μ m to 50 μ m left and right.
Below, with reference to Fig. 2 B, by wiring circuit, form operation E, first stacked conductive metal and form conductive layer 12 on substrate layer 11.
This conductive layer 12 can be used known formation method to form.For example, can form by plating conductive metal paper tinsel on substrate layer 11 (so-called addition (additive) method).
In addition,, as conductive metal paper tinsel, can use copper (Cu).Certainly the material using usually used as the conductive metal paper tinsel that forms the conductive layer of flexible printed wiring board is not limited to copper (Cu), so long as can be used any material.
Below, with reference to Fig. 2 C, by wiring circuit, form operation E, on conductive layer 12, form many wiring circuit 12a.
More particularly, by etching, the regulation region of conductive layer 12 (not forming the region of wiring circuit) do not removed and form wiring circuit 12a.
In addition, the width L of the wiring circuit 12a shown in Figure 1B is preferably made as 5 μ m to 150 μ m left and right.In addition, the interval S between adjacent wiring circuit 12a is preferably made as 5 μ m to 150 μ m left and right.Preferred mode be the width L of wiring circuit 12a and the interval S between adjacent wiring circuit 12a at least any one is made as and is more than or equal to 5 μ m and is less than or equal to 20 μ m.By forming said structure, can produce and can realize the granular of wiring circuit 12a and the flexible printed wiring board of high density distribution.
In addition, the height M of wiring circuit 12a is preferably made as 5 μ m to 35 μ m left and right.
In addition, in the present embodiment, although do not carry out detailed diagram, width L and interval S are made as to same length.
Below, with reference to Fig. 2 D, by insulating barrier, form the resin bed formation processing F1 of operation F, photoresist is coated on the surface of substrate layer 11 and wiring circuit 12a and forms resin bed 13a.
More particularly, in the present embodiment, by aqueous photosensitive polyimide being coated on the surface of substrate layer 11 and wiring circuit 12a, form resin bed 13a.
In addition, the photoresist as aqueous, is not limited to photosensitive polyimide, can use sense photosensitiveness epoxylite, photonasty acrylic resin etc.
Below, by insulating barrier, form the not shown dry processing of operation F, make the solvent evaporation of resin bed 13a.
Then, with reference to Fig. 3 A, by insulating barrier, form the exposure-processed F2 of operation F, use exposing unit 30 to make resin bed 13a exposure via pattern mask 20.
More particularly, as shown in Figure 4 A, on flexible printed wiring board 10, use have with the coated region Q1(of the insulating barrier being coated by insulating barrier 13 by single-point line, represented) and can't help the non-coated region Q2(of the coated insulating barrier of insulating barrier 13 and mainly make wiring circuit 12a expose and form the region that wiring circuit exposes region R) pattern mask 20 of corresponding pattern, resin bed 13a is exposed.
In addition, in the present embodiment, as shown in Figure 4 A, the boundary line K1 that the pattern form of pattern mask 20 is formed to the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier is corrugated pattern form.
More particularly, as shown in Figure 4 B, as the boundary member K2 with the non-coated region Q2 of insulating barrier at the coated region Q1 of insulating barrier, do not produce slight crack and the measure taked, form in the following manner.; be configured to; the pattern mask 20 that use has wave pattern exposes; this wave pattern makes when the vertical direction of the surperficial H from flexible printed wiring board is observed, and the boundary line K1(of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier represents the line T1 of end face 13-1 of the insulating barrier 13 of follow-up formation), the intersecting angle A1 that forms with representing the line T2 that is coated the side 12a-1 of the coated wiring circuit 12a both sides of region Q1 by insulating barrier to intersect forms acute angle to intersecting angle A 4.
In addition, in this what is called " boundary member K2 ", refer to, " when the vertical direction of the surperficial H from flexible printed wiring board is observed, from boundary line K1 with represent to be started to the region in the scope about the Width outside 5 μ m of wiring circuit 12a by the intersection point between the line T2 of the side 12a-1 of the coated wiring circuit 12a of the coated region Q1 of insulating barrier ".
In addition, so-called " the surperficial H of flexible printed wiring board " refer to, as shown in Figure 1A, Figure 1B, Fig. 5, " face that disposes wiring circuit 12a on flexible printed wiring board 10 ".
In addition, as long as intersecting angle A1 forms acute angle to intersecting the angle of angle A 4, intersecting angle A1 to intersect angle A 4 can and the width L of wiring circuit 12a, adjacent wiring circuit 12a between interval S suitably change accordingly.But be preferably made as, be more than or equal to 15 degree and be less than 90 degree, being more preferably made as and being more than or equal to 30 degree and being less than or equal to 60 degree.In addition, be formed on intersecting angle A1 and intersecting angle A2(intersecting angle A3 and the intersecting angle A4 of the Width both sides of wiring circuit 12a) can be equal angular, can be also different angles.
In addition, the exposure of exposure-processed F2, time for exposure can suitably change.But preferably exposure is made as 200mj/cm
2to 1500mj/cm
2left and right, the time for exposure is made as about 20 seconds to 90 seconds.
In addition, pattern mask 20 can be to use any structure of eurymeric, minus.
In addition, the shape of wave, more specifically says that the amplitude, cycle etc. of wave can suitably change along with the interval S between the width L of wiring circuit 12a, adjacent wiring circuit 12a.In addition, in the present embodiment, as shown in simplifying, Fig. 4 B is configured to, amplitude forms laterally zygomorphic sine wave, and, width L at 1 wiring circuit 12a(1 wiring circuit 12a) 1 crest of upper configuration, locates to configure 1 trough at (the interval S between adjacent wiring circuit 12a) between adjacent wiring circuit 12a.
Below, at insulating barrier, form in the not shown development treatment of operation F, the resin bed 13a by after exposure-processed F2 exposure is developed.
More particularly, by developer solution, the region corresponding with the non-coated region Q2 of insulating barrier of resin bed 13a dissolved and removed.
By this, process, as shown in Figure 4 B, form the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier.
In addition,, as developer solution, so long as organic solvent, alkaline aqueous solution etc. are generally used for the material that the photoresist that forms the insulating barrier of flexible printed wiring board is developed, can use any material.But preferably with an organic solvent, preferably developing time is made as about 5 minutes to 15 minutes.
Below, with reference to Fig. 3 B, Fig. 3 C, by insulating barrier, form the cure process F3 of operation F, make the resin bed 13a sclerosis after developing by development treatment form insulating barrier 13.
More particularly, by thermmohardening unit 40, make not dissolve the resin bed 13a thermmohardening that is used to form the coated region Q1 of insulating barrier of removing in developing procedure.
In addition, the condition of thermmohardening can suitably change.But preferably at 150 ℃ to the temperature atmosphere of 350 ℃ of left and right, carry out the heat treated about 30 minutes to 10 hours.
In addition, the thickness of insulating barrier 13 is preferably made as 3 μ m to 25 μ m left and right.
By via above operation, form the related flexible printed wiring board 10 of embodiments of the present invention shown in Fig. 3 C.More particularly, as shown in Figure 5, when the vertical direction of the surperficial H from flexible printed wiring board 10 is observed, the boundary line K1 of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier, the intersecting angle A1 that forms with representing the line T2 that is coated the side 12a-1 of the coated wiring circuit 12a of region Q1 by insulating barrier to intersect form acute angle to intersecting angle A 4.And, forming the flexible printed wiring board 10 with insulating barrier 13, this insulating barrier 13 has corrugated end face 13-1.
The flexible printed wiring board 10 forming is in the manner described above configured in the inside of the various electronic equipments such as mobile phone.
The flexible printed wiring board 10 that the embodiments of the present invention that consist of said structure are related and the manufacture method of this flexible printed wiring board 10 realize following effect.
The pattern mask using 20 is formed to the pattern mask with corrugated boundary line K1 in exposure-processed F2, this corrugated boundary line K1 makes when the vertical direction of the surperficial H from flexible printed wiring board 10 is observed, and the boundary line K1(of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier represents the line T1 of end face 13-1 of the insulating barrier 13 of follow-up formation), the intersecting angle A1 that forms with representing the line T2 that is coated the side 12a-1 of the coated wiring circuit 12a both sides of region Q1 by insulating barrier to intersect forms acute angle to intersecting angle A 4.Thus, can effectively prevent in development treatment (not shown) and cure process F3, owing to producing slight crack (crackle) etc. at coated boundary member K2 region Q1 and the non-coated region Q2 of insulating barrier of the insulating barrier shown in Fig. 4 B, Fig. 4 C, occur to be coated bad.
That is, in development treatment and cure process F3, in resin bed 13a, can follow the expansion that absorbs developer solution and cause, and follow subsequently contraction dry and that cause.For above-mentioned phenomenon, by intersecting angle A1 is designed to acute angle to intersecting angle A 4, thereby the boundary member K2 of the resin bed 13a that can effectively prevent particularly at the coated region Q1 of insulating barrier follows dry and being contracted in multiple directions of causing occurs, there is stress and concentrate in the boundary member K2 that can prevent at resin bed 13a.Thus, can effectively prevent in development treatment, at the boundary member K2 of the resin bed 13a of the coated region Q1 of insulating barrier, produce slight crack (crackle) etc. coated bad.
And, in cure process F3, for resin bed 13a, when heating acid imide precursor and imidizate, there is volume contraction.For above-mentioned phenomenon, by intersecting angle A1 is designed to acute angle to intersecting angle A 4, thereby the boundary member K2 heat tracing of the resin bed 13a that can effectively prevent particularly at the coated region Q1 of insulating barrier and being contracted in multiple directions of causing occurs, there is stress and concentrates in the boundary member K2 that can prevent at resin bed 13a.Thus, can effectively prevent in cure process F3, at the boundary member K2 of the resin bed 13a of the coated region Q1 of insulating barrier, slight crack (crackle) etc. occur coated bad.
Therefore, can be achieved as follows the manufacture method of flexible printed wiring board and flexible printed wiring board, that is, can effectively prevent from the fabrication stage occurring slight crack etc. coated bad in the resin bed 13a of the coated region Q1 of insulating barrier, manufacture that efficiency is high, rate of finished products is high.
In addition, as mentioned above, form following structure, that is, consider the circuit direction (the laying direction of wiring circuit 12a) of wiring circuit 12a and the action of the resin bed 13a in development treatment and cure process F3 and carry out the design (design of the end surface shape of insulating barrier 13) of pattern mask 20.Thus, do not change and form resin bed 13a(insulating barrier 13) the material of photoresist itself, only change design, the boundary member K2 of the resin bed 13a that can prevent at the coated region Q1 of insulating barrier occurs to be coated bad.Thus, can realize manufacture efficiency is high, rate of finished products is high flexible printed wiring board and the manufacture method of flexible printed wiring board with low cost.
In addition, as shown in Figure 4 A, the boundary line K1 that the pattern form of pattern mask 20 is formed to the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier is corrugated pattern form.Thus, when the vertical direction of the surperficial H from flexible printed wiring board 10 is observed, the intersecting angle A1 can be easily boundary line K1 being formed with representing the line T2 that is coated the side 12a-1 of the coated wiring circuit 12a both sides of region Q1 by insulating barrier to intersect forms acute angle to intersecting angle A 4.Thus, can realize and manufacture the further flexible printed wiring board improving of efficiency and the manufacture method of flexible printed wiring board.
And, by being configured to, width L and interval S are made as to same length, and wave-like is formed to the laterally zygomorphic sine wave of amplitude, and, width L at 1 wiring circuit 12a(1 wiring circuit 12a) 1 crest of upper configuration, locates to configure 1 trough at (the interval S between adjacent wiring circuit 12a) between adjacent wiring circuit 12a, thereby intersecting angle A1 can be formed to equal angular to intersecting angle A 4.Thus, can make the stress equilibrium that applies to a plurality of boundary member K2 of the resin bed 13a of the coated region Q1 of insulating barrier.Thus, in the situation that implementing high density distribution, it is coated bad to there are slight cracks (crackle) etc. in a plurality of boundary member K2 that also can effectively prevent at resin bed 13a.Therefore, can access rate of finished products high and realize the manufacture method of flexible printed wiring board and the flexible printed wiring board of high density distribution.In addition, the pattern of pattern mask 20 forms and also can become easily, can realize and manufacture the further flexible printed wiring board improving of efficiency and the manufacture method of flexible printed wiring board.
On the other hand, in the manufacture method of existing flexible printed wiring board and flexible printed wiring board, conventionally do not consider the circuit direction (the laying direction of wiring circuit) of wiring circuit and the action of the resin bed in development treatment and cure process, and carried out the design (design of the end surface shape of insulating barrier) of pattern mask.
For example, there is following flexible printed wiring board 100, as shown in Figure 6A, when the vertical direction of the surperficial H from flexible printed wiring board 100 is observed, make the boundary line K1(of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier represent the line T1 of the end face 130-1 of insulating barrier 130) form the rectilinear form of inclination.
In said structure, as shown in Figure 6A, although intersecting angle B1 and intersecting angle B3 can be formed to acute angle, intersecting angle B2 and intersecting angle B4 form obtuse angle.
Thus, in development treatment and cure process, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, follow dry and being contracted in multiple directions of causing occurs.Thus, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, stress occurring concentrates.Therefore, as shown in Figure 6B, have in development treatment, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, the coated bad problems such as slight crack (crackle) occur.
And, in cure process, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, follow imidizate and being contracted in multiple directions of causing occurs.Thus, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, stress occurring concentrates.Therefore, as shown in Figure 6B, have in cure process, at the boundary member K2 of the resin bed 130a corresponding with intersecting angle B2 and intersecting angle B4, the coated bad problems such as slight crack (crackle) occur.
In addition, in existing flexible printed wiring board 100, for the identical parts of the flexible printed wiring board 10 with already described, realize the part of same function, mark numbering and the identical label of letter of first 2, and detailed.
Thus, by adopting the structure of the manufacture method of the related flexible printed wiring board 10 of embodiments of the present invention and flexible printed wiring board 10, thereby can effectively prevent in development treatment and cure process F3, at the boundary member K2 of the resin bed 13a of the coated region Q1 of insulating barrier, slight crack (crackle) etc. occur coated bad.
Therefore, can realize and manufacture efficiency is high, rate of finished products is high flexible printed wiring board and the manufacture method of flexible printed wiring board.
In addition, in the present embodiment, flexible printed wiring board 10 is configured to the so-called one side flexible printed wiring board only at the one side of substrate layer 11 with wiring circuit 12a, but might not be defined as said structure, also can be configured to the two-sided so-called double-faced flexible printing wiring board with wiring circuit 12a at substrate layer 11.
In addition, in the present embodiment, be configured to by aqueous photoresist and form resin bed 13a, but might not be defined as said structure, also can be configured to membranaceous photoresist is attached on substrate layer 11 and wiring circuit 12a.
In addition, in the present embodiment, the boundary line K1 of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier is configured to waveform.But, might not be defined as said structure, so long as when the vertical direction of the surperficial H from flexible printed wiring board 100 is observed, the intersecting angle that boundary line K1 forms with representing line T2 by the side 12a-1 of the coated wiring circuit 12a both sides of the coated region Q1 of insulating barrier to intersect can form acute angle, can be configured to any shape.
In addition, in the present embodiment, be configured to by substrate layer 11, conductive layer 12 and insulating barrier 13 and form flexible printed wiring board 10, but might not be defined as said structure, also can be configured to metallic plates such as increasing stainless-steel sheet and form the flexible printed wiring board of flexible portion.
In addition, in the present embodiment, be configured to the interval S between the width L of wiring circuit 12a and adjacent wiring circuit 12a is made as to same length, but might not be defined as said structure, also can be configured to width L and interval S are made as to different length.
In addition, the shape of flexible printed wiring board 10, the quantity of wiring circuit 12a, wiring circuit expose formation position of region R etc. and are also not limited to present embodiment, can suitably change.
Embodiment
Below, by embodiment, the present invention will be described in more detail, but the present invention is not limited to the present embodiment.
Make respectively the value of the width L of wiring circuit 12a, the value of interval S between adjacent wiring circuit 12a, and when the vertical direction of the surperficial H from flexible printed wiring board 10 is observed, the boundary line K1 of the coated region Q1 of insulating barrier and the non-coated region Q2 of insulating barrier, the value of the intersecting angle A1 forming with representing line T2 by the side 12a-1 of the coated wiring circuit 12a of the coated region Q1 of insulating barrier to intersect changes and forms flexible printed wiring board, whether the boundary member K2 of the resin bed 13a at the coated region Q1 of insulating barrier is produced to slight crack (crackle) is observed.Its result is shown in table 1.
[table 1]
As can be known from the results of Table 1, by intersecting angle A1 being formed to acute angle (be more than or equal to 30 degree and be less than or equal to 60 degree), the boundary member K2 of the resin bed 13a that can effectively prevent at the coated region Q1 of insulating barrier produces slight crack (crackle).Particularly known in the situation that the interval S between the width L of wiring circuit 12a and adjacent wiring circuit 12a is formed tricklely (be more than or equal to 18 μ m and be less than or equal to 20 μ m), the boundary member K2 of the resin bed 13a that can effectively prevent at the coated region Q1 of insulating barrier produces slight crack (crackle).
Industrial applicibility
According to the present invention, owing to can effectively preventing forming in operation at insulating barrier, in the region that forms the insulating barrier formed by photoresist, there is slight crack etc. coated bad, therefore, the industrial applicibility in the field of flexible printed wiring board with the insulating barrier consisting of photoresist is high.
Claims (6)
1. a flexible printed wiring board, it consists of following part: substrate layer; Wiring circuit, it is formed on this substrate layer; And insulating barrier, it consists of photoresist, coated described substrate layer and described wiring circuit,
This flexible printed wiring board is characterised in that,
In described flexible printed wiring board, there is the coated region of the insulating barrier being coated by described insulating barrier and can't help the non-coated region of the coated insulating barrier of described insulating barrier, when on the surface from flexible printed wiring board, vertical direction is observed, the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle forming with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect form acute angle.
2. flexible printed wiring board according to claim 1, is characterized in that,
Described intersecting angle is less than 90 degree for being more than or equal to 15 degree.
3. flexible printed wiring board according to claim 1 and 2, is characterized in that,
Described intersecting angle is less than 60 degree for being more than or equal to 30 degree.
4. according to the flexible printed wiring board described in any one in claims 1 to 3, it is characterized in that,
Described wiring circuit forms by many, and, at least some 20 μ m that are less than or equal in the interval between the width of wiring circuit and adjacent wiring circuit.
5. according to the flexible printed wiring board described in any one in claim 1 to 4, it is characterized in that,
The boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier is waveform.
6. a manufacture method for flexible printed wiring board, it is the manufacture method of flexible printed wiring board claimed in claim 1,
The manufacture method of this flexible printed wiring board is characterised in that at least have following operation:
Substrate layer forms operation, in this operation, forms substrate layer;
Wiring circuit forms operation, in this operation, on described substrate layer, forms wiring circuit; And
Insulating barrier forms operation, in this operation, after photoresist being coated on described substrate layer and described wiring circuit, through exposure-processed, development treatment, cure process, the insulating barrier that formation is coated by insulating barrier is coated region and can't help the non-coated region of the coated insulating barrier of insulating barrier
And, as the boundary member with the non-coated region of described insulating barrier in the coated region of described insulating barrier, do not produce slight crack and the measure taked, at described insulating barrier, form in operation, when on the surface from flexible printed wiring board, vertical direction is observed, the mode that forms acute angle with the boundary line in the coated region of described insulating barrier and the non-coated region of described insulating barrier, the intersecting angle that forms with representing line by the side of the coated described wiring circuit in the coated region of described insulating barrier to intersect, forms insulating barrier.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-181133 | 2011-08-23 | ||
| JP2011181133A JP5703525B2 (en) | 2011-08-23 | 2011-08-23 | Flexible printed wiring board and method for manufacturing the flexible printed wiring board |
| PCT/JP2012/069307 WO2013027542A1 (en) | 2011-08-23 | 2012-07-30 | Flexible printed circuit board and method for producing flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103748975A true CN103748975A (en) | 2014-04-23 |
| CN103748975B CN103748975B (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280040897.XA Active CN103748975B (en) | 2011-08-23 | 2012-07-30 | Flexible printed wiring board and the manufacture method of this flexible printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5703525B2 (en) |
| CN (1) | CN103748975B (en) |
| WO (1) | WO2013027542A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106536384A (en) * | 2014-07-04 | 2017-03-22 | 盖茨优霓塔亚洲有限公司 | Multifunctional belt |
| CN106918938A (en) * | 2017-04-28 | 2017-07-04 | 上海中航光电子有限公司 | A kind of display base plate, its preparation method and display device |
| CN113474853A (en) * | 2019-02-27 | 2021-10-01 | 住友电工印刷电路株式会社 | Printed wiring board and method for manufacturing printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6959066B2 (en) * | 2017-08-14 | 2021-11-02 | 住友電気工業株式会社 | Flexible printed wiring board |
| JP7006863B1 (en) * | 2021-06-09 | 2022-01-24 | 三菱電機株式会社 | Flexible printed board |
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| JPH04121777U (en) * | 1991-04-19 | 1992-10-30 | 信越ポリマー株式会社 | flexible printed circuit board |
| CN1427662A (en) * | 2001-12-10 | 2003-07-02 | 日本碍子株式会社 | Flexible distributing board |
| CN1744799A (en) * | 2004-09-01 | 2006-03-08 | 日东电工株式会社 | Wire-laying circuit substrate |
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| JPH03230595A (en) * | 1990-02-05 | 1991-10-14 | Nitto Denko Corp | Flexible printed circuit board |
| JP2005268593A (en) | 2004-03-19 | 2005-09-29 | Fujikura Ltd | Printed-wiring board and manufacturing method thereof |
| JP2007279489A (en) | 2006-04-10 | 2007-10-25 | Hitachi Chem Co Ltd | Photosensitive resin composition, method for producing resist pattern, flexible substrate and electronic component |
| EP2091307B1 (en) * | 2006-11-15 | 2011-10-19 | Panasonic Corporation | Circuit board connection structure and circuit board |
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- 2012-07-30 WO PCT/JP2012/069307 patent/WO2013027542A1/en active Application Filing
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| JPH04121777U (en) * | 1991-04-19 | 1992-10-30 | 信越ポリマー株式会社 | flexible printed circuit board |
| CN1427662A (en) * | 2001-12-10 | 2003-07-02 | 日本碍子株式会社 | Flexible distributing board |
| CN1744799A (en) * | 2004-09-01 | 2006-03-08 | 日东电工株式会社 | Wire-laying circuit substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106536384A (en) * | 2014-07-04 | 2017-03-22 | 盖茨优霓塔亚洲有限公司 | Multifunctional belt |
| CN106536384B (en) * | 2014-07-04 | 2019-12-20 | 盖茨优霓塔亚洲有限公司 | Multifunctional belt |
| CN106918938A (en) * | 2017-04-28 | 2017-07-04 | 上海中航光电子有限公司 | A kind of display base plate, its preparation method and display device |
| CN106918938B (en) * | 2017-04-28 | 2020-06-16 | 上海中航光电子有限公司 | Display substrate, manufacturing method thereof and display device |
| CN113474853A (en) * | 2019-02-27 | 2021-10-01 | 住友电工印刷电路株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN113474853B (en) * | 2019-02-27 | 2023-04-04 | 住友电工印刷电路株式会社 | Printed wiring board and method for manufacturing printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5703525B2 (en) | 2015-04-22 |
| WO2013027542A1 (en) | 2013-02-28 |
| CN103748975B (en) | 2016-08-24 |
| JP2013045818A (en) | 2013-03-04 |
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